Pickling device for semiconductor monocrystalline silicon wafer production

Abstract

The utility model discloses a pickling device for semiconductor monocrystalline silicon wafer production, which relates to the technical field of semiconductor monocrystalline silicon wafer production and comprises a pickling mechanism, the top of the pickling mechanism is connected with a drying mechanism, and a transposition accommodating mechanism is arranged in the pickling mechanism; the transposition accommodating mechanism comprises a back plate, a driving motor, a bidirectional hydraulic rod, a fixed sleeve plate, a connecting shaft, a lug plate and a mesh cage; the back plate is located in the box body, the driving motor is fixedly arranged on the rear side of the box body and is in transmission connection with the back plate, the two-way hydraulic rod is located in the middle of the front face of the back plate, and the two fixing sleeve plates are fixedly arranged at the two ends of the outer side of the two-way hydraulic rod in a sleeving mode respectively and are fixedly connected with the back plate. According to the utility model, the dried monocrystalline silicon wafer can be conveniently discharged, and meanwhile, the feeding and acid leaching processes can be synchronously carried out, so that the acid pickling efficiency of the monocrystalline silicon wafer is effectively improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor single crystal silicon wafer production, in particular to a pickling device for semiconductor single crystal silicon wafer production. Background Art

[0002] Monocrystalline silicon is an important component of crystalline materials. When it is made into solar cells, it must undergo a series of processing. The most important of these is to cut the monocrystalline silicon rod raw material into monocrystalline silicon wafers, and then go through the cleaning process of the monocrystalline silicon wafers.

[0003] The utility model patent with patent application publication number CN 217251113 U discloses a pickling device for semiconductor single crystal silicon wafer production, including a box body and a box cover, the box cover is hinged on the box body, and a handle is fixedly connected to the side of the box cover facing away from the box body. It also includes: two installation grooves are opened on the inner end surface of the box body, and a second electric push rod is arranged inside the installation groove. A placement component is arranged between the telescopic ends of the two second electric push rods, and the placement component is used to hold the single crystal silicon wafer.

[0004] The utility model controls the telescopic end of the second electric push rod to shorten, drives the placement component to descend, immerses the placement component in the acid immersion tank, washes away impurities on the surface of the single crystal silicon wafer, then lifts the placement component, sprays high-pressure water through the nozzle to rinse the surface of the single crystal silicon wafer, washes away the residual acid immersion solution on the single crystal silicon wafer, avoids corrosion of the single crystal silicon wafer, and achieves a better cleaning effect; the single crystal silicon wafer can be dried by the drying component.

[0005] However, the above device still has some shortcomings in actual use. The most obvious one is that after the drying is completed, since the mesh cage is located inside the box, it is very difficult for the operator to unload the single crystal silicon wafers inside the mesh cage. It will not only consume more physical strength, but also take a long time, which has a great impact on the pickling efficiency of the single crystal silicon wafers.

[0006] Therefore, it is necessary to invent a pickling device for semiconductor single crystal silicon wafer production to solve the above problems. Utility Model Content

[0007] The utility model aims to provide a pickling device for producing semiconductor single crystal silicon wafers to solve the problems raised in the above-mentioned background technology.

[0008] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: A pickling device for producing semiconductor single crystal silicon wafers, comprising a pickling mechanism, a drying mechanism is connected to the top of the pickling mechanism, and a transposition accommodating mechanism is arranged inside the pickling mechanism;

[0009] The transposition accommodating mechanism comprises a back plate, a driving motor, a bidirectional hydraulic rod, a fixed sleeve plate, a connecting shaft, an ear plate and a mesh cage;

[0010] The back plate is located inside the box body, the drive motor is fixedly arranged on the rear side of the box body and is transmission-connected to the back plate, the bidirectional hydraulic rod is located in the middle of the front side of the back plate, two fixed sleeves are provided, and the two fixed sleeves are respectively fixedly sleeved on the two ends of the outer side of the bidirectional hydraulic rod and are both fixedly connected to the back plate, the connecting shaft is fixedly arranged on the output shaft end of the bidirectional hydraulic rod, the ear plate is rotatably sleeved on the outer side of the connecting shaft through a bearing, and the mesh cage is fixedly arranged at the bottom of the ear plate.

[0011] Preferably, the pickling mechanism comprises a box body, a pickling tank, a sealing plate, a hydraulic cylinder and a nozzle.

[0012] Preferably, the acid immersion tank is opened at the bottom of the inner cavity of the box, the sealing plate is slidably arranged inside the box, the hydraulic cylinder is fixedly arranged on the side of the box and its output shaft is fixedly connected to the sealing plate, and the nozzle is fixedly arranged inside the box.

[0013] Preferably, the drying mechanism includes a box cover, a fan and a heating rod.

[0014] Preferably, the box cover is movably connected to the top of the box body through a hinge, the fan is fixedly nested on the top of the box cover, and a plurality of heating rods are provided, and the plurality of heating rods are evenly fixedly arranged on the inner side of the box cover.

