Chip upgrading tool

Abstract

The utility model discloses a chip upgrading tool which comprises a base, a cover body and a terminal, the cover body is detachably connected with the base, the terminal is arranged on the cover body, one end of the terminal is used for being electrically connected with a host of chip upgrading equipment, and the other end of the terminal penetrates out of the cover body. When the chip upgrading tool needs to be replaced, only the cover body needs to be replaced, the base does not need to be detached from the host, the cover body and the terminal on the cover body are pulled out from the base, and then the other cover body and the terminal on the cover body are inserted into the base, so that replacement of the chip upgrading tool can be realized; the mode of replacing the chip upgrading tool is simple, and the efficiency is high.

Description

Technical Field

[0001] The present application relates to the technical field of consumables, and in particular to a chip upgrading tool. Background Art

[0002] The chip upgrade device achieves chip upgrade by electrically connecting and transmitting signals with the chip on the powder box. There is a chip upgrade tool installed on the chip upgrade device. The chip upgrade tool is inserted into the package and cooperates with the positioning part on the chip of the powder box. The positioning part can position the chip upgrade tool, and the chip on the powder box can be quickly upgraded. For different types of positioning parts installed on the powder box, it is necessary to remove the original chip upgrade tool on the chip upgrade device, and then install the chip upgrade tool that matches the positioning part to the chip upgrade device, so that the chip can be upgraded. However, since the chip upgrade tool is installed on the chip upgrade device or removed from the chip upgrade device mainly by locking screws and removing screws, the method of replacing the chip upgrade device is complicated and inefficient. Utility Model Content

[0003] In order to overcome the problems existing in the above-mentioned prior art, the main purpose of the present application is to provide a chip upgrade tool with simple replacement method and high efficiency.

[0004] In order to achieve the above objectives, this application specifically adopts the following technical solutions:

[0005] The present application provides a chip upgrade tool, the chip upgrade tool comprising:

[0006] Base;

[0007] A cover body, wherein the cover body is detachably connected to the base;

[0008] The terminal is arranged on the cover body, and one end of the terminal is used for electrical connection with the host of the chip upgrading device, and the other end of the terminal passes through the cover body.

[0009] In some embodiments, the chip upgrade tool further includes a support member, the support member is disposed on the cover body, and the terminal is connected to the support member.

[0010] In some embodiments, the support member is configured as a circuit board, and the terminal is fixed to the circuit board.

[0011] In some embodiments, the base includes a supporting portion, and when the cover body and the base are in a plug-in state, the supporting member abuts against the supporting portion in a plug-in direction of the cover body and the base.

[0012] In some embodiments, the base includes a first engaging portion, the first engaging portion is located outside the supporting portion, and the cover includes a second engaging portion;

[0013] When the cover body and the base are in a plugged state, the cover body is sleeved on the outer side of the support portion or the cover body is sleeved on the inner side of the first engaging portion, and the second engaging portion abuts against the first engaging portion in the plugging direction.

[0014] In some embodiments, the second joining portion is configured as an inclined interface, and the shape of the first joining portion is configured to correspond to the shape of the second joining portion.

[0015] In some embodiments, the cover body further includes a first positioning portion, and the support member includes a second positioning portion, and the second positioning portion can cooperate with the first positioning portion to position the support member.

[0016] In some embodiments, the base includes a guiding portion, and the guiding portion can cooperate with the first positioning portion to guide the assembly of the cover body and the base.

[0017] In some embodiments, one of the first positioning portion and the second positioning portion is configured as a groove, and the other of the first positioning portion and the second positioning portion is configured as a protrusion;

[0018] When the first positioning portion is set as the groove, the guide portion is set as the protrusion; when the first positioning portion is set as the protrusion, the guide portion is set as the groove.

[0019] In some embodiments, the cover body includes an end portion having a first inclined surface and a second inclined surface, the first inclined surface and the second inclined surface intersect to form a V-shaped structure, one end of the terminal can pass through the intersection of the first inclined surface and the second inclined surface, so that the terminal is surrounded by the cover body, and the end of the terminal passing through the cover body can telescope relative to the cover body.

