Low-cost Beidou communication mobile phone accessory

Abstract

The utility model relates to the technical field of Beidou communication mobile phone accessories, in particular to a low-cost Beidou communication mobile phone accessory, which comprises a chip main body, a plurality of groups of clamping grooves used for connection are arranged on the peripheral surface of the chip main body, clamping blocks used for connection are mounted on the inner sides of the clamping grooves in a clamping manner, and the chip main body and the clamping blocks are connected through the chip main body. A shell cover located on the periphery of the chip body is integrally formed on the surfaces of the top ends of the multiple sets of clamping blocks. When the Beidou communication mobile phone accessory is used, the shell cover can be connected with the clamping groove in the periphery of the chip body in a clamped mode through the clamping block, the shell cover can be conveniently installed on the periphery of the chip body, the shell cover can protect structural components on the surface of the chip body, meanwhile, the shell cover is integrally formed in a die-casting mode, the structure is simple, and the cost is low. The chip is convenient to install and low in cost, so that structural components on the surface of the chip main body can operate more safely.

Description

Technical Field

[0001] The utility model relates to the technical field of Beidou communication mobile phone accessories, in particular to low-cost Beidou communication mobile phone accessories. Background Art

[0002] Mobile phone accessories undoubtedly refer to the accessories directly related to the use of mobile phones, which are what we usually call secondary mobile phone products. Mobile phone accessories mainly include two categories: internal mobile phone accessories and external mobile phone accessories; and generally, Beidou GPS modules are installed inside mobile phones to complete positioning navigation or location sharing operations, but generally Beidou GPS modules are directly installed in the corresponding position inside the mobile phone. For example, the various structural components on the surface of the GPS03 module are directly exposed. If it is shaken or rubbed during use, it is easy to cause scratches and damage to the components on the surface of the circuit board. For this reason, we propose low-cost Beidou communication mobile phone accessories. Utility Model Content

[0003] In view of the problems in the prior art, the utility model provides a low-cost Beidou communication mobile phone accessory.

[0004] The technical solution adopted by the utility model to solve the technical problem is a low-cost Beidou communication mobile phone accessory, comprising a chip body, a card slot for connection is provided on the outer peripheral surface of the chip body, and there are multiple groups of card slots, card blocks for connection are mounted on the inner side of the card slots, and the top surfaces of the multiple groups of card blocks are integrally constructed with a shell cover located on the outer periphery of the chip body;

[0005] A ring seat for support is assembled on the inner side of the top opening end of the shell cover by screws, and a sponge ring for support is bonded to the inner circumferential surface of the ring seat, and a graphite heat sink block that is bonded and connected to the chip body is bonded to the bottom end surface of the sponge ring.

[0006] By adopting the above technical solution, when using the Beidou communication mobile phone accessories, the shell cover can be mutually engaged with the card slot on the outer periphery of the chip body by using the card block, so that the shell cover can be installed on the outer periphery of the chip body, so that the shell cover can protect the structural components on the surface of the chip body. At the same time, the shell cover is integrally die-cast, with a simple structure, convenient installation and low cost, so that the structural components on the surface of the chip body can operate more safely.

[0007] When the shell cover is installed on the periphery of the chip body, the ring seat can be installed in the opening on the surface of the shell cover by using screws, and the sponge ring inside the ring seat pushes the graphite heat sink, so that the graphite heat sink can fit with the GPS chip on the surface of the chip body, so as to facilitate the use of the good heat dissipation of the graphite heat sink itself to assist in heat dissipation. At the same time, the shell cover also facilitates the conduction of heat from the surface of the chip body, so that the heat can be conducted and volatilized more quickly, thereby improving the heat dissipation effect of the chip body.

[0008] Specifically, a filter ring for protection is bonded to one end of the ring seat located outside the shell cover.

[0009] By adopting the above technical solution, the filter ring is convenient for intercepting dust and debris, and is convenient for reducing the possibility of dust and debris entering the inner side of the ring seat.

[0010] Specifically, a rubber pad is bonded to one side of the ring seat located on the inner side of the shell cover.

[0011] By adopting the above technical solution, the rubber pad can conveniently protect the end of the ring seat located on the inner side of the shell cover, so as to prevent scratches caused by contact between the ring seat and the structural components on the surface of the chip body.

[0012] Specifically, a vertical hole for connection is opened on the top surface of the shell cover, and a rubber ring for protection is bonded to the inner circumferential surface of the vertical hole.

