Circuit board electroplating hanger
By designing a circuit board plating rack that includes cathode circuits connected in parallel and interconnect circuits in series, the problem of uneven plating effects caused by wear of conductive paths in existing electroplating equipment is solved, and the uniformity of circuit board plating effects is achieved.
Patent Information
- Application Number
- CN202421038225.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-13
- Publication Date
- 2025-02-25
- Estimated Expiration
- 2034-05-13
AI Technical Summary
In existing electroplating equipment, the wear of the conductive path leads to a change in resistance, which causes the circuit board plating effect on the conductive path in the same electroplating tank to be far from the circuit board plating effect on other electrically conductive paths.
A circuit board electroplating hanger is designed, including a hanger body, a plurality of chuck components, a main conductive track, a conductive connection assembly and a conductive device. The cathode circuit and the interconnection circuit are formed by electrically connecting the connecting assembly and the collet assembly. The cathode circuit is connected in parallel and the interconnection circuit is connected in series to ensure equal current division.
Through the design of parallel cathode circuits and series connection of interconnect circuits, the electroplating effect of multiple circuit boards is achieved, avoiding the resistance change caused by wear of conductive paths.
Smart Images
Figure CN222524731U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of circuit board electroplating processing, in particular to a circuit board electroplating rack. Background Art
[0002] In the manufacturing process of printed circuit boards, it is necessary to form conductive paths between substrates through an electroplating process, and then perform subsequent surface treatment to form the printed circuit boards. In order to facilitate electroplating of multiple sets of circuit boards at the same time, continuous mobile electroplating equipment is disclosed in the prior art, such as Figure 1 As shown, the conductive paths in this mobile electroplating equipment are connected through sliders, wherein each conductive path is connected in parallel. Therefore, when the slider in a conductive path is severely worn, the resistance of the conductive path will increase or decrease, resulting in the electroplating effect of the circuit board on the conductive path in the same electroplating tank being very different from that of the circuit board on other conductive paths. Utility Model Content
[0003] The main purpose of the utility model is to provide a circuit board electroplating rack, aiming to solve the problem that the electroplating effect of the circuit board on the conductive path in the same electroplating tank is very different from that of the circuit board on other conductive paths.
[0004] In order to achieve the above-mentioned purpose, the utility model proposes a circuit board electroplating rack, comprising:
[0005] The main body of the rack;
[0006] A plurality of clamping head assemblies are arranged on the rack body and used for clamping a plurality of circuit boards, each of the clamping head assemblies comprises a first clamping head and a second clamping head;
[0007] A main conductive track, on which the hanger body is slidably arranged;
[0008] A conductive connection assembly, wherein the main conductive track is electrically connected to the first clamps of the plurality of clamp assemblies through the conductive connection assembly to form a plurality of cathode circuits, wherein the cathode circuits are used to provide cathode current to the circuit board; and
[0009] A conductive device, wherein the conductive device is electrically connected to the second clamps of the plurality of clamp assemblies through the conductive connection assembly to form a plurality of interconnected circuits, wherein the first clamp and the second clamp of each clamp assembly clamp the same circuit board, and each cathode circuit is conductively connected to an interconnected circuit through a circuit board, and the plurality of interconnected circuits are used to adjust the cathode currents distributed to the circuit board by the plurality of cathode circuits.
[0010] In one embodiment, the circuit board electroplating rack is applied to an electroplating device, the electroplating device includes a rectifier, the main conductive track is electrically connected to the cathode of the rectifier through the conductive connection component to form a first cathode loop, and a plurality of cathode circuits are all conductively connected to the first cathode loop;
[0011] The conductive device includes a secondary conductive track, which is electrically connected to the rectifier through a conductive connection component to form a second cathode loop. A plurality of interconnected circuits are conductive to the second cathode loop, and the first cathode loop is connected in parallel with the second cathode loop.
[0012] In one embodiment, the electroplating device further comprises an electroplating tank, the electroplating tank is used for electroplating the circuit board, the electroplating tank is electrically connected to the anode of the rectifier through the conductive connection component to form an anode circuit, and forms a conductive loop with the first cathode loop and / or the second cathode loop;
[0013] The rack bodies are provided in plurality, and the circuit boards in the same electroplating tank on the rack bodies are electrically connected via the conductive device.
[0014] In one embodiment, the conductive device also includes a sliding portion, and the sliding portion includes a mounting seat, a second insulating pad and a sliding block, the sliding block is movably connected to the mounting seat, the mounting seat is detachably arranged on the bracket body, and the second insulating pad is arranged between the mounting seat and the bracket body to insulate the interconnection circuit from the bracket body.