[0020] Compared with the prior art, the chip upgrade tool of the present application includes a base, a cover body and a terminal. The cover body is detachably connected to the base, the terminal is arranged on the cover body, and one end of the terminal is used to electrically connect to the host of the chip upgrade device, and the other end of the terminal passes through the cover body; when the chip upgrade tool needs to be replaced, only the cover body needs to be replaced without removing the base from the host. The chip upgrade tool can be replaced by unplugging the cover body and the terminals on the cover body from the base and inserting another cover body with terminals into the base. The method of replacing the chip upgrade tool is simple and efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 A three-dimensional diagram of the chip upgrade tool provided in an embodiment of the present application.

[0022] Figure 2 A three-dimensional exploded view of the chip upgrade tool provided in an embodiment of the present application.

[0023] Figure 3 for Figure 2 A cross-sectional view of a cover body including terminals and support members.

[0024] Figure 4 for Figure 2 A three-dimensional view of the base in FIG.

[0025] Figure 5 for Figure 2 A three-dimensional view of the cover body in FIG.

[0026] Figure 6 Another three-dimensional exploded view of the chip upgrade tool provided in an embodiment of the present application.

[0027] Figure ID:

[0028] 1. Base; 11. Support part; 12. First joint part; 13. Guide part; 2. Cover body; 20. End part; 20a. First inclined surface; 20b. Second inclined surface; 21. First positioning part; 22. Second joint part; 3. Terminal; 4. Support member; 41. Second positioning part; 42. Through hole. DETAILED DESCRIPTION

[0029] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0030] In the description of this application, unless otherwise clearly specified and limited, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more, and the term "multiple" refers to two or more; the terms "connected", "fixed", etc. should be understood in a broad sense, for example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0031] In the description of this specification, it should be understood that the directional words such as "upper" and "lower" described in the embodiments of the present application are described at the angles shown in the accompanying drawings and should not be understood as limiting the embodiments of the present application. In addition, in the context, it should also be understood that when it is mentioned that an element is connected to another element "upper" or "lower", it can not only be directly connected to another element "upper" or "lower", but also indirectly connected to another element "upper" or "lower" through an intermediate element.

[0032] The consumables in the printer are usually equipped with a chip, which is used to store relevant information about the consumables, such as the consumable model, production date, manufacturer, serial number, chip program version and other attribute information. With the update of the consumable model, the current program content in the chip needs to be overwritten and updated, which requires the use of chip upgrade equipment to burn the chip program (i.e. write data), that is, to "rework" the chip that needs to be upgraded. The "rework" process may include modifying, adding or deleting the data or program stored in the chip, as well as testing and confirmation after performing the above operations.

[0033] Existing chip upgrade equipment usually includes two types: split type and integrated type. For the split chip upgrade equipment, it generally includes a host and a chip contact (chip upgrade tool). The chip contact and the host can be connected by locking screws to electrically connect the chip contact and the host. When reading and writing consumable chips, the chip contact can be abutted against the contact of the consumable chip to electrically connect the consumable chip and the host, and then the host is operated to perform reading and writing of the consumable chip. However, for the upgrade of chip products of different models, different chip contacts need to be replaced, or for the same model of chip contacts, different hosts may need to be matched due to different interfaces, and the disassembly and installation process of the chip contacts and the host is relatively complicated, troublesome, and inefficient. At the same time, the chip contacts of this type of split chip upgrade equipment are large in size, the contacts are easy to break, the operation is not positioned and it is inconvenient to align, and the upgrade efficiency is low.

[0034] For the integrated chip upgrade equipment, namely the handheld chip upgrade tool or the plug-in type chip upgrade tool, generally one host corresponds to one single model, the chip contacts cannot be switched, the use cost is high, the operation is inconvenient, and the work efficiency is low.

[0035] Reference Figure 1 and Figure 2As shown, an embodiment of the present application discloses a chip upgrade tool, which includes a base 1, a cover 2, a support 4 and a plurality of terminals 3. The cover 2, the support 4 and the plurality of terminals 3 are interconnected to form a module. Specifically, the cover 2 is detachably connected to the base 1. In an embodiment, the cover 2 and the base 1 are detachably plugged. The plurality of terminals 3 and the support 4 are respectively arranged on the cover 2, and the plurality of terminals 3 are connected to the support 4. The plurality of terminals 3 are distributed in rows, one end of the plurality of terminals 3 is used to be electrically connected to the host, and the other end of the plurality of terminals 3 passes through the cover 2.

