Adhesive platform

Abstract

The utility model relates to the technical field of gluing platforms, and particularly discloses a gluing platform which comprises a base and a gluing table, a containing groove is formed in the base, the gluing table is located in the containing groove, and a first gluing area and a second gluing area are arranged at the top of the gluing table. The depth of the first gluing area is larger than that of the second gluing area so as to be suitable for chips with different protruding point heights, a glue inlet channel is arranged in the middle of the gluing table, penetrates through the top face and the bottom face of the gluing table, and is located between the first gluing area and the second gluing area. A glue inlet channel is formed in the bottom of the base, a glue inlet hole communicated with the glue inlet channel is formed in the bottom of the base, a glue storage groove is defined by the outer wall of the gluing table and the inner wall of the base, scaling powder is driven into the glue inlet channel from the glue inlet hole, conveyed to the top face of the gluing table from the glue inlet channel and moved to the position between the first gluing area and the second gluing area, and the conveying amount does not need to be accurately controlled. The soldering flux is easy and convenient to convey, the precision requirement is low, and the cost is relatively low.

Description

Technical Field

[0001] The utility model relates to the technical field of glue platforms, in particular to a glue platform. Background Art

[0002] With the rapid development of the semiconductor industry, chip forming technology has also become mature, and chip flipping is an important process step in chip forming. In this process, the bumps of the flip chip need to be welded to the substrate. Before welding, the bumps need to be bonded with flux to ensure complete welding. In the existing technology, flux is provided to the bumps through an adhesive platform.

[0003] The existing viscose platform has the following disadvantages:

[0004] 1. The existing adhesive platform uses a scraper to scrape the corresponding flux, which is troublesome to add flux, and the overall structure is complex and the cost is high;

[0005] 2. Chip products with different height specifications require the use of different adhesive platforms, resulting in increased costs. Summary of the invention

[0006] The utility model is made in consideration of the above-mentioned problems. The utility model aims to provide an adhesive platform, which is easy to add soldering flux, can be applied to chip products of different heights, and has low cost.

[0007] In order to achieve the above object, the utility model provides a gluing platform, comprising:

[0008] A base having a receiving groove therein;

[0009] A glue table is located in the receiving groove, the top of the glue table is provided with a first glue area and a second glue area, the depth of the first glue area is greater than the depth of the second glue area; a glue inlet channel is provided in the middle of the glue table, the glue inlet channel runs through the top and bottom surfaces of the glue table and is used to supply glue to the first glue area and the second glue area, and a glue inlet hole connected to the glue inlet channel is provided at the bottom of the base;

[0010] The outer wall of the glue table and the inner wall of the base are combined to form a glue storage tank.

[0011] According to the above-mentioned glue platform, a third glue area is further provided on the glue platform, and the depth of the third glue area is less than the depth of the second glue area.

[0012] According to the above-mentioned glue platform, a glue outlet hole is further provided at the bottom of the base, and the glue outlet hole is communicated with the glue storage tank.

[0013] The adhesive platform described above further includes a cover, which can be rotatably buckled onto the base to seal the receiving groove.

[0014] According to the above-mentioned adhesive platform, the cover is provided with an observation window, and the observation window can be located above the first adhesive area or the second adhesive area.

[0015] The utility model has the following beneficial effects:

[0016] 1. The flux can be poured into the glue inlet channel and flow into each adhesive area. Even if too much flux is poured, it can flow into the glue storage tank and circulate, so as to load the flux. It has a simple structure, convenient loading and low cost.

[0017] 2. A cover is provided to prevent dust from falling into the flux and ensure its purity;

[0018] 3. An observation window is provided on the cover, through which the liquid level of the flux in each adhesive area can be clearly observed, making it easy to control the liquid level of the flux. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the embodiment;

[0020] Figure 2 1 is a schematic diagram of the assembly of the gluing table and the base of the embodiment;

[0021] Figure 3 2 is a schematic diagram of the bottom structure of the base of the embodiment.

[0022] In the figure: 1. base; 11. glue storage tank; 12. glue inlet hole; 13. glue outlet hole; 2. glue table; 21. first glue area; 22. second glue area; 23. third glue area; 24. glue inlet channel; 3. cover; 31. observation window. DETAILED DESCRIPTION

[0023] The following are specific embodiments of the present invention and the accompanying drawings to further describe the technical solution of the present invention, but the present invention is not limited to these embodiments.

