Electroplating frame of thin film circuit board

Abstract

The utility model relates to the technical field of circuit board films, and discloses an electroplating frame of a film circuit board, which comprises an electroplating frame body, a fixing component is arranged on the left side of the electroplating frame body, and a supporting component is arranged in the electroplating frame body. And the fixing assembly comprises a fixing box fixedly mounted on the left side of the electroplating frame body, a rotating shaft is arranged in the fixing box, a manual assembly for driving the rotating shaft to rotate is arranged in the fixing box, and a transverse assembly for supporting the rotating shaft is arranged in the fixing box. According to the electroplating frame of the thin-film circuit board, the thin-film circuit board can be fixed in the electroplating frame body by arranging the fixing assembly, so that the thin-film circuit board can be fixed more stably, thin-film circuit boards of different models can be fixed, and the stability of the thin-film circuit board during electroplating is ensured; and the practicability of the thin film circuit board electroplating frame is greatly improved.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board films, in particular to an electroplating frame of a film circuit board. Background Art

[0002] A thin film circuit board is a flexible circuit board made of PET film as a substrate and is flexible. During the processing of the thin film circuit board, it needs to be electroplated. In the circuit board electroplating process, a plating frame is needed to fix the circuit board and send it into the electroplating equipment.

[0003] The existing electroplating frame for thin film circuit boards is generally a square frame, and the thin film circuit board is then placed inside the electroplating frame and fixed. However, in actual use, the size of the electroplating frame is fixed and can only fix and place thin film circuit boards of specific models, which reduces the practicality of the thin film circuit board. Therefore, a plating frame for thin film circuit boards is proposed to solve the above problem. Utility Model Content

[0004] (1) Technical problems solved

[0005] In response to the shortcomings of the existing technology, the utility model provides a plating frame for a thin film circuit board, which has the advantages of being able to fix different types of thin film circuit boards. It solves the problem that the size of the existing electroplating frame for thin film circuit boards is fixed and can only fix and place specific types of thin film circuit boards, which reduces the practicality of the thin film circuit boards.

[0006] (2) Technical solution

[0007] In order to achieve the above-mentioned purpose of fixing different types of thin film circuit boards, the utility model provides the following technical solution: a plating frame for a thin film circuit board, comprising an electroplating frame body, a fixing component is provided on the left side of the electroplating frame body, and a supporting component is provided inside the electroplating frame body.

[0008] The fixing assembly includes a fixing box fixedly installed on the left side of the electroplating frame body, a rotating shaft is provided inside the fixing box, a manual assembly for driving the rotating shaft to rotate is provided inside the fixing box, a horizontal assembly for supporting the rotating shaft is provided inside the fixing box, and the left side wall of the inner cavity of the fixing box is rotatably connected to two threaded sleeves with one end passing through and extending into the inside of the electroplating frame body, the outer sides of the two threaded sleeves are provided with bevel gear assemblies for driving them to rotate, the interiors of the two threaded sleeves are threadedly connected to threaded rods, and abutment plates are fixedly installed on the right sides of the two threaded rods.

[0009] Furthermore, the manual assembly includes a rotating rod rotatably connected to the front of the fixed box and penetrating into the interior thereof, a knob is fixedly mounted on the front of the rotating rod, and an engaging assembly is provided on the outer side of the rotating rod.

[0010] Furthermore, the support assembly includes two mounting posts fixedly mounted on the right side wall of the inner cavity of the electroplating frame body, and a support plate is fixedly mounted on the left side of the two mounting posts.

[0011] Furthermore, four evenly distributed bases are fixedly mounted on the inner bottom wall of the electroplating frame body.

[0012] Furthermore, the transverse assembly includes two transverse plates fixedly mounted on the left side wall of the inner cavity of the fixed box, and the rotating shaft is rotatably connected to the inside of the two transverse plates through bearings.

[0013] Furthermore, the bevel gear assembly includes driving bevel gears fixedly mounted on the top and bottom of the rotating shaft, and driven bevel gears meshing with the driving bevel gears are fixedly mounted on the outer sides of the two threaded sleeves.

[0014] Furthermore, two rotation holes penetrating into the interior of the fixing box are provided on the left side wall of the inner cavity of the electroplating frame body, and the outer surfaces of the two threaded sleeves are rotatably connected to the two rotation holes respectively.

[0015] Furthermore, the meshing assembly includes a worm fixedly mounted on the outside of the rotating rod, and a worm wheel meshing with the worm is fixedly mounted on the outside of the rotating shaft.

[0016] (3) Beneficial effects

[0017] Compared with the prior art, the present invention provides a plating frame for a thin film circuit board, which has the following beneficial effects:

[0018] The electroplating frame of the thin film circuit board can fix the thin film circuit board inside the electroplating frame body by setting a fixing component. While ensuring that the thin film circuit board is fixed more stably, it can also fix different models of thin film circuit boards to ensure the stability of the thin film circuit board during electroplating, greatly increasing the practicality of the thin film circuit board electroplating frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of the utility model;

[0020] Figure 2 It is a left side cross-sectional view of the fixed component in the structure of the utility model;

[0021] Figure 3 For the utility model structure Figure 1 A magnified view of middle A;

[0022] Figure 4In the structure of this utility model Figure 1 Schematic diagram of the three-dimensional structure.