[0036] In this embodiment, the chip upgrade tool and the host are separate structures, and the base 1 is used to connect with the host of the chip upgrade device. For example, the base 1 can be detachably connected to the host by screws. Of course, in other embodiments, the chip upgrade tool and the host can also be an integrated structure, for example, the host can be installed in the base.

[0037] When reading and writing consumable chips, the base 1 is installed on the host by screws, and the cover 2 is plugged into the base 1, so that the multiple terminals 3 are electrically connected to the host, and then the chip upgrade tool is extended into the package containing the consumables, so that the end of the cover 2 cooperates with the positioned portion on the consumables in the package to position the chip upgrade tool, and each terminal 3 abuts against the contact of the consumable chip in the package, so that the consumable chip is electrically connected to the host, and then the consumable chip is read and written by the host, that is, the consumable chip is upgraded. When upgrading consumable chips of different models and different tools need to be replaced, it is only necessary to unplug the cover 2 and then plug another matching cover 2 into the base 1, and the consumable chip upgrade operation can be achieved through the replaced tool.

[0038] This embodiment sets the chip upgrade tool as a split structure, so that the cover body 2 in the chip upgrade tool can be replaced as needed, so that one host corresponds to multiple cover bodies, and one host can upgrade multiple types of chips, saving costs; at the same time, when the chip upgrade tool needs to be replaced, it is only necessary to quickly replace the cover body 2 to complete the switch, which is simple and fast and can quickly improve efficiency; in addition, if the terminal 3 is damaged, the cover body 2 with the damaged terminal 3 can be directly unplugged, and then the new cover body 2 can be inserted into the base 1, which is fast and more convenient to replace.

[0039] In this embodiment, the support member 4 can be set as a circuit board, so that the terminal 3 can be fixed to the circuit board by welding. This method of fixing the terminal 3 is simple and reliable. The circuit board is provided with a plurality of through holes 42, one end of the plurality of terminals 3 is respectively passed through each through hole 42 and is welded and fixed to the circuit board, and the other end of the plurality of terminals 3 passes through the cover body 2 and can perform telescopic movement relative to the cover body 2. Of course, in other embodiments, the support member 4 can also be other structures, such as plastic parts, metal plates, etc., and the terminal 3 can also be bonded to the support member 4.

[0040] Also refer to Figure 1 and Figure 3 As shown, the cover body 2 includes an end 20, and the end 20 has a first inclined surface 20a and a second inclined surface 20b, and the first inclined surface 20a and the second inclined surface 20b intersect to form a V-shaped structure. One end of the terminal 3 can pass through the intersection of the first inclined surface 20a and the second inclined surface 20b, so that at least part of the terminal 3 is covered by the cover body 2, and the end of the terminal 3 passing through the cover body 2 can make telescopic movements relative to the cover body 2. In this embodiment, by setting the end 20 of the cover body 2 as an inclined structure, it is helpful to apply force to the packaging film / packaging bag, reduce the force on the terminal 3, make it easy for the terminal 3 to pierce the packaging film / packaging bag without disassembling the packaging, improve efficiency, and the terminal 3 is not easy to deform or break. By limiting the terminal 3 at least part of the length direction around the cover body, the force on the terminal can also be reduced, and the terminal is not easy to deform or break.

[0041] Reference Figure 4 and Figure 5 As shown, the base 1 includes a support portion 11 and a first engaging portion 12, the first engaging portion 12 is located outside the support portion 11, and the cover 2 includes a second engaging portion 22. When the cover 2 and the base 1 are in a plug-in state, the cover 2 is sleeved on the outside of the support portion 11, and the second engaging portion 22 is in the plug-in direction ( Figure 1 The first engaging portion 12 is abutted against the first engaging portion 12 in the X direction in the insertion direction, and the supporting member 4 is abutted against the supporting portion 11 in the insertion direction. During the process of inserting the terminal 3 into the package and the process of upgrading the consumable chip by the terminal, the pressure can be directly transferred from the needle tip of the terminal 3 to the supporting member 4, and then transferred from the supporting member 4 to the base 1, instead of acting completely on the supporting member 4, thereby ensuring the stability of the supporting member 4 structure to prevent the terminal 3 from deformation or pin breakage, thereby extending the service life of the terminal 3.