[0015] In one embodiment, the sliding portion further includes an elastic member, and the elastic member is disposed between the mounting seat and the sliding block, and is used to push the sliding block to be in close contact with the secondary conductive rail.
[0016] In one embodiment, the sliding block is a sliding wheel.
[0017] In one embodiment, the hanger body is hollow, and the conductive connection component passes through the hanger body and is electrically connected to the second clamp.
[0018] In one embodiment, each of the chuck assemblies includes a chuck fixing plate, a plurality of first chucks and a plurality of second chucks, the chuck fixing plate is electrically connected to the conductive connection assembly, and the plurality of first chucks are detachably disposed on the chuck fixing plate.
[0019] In one embodiment, the clamp assembly further includes a first insulating pad, and a plurality of the second clamps are detachably mounted on the clamp fixing plate via the insulating pad.
[0020] In one embodiment, the conductive connection structure is a connecting wire or a conductive flat.
[0021] The technical solution of the utility model is to add a conductive device on the basis of a cathode circuit formed on the circuit board by a main conductive track, a conductive connection component and a first clamp on a circuit board electroplating rack, and form an interconnection circuit by the conductive device, the conductive connection component and the second clamp. Since there are multiple cathode circuits and the multiple cathode circuits are connected in parallel, there are also multiple interconnection circuits. The multiple interconnection circuits connect the multiple cathode circuits in series through the circuit board so that the cathode current distributed to the multiple cathode circuits on the circuit board is evenly divided by connecting the multiple circuit boards in series through the interconnection circuits, so that the current on the multiple circuit boards connected in series through the interconnection circuits is evenly divided, and the electroplating effect of the multiple circuit boards is uniform. BRIEF DESCRIPTION OF THE DRAWINGS
[0022] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0023] Figure 1 It is a structural schematic diagram of an existing circuit board electroplating rack;
[0024] Figure 2 A schematic structural diagram of an embodiment of a circuit board electroplating rack provided by the utility model;
[0025] Figure 3 for Figure 2 Schematic diagram of the disassembled structure of the circuit board electroplating rack;
[0026] Figure 4 for Figure 2 Schematic diagram of the structure of the AA section;
[0027] Figure 5 A schematic diagram of the structure of the circuit board electroplating rack provided by the utility model;
[0028] Figure 6 A schematic structural diagram of the circuit board electroplating rack provided by the utility model from another perspective;
[0029] Figure 7 This is a schematic diagram of the principle analysis of the circuit board electroplating rack provided by the utility model.
[0030] Description of Figure Numbers:
[0031] 100, electroplating device; 10, rack body; 20, chuck assembly; 21, chuck fixing plate; 22, first chuck; 23, second chuck; 231, first insulating pad; 30, main conductive track; 31, connecting slider; 40, conductive device; 41, secondary conductive track; 42, mounting seat; 43, second insulating pad; 44, sliding block; 45, elastic member; 50, conductive connection assembly; 51, connecting wire; 52, conductive flat; 60, electroplating tank; 70, circuit board; 80, rectifier; 81, anode sheet.
[0032] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0034] It should be noted that if the embodiments of the present invention involve directional indications (such as up, down, left, right, front, back...), the directional indications are only used to explain the relative position relationship, movement status, etc. between the components in a certain specific posture. If the specific posture changes, the directional indications will also change accordingly.
[0035] In addition, if there are descriptions involving "first", "second", etc. in the embodiments of the utility model, the descriptions of "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of technical features indicated. Therefore, the features limited to "first" and "second" may explicitly or implicitly include at least one of the features. In addition, if "and / or" or "and / or" appears in the full text, its meaning includes three parallel solutions. Taking "A and / or B" as an example, it includes solution A, solution B, or solutions that satisfy both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the utility model.
[0036] The prior art discloses a continuous mobile electroplating device, in which the conductive paths are connected via sliders, wherein each conductive path is connected in parallel. Therefore, when the slider in a conductive path is severely worn, the resistance of the conductive path will increase or decrease, resulting in the electroplating effect of the circuit board on the conductive path in the same electroplating tank being very different from that of the circuit board on other conductive paths.
[0037] The utility model provides a circuit board electroplating rack.