[0013] By adopting the above technical solution, the vertical holes on the outer periphery of the shell cover correspond to the holes on the surface of the chip body. When the chip body is fixed with screws, the shell cover is convenient for protecting it, thereby reducing the friction between the chip body and the screws and causing scratches and damage.

[0014] Specifically, a surface of the shell cover close to the chip body is integrally structured with heat dissipation fins, and the heat dissipation fins include multiple groups.

[0015] By adopting the above technical solution, the heat dissipation fins can increase the contact area between the shell cover and the air, thereby improving the heat dissipation effect, so that the shell cover can protect the chip body more stably and smoothly.

[0016] Compared with the prior art, the utility model has the following beneficial effects:

[0017] 1. The technical solution of the present application adopts the design of the card slot, the card block and the shell cover. When the Beidou communication mobile phone accessories are used, the shell cover can be connected with the card slot on the periphery of the chip body by utilizing the card block, so that the shell cover can be installed on the periphery of the chip body, so that the shell cover can protect the structural components on the surface of the chip body. At the same time, the shell cover is formed by one-piece die-casting, which has a simple structure, is easy to install and has a low cost, so that the structural components on the surface of the chip body can operate more safely.

[0018] 2. The technical solution of the present application adopts the design of the ring seat, graphite heat sink and sponge ring. When the shell cover is installed on the periphery of the chip body, the ring seat can be installed in the opening on the surface of the shell cover by screws, and the sponge ring on the inner side of the ring seat pushes the graphite heat sink, so that the graphite heat sink and the GPS chip on the surface of the chip body can fit each other, making use of the good heat dissipation of the graphite heat sink itself to assist in heat dissipation. At the same time, the shell cover also facilitates the conduction of heat from the surface of the chip body, so that the heat can be conducted and volatilized more quickly, thereby improving the heat dissipation effect of the chip body. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0020] Figure 1 It is an axonometric drawing of the utility model;

[0021] Figure 2 It is a cross-sectional schematic diagram of the ring seat structure of the utility model;

[0022] Figure 3 It is a schematic cross-sectional view of the shell cover structure of the utility model;

[0023] In the figure: 1. Chip body; 2. Card slot; 3. Card block; 4. Shell cover; 5. Ring seat; 6. Sponge ring; 7. Graphite heat sink; 8. Filter ring; 9. Rubber pad; 10. Vertical hole; 11. Rubber ring; 12. Heat sink fins. DETAILED DESCRIPTION

[0024] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further described below in conjunction with specific implementation methods.

[0025] See also Figure 1-3 The embodiment of the utility model provides a technical solution: a low-cost Beidou communication mobile phone accessory, including a chip body 1, a card slot 2 for connection is opened on the outer peripheral surface of the chip body 1, and the card slot 2 has multiple groups, and a card block 3 for connection is installed on the inner side of the card slot 2, and the top surfaces of the multiple groups of card blocks 3 are integrally constructed with a shell cover 4 located on the outer periphery of the chip body 1; a ring seat 5 for support is assembled on the inner side of the top opening end of the shell cover 4 by screws, and a sponge ring 6 for support is bonded to the inner peripheral surface of the ring seat 5, and a graphite heat dissipation block 7 that is bonded and connected to the chip body 1 is bonded to the bottom end surface of the sponge ring 6.

[0026] When using the Beidou communication mobile phone accessories, the shell cover 4 can be mutually engaged with the card slot 2 on the outer periphery of the chip body 1 by utilizing the card block 3, so that the shell cover 4 can be installed on the outer periphery of the chip body 1, so that the shell cover 4 can protect the structural components on the surface of the chip body 1. At the same time, the shell cover 4 is integrally die-cast, with a simple structure, convenient installation and low cost, so that the structural components on the surface of the chip body 1 can operate more safely;

[0027] When the shell cover 4 is installed on the periphery of the chip body 1, the ring seat 5 can be installed in the opening on the surface of the shell cover 4 by using screws, and the sponge ring 6 inside the ring seat 5 pushes the graphite heat sink 7, so that the graphite heat sink 7 can fit with the GPS chip on the surface of the chip body 1, so as to facilitate the use of the good heat dissipation of the graphite heat sink 7 itself to assist in heat dissipation. At the same time, the shell cover 4 also facilitates the conduction of heat from the surface of the chip body 1, so that the heat can be conducted and volatilized more quickly, thereby improving the heat dissipation effect of the chip body 1.

[0028] like Figure 1 and Figure 2 As shown, a filter ring 8 for protection is bonded to one end of the ring seat 5 located outside the shell cover 4.

