Cooling equipment and server

Abstract

The utility model provides cooling equipment and a server. The liquid cooling equipment comprises a heat dissipation assembly and a soaking assembly, the soaking assembly comprises a soaking plate and a first heat dissipation piece, and the soaking plate comprises a first containing cavity for containing a first cooling medium; the first heat dissipation piece extends in the direction perpendicular to the vapor chamber and comprises a first cavity and a second cavity which communicate with the first containing cavity. The second chamber surrounds the outer peripheral surface of the first chamber; the first cavity communicates with the second cavity through a first one-way valve, and the bottom of the second cavity communicates with the first containing cavity through a second one-way valve. The heat dissipation assembly is arranged on the first heat dissipation piece in a sleeving manner and is configured to exchange heat with a first cooling medium; the heated and gasified first cooling medium enters the second cavity through the first one-way valve, exchanges heat with the heat dissipation assembly and then is condensed into a liquid state; the liquid first cooling medium flows back to the bottom of the first containing cavity through the second one-way valve, and the cooling effect of the cooling equipment is improved.

Description

Technical Field

[0001] The present application relates to the technical field of servers, and in particular to a cooling device and a server. Background Art

[0002] With the promotion and application of artificial intelligence technology, the demand for high computing power scenarios is also increasing, causing the average power consumption of chips inside the server to jump from 300W to more than 1000W, which in turn causes the temperature of the server to rise, affecting the normal use of the server. At present, air cooling equipment is usually used to cool the chips inside the server to dissipate heat from the server. However, air cooling technology can no longer meet the heat dissipation needs of the chips inside the server.

[0003] In order to improve the heat dissipation effect of the server, the cooling device in the related art combines the air cooling technology with the vacuum chamber heat dissipation plate technology. However, the above cooling device has insufficient heat transfer capacity, which greatly reduces the cooling capacity of the cooling device. Utility Model Content

[0004] Embodiments of the present application provide a cooling device and a server.

[0005] In a first aspect, an embodiment of the present application provides a liquid cooling device, comprising:

[0006] A heat spreader assembly, the heat spreader assembly comprising a heat spreader and a first heat sink disposed on the heat spreader, the heat spreader comprising a first accommodating chamber for accommodating a first cooling medium; the first heat sink extends in a direction perpendicular to the heat spreader, and comprises a first chamber and a second chamber both in communication with the first accommodating chamber; the second chamber surrounds the outer circumference of the first chamber; the first chamber is in communication with the second chamber via a first one-way valve, and the bottom of the second chamber is in communication with the first accommodating chamber via a second one-way valve;

[0007] A heat dissipation component is mounted on the first heat dissipation component and is configured to exchange heat with the first cooling medium; wherein the heated and vaporized first cooling medium enters the second chamber through the first one-way valve and condenses into liquid after heat exchange with the heat dissipation component; the liquid first cooling medium flows back to the bottom of the first accommodating chamber through the second one-way valve.

[0008] In the cooling device provided in the embodiment of the present application, the inner cavity of the first heat sink disposed on the heat spreader is improved so that the inner cavity includes a first chamber and a second chamber both connected to the first accommodating chamber, and the second chamber surrounds the outer peripheral surface of the first chamber. The first chamber is connected to the second chamber through a first one-way valve, and the bottom of the second chamber is connected to the first accommodating chamber through a second one-way valve. Among them, the first one-way valve allows the first cooling medium that is heated and vaporized in the first accommodating chamber to enter the second chamber, and prevents the first cooling medium that is condensed in the second chamber from entering the first chamber again, so that the condensed first cooling medium flows back to the bottom of the first accommodating chamber along the second chamber. At the same time, the second one-way valve prevents the first cooling medium that is heated and vaporized in the first accommodating chamber from entering the second chamber. With such an arrangement, the flow path of the first cooling medium after being heated and vaporized can be separated from the flow path of the first cooling medium after being condensed. On the one hand, it can prevent the liquid first cooling medium moving from top to bottom from hindering the movement of the gaseous first cooling medium, thereby ensuring that the heat absorbed by the heat spreader is transferred to the first heat sink in a timely manner, thereby improving the heat transfer capacity of the heat spreader component; on the other hand, it can also prevent the gaseous first cooling medium in the first chamber from condensing into liquid too early when the heat dissipation capacity of the heat dissipation component is too strong, thereby preventing the liquid first cooling medium from hindering the movement of the gaseous first cooling medium from bottom to top, thereby improving the heat transfer capacity of the first heat sink, and thereby improving the heat dissipation capacity of the cooling equipment.

[0009] In a possible implementation, the second chamber surrounds the entire outer circumference of the first chamber, and a heat exchange chamber is formed between the top of the second chamber and the top of the first chamber.

[0010] In a possible implementation, the second chamber surrounds the outer circumference of the first chamber portion.

[0011] In a possible implementation, the first heat sink includes a heat dissipation pipe and a cylindrical body; the inner cavity of the heat dissipation pipe constitutes the first chamber, one end of the heat dissipation pipe is connected to the first accommodating cavity, and the other end of the heat dissipation pipe is provided with the first one-way valve;

[0012] The cylindrical body is sleeved on the heat dissipation pipe, and the buffer cavity is formed between the top of the heat dissipation pipe and the top of the cylindrical body; a first connecting hole is arranged on the area opposite to the heat spreader and the second chamber, and the second one-way valve is arranged in the first connecting hole.

[0013] In a possible implementation, the first accommodating cavity includes at least two relatively independently arranged sub-chambers, the bottom surfaces of at least two of the sub-chambers are in contact with the part to be cooled, and the top surfaces of at least two of the sub-chambers are connected to the first chamber and the second chamber of the first heat dissipation part.

[0014] In a possible implementation, there are multiple first heat sinks, and the multiple first heat sinks are arranged on the heat spreader at intervals;

[0015] Any of the at least two sub-chambers is communicated with the first chamber and the second chamber of a portion of the first heat dissipation element.