[0042] In this embodiment, the support member 4 is arranged on the cover body 2, and the terminal 3 is connected to the support member 4. When the cover body 2 and the base 1 are in the plug-in state, the support member 4 abuts against the support portion 11 in the plug-in direction, so that when the terminal 3 abuts against the consumable chip, the pressure on the terminal 3 can be transferred to the base 1 through the support member 4, thereby reducing the pressure on the support member 4, that is, the force condition of the terminal 3 is changed, the tool reliability is improved, and the tool life is extended. In this embodiment, the height of the first joint portion 12 in the plug-in direction is lower than the height of the support portion 11 in the height direction, and the cover body 2 is sleeved on the outer side of the support portion 11 of the base 1. In some embodiments, the height of the first joint portion 12 in the plug-in direction can also be higher than the height of the support portion 11 in the height direction, the support member 4 abuts against the support portion 11 in the plug-in direction, and the cover body 2 is sleeved on the inner side of the first joint portion 12. In this embodiment, the cover body 2 is sleeved on the outer side of the support portion 11 or the cover body 2 is sleeved on the inner side of the first joint portion 12 , thereby improving the plug-in effect between the cover body 2 and the base 1 to prevent the cover body 2 from easily falling off from the base 1 .

[0043] In this embodiment, the second joint portion 22 is set as an inclined interface, and the shape of the first joint portion 12 is set corresponding to the shape of the second joint portion 22. In this embodiment, by setting the second joint portion 22 as an inclined interface, an operating space is provided for welding between the support member 4 and the terminal 3, which is convenient for processing. At the same time, through the cooperation of the first joint portion 12 and the second joint portion 22, a foolproof effect is played (i.e., preventing the cover body 2 from being installed reversely with the base 1). When the operator is working, by observing the inclined first joint portion 12 and the second joint portion 22, the cover body 2 can be quickly plugged into the base 1, thereby improving the working efficiency and increasing the fit between the cover body 2 and the base 1.

[0044] Also refer to Figure 4 and Figure 6 As shown, the cover 2 also includes a first positioning portion 21, the support member 4 includes a second positioning portion 41, and the base 1 includes a guide portion 13. The second positioning portion 41 can be connected with the first positioning portion 21 to position the support member 4, prevent the support member 4 from being installed upside down, and improve the working efficiency. The guide portion 13 can also be connected with the first positioning portion 21 to guide the assembly of the cover 2 and the base 1, and can also prevent the cover 2 and the base 1 from being installed upside down, and improve the working efficiency. Among them, one of the first positioning portion 21 and the second positioning portion 41 is set as a groove, and the other is set as a protrusion.

[0045] In this embodiment, the first positioning portion 21 and the second positioning portion 41 are arranged in coordination, which facilitates the installation of the circuit board and plays a foolproof role (preventing the circuit board from being installed upside down); the first positioning portion 21 and the guide portion 13 are arranged in coordination, which realizes the rapid disassembly and installation of the cover body 2 and the base 1. In this embodiment, the guide portion 13 and the second positioning portion 41 are both coordinated with the same first positioning portion 21. In some embodiments, there are multiple first positioning portions 21, one of which is located on one side of the inner wall of the cover body 2, and the second positioning portion 41 corresponds to the position of the first positioning portion 21, and the other first positioning portion 21 is located on the other side of the inner wall of the cover body 2, and the guide portion 13 corresponds to the position of the first positioning portion 21, which can also realize the coordination of the guide portion 13 and the second positioning portion 41 with the first positioning portion 21. In this embodiment, the cover body 2 is provided with a second engaging portion 22 and a first positioning portion 21, and the base 1 is provided with a first engaging portion 12 and a guide portion 13, which can prevent the cover body 2 and the base 1 from being installed reversely, and the cover body 2 is sleeved on the outer side of the supporting portion 11 of the base 1, so that the cover body 2 can wrap the base 1 well to prevent the cover body 2 from falling off from the base 1 easily.