[0024] like Figure 1-3As shown, a glue platform includes a base 1 and a glue platform 2. A receiving groove is provided in the base 1, and the glue platform 2 is located in the receiving groove. A first glue area 21 and a second glue area 22 are provided on the top of the glue platform 2. The depth of the first glue area 21 is greater than the depth of the second glue area 22, so as to be suitable for chips with different bump heights. In this embodiment, a glue feed channel 24 is provided in the middle of the glue platform 2. The glue feed channel 24 runs through the top and bottom surfaces of the glue platform 2. The glue feed channel 24 is located between the first glue area 21 and the second glue area 22, and is used to Glue is supplied to the first glue area 21 and the second glue area 22, and a glue inlet hole 12 connected to the glue inlet channel 24 is provided at the bottom of the base 1. The outer wall of the glue table 2 and the inner wall of the base 1 are surrounded by a glue storage tank 11. The flux is injected into the glue inlet channel 24 from the glue inlet hole 12, and is transported from the glue inlet channel 24 to the top surface of the glue table 2, and moves to between the first glue area 21 and the second glue area 22. There is no need to accurately control the delivery amount. Even if there is too much flux, it will overflow into the glue storage tank 11. The flux delivery is simple, the precision requirement is low, and the cost is relatively low.

[0025] In this embodiment, a third glue area 23 is further provided on the glue platform 2. The depth of the third glue area 23 is less than the depth of the second glue area 22, so that multiple partitions can be achieved. Of course, a fourth glue area, a fifth glue area, etc. can also be provided, which should not exceed the protection scope of this application.

[0026] In order to realize liquid circulation in the glue storage tank 11, a glue outlet hole 13 is further provided at the bottom of the base 1. The glue outlet hole 13 is connected to the glue storage tank 11. The soldering flux in the storage tank can be discharged through the glue outlet hole 13 to avoid excessive accumulation.

[0027] In order to achieve the sealing of the receiving groove, a cover 3 is also included, which can be rotatably buckled onto the base 1 to seal the receiving groove, thereby preventing dust from entering the receiving groove and preventing the flux from being contaminated. At the same time, an observation window 31 is provided on the cover 3, and the observation window 31 can rotate with the cover 3 to adjust the position of the observation window 31 so that it is located above the first adhesive area 21 or the second adhesive area 22 or other adhesive areas, so as to observe the flux liquid level in the adhesive area and accurately judge whether it needs to be added.

[0028] The technical solution of the utility model is described in detail above in conjunction with the accompanying drawings, and the described embodiments are used to help understand the idea of ​​the utility model. The specific embodiments described herein are merely examples of the spirit of the utility model. A person skilled in the art of the utility model may make various modifications or supplements to the described specific embodiments or replace them in a similar manner, but this will not deviate from the spirit of the utility model or exceed the scope defined by the attached claims.

[0029] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0030] In addition, in the present invention, the descriptions of "first", "second", "one", etc. are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present invention, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In the present invention, unless otherwise clearly specified and limited, the terms "connection", "fixation", etc. should be understood in a broad sense. For example, "fixation" can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0032] In addition, the technical solutions between the various embodiments of the present invention can be combined with each other, but it must be based on the fact that ordinary technicians in the field can implement it. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present invention.

Claims

1. A glue platform, characterized in that: include: A base having a receiving groove therein; A glue table is located in the receiving groove, the top of the glue table is provided with a first glue area and a second glue area, the depth of the first glue area is greater than the depth of the second glue area; a glue inlet channel is provided in the middle of the glue table, the glue inlet channel runs through the top and bottom surfaces of the glue table and is used to supply glue to the first glue area and the second glue area, and a glue inlet hole connected to the glue inlet channel is provided at the bottom of the base; The outer wall of the glue table and the inner wall of the base are combined to form a glue storage tank.

2. The adhesive platform according to claim 1, characterized in that: The glue table is further provided with a third glue area, and the depth of the third glue area is less than the depth of the second glue area.

3. The adhesive platform according to claim 1, characterized in that: The bottom of the base is also provided with a glue outlet hole, and the glue outlet hole is communicated with the glue storage tank.

4. The adhesive platform according to claim 1, characterized in that: It also includes a cover, which can be rotatably buckled onto the base to seal the receiving groove.

5. The gluing platform according to claim 4, characterized in that: The cover is provided with an observation window, and the observation window may be located above the first adhesive area or the second adhesive area.

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