[0016] In a possible implementation, the heat dissipation assembly includes a heat dissipation housing and a plurality of second heat dissipation members; the heat dissipation housing is disposed on the heat spreader and encloses a second accommodating cavity with the heat spreader; the second accommodating cavity accommodates a second cooling medium;

[0017] A plurality of second heat sinks are spaced apart and sleeved on the first heat sink in a direction perpendicular to the heat spreader and are located in the second accommodating cavity; wherein a flow channel is formed between any adjacent second heat sinks, and the flow channel extends in a direction parallel to the heat spreader.

[0018] In a possible implementation, a liquid inlet pipe is provided on the top surface of the heat dissipation housing facing away from the vapor chamber, the liquid inlet pipe is communicated with the second accommodating cavity, and is located on one side of the inlet end of the circulation channel;

[0019] A flow balancing member is provided between the inlet end of the circulation channel and the liquid inlet pipe, the flow balancing member extends in a direction perpendicular to the heat spreader, and one end of the flow balancing member is connected to the top surface of the heat dissipation housing, and the other end is connected to the heat spreader;

[0020] The flow balancing member includes a plurality of flow balancing portions, and the plurality of flow balancing portions are configured to balance the flow of the second cooling medium in the plurality of flow channels.

[0021] In a possible implementation, the flow balancing member includes a flow balancing plate and a plurality of flow balancing hole groups arranged on the flow balancing plate; the plurality of flow balancing hole groups are arranged at intervals in a direction perpendicular to the heat balancing plate, and each of the flow balancing hole groups is arranged opposite to one of the flow channels to form a flow balancing portion;

[0022] Each of the flow balancing hole groups includes a plurality of flow balancing holes, and each of the flow balancing holes penetrates the flow balancing plate along the thickness direction of the flow balancing plate.

[0023] In a possible implementation, a liquid outlet pipe is provided on the top surface of the heat dissipation housing facing away from the vapor chamber, and the liquid outlet pipe is communicated with the second accommodating chamber;

[0024] The top surface of the heat dissipation housing facing away from the vapor chamber is square, and the liquid inlet pipe and the liquid outlet pipe are arranged at the diagonal positions of the top surface of the heat dissipation housing facing away from the vapor chamber.

[0025] In a possible implementation, the cooling device further includes an annular mounting plate and a locking member, and the mounting plate is provided with a first mounting hole;

[0026] A second mounting hole is provided on the heat spreader, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is provided on the heat spreader and is sleeved on the outer peripheral surface of the heat dissipation component; the locking member is fixedly connected to the member to be cooled after passing through the first mounting hole and the second mounting hole in sequence.

[0027] In a possible implementation, the locking member includes a locking rod and an adapter sleeved on the locking rod;

[0028] The adapter comprises an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.

[0029] In a possible implementation, the locking member further includes an elastic member; the locking rod includes a first boss and a second boss that are spaced apart, and the second boss and the adapter are respectively located on two sides of the annular mounting plate;

[0030] The elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

[0031] In a second aspect, an embodiment of the present application provides a server, comprising a circuit board, a chip, and a cooling device as described in any one of the first aspects; the chip is arranged on the circuit board; the cooling device is arranged on the circuit board, and the heat spreader of the cooling device is attached to the chip.

[0032] Since the server provided in the embodiment of the present application includes the cooling device of the first aspect, the server in the embodiment of the present application also has the effects of the cooling device of the first aspect, which will not be repeated here.

[0033] In addition to the technical problems solved by the embodiments of the present application described above, the technical features that constitute the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions, other technical problems that can be solved by the cooling equipment and server provided by the embodiments of the present application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further described in detail in the specific implementation methods. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, a brief introduction will be given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0035] Figure 1 An exploded schematic diagram of a cooling device provided in one embodiment of the present application;

[0036] Figure 2 for Figure 1 A magnified schematic diagram of the middle A area;

[0037] Figure 3 Schematic diagram of a heat spreader assembly provided for an embodiment of the application Figure 1 ;

[0038] Figure 4 Schematic diagram of a heat spreader assembly provided in one embodiment of the present application Figure 2 ;

[0039] Figure 5 A partial exploded schematic diagram of a cooling device provided in one embodiment of the present application;

[0040] Figure 6 for Figure 5 A magnified schematic diagram of the middle B area;

[0041] Figure 7 Schematic diagram of a heat spreader assembly provided in one embodiment of the present application Figure 3 ;

[0042] Figure 8 A schematic diagram of a current equalizing plate provided in one embodiment of the present application;

[0043] Fig. 9 A top view of a cooling device provided in one embodiment of the present application;

[0044] Fig.10 A three-dimensional diagram of a locking member provided in one embodiment of the present application;

[0045] Fig.11 A schematic diagram of an adapter provided in an embodiment of the present application;

[0046] Fig.12 A schematic diagram of a server provided in accordance with an embodiment of the present application.

[0047] Reference numerals:

[0048] 100: heat soaking assembly;

[0049] 110: heat sink; 111: first accommodating chamber; 1111: sub-chamber; 112: second mounting hole;

[0050] 120: first heat sink; 121: first chamber; 122: second chamber; 123: buffer chamber; 124: heat dissipation pipe; 125: cylindrical body;

[0051] 130: first one-way valve;

[0052] 140: second one-way valve;

[0053] 150: partition;

[0054] 200: heat dissipation component;

[0055] 210: heat dissipation housing; 211: top plate; 2111: groove; 212: annular side plate;

[0056] 220: second heat sink; 221: through hole;

[0057] 230: circulation channel;

[0058] 240: liquid inlet pipe;

[0059] 250: liquid outlet pipe;

[0060] 260: flow equalizing member; 261: flow equalizing portion; 262: flow equalizing plate;

[0061] 300: mounting plate;

[0062] 400: locking member; 410: locking rod; 411: first boss; 412: second boss; 420: adapter; 421: annular body; 422: elastic claw; 430: elastic member;

[0063] 500: Circuit board;