[0038] See also Figure 1 to Figure 2 In one embodiment of the utility model, the circuit board 70 electroplating rack includes a rack body 10, a plurality of clamp assemblies 20, a main conductive track 30, a conductive connection assembly 50 and a conductive device 40, wherein the plurality of clamp assemblies 20 are arranged on the rack body 10 for clamping the plurality of circuit boards 70, and each clamp assembly 20 includes a first clamp 22 and a second clamp 23; the rack body 10 is slidably arranged on the main conductive track 30; the main conductive track 30 is electrically connected to the first clamp 22 of the plurality of clamp assemblies 20 through the conductive connection assembly 50 to form a plurality of cathode circuits, and the cathode circuit is used to provide a cathode conductive circuit to the circuit board 70; and the conductive device 40 is electrically connected to the second clamp 23 of the plurality of clamp assemblies 20 through the conductive connection assembly 50 to form a plurality of interconnected circuits, the first clamp 22 and the second clamp 23 of each clamp assembly 20 clamp the same circuit board 70, each cathode circuit is conductively connected to an interconnected circuit through a circuit board 70, and the plurality of interconnected circuits are used to adjust the cathode current distributed to the circuit board 70 by the plurality of cathode circuits.
[0039] The technical solution of the utility model is to add a conductive device 40 on the basis of a cathode circuit formed on the circuit board 70 by a main conductive track 30, a conductive connection component 50 and a first clamp 22 on the electroplating rack of the circuit board 70, and form an interconnection circuit through the conductive device 40, the conductive connection component 50 and the second clamp 23. Since there are multiple cathode circuits and the multiple cathode circuits are connected in parallel, there are also multiple interconnection circuits. The multiple interconnection circuits connect the multiple cathode circuits in series through the circuit board 70, so that the cathode current distributed to the multiple cathode circuits on the circuit board 70 is distributed. Therefore, the multiple circuit boards 70 are connected in series to share the current, so that the current on the multiple circuit boards 70 connected in series through the interconnection circuit is shared, and the electroplating effect of the multiple circuit boards 70 is uniform.
[0040] In another embodiment, if Figure 1 , Figure 3 and Figure 4As shown in , the electroplating rack of the circuit board 70 is applied to the electroplating device 100, and the electroplating device 100 includes a rectifier 80, and the main conductive track 30 is electrically connected to the cathode of the rectifier 80 through the conductive connection component 50 to form a first cathode loop, and multiple cathode circuits are all conductively connected to the first cathode loop;
[0041] The conductive device 40 includes a secondary conductive track 41, which is electrically connected to the rectifier 80 through a conductive connection assembly 50 to form a second cathode loop. Multiple interconnected circuits are conductive to the second cathode loop, and the first cathode loop is connected in parallel with the second cathode loop.
[0042] In this embodiment, the electroplating device 100 includes a rectifier 80, which is used to realize anode power supply for the circuit board 70, and the main conductive track 30 is connected to the cathode of the rectifier 80 through a connecting wire 51, and the main conductive track 30 is electrically connected to the circuit board 70 through a conductive connection component 50 and a clamping head component 20, so as to form a first cathode loop, wherein a plurality of cathode circuits are all conductively connected to the first cathode loop through the main conductive track 30. On the basis of forming the above-mentioned first cathode loop, the secondary conductive track 41 of the conductive device 40 is also connected to the cathode of the rectifier 80 through the conductive connection component 50. Since the secondary conductive track 41 is connected to the second clamping head 23 through the conductive connection component 50 It is connected to the circuit board 70 to form a second cathode loop, wherein multiple circuit boards are connected to the second cathode loop. In the present embodiment, the first cathode loop is connected in parallel with the second cathode loop. The second cathode loop can be set as a backup conduction circuit when the resistance of the first cathode loop is too large or too small. In the present embodiment, the conductive device 40 includes a secondary conductive track 41. The secondary conductive track 41 can not only realize sliding support for the hanger body 10, but also can conduct the interconnection circuits arranged on multiple hanger bodies 10 when multiple hanger bodies 10 are arranged, so that the current of the circuit boards 70 connected in series through the secondary conductive track 41 can be evenly divided, thereby achieving the purpose of uniform electroplating.
[0043] Furthermore, the electroplating device 100 further includes an electroplating tank 60, which is used for electroplating the circuit board 70, and the electroplating tank 60 is electrically connected to the anode of the rectifier 80 through the conductive connection component 50 to form an anode circuit, and forms a conductive loop with the first cathode loop and / or the second cathode loop;
[0044] A plurality of rack bodies 10 are provided, and a plurality of circuit boards 70 in the same electroplating tank 60 on the plurality of rack bodies 10 are connected through the conductive device 40 .