[0023] In the figure: 1. Electroplating frame body; 2. Fixing assembly; 201. Fixing box; 202. Rotating shaft; 203. Manual assembly; 2031. Rotating rod; 2032. Knob; 2033. Engaging assembly; 204. Horizontal assembly; 205. Threaded sleeve; 206. Bevel gear assembly; 207. Threaded rod; 208. Abutment plate; 3. Support assembly; 301. Mounting column; 302. Support plate; 4. Base. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0025] Example 1: Please refer to Figure 1-4 In this embodiment, a plating frame for a thin film circuit board includes a plating frame body 1, a fixing component 2 is provided on the left side of the plating frame body 1, and a supporting component 3 is provided inside the plating frame body 1.

[0026] The thin film circuit board can be placed inside the electroplating frame body 1. At the same time, four evenly distributed bases 4 are fixedly installed on the inner bottom wall of the electroplating frame body 1, and the thin film circuit board can be supported by the four bases 4.

[0027] Example 2: Please refer to Figure 1-4 On the basis of Example 1, the fixing component 2 includes a fixing box 201 fixedly installed on the left side of the electroplating frame body 1, a rotating shaft 202 is provided inside the fixing box 201, a manual component 203 for driving the rotating shaft 202 to rotate is provided inside the fixing box 201, a horizontal component 204 for supporting the rotating shaft 202 is provided inside the fixing box 201, and the left side wall of the inner cavity of the fixing box 201 is rotatably connected to two threaded sleeves 205 with one end passing through and extending into the interior of the electroplating frame body 1, and the outer sides of the two threaded sleeves 205 are provided with bevel gear components 206 for driving them to rotate, and the interiors of the two threaded sleeves 205 are threadedly connected to threaded rods 207, and the right sides of the two threaded rods 207 are fixedly installed with abutment plates 208.

[0028] It should be noted that the manual component 203 includes a rotating rod 2031 rotatably connected to the front of the fixed box 201 and extending into the interior thereof, a knob 2032 is fixedly mounted on the front of the rotating rod 2031 , and an engaging component 2033 is provided on the outer side of the rotating rod 2031 .

[0029] The bottom of the rotating rod 2031 is rotatably connected to the rear side wall of the inner cavity of the fixed box 201 to ensure the stability of the rotation of the rotating rod 2031. When the knob 2032 is rotated, the knob 2032 will drive the rotating rod 2031 to rotate.

[0030] In addition, the meshing assembly 2033 includes a worm fixedly mounted on the outside of the rotating rod 2031, and a worm wheel meshing with the worm is fixedly mounted on the outside of the rotating shaft 202. When the rotating rod 2031 rotates, the rotating rod 2031 drives the worm to rotate, the worm drives the worm wheel meshing with it to rotate, and the worm wheel drives the rotating shaft 202 to rotate.

[0031] Among them, the horizontal component 204 includes two horizontal plates fixedly installed on the left side wall of the inner cavity of the fixed box 201, and the rotating shaft 202 is rotatably connected to the inside of the two horizontal plates through bearings. The two horizontal plates and bearings can provide stable support for the rotating shaft 202, ensuring the stability of the rotating shaft 202 and preventing the rotating shaft 202 from shifting up and down.

[0032] It should be noted that the bevel gear assembly 206 includes a driving bevel gear fixedly mounted on the top and bottom of the rotating shaft 202, and a driven bevel gear meshing with the driving bevel gear is fixedly mounted on the outer side of the two threaded sleeves 205. When the rotating shaft 202 rotates, the rotating shaft 202 will drive the two driving bevel gears to rotate, and the two driving bevel gears will drive the two driven bevel gears to rotate, and the two driven bevel gears will respectively drive the two threaded sleeves 205 to rotate.

[0033] Among them, the left side wall of the inner cavity of the electroplating frame body 1 is provided with two rotating holes that penetrate into the interior of the fixed box 201. The outer surfaces of the two threaded sleeves 205 are rotatably connected to the two rotating holes respectively, and the rotation stability of the two threaded sleeves 205 is ensured by the two rotating holes.

[0034] It should be noted that because the right sides of the two threaded rods 207 are fixedly connected to the left side of the abutment plate 208, the two threaded rods 207 will not rotate. When the two threaded sleeves 205 rotate, under the action of the threaded thrust, the two threaded sleeves 205 will respectively drive the two threaded rods 207 to move to the right, and the two threaded rods 207 will drive the abutment plate 208 to move to the right.

[0035] Example 3: Please refer to Figure 1Based on the first and second embodiments, the support assembly 3 includes two mounting posts 301 fixedly mounted on the right side wall of the inner cavity of the electroplating frame body 1 , and a support plate 302 is fixedly mounted on the left side of the two mounting posts 301 .