[0064] 600: Chip. DETAILED DESCRIPTION

[0065] As described in the background technology, the cooling device that combines air cooling technology with vacuum heat spreader heat dissipation technology has the problem of insufficient heat transfer capacity. The inventors have found that the reason for this problem is that the heat spreader in the related technology includes a heat dissipation column, and the heat dissipation column extends in a direction perpendicular to the bottom surface of the heat spreader; wherein the heat dissipation column is filled with a cooling medium. The heat dissipation element is mounted on the heat dissipation column. When the cooling medium in the heat spreader absorbs heat and vaporizes, it moves from bottom to top along the height direction of the heat dissipation column, and condenses into liquid through air cooling heat exchange of the heat dissipation element, and flows back along the inner cavity of the heat dissipation column by its own gravity, realizing the heat dissipation function of the cooling device. However, in the process of heat transfer of the heat dissipation column, the heat dissipation column includes both gaseous cooling medium moving from bottom to top and liquid cooling medium moving from top to bottom. In this way, the liquid cooling medium moving from top to bottom will hinder the movement of the gaseous cooling medium, so that the first cooling medium heated and vaporized in the heat spreader cannot be transferred to the heat dissipation element in time, resulting in the defects of insufficient heat transfer capacity and poor cooling effect.

[0066] In view of this, an embodiment of the present application provides a cooling device and a server, by improving the inner cavity of the first heat sink disposed on the heat spreader, so that its inner cavity includes a first chamber and a second chamber that are both connected to the first accommodating chamber, the second chamber surrounds the outer peripheral surface of the first chamber, and the top of the second chamber and the top of the first chamber form a second chamber. The first chamber is connected to the second chamber through a first one-way valve, and the bottom of the second chamber is connected to the first accommodating chamber through a second one-way valve. Among them, the first one-way valve allows the first cooling medium that is heated and vaporized in the first accommodating chamber to enter the second chamber, and prevents the first cooling medium that is condensed in the second chamber from entering the first chamber again, so that the condensed first cooling medium flows along the second chamber to the bottom of the first accommodating chamber. At the same time, the second one-way valve prevents the first cooling medium that is heated and vaporized in the first accommodating chamber from entering the second chamber. With such an arrangement, the flow path of the first cooling medium after being heated and vaporized can be separated from the flow path of the first cooling medium after being condensed. On the one hand, it can prevent the liquid first cooling medium moving from top to bottom from hindering the movement of the gaseous first cooling medium, thereby ensuring that the heat absorbed by the heat spreader is transferred to the first heat sink in a timely manner, thereby improving the heat transfer capacity of the heat spreader component; on the other hand, it can also prevent the gaseous first cooling medium in the first chamber from condensing into liquid too early when the heat dissipation capacity of the heat dissipation component is too strong, thereby preventing the liquid first cooling medium from hindering the movement of the gaseous first cooling medium from bottom to top, thereby improving the heat transfer capacity of the first heat sink, and thereby improving the heat dissipation capacity of the cooling equipment.

[0067] In order to make the above-mentioned purposes, features and advantages of the embodiments of the present application more obvious and understandable, the technical solutions in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work belong to the scope of protection of this application.

[0068] Please refer to the attached Figure 1 To Attachment Fig.11 The embodiment of the present application provides a cooling device, which is used to dissipate heat from a part to be cooled to ensure the normal operation of the part to be cooled. Exemplarily, the cooling device is used to dissipate heat from a server chip. The cooling device has a strong heat dissipation performance and can quickly take away the heat generated by the server chip, ensuring the normal operation of the server chip.

[0069] The cooling device includes a heat spreader assembly 100 and a heat dissipation assembly 200. The heat spreader assembly 100 includes a heat spreader plate 110 and a first heat dissipation member 120. The first heat dissipation member 120 is disposed on the heat spreader plate 110 and extends in a direction perpendicular to the heat spreader plate 110, that is, the first heat dissipation member 120 extends in a vertical direction. The heat spreader plate 110 and the first heat dissipation member 120 both have an inner cavity, and the inner cavities of the two are interconnected. For example, please continue to refer to the attached Figure 3 and attached Figure 4 The heat sink 110 includes a first accommodating cavity 111 , and the first heat dissipation member 120 includes a first chamber 121 and a second chamber 122 . Both the first chamber 121 and the second chamber 122 are connected to the first accommodating cavity 111 .

[0070] The second chamber 122 surrounds the outer circumference of the first chamber 121. The first chamber 121 is connected to the second chamber 122 through the first one-way valve 130, and the bottom of the second chamber 122 is connected to the first accommodating chamber 111 through the second one-way valve 140. The first one-way valve 130 only allows the first cooling medium heated and vaporized in the first accommodating chamber 111 to flow in the first chamber 121; it can also enter the second chamber 122 through the first one-way valve 130, preventing the first cooling medium condensed in the second chamber 122 from entering the first chamber 121 again, so that the condensed first cooling medium flows back to the bottom of the first accommodating chamber 111 along the second chamber 122. At the same time, the second one-way valve 140 prevents the first cooling medium heated and vaporized in the first accommodating chamber 111 from entering the second chamber 122.

[0071] Please continue to refer to the attached Figure 1 , Attachment Figure 5 and attached Figure 6The heat dissipation component 200 is sleeved on the first heat dissipation element 120 and is configured to exchange heat with the first cooling medium. The heat dissipation component 200 may be a plate heat sink or a microchannel heat sink, and the heat dissipation component 200 may be air-cooled or water-cooled, which is not specifically limited in this embodiment.

[0072] During use, it can be ensured that the first cooling medium vaporized by heat in the first accommodating chamber 111 enters the second chamber 122 through the first one-way valve 130, and condenses into liquid after heat exchange with the heat dissipation component 200; the liquid first cooling medium flows back to the bottom of the first accommodating chamber 111 through the second one-way valve 140. It should be noted that the attached Figure 3 and attached Figure 4 In the figure, the solid arrow is used to represent the flow direction of the first cooling medium after being heated and vaporized, and the dotted arrow is used to represent the flow direction of the first cooling medium after being condensed by heat exchange with the heat dissipation component 200.