[0045] In this embodiment, the electroplating device 100 also includes an electroplating tank 60, wherein the anode plate 81 of the rectifier 80 is arranged in the electroplating tank 60, and the electroplating tank 60 is filled with a solution for electroplating, which is conductive. When there are multiple rack bodies 10, since the circuit boards 70 clamped on each rack body 10 are interconnected through the conductive device 40, the multiple circuit boards 70 in the same electroplating tank 60 will share the current evenly due to the conductive device 40, so that the electroplating effect of the circuit boards 70 in the same electroplating tank 60 is uniform.
[0046] In one embodiment, if Figure 2 As shown, the conductive device 40 also includes a sliding portion, and the conductive connection assembly 50 is used to connect the sliding portion and the second clamp 23. The sliding portion includes a mounting seat 42, a second insulating pad 43 and a sliding block 44. The sliding block 44 is movably connected to the mounting seat 42. The mounting seat 42 is detachably arranged on the bracket body 10. The second insulating pad 43 is arranged between the mounting seat 42 and the bracket body 10 to insulate the interconnection circuit from the bracket body 10. In this embodiment, the conductive device 40 includes a sliding portion, and one end of the conductive connection assembly 50 is connected to the sliding portion and is electrically connected to the secondary conductive track 41 through the sliding portion. The sliding portion includes a mounting seat 42, a second insulating pad 43 and a sliding block 44, wherein the sliding block 44 is movably arranged on the mounting seat 42 and installed on the bracket body 10. In order to prevent the current from being conducted to the bracket body 10, a second insulating pad 43 is arranged between the mounting seat 42 and the bracket body 10, so that the interconnected circuit formed by the conduction of the sliding portion is insulated from the bracket body 10. In other embodiments, since there are multiple sliding portions and the width of the bracket body 10 is limited, in order to facilitate the simultaneous installation of multiple sliding portions, a bracket is installed on the bracket body 10 through a screw connection mechanism, and then multiple sliding portions are installed on the bracket. In order to insulate the sliding portion from the bracket, the second insulating pad 43 can be arranged between the sliding portion and the bracket.
[0047] Furthermore, the sliding part further includes an elastic member 45, which is disposed between the mounting seat 42 and the sliding block 44, and is used to push the sliding block 44 to be in close contact with the secondary conductive track. In this embodiment, in order to allow the sliding block 44 in the sliding part to always keep in contact with the secondary conductive track 41, an elastic member 45 is additionally installed between the sliding block 44 and the mounting seat 42. The elastic member 45 forces the sliding block 44 to always keep in stable contact with the secondary conductive track 41 during movement or when the movement stops through its own elastic force, so as to stabilize the conducting circuit.
[0048] Furthermore, in this embodiment, the sliding block 44 is configured to be block-shaped, and a cutting corner is provided on one side or both sides facing the auxiliary conductive track 41. The cutting corner is provided to facilitate installation. In this embodiment, the sliding block 44 is pushed by the elastic force of the above-mentioned elastic member to keep in contact with the auxiliary conductive track 41 at all times.
[0049] In another embodiment, in order to reduce the wear caused by friction when the sliding part and the auxiliary conductive track 41 are slidably connected, the sliding block 44 is set as a sliding wheel. In this embodiment, the sliding wheel is pushed by the elastic force of the elastic member to keep in contact with the auxiliary conductive track 41 at all times.
[0050] In one embodiment, if Figure 2 As shown, the hanger body 10 is hollow, and the conductive connection component 50 passes through the hanger body 10 and is electrically connected to the second clamp 23. In this embodiment, in order to make the conductive connection component 50 not occupy additional space when installed, in this embodiment, the hanger body 10 is hollow, and when the conductive connection component 50 is set, the conductive connection component 50 can be connected to the first clamp 22 or the second clamp 23 in the clamp assembly 20 after passing through the hanger body 10.
[0051] Further, each chuck assembly 20 includes a chuck fixing plate 21, a plurality of first chucks 22 and a plurality of second chucks 23. The chuck fixing plate 21 is electrically connected to the conductive connection assembly 50, and the plurality of first chucks 22 are detachably disposed on the chuck fixing plate 21. In the present embodiment, in order to ensure that the first chuck 22 and the second chuck 23 in the chuck assembly 20 have a stable clamping effect on the circuit board 70, in the present embodiment, a plurality of first chucks 22 and second chucks 23 are respectively provided in each chuck assembly 20, and the plurality of first chucks 22 are detachably disposed on the chuck fixing plate 21.