[0046] In this embodiment, the first positioning portion 21 is configured as a protrusion, and the second positioning portion 41 and the guide portion 13 are configured as grooves. During assembly, the circuit board is assembled to the cover body 2, and then the cover body 2 is inserted into the base 1, and the protrusion is located in the groove of the cover body 2 and the circuit board. Of course, in other embodiments, the first positioning portion 21 can also be configured as a groove, and the second positioning portion 41 and the guide portion 13 can also be configured as a protrusion.

[0047] In this embodiment, the shell of the chip upgrade tool is set as a split structure, that is, the shell is set as two parts, namely, the base 1 and the cover 2, and the cover 2 is detachably mounted on the base 1. When the chip upgrade tool needs to be replaced, only the cover 2 needs to be replaced without removing the base 1 from the chip upgrade device. By pulling the cover 2 and the terminals 3 and the circuit board on the cover 2 from the base 1, and inserting another cover 2 with the terminals 3 and the circuit board into the base 1, the chip upgrade tool can be replaced. For example, the cover 2 with damaged terminals 3 can be replaced, and covers 2 of different models can also be replaced. This solution is simple and efficient in replacing the chip upgrade tool; at the same time, this solution does not need to replace the base 1, reduces the scrapping of materials, and saves costs; the cover 2 can cooperate with the positioned part on the powder box, which is convenient for the cover 2 to be positioned, not easy to shake, and improves the working efficiency.

[0048] In addition, since the support member 4 is mounted on the cover 2 instead of the base 1, the length of the terminal 3 (probe) is shortened. Thus, when the chip upgrade device abuts the consumable chip through the terminal 3 of the chip upgrade tool to upgrade the consumable chip, the probability of the terminal 3 being deformed or broken is reduced, thereby improving work efficiency and cost. In some embodiments, the cover 2 can be detachably mounted on the base 1 by means of a snap-fit ​​or the like.

[0049] The above is only a preferred specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed in the present application should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A chip upgrade tool, characterized in that: include: Base; A cover body, wherein the cover body is detachably connected to the base; The terminal is arranged on the cover body, and one end of the terminal is used for electrical connection with the chip upgrading device, and the other end of the terminal passes through the cover body.

2. The chip upgrade tool according to claim 1, characterized in that: The chip upgrade tool further includes a support member, which is disposed on the cover body, and the terminal is connected to the support member.

3. The chip upgrade tool according to claim 2, characterized in that: The support member is configured as a circuit board, and the terminal is fixed to the circuit board.

4. The chip upgrade tool according to claim 2, characterized in that: The base comprises a supporting portion, and when the cover body and the base are in a plug-in state, the supporting member abuts against the supporting portion in a plug-in direction between the cover body and the base.

5. The chip upgrade tool according to claim 4, characterized in that: The base includes a first engaging portion, the first engaging portion is located outside the supporting portion, and the cover includes a second engaging portion; When the cover body and the base are in a plugged state, the cover body is sleeved on the outer side of the support portion or the cover body is sleeved on the inner side of the first engaging portion, and the second engaging portion abuts against the first engaging portion in the plugging direction.

6. The chip upgrade tool according to claim 5, characterized in that: The second joint portion is configured as an inclined interface, and the shape of the first joint portion is configured to correspond to the shape of the second joint portion.

7. The chip upgrade tool according to claim 2, characterized in that: The cover body further includes a first positioning portion, and the support member includes a second positioning portion, and the second positioning portion can cooperate with the first positioning portion to position the support member.

8. The chip upgrade tool according to claim 7, characterized in that: The base includes a guide portion, which can cooperate with the first positioning portion to guide the assembly of the cover body and the base.

9. The chip upgrade tool according to claim 8, characterized in that: One of the first positioning portion and the second positioning portion is configured as a groove, and the other of the first positioning portion and the second positioning portion is configured as a protrusion; When the first positioning portion is set as the groove, the guide portion is set as the protrusion; when the first positioning portion is set as the protrusion, the guide portion is set as the groove.

10. The chip upgrade tool according to any one of claims 1 to 9, characterized in that: The cover body includes an end portion, the end portion has a first inclined surface and a second inclined surface, the first inclined surface and the second inclined surface intersect to form a V-shaped structure, one end of the terminal can pass through the intersection of the first inclined surface and the second inclined surface, so that the terminal is surrounded by the cover body, and the end of the terminal passing through the cover body can perform telescopic movement relative to the cover body.

Images