[0073] With such an arrangement, the present embodiment can separate the flow path of the first cooling medium after being heated and vaporized and the flow path of the first cooling medium after being condensed. On the one hand, it can prevent the liquid first cooling medium moving from top to bottom from hindering the movement of the gaseous first cooling medium, thereby ensuring that the heat absorbed by the heat spreader 110 is promptly transferred to the first heat sink 120, thereby improving the heat transfer capacity of the heat spreader assembly 100; on the other hand, it can also prevent the gaseous first cooling medium in the first chamber 121 from condensing into liquid too early when the heat dissipation capacity of the heat dissipation assembly 200 is too strong, thereby preventing the liquid first cooling medium from hindering the movement of the gaseous first cooling medium from bottom to top, thereby improving the heat transfer capacity of the first heat sink 120, and further improving the heat dissipation capacity of the cooling device.

[0074] In this embodiment, the second chamber 122 surrounds the outer circumference of the first chamber 121 . The second chamber 122 may surround a portion of the outer circumference of the first chamber 121 , or the second chamber 122 may surround the entire outer circumference of the first chamber 121 .

[0075] In one example, the second chamber 122 surrounds part of the outer circumference of the first chamber. For example, the second chamber 122 can be located on one side of the first chamber 121 and surround the outer side of the first chamber 121 so that the height of the second chamber 122 is equal to the height of the first chamber 121. This arrangement can simplify the preparation of the first heat sink 120. It should be noted that the first one-way valve 130 can be set on the side wall of the first chamber 121.

[0076] For another example, please refer to the attached Figure 3, the second chamber 122 is located on one side of the first chamber 121, and the height of the second chamber 122 is greater than that of the first chamber 121, and the second chamber 122 surrounds part of the outer side surface of the first chamber 121, and surrounds the top surface of the first chamber 121. For example, the cross-sectional shape of the second chamber 122 is semicircular, and the second chamber 122 can surround part of the outer circumference of the first chamber 121. Among them, a buffer chamber 123 is formed between the top of the second chamber 122 and the top of the first chamber 121; that is, the height of the first chamber 121 is less than the height of the second chamber 122, so that a buffer chamber 123 is formed between the top of the first chamber 121 and the top of the second chamber 122. It should be understood that the attached Figure 3 and attached Figure 4 The area above the dotted line is the buffer cavity 123 .

[0077] The volume of the buffer chamber 123 is larger than the volume of other areas of the second chamber 122. When the heated and vaporized first cooling medium enters the buffer chamber 123 through the first one-way valve 130, the buffer chamber 123 can slow down the flow rate of the first cooling medium, reduce the impact on the first heat sink 120, and improve the safety of the cooling device. In addition, the heat exchange time between the second cooling medium and the first cooling medium in the buffer chamber 123 can be extended, thereby improving the cooling effect of the cooling device.

[0078] In another example, the second chamber 122 may also surround the entire outer circumference of the first chamber 121, and the top of the second chamber 122 and the top of the first chamber 121 form a buffer chamber 123. Figure 4 , the second chamber 122 surrounds the outer side of the first chamber 121, and surrounds the top surface of the first chamber 121; in other words, the height of the second chamber 122 is greater than that of the first chamber 121. In this way, the second chamber 122 can wrap the first chamber 121, and the buffer chamber 123 can be used to slow down the flow rate of the first cooling medium, reduce the impact on the first heat sink 120, and improve the safety of the cooling device. In addition, the heat exchange time between the second cooling medium and the first cooling medium in the buffer chamber 123 can be extended, thereby improving the cooling effect of the cooling device.

[0079] In view of this embodiment, please continue to refer to the attached Figure 5 and attached Figure 6 , the heat dissipation assembly 200 is sleeved on the first heat dissipation element 120. If the first heat dissipation element 120 includes only one chamber, the distance between the heat dissipation assembly 200 and the chamber of the first heat dissipation element 120 will be shortened. If the heat dissipation capacity of the heat dissipation assembly 200 is strong, the vaporized first cooling medium in the chamber of the first heat dissipation element 120 will condense into liquid prematurely, and then, the liquid first cooling medium will hinder the movement of the heated vaporized first cooling medium from bottom to top during the downward movement, thereby reducing the cooling effect of the cooling device.

[0080] Therefore, in this embodiment, the second chamber 122 surrounds the entire outer circumference of the first chamber 121, and the second chamber 122 is also separated from the heat dissipation component 200 and the first chamber 121. On the one hand, the distance between the heat dissipation component 200 and the first chamber 121 can be extended. Figure 3 The heated and vaporized first cooling medium has enough time to be conducted upward along the vertical heat spreader 110, so that the heated and vaporized first cooling medium can quickly diffuse into the second chamber 122, thereby avoiding the first cooling medium in the first chamber 121 from condensing into liquid too early, thereby improving the heat transfer capacity of the first heat sink 120.

[0081] On the other hand, the first chamber 121 and the second chamber 122 are completely independent chambers. The first chamber 121 only allows the first cooling medium that has been heated and vaporized to flow, and the second chamber 122 only allows the first cooling medium that has been condensed after heat exchange with the heat dissipation component 200 to flow. In this way, the first cooling medium that has been heated and vaporized and the first cooling medium that has been condensed after heat exchange can flow in two relatively independent chambers, thereby preventing the first cooling medium that has been condensed after heat exchange from hindering the movement of the first cooling medium that has been heated and vaporized from bottom to top, thereby improving the cooling effect of the cooling equipment.