[0036] Among them, the right side of the thin film circuit board can be supported by two mounting columns 301 and the support plate 302. When fixing the thin film circuit board, first place the thin film circuit board inside the electroplating frame body 1. At the same time, make the bottom of the thin film circuit board abut against the top of the four bases 4, and the right side of the thin film circuit board abut against the left side of the support plate 302. Then turn the knob 2032 to make the abutment plate 208 move to the right. When the right side of the abutment plate 208 abuts against the left side of the thin film circuit board, the thin film circuit board can be fixed by the abutment plate 208 and the support plate 302.

[0037] The working principle of the above embodiment is:

[0038] When using the electroplating frame of the thin film circuit board, the thin film circuit board is first placed inside the electroplating frame body 1, and at the same time, the bottom of the thin film circuit board is abutted against the tops of the four bases 4, and the right side of the thin film circuit board is abutted against the left side of the support plate 302. Then, the knob 2032 is turned, and the knob 2032 drives the rotating rod 2031 to rotate, and the rotating rod 2031 drives the worm to rotate, and the worm drives the worm gear engaged with it to rotate, and the worm gear drives the rotating shaft 202 to rotate, and the rotating shaft 202 drives The two active bevel gears are driven to rotate, and the two active bevel gears drive the two driven bevel gears to rotate. The two driven bevel gears respectively drive the two threaded sleeves 205 to rotate. Under the action of the thread thrust, the two threaded sleeves 205 respectively drive the two threaded rods 207 to move to the right, and the two threaded rods 207 drive the abutment plate 208 to move to the right until the right side of the abutment plate 208 abuts against the left side of the thin film circuit board. The thin film circuit board can be fixed by the abutment plate 208 and the support plate 302.

[0039] The electrical components mentioned in this article are all electrically connected to the main controller and the power supply. The main controller can be a conventional known device that controls a computer, etc., and the existing public power connection technology is not described in detail in this article.

[0040] It should be noted that the terms "comprises," "includes," or any other variations thereof are intended to encompass non-exclusive inclusion, such that a process, method, article, or apparatus that includes a series of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus. In the absence of further limitations, an element defined by the phrase "comprises a ..." does not preclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0041] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A plating frame for a thin film circuit board, comprising a plating frame body (1), characterized in that: A fixing component (2) is arranged on the left side of the electroplating frame body (1), and a supporting component (3) is arranged inside the electroplating frame body (1); The fixing assembly (2) comprises a fixing box (201) fixedly mounted on the left side of the electroplating frame body (1); a rotating shaft (202) is arranged inside the fixing box (201); a manual assembly (203) for driving the rotating shaft (202) to rotate is arranged inside the fixing box (201); a transverse assembly (204) for supporting the rotating shaft (202) is arranged inside the fixing box (201); two threaded sleeves (205) are rotatably connected to the left side wall of the inner cavity of the fixing box (201), one end of which passes through and extends into the inside of the electroplating frame body (1); the outer sides of the two threaded sleeves (205) are both provided with bevel gear assemblies (206) for driving them to rotate; the interiors of the two threaded sleeves (205) are both threadedly connected with threaded rods (207); and abutment plates (208) are fixedly mounted on the right sides of the two threaded rods (207).

2. The electroplating frame of a thin film circuit board according to claim 1, characterized in that: The manual assembly (203) comprises a rotating rod (2031) rotatably connected to the front of the fixed box (201) and penetrating into the interior thereof, a knob (2032) is fixedly mounted on the front of the rotating rod (2031), and an engaging assembly (2033) is arranged on the outer side of the rotating rod (2031).

3. The electroplating frame of a thin film circuit board according to claim 1, characterized in that: The support assembly (3) comprises two mounting posts (301) fixedly mounted on the right side wall of the inner cavity of the electroplating frame body (1), and a support plate (302) is fixedly mounted on the left side of the two mounting posts (301).

4. The electroplating frame of a thin film circuit board according to claim 1, characterized in that: Four evenly distributed bases (4) are fixedly mounted on the inner bottom wall of the electroplating frame body (1).

5. The electroplating frame of a thin film circuit board according to claim 1, characterized in that: The transverse assembly (204) comprises two transverse plates fixedly mounted on the left side wall of the inner cavity of the fixed box (201), and the rotating shaft (202) is rotatably connected to the inside of the two transverse plates via a bearing.

6. The electroplating frame of a thin film circuit board according to claim 1, characterized in that: The bevel gear assembly (206) comprises driving bevel gears fixedly mounted on the top and bottom of the rotating shaft (202), and driven bevel gears meshing with the driving bevel gears are fixedly mounted on the outer sides of the two threaded sleeves (205).

7. The electroplating frame of a thin film circuit board according to claim 1, characterized in that: The left side wall of the inner cavity of the electroplating frame body (1) is provided with two rotation holes penetrating into the interior of the fixing box (201), and the outer surfaces of the two threaded sleeves (205) are rotatably connected to the two rotation holes respectively.

8. The electroplating frame of a thin film circuit board according to claim 2, characterized in that: The meshing assembly (2033) comprises a worm fixedly mounted on the outside of the rotating rod (2031), and a worm wheel meshing with the worm is fixedly mounted on the outside of the rotating shaft (202).

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