[0029] When in use, the filter ring 8 is convenient for intercepting dust and debris, and is convenient for reducing the possibility of dust and debris entering the inner side of the ring seat 5.

[0030] like Figure 2 As shown, a rubber pad 9 is bonded to one side of the ring seat 5 located on the inner side of the shell cover 4 .

[0031] When in use, the rubber pad 9 is convenient for protecting the end of the ring seat 5 located on the inner side of the shell cover 4, and is convenient for preventing the ring seat 5 from being scratched when contact occurs between the ring seat 5 and the structural components on the surface of the chip body 1.

[0032] like Figure 1 As shown, a vertical hole 10 for connection is opened on the top surface of the shell cover 4, and a rubber ring 11 for protection is bonded to the inner circumferential surface of the vertical hole 10.

[0033] When in use, the vertical holes 10 on the outer periphery of the shell cover 4 correspond to the holes on the surface of the chip body 1. When the chip body 1 is fixed with screws, the shell cover 4 is convenient for protecting it, thereby reducing the friction between the chip body 1 and the screws and causing scratches and damage.

[0034] like Figure 1 As shown, a surface of the shell cover 4 close to the chip body 1 is integrally constructed with heat dissipation fins 12, and the heat dissipation fins 12 include multiple groups.

[0035] When in use, the heat dissipation fins 12 can increase the contact area between the shell cover 4 and the air, thereby improving the heat dissipation effect, so that the shell cover 4 can protect the chip body 1 more stably and smoothly.

[0036] The working principle and use process of the utility model are as follows: when in use, first install the corresponding structural components in a suitable position. When using the Beidou communication mobile phone accessories, the shell cover 4 can be mutually engaged with the card slot 2 on the outer periphery of the chip body 1 by utilizing the card block 3, so that the shell cover 4 can be installed on the outer periphery of the chip body 1, so that the shell cover 4 can protect the structural components on the surface of the chip body 1. At the same time, the shell cover 4 adopts an integrated die-casting molding, which has a simple structure, is convenient to install and has a low cost, so that the structural components on the surface of the chip body 1 can operate more safely. At the same time, when the shell cover 4 is installed on the outer periphery of the chip body 1, the ring seat 5 can be installed in the opening on the surface of the shell cover 4 by screws, and the sponge ring 6 on the inner side of the ring seat 5 pushes the graphite heat sink 7, so that the graphite heat sink 7 can fit with the GPS chip on the surface of the chip body 1, so that the good heat dissipation of the graphite heat sink 7 itself can be used to assist in heat dissipation. At the same time, the shell cover 4 is also convenient for conducting the heat on the surface of the chip body 1, so that the heat can be conducted and volatilized more quickly, thereby improving the heat dissipation effect of the chip body 1.

[0037] The above shows and describes the basic principles, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions in the specification are only to illustrate the principles of the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the protection required by the utility model. The scope of protection required by the utility model is defined by the attached claims and their equivalents.

Claims

1. Low-cost Beidou communication mobile phone accessories, characterized by: The invention comprises a chip body (1), wherein the outer peripheral surface of the chip body (1) is provided with a card slot (2) for connection, and the card slot (2) has a plurality of groups, a card block (3) for connection is mounted on the inner side of the card slot (2), and the top surfaces of the plurality of groups of card blocks (3) are integrally constructed with a shell cover (4) located on the outer periphery of the chip body (1); A ring seat (5) for support is assembled on the inner side of the top open end of the shell cover (4) by screws, and a sponge ring (6) for support is bonded to the inner circumferential surface of the ring seat (5), and a graphite heat sink (7) which is bonded and connected to the chip body (1) is bonded to the bottom end surface of the sponge ring (6).

2. The low-cost Beidou communication mobile phone accessory according to claim 1, characterized in that: A filter ring (8) for protection is bonded to one end of the ring seat (5) located outside the shell cover (4).

3. The low-cost Beidou communication mobile phone accessory according to claim 1, characterized in that: A rubber pad (9) is bonded to one side of the ring seat (5) located on the inner side of the shell cover (4).

4. The low-cost Beidou communication mobile phone accessory according to claim 1, characterized in that: A vertical hole (10) for connection is provided on the top surface of the shell cover (4), and a rubber ring (11) for protection is bonded to the inner peripheral surface of the vertical hole (10).

5. The low-cost Beidou communication mobile phone accessory according to claim 1, characterized in that: A surface of the shell cover (4) close to the chip body (1) is integrally constructed with heat dissipation fins (12), and the heat dissipation fins (12) are provided in multiple groups.

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