[0082] It should be noted that the separation of the first chamber 121 and the second chamber 122 can be achieved by a partition disposed in the first heat sink 120, or can be composed of two relatively independent components. Figure 4 , the first heat sink 120 includes a heat dissipation pipe 124; the inner cavity of the heat dissipation pipe 124 constitutes the first chamber 121, and one end of the heat dissipation pipe 124 is connected to the first accommodating chamber 111. For example, a second connecting hole (not shown in the figure) is provided on the heat spreader 110, and one end of the heat dissipation pipe 124 is fixedly connected in the first connecting hole; the other end of the heat dissipation pipe 124 is provided with a first one-way valve 130, and the first one-way valve 130 is used to allow the first cooling medium after heating and vaporization to flow from the first chamber 121 to the second chamber 122; it should be noted that the heat dissipation pipe 124 can be a cylinder with openings at both ends, or a cylinder with an opening at one end. When the heat dissipation pipe 124 is a cylinder with an opening at one end, the opening faces the heat spreader 110, and a mounting hole is provided on the surface of the heat dissipation pipe 124 facing away from the opening, and the first one-way valve 130 can be provided in the mounting hole.

[0083] The first heat sink 120 also includes a cylindrical body 125, which is sleeved on the heat pipe 124, and a buffer chamber 123 is formed between the top of the heat pipe 124 and the top of the cylindrical body 125; a first connecting hole (not shown in the figure) is provided on the area of ​​the heat spreader 110 opposite to the second chamber 122, and a second one-way valve 140 is provided in the first connecting hole, and the second one-way valve 140 is used to allow the first cooling medium condensed into liquid to flow from the second chamber 122 to the first accommodating chamber 111. The shape of the cylindrical body 125 can be in various forms, for example, the shape of the cylindrical body 125 can be cylindrical. For another example, the shape of the cylindrical body 125 can be a polyhedron, and illustratively, the shape of the cylindrical body 125 is a tetrahedron, a hexahedron or other polyhedron.

[0084] It should be noted that the first accommodating cavity 111 of the heat spreader 110 and the first chamber 121 and the second chamber 122 of the first heat sink 120 are all vacuum chambers. For example, in a specific preparation process, the first cooling medium can be filled into the first accommodating cavity 111 and the first accommodating cavity 111, the first chamber 121 and the second chamber 122 can be evacuated to form a vacuum in the first accommodating cavity 111, the first chamber 121 and the second chamber 122.

[0085] In this embodiment, the first heat sink 120 includes a relatively independent heat sink 124 and a cylindrical body 125, which is beneficial to the preparation of the first heat sink 120 and the reasonable adjustment of the sizes of the first chamber 121 and the second chamber 122. It is also beneficial to the installation of the first check valve 130, reducing the difficulty of assembling the first heat sink 120, and further reducing the production cost of the first heat sink 120.

[0086] In one possible implementation, please refer to the attached Figure 7 The first accommodating chamber 111 includes at least two relatively independent sub-chambers 1111. For example, a partition 150 is provided in the first accommodating chamber 111, and the partition 150 divides the first accommodating chamber 111 into at least two relatively independent sub-chambers 1111. The bottom surfaces of the at least two sub-chambers 1111 are in contact with the part to be cooled, and the top surfaces of the at least two sub-chambers 1111 are in communication with the first chamber 121 and the second chamber 122 of the first heat dissipating element 120.

[0087] In this embodiment, the partition 150 may be a straight plate, and the partition 150 may be perpendicular to the bottom surface of the vapor chamber 110, or may be arranged to be inclined relative to the direction perpendicular to the bottom surface of the vapor chamber 110, so that at least two sub-chambers 1111 are regular shapes. The partition 150 may also be an irregular shape, so that at least two sub-chambers 1111 are irregular shapes.

[0088] Among them, in a direction perpendicular to the bottom surface of the vapor chamber 110, one end of the partition 150 is connected to the bottom surface of the vapor chamber 110, and the other end of the partition 150 is connected to the top surface of the vapor chamber 110, so that the bottom surface of each sub-chamber 1111 formed is in contact with the part to be cooled, and the top surface is in contact with the surface of the first heat sink 120 facing the vapor chamber 110. In this way, the first cooling medium in each sub-chamber 1111 can absorb the heat of the part to be cooled and vaporize. The heated and vaporized first cooling medium can move to the top of the sub-chamber 1111 and move to the second chamber 122 through the first chamber 121 and the first one-way valve 130. The heated and vaporized first cooling medium exchanges heat with the second cooling medium and condenses into liquid. The liquid first cooling medium flows back to the bottom of the sub-chamber 1111 along the second chamber 122 and the second one-way valve 140 under the action of its own gravity. With such an arrangement, when one of the sub-chambers 1111 fails, the other sub-chamber 1111 can still keep working and complete the cooling function of the heat spreader 110, so that the cooling device can perform its cooling function normally.

[0089] It should be noted that, when the first heat sink 120 is a single heat sink, each sub-chamber 1111 is connected to the first chamber 121 and the second chamber 122 of the first heat sink 120. When the first heat sink 120 is composed of a plurality of monomers, each sub-chamber 1111 is connected to the first chamber 121 and the second chamber 122 of some of the monomers.

[0090] For example, please refer to the attached Figure 7 There are multiple first heat sinks 120, each of which has a first chamber 121 and a second chamber 122 that are both connected to the first accommodating chamber 111, and multiple first heat sinks 120 are arranged at intervals on the heat spreader 110. Among at least two sub-chambers 1111, any sub-chamber 1111 is connected to the first chamber 121 and the second chamber 122 of some first heat sinks 120, so that any sub-chamber 1111 and some first heat sinks 120 can form a separate heat spreader assembly 100.

[0091] It should be noted that the arrangement of the plurality of first heat dissipating elements 120 may be reasonably arranged based on the layout of at least two sub-chambers 1111 , and this embodiment does not make any specific limitation thereto.

[0092] Please continue to refer to the attached Figure 1 , Attachment Figure 2 and attached Figure 5The heat dissipation assembly 200 provided in this embodiment includes a heat dissipation housing 210 and a plurality of second heat dissipation members 220. The heat dissipation housing 210 is disposed on the heat spreader 110 and encloses a second accommodating chamber (not shown in the figure) with the heat spreader 110; the second accommodating chamber accommodates a second cooling medium. It should be noted that the projected area of ​​the heat dissipation housing 210 on the heat spreader 110 is smaller than the area of ​​the heat spreader 110, so that the heat dissipation housing 210 and the heat spreader 110 can directly enclose a closed second accommodating chamber.