[0052] Furthermore, the clamp assembly 20 further includes a first insulating pad 231, and a plurality of second clamps 23 are detachably disposed on the clamp fixing plate 21 through the insulating pad. Since the first clamp 22 and the second clamp 23 in the same clamp assembly 20 are both used to clamp the same circuit board 70, in order to enable the second clamp 23 to stably clamp the circuit board 70, the second clamp 23 is also detachably disposed on the clamp fixing plate 21. In order to prevent the circuit formed by the second clamp 23 and the first clamp 22 from being conductive, a first insulating pad 231 is additionally installed between the second clamp 23 and the clamp fixing plate 21, so that the second clamp 23 is insulated from the clamp fixing plate 21 when being fixed on the clamp fixing plate 21, that is, the second clamp 23 is insulated from the first clamp 22.
[0053] In one embodiment, if Figure 2 As shown, the conductive connection structure is a connecting wire 51 or a conductive flat 52. In this solution, the conductive connection component 50 can be a connecting wire 51 or a conductive flat 52. In this solution, the main conductive track 30 is electrically connected to the clamp assembly 20 through the conductive flat 52, and the conductive device 40 is electrically connected to the clamp assembly 20 through the connecting wire 51, and no further limitation is made to this.
[0054] The above description is only an exemplary embodiment of the present invention, and does not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the technical concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.
Claims
1. A circuit board electroplating rack, characterized in that: include: The main body of the rack; A plurality of clamping head assemblies are arranged on the rack body and used for clamping a plurality of circuit boards, each of the clamping head assemblies comprises a first clamping head and a second clamping head; A main conductive track, on which the hanger body is slidably arranged; A conductive connection assembly, wherein the main conductive track is electrically connected to the first clamps of the plurality of clamp assemblies through the conductive connection assembly to form a plurality of cathode circuits, wherein the cathode circuits are used to provide cathode current to the circuit board; as well as A conductive device, wherein the conductive device is electrically connected to the second clamps of the plurality of clamp assemblies through the conductive connection assembly to form a plurality of interconnected circuits, wherein the first clamp and the second clamp of each clamp assembly clamp the same circuit board, and each cathode circuit is conductively connected to an interconnected circuit through a circuit board, and the plurality of interconnected circuits are used to adjust the cathode currents distributed to the circuit board by the plurality of cathode circuits.
2. The circuit board electroplating rack according to claim 1, characterized in that: The circuit board electroplating rack is applied to an electroplating device, which includes a rectifier, the main conductive track is electrically connected to the cathode of the rectifier through the conductive connection component to form a first cathode loop, and a plurality of cathode circuits are all conductively connected to the first cathode loop; The conductive device includes a secondary conductive track, which is electrically connected to the rectifier through a conductive connection component to form a second cathode loop. A plurality of interconnected circuits are conductive to the second cathode loop, and the first cathode loop is connected in parallel with the second cathode loop.
3. The circuit board electroplating rack according to claim 2, characterized in that: The electroplating device further comprises an electroplating tank, the electroplating tank is used for electroplating the circuit board, the electroplating tank is electrically connected to the anode of the rectifier through the conductive connection component to form an anode circuit, and forms a conductive loop with the first cathode loop and / or the second cathode loop; The rack bodies are provided in plurality, and the circuit boards in the same electroplating tank on the rack bodies are electrically connected via the conductive device.
4. The circuit board electroplating rack according to claim 1, characterized in that: The conductive device also includes a sliding part, which includes a mounting seat, a second insulating pad and a sliding block, wherein the sliding block is movably connected to the mounting seat, the mounting seat is detachably arranged on the bracket body, and the second insulating pad is arranged between the mounting seat and the bracket body to insulate the interconnection circuit from the bracket body.
5. The circuit board electroplating rack as claimed in claim 4, characterized in that: The sliding part further comprises an elastic member, which is arranged between the mounting seat and the sliding block and is used for pushing the sliding block to be in close contact with the secondary conductive track.
6. The circuit board electroplating rack according to claim 5, characterized in that: The sliding block is a sliding wheel.
7. The circuit board electroplating rack according to claim 1, characterized in that: The hanger body is hollow, and the conductive connection component passes through the hanger body and is electrically connected to the second clamp.
8. The circuit board plating rack according to any one of claims 1 to 7, characterized in that: Each of the chuck assemblies comprises a chuck fixing plate, a plurality of first chucks and a plurality of second chucks. The chuck fixing plate is electrically connected to the conductive connection assembly, and the plurality of first chucks are detachably arranged on the chuck fixing plate.
9. The circuit board electroplating rack according to claim 8, characterized in that: The clamp assembly also includes a first insulating pad, and a plurality of the second clamps are detachably arranged on the clamp fixing plate via the insulating pad.
10. The circuit board electroplating rack according to claim 1, characterized in that: The conductive connection structure is a connecting wire or a conductive flat.