[0093] The plurality of second heat sinks 220 are spaced apart and sleeved on the first heat sink 120 in a direction perpendicular to the heat spreader 110, and are located in the second accommodation cavity; illustratively, a through hole 221 may be formed on each second heat sink 220, and each first heat sink 120 may pass through the corresponding through hole 221 in sequence to achieve the connection between the plurality of second heat sinks 220 and the first heat sink 120. In this example, the plurality of second heat sinks 220 and the first heat sink 120 are always immersed in the second cooling medium, and the second cooling medium is always in a circulating state, and can exchange heat with the first cooling medium as quickly as possible, so as to improve the cooling effect of the cooling device.

[0094] Among them, a flow channel 230 is formed between any adjacent second heat sinks 220, and the flow channel 230 extends in a direction parallel to the heat spreader 110. In this embodiment, the second heat sink 220 is a heat sink fin, and the shape of the heat sink fin and the heat spreader 110 are both square. The extension direction of the flow channel 230 can be the length direction of the heat spreader 110, or the width direction of the heat spreader 110. Exemplarily, the extension direction of the flow channel 230 can be changed by reasonably setting the positions of the liquid inlet pipe 240 and the liquid outlet pipe 250. For example, the length direction of the heat sink fin is the same as the length direction of the heat spreader 110, that is, for the attached Figure 1 When the heat sink 110 is in the X direction, the liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at intervals along the length direction of the heat sink 110, and the flow channel 230 formed between adjacent heat sink fins extends along the length direction of the heat sink 110, that is, the flow channel 230 is arranged along the adjacent Figure 1 For another example, the length direction of the heat sink fin is the same as the width direction of the heat spreader 110, that is, Figure 1 When the Y direction is in the middle, the liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at intervals along the width direction of the heat spreader 110, and the flow channel 230 formed between adjacent heat dissipation fins extends along the width direction of the heat spreader 110, that is, the flow channel 230 extends along the adjacent Figure 1 Extends in the Y direction.

[0095] In this embodiment, a plurality of second heat sinks 220 are sleeved and fixedly connected to the first heat sink 120, and a plurality of flow channels 230 are formed, so that the second cooling medium can contact each second heat sink 220. The heat carried by the first heat sink 120 can also be transferred to the second heat sink 220. In this configuration, the heat carried by the first heat sink 120 can not only exchange heat with the second cooling medium surrounding it, but also exchange heat with the second cooling medium surrounding the second heat sink 220, which greatly increases the heat dissipation area of ​​the heat dissipation assembly 200 and improves the heat dissipation capacity of the heat dissipation assembly 200.

[0096] In addition, since the heat dissipation area of ​​the heat dissipation assembly 200 is greatly improved, the distance between adjacent second heat dissipation elements 220 can be increased to reduce the resistance of the flow channel 230 and the flow through the second heat dissipation elements 220, thereby reducing the power consumption of the circulation pump of the cooling device.

[0097] Please refer to the attached Figure 1 and attached Figure 5 A liquid inlet pipe 240 is provided on the top surface of the heat dissipation housing 210 facing away from the heat spreader 110. Exemplarily, the heat dissipation housing 210 includes a top plate 211 and an annular side plate 212 provided on the side of the top plate 211 facing the heat spreader 110. The liquid inlet pipe 240 is provided on the top plate 211 and passes through the top plate 211. The liquid inlet pipe 240 is communicated with the second accommodating cavity and is located on the inlet side of the circulation channel 230, so as to provide the second cooling medium to circulate in the second accommodating cavity.

[0098] Please refer to the attached Figure 8 A flow equalizer 260 is disposed between the inlet end of the flow channel 230 and the liquid inlet pipe 240. The flow equalizer 260 extends in a direction perpendicular to the heat spreader 110, and one end of the flow equalizer 260 is connected to the top surface of the heat dissipation housing 210, and the other end is connected to the heat spreader 110.

[0099] Among them, the flow equalizing element 260 includes multiple flow equalizing parts 261, and the multiple flow equalizing parts 261 are configured to balance the flow of the second cooling medium in the multiple circulation channels 230, so that the flow of the second cooling medium in the multiple circulation channels 230 is more uniform and stable, which is beneficial to improving the safety and cooling effect of the cooling equipment.

[0100] In this example, the flow equalizer 260 further includes a flow equalizer plate 262, and a plurality of flow equalizer portions 261 are arranged at intervals on the flow equalizer plate 262, and each flow equalizer portion 261 corresponds to one of the flow channels 230. As a possible implementation of the flow equalizer portion 261, the flow equalizer portion 261 may be an oblong hole extending along the width direction of the heat spreader plate 110, and the oblong hole corresponds to one of the flow channels. In another example, please refer to the attached Figure 8, a plurality of flow balancing hole groups are arranged on the flow balancing plate 262, and the plurality of flow balancing hole groups are arranged at intervals in a direction perpendicular to the heat balancing plate 110, and each flow balancing hole group is arranged opposite to one of the flow channels 230, and constitutes a flow balancing portion 261. It should be noted that the attached Figure 8 The flow-sharing holes within the dotted lines in the figure represent a flow-sharing hole group.

[0101] Each flow balancing hole group includes a plurality of flow balancing holes, and the plurality of flow balancing holes can be arranged at intervals along a direction perpendicular to the extension direction of the flow channel 230, that is, the plurality of flow balancing holes are arranged along the adjacent Figure 1 and attached Figure 5 Each flow balancing hole penetrates the flow balancing plate 262 along the thickness direction of the flow balancing plate 262, so that the second cooling medium located on the side of the flow balancing plate 262 facing the liquid inlet pipe 240 moves through the flow balancing hole to the side of the flow balancing member 260 facing the second heat sink 220. In this way, the second cooling medium can be distributed more effectively, which is conducive to improving the heat exchange efficiency between the second cooling medium and the first cooling medium that is heated and vaporized.

[0102] In one possible implementation, a liquid outlet pipe 250 is provided on the top surface of the heat dissipation shell 210 facing away from the heat spreader 110, and the liquid outlet pipe 250 is connected to the second accommodating cavity; that is, a liquid outlet pipe 250 is provided on the top surface of the top plate 211 of the heat dissipation shell 210, and the liquid outlet pipe 250 penetrates the top plate 211 along the thickness direction of the top plate 211.

[0103] The top surface of the heat spreader 110 of the heat dissipation housing 210 is square. In other words, the top plate 211 of the heat dissipation housing 210 is square. The liquid inlet pipe 240 and the liquid outlet pipe 250 are arranged at the diagonal position of the top surface of the heat dissipation housing 210 away from the heat spreader 110. The top plate 211 includes a first diagonal line and a second diagonal line intersecting each other to attach Figure 1 Taking the orientation shown as an example, the angle between the first diagonal line and the X direction is an acute angle, and the liquid inlet pipe 240 and the liquid outlet pipe 250 can be arranged on the first diagonal line or the second diagonal line. In this way, the flow path of the second cooling medium in the second accommodating cavity can be extended, thereby improving the heat dissipation effect of the cooling device.

[0104] It should be noted that the other ends of the liquid inlet pipe 240 and the liquid outlet pipe 250 may also be connected to a storage box respectively, and the storage box is used to store the first cooling medium to ensure the normal use of the cooling device.

[0105] At least two grooves 2111 are spaced apart on the top plate 211, the bottoms of at least two grooves 2111 are located inside the top plate 211, and the two grooves 2111 have side openings, and the side openings penetrate one side of the top plate 211 along the width direction of the top plate 211, so that the grooves 2111 can be easily held by the operator, which is beneficial to the installation or disassembly of the heat dissipation housing 210 and the heat spreader 110.

[0106] It should be noted that the cooling device disclosed in the embodiment of the present application needs to be installed on the part to be cooled, for example, it needs to be installed on a circuit board. Therefore, the cooling device disclosed in the embodiment of the present application also includes a mounting plate 300 and a locking member 400.

[0107] For example, please refer to the attached Figure 1 , Attachment Figure 5 and attached Fig. 9 The mounting plate 300 is an annular member, and a first mounting hole (not shown in the figure) is provided on the mounting plate 300; a second mounting hole 112 is provided on the heat spreader 110; the second mounting hole 112 is arranged opposite to the first mounting hole. The mounting plate 300 is arranged on the heat spreader 110 and sleeved on the outer peripheral surface of the heat dissipation assembly 200; that is, the mounting plate 300 is sleeved on the outer peripheral surface of the heat dissipation housing 210.

[0108] One end of the locking member 400 passes through the first mounting hole and the second mounting hole 112 in sequence and is fixedly connected to the cooling member. For example, one end of the locking member 400 passes through the first mounting hole and the second mounting hole 112 in sequence and is fixedly connected to the circuit board.

[0109] Please refer to the attached Fig.10 and attached Fig.11 , wherein the locking member 400 includes a locking rod 410 and an adapter 420 , and the adapter 420 is sleeved on the locking rod 410 , wherein the adapter 420 is located below the mounting plate 300 and in the second mounting hole 112 for matching with the second mounting hole 112 .

[0110] Please refer to the attached Fig.11 The adapter 420 includes an annular body 421 and a plurality of elastic claws 422; the plurality of elastic claws 422 are connected to the inner surface of the annular body 421, and the plurality of elastic claws 422 are arranged at intervals along the circumference of the annular body 421. The end of each elastic claw 422 away from the annular body 421 extends toward the center of the annular body 421, so that the diameter of the area surrounded by the plurality of elastic claws 422 gradually decreases in the direction away from the annular body 421. In this way, the adapter 420 can be adapted to locking rods 410 of different sizes, and the connection strength between the heat spreader 110 and the locking member 400 can be improved.

[0111] The locking member 400 further includes an elastic member 430; the elastic member 430 may include a spring. The locking rod 410 includes a first boss 411 and a second boss 412 arranged at intervals, and the second boss 412 and the adapter 420 are respectively located on both sides of the annular mounting plate 300. Figure 1 Taking the illustrated orientation as an example, the second boss 412 is located above the mounting plate 300 , and the adapter 420 is located below the annular mounting plate 300 .

[0112] The elastic member 430 is sleeved on the locking rod 410 and is located between the first boss 411 and the second boss 412 , so as to buffer the installation force, reduce the damage to the circuit board, and increase the service life of the circuit board.

[0113] The present application also provides a server, please refer to the attached Fig.12 The server includes a circuit board 500, a chip 600 and a cooling device described in any of the above embodiments.

[0114] The chip 600 is disposed on the circuit board 500 ; the cooling device is disposed on the circuit board 500 , and the heat spreader 110 of the cooling device is at least attached to the chip.

[0115] Since the server provided in the embodiment of the present application includes the cooling device described in any of the above embodiments, the effects of the cooling device described in any of the above embodiments are also possessed by the server in the embodiment of the present application, which will not be described in detail here.

[0116] It should be noted that other components on the circuit board 500 can also dissipate heat through cooling equipment. For example, other components can contact the bottom surface of the heat spreader 110 with thermally conductive materials to conduct the heat generated by other components to the heat spreader 110.

[0117] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, or it can be an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.

[0118] In the embodiments of the present application, the devices or elements referred to or implied must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In the description of the embodiments of the present application, the meaning of "multiple" is two or more, unless otherwise precisely and specifically specified.

[0119] The terms "first", "second", "third", "fourth", etc. (if any) in the specification and claims of the embodiments of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "may include" and "have" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0120] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the embodiments of the present application, rather than to limit them. Although the embodiments of the present application have been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents, and these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A cooling device, characterized in that: include: A heat spreader assembly, the heat spreader assembly comprising a heat spreader and a first heat sink disposed on the heat spreader, the heat spreader comprising a first accommodating chamber for accommodating a first cooling medium; the first heat sink extends in a direction perpendicular to the heat spreader, and comprises a first chamber and a second chamber both in communication with the first accommodating chamber; the second chamber surrounds the outer circumference of the first chamber; the first chamber is in communication with the second chamber via a first one-way valve, and the bottom of the second chamber is in communication with the first accommodating chamber via a second one-way valve; A heat dissipation component is mounted on the first heat dissipation component and is configured to exchange heat with the first cooling medium; wherein the heated and vaporized first cooling medium enters the second chamber through the first one-way valve and condenses into liquid after heat exchange with the heat dissipation component; the liquid first cooling medium flows back to the bottom of the first accommodating chamber through the second one-way valve.

2. The cooling device according to claim 1, characterized in that: The second chamber surrounds the entire outer circumference of the first chamber, and a buffer chamber is formed between the top of the second chamber and the top of the first chamber.

3. The cooling device according to claim 1, characterized in that: The second chamber surrounds the outer circumference of the first chamber portion.

4. The cooling device according to claim 2, characterized in that: The first heat sink comprises a heat dissipation pipe and a cylindrical body; The inner cavity of the heat dissipation pipe constitutes the first chamber, one end of the heat dissipation pipe is connected to the first accommodating cavity, and the other end of the heat dissipation pipe is provided with the first one-way valve; The cylindrical body is sleeved on the heat dissipation pipe, and the buffer cavity is surrounded by the top of the heat dissipation pipe and the top of the cylindrical body; a first connecting hole is arranged on the area opposite to the heat spreader and the second chamber, and the second one-way valve is arranged in the first connecting hole.

5. The cooling device according to any one of claims 1 to 4, characterized in that: The first accommodating cavity includes at least two relatively independently arranged sub-chambers, the bottom surfaces of at least two of the sub-chambers are in contact with the part to be cooled, and the top surfaces of at least two of the sub-chambers are connected to the first chamber and the second chamber of the first heat dissipation part.

6. The cooling device according to claim 5, characterized in that There are multiple first heat sinks, and the multiple first heat sinks are arranged on the heat spreader at intervals; Any of the at least two sub-chambers is communicated with the first chamber and the second chamber of a portion of the first heat dissipation element.

7. The cooling device according to any one of claims 1 to 4, characterized in that: The heat dissipation assembly includes a heat dissipation housing and a plurality of second heat dissipation members; the heat dissipation housing is disposed on the heat spreader and encloses a second accommodating cavity with the heat spreader; the second accommodating cavity accommodates a second cooling medium; A plurality of second heat sinks are spaced apart and sleeved on the first heat sink in a direction perpendicular to the heat spreader and are located in the second accommodating cavity; wherein a flow channel is formed between any adjacent second heat sinks, and the flow channel extends in a direction parallel to the heat spreader.

8. The cooling device according to claim 7, characterized in that A liquid inlet pipe is provided on the top surface of the heat dissipation housing facing away from the heat spreader, the liquid inlet pipe is communicated with the second accommodating cavity and is located on one side of the inlet end of the circulation channel; A flow balancing member is arranged between the inlet end of the circulation channel and the liquid inlet pipe, and the flow balancing member extends in a direction perpendicular to the heat spreader, and one end of the flow balancing member is connected to the top surface of the heat dissipation shell, and the other end is connected to the heat spreader; the flow balancing member includes a plurality of flow balancing parts, and the plurality of flow balancing parts are configured to balance the flow of the second cooling medium in the plurality of circulation channels.

9. The cooling device according to claim 8, characterized in that The flow balancing member includes a flow balancing plate and a plurality of flow balancing hole groups arranged on the flow balancing plate; the plurality of flow balancing hole groups are arranged at intervals in a direction perpendicular to the heat balancing plate, and each of the flow balancing hole groups is arranged opposite to one of the flow channels to form a flow balancing portion; Each of the flow balancing hole groups includes a plurality of flow balancing holes, and each of the flow balancing holes penetrates the flow balancing plate along the thickness direction of the flow balancing plate.

10. The cooling device according to claim 8 or 9, characterized in that: A liquid outlet pipe is provided on the top surface of the heat dissipation housing facing away from the heat spreader, and the liquid outlet pipe is communicated with the second accommodating chamber; The top surface of the heat dissipation housing facing away from the vapor chamber is square, and the liquid inlet pipe and the liquid outlet pipe are arranged at the diagonal positions of the top surface of the heat dissipation housing facing away from the vapor chamber.

11. The cooling device according to any one of claims 1 to 4, characterized in that: The cooling device further comprises an annular mounting plate and a locking member, wherein the mounting plate is provided with a first mounting hole; A second mounting hole is provided on the heat spreader, and the second mounting hole is arranged opposite to the first mounting hole; the annular mounting plate is arranged on the heat spreader and is sleeved on the outer peripheral surface of the heat dissipation component; the locking member is fixedly connected to the member to be cooled after passing through the first mounting hole and the second mounting hole in sequence.

12. The cooling device according to claim 11, characterized in that The locking member comprises a locking rod and an adapter sleeved on the locking rod; The adapter comprises an annular body and a plurality of elastic claws; the plurality of elastic claws are connected to the inner surface of the annular body, and the plurality of elastic claws are arranged at intervals along the circumference of the annular body.

13. The cooling device according to claim 12, characterized in that The locking member further comprises an elastic member; the locking rod comprises a first boss and a second boss which are spaced apart, the second boss and the adapter being respectively located on two sides of the annular mounting plate; The elastic member is sleeved on the locking rod and is located between the first boss and the second boss.

14. A server, characterized in that: It comprises a circuit board, a chip and the cooling device according to any one of claims 1 to 13; the chip is arranged on the circuit board; The cooling device is arranged on the circuit board, and a heat spreader of the cooling device is attached to the chip.

Images