[0015] Technical effects and advantages of the utility model:

[0016] The utility model is provided with a transposition and accommodating mechanism, so that after a single drying, cleaning and drying is completed, the bidirectional hydraulic rod drives its output shaft to extend, and at this time the lower mesh cage drives the single crystal silicon wafer to be processed into the acid immersion tank for acid immersion, and the upper mesh cage drives the dried single crystal silicon wafer to rise from the top opening of the box body, and at this time the operator can take out the dried single crystal silicon wafer from the top opening of the upper mesh cage and replace the new single crystal silicon wafer to be processed. Compared with the same type of device in the prior art, the utility model can not only discharge the dried single crystal silicon wafer more conveniently, but also can carry out the feeding and acid immersion processes simultaneously, thereby effectively improving the pickling efficiency of the single crystal silicon wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a schematic diagram of the overall front cross-sectional structure of the utility model.

[0018] Figure 2 It is a front view cross-sectional structural schematic diagram of the transposition accommodation mechanism of the utility model.

[0019] Figure 3It is a structural schematic diagram of the transposition accommodating mechanism of the utility model when rotating.

[0020] In the figure: 1. pickling mechanism; 11. box body; 12. pickling tank; 13. sealing plate; 14. hydraulic cylinder; 15. nozzle; 2. transposition and accommodation mechanism; 21. back plate; 22. driving motor; 23. bidirectional hydraulic rod; 24. fixed sleeve plate; 25. connecting shaft; 26. ear plate; 27. mesh cage; 3. drying mechanism; 31. box cover; 32. fan; 33. heating rod. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0022] The utility model provides Figure 1-3 The pickling device shown is used for producing semiconductor single crystal silicon wafers, and comprises a pickling mechanism 1, a drying mechanism 3 is connected to the top of the pickling mechanism 1, and a transposition accommodating mechanism 2 is arranged inside the pickling mechanism 1.

[0023] like Figure 1 As shown, the pickling mechanism 1 includes a box body 11, a pickling tank 12, a sealing plate 13, a hydraulic cylinder 14 and a nozzle 15, wherein the pickling tank 12 is opened at the bottom of the inner cavity of the box body 11, the sealing plate 13 is slidably arranged inside the box body 11, the hydraulic cylinder 14 is fixedly arranged on the side of the box body 11 and its output shaft is fixedly connected to the sealing plate 13, and the nozzle 15 is fixedly arranged inside the box body 11.

[0024] By setting the above structure, after the pickling is completed, the hydraulic cylinder 14 drives the sealing plate 13 to seal the pickling tank 12, and then the nozzle 15 sprays the cleaning liquid to the adjacent mesh cage 27 to complete the cleaning operation. The cleaning liquid is discharged through the pipeline on the rear side of the box body 11.

[0025] like Figure 2As shown, the transposition accommodating mechanism 2 includes a back plate 21, a driving motor 22, a bidirectional hydraulic rod 23, a fixed sleeve plate 24, a connecting shaft 25, an ear plate 26 and a mesh cage 27, wherein the back plate 21 is located inside the box body 11, the driving motor 22 is fixedly arranged on the rear side of the box body 11 and is transmission-connected to the back plate 21, the bidirectional hydraulic rod 23 is located in the middle of the front of the back plate 21, two fixed sleeve plates 24 are provided, and the two fixed sleeve plates 24 are respectively fixedly sleeved on the outer ends of the bidirectional hydraulic rod 23 and are fixedly connected to the back plate 21, the connecting shaft 25 is fixedly arranged on the output shaft end of the bidirectional hydraulic rod 23, the ear plate 26 is rotatably sleeved on the outer side of the connecting shaft 25 through a bearing, and the mesh cage 27 is fixedly arranged at the bottom of the ear plate 26.

[0026] By setting the above structure, after a single drying, cleaning and drying is completed, the bidirectional hydraulic rod 23 drives its output shaft to extend, and at this time the lower mesh cage 27 drives the single crystal silicon wafer to be processed into the acid immersion tank 12 for acid immersion, and the upper mesh cage 27 drives the dried single crystal silicon wafer to rise from the top opening of the box body 11. At this time, the operator can take out the dried single crystal silicon wafer from the top opening of the upper mesh cage 27 and replace the new single crystal silicon wafer to be processed. Compared with the same type of device in the prior art, the utility model can not only discharge the dried single crystal silicon wafer more conveniently, but also can simultaneously carry out the feeding and acid immersion processes, thereby effectively improving the pickling efficiency of the single crystal silicon wafer.

[0027] like Figure 1 As shown, the drying mechanism 3 includes a box cover 31, a fan 32 and a heating rod 33, wherein the box cover 31 is movably connected to the top of the box body 11 through a hinge, the fan 32 is fixedly nested on the top of the box cover 31, and a plurality of heating rods 33 are provided, and the plurality of heating rods 33 are evenly fixedly arranged on the inner side of the box cover 31.

[0028] By setting the above structure, it is convenient to close the box cover 31 and start the fan 32 and the heating rod 33. The fan 32 and the heating rod 33 cooperate to dry the cleaned single crystal silicon wafer. After drying, the box cover 31 is opened and the fan 32 and the heating rod 33 are stopped.

[0029] Working principle of this utility model:

[0030] During actual use, a single crystal silicon wafer is added to the upper mesh cage 27, and then the driving motor 22 drives the back plate 21 to rotate. When the back plate 21 rotates, the two mesh cages 27 are driven to rotate synchronously through the bidirectional hydraulic rod 23, the fixed sleeve plate 24, the connecting shaft 25 and the ear plate 26. During the rotation of the mesh cages 27, the mesh cages 27 are kept open upward under the action of gravity. When the positions of the two mesh cages 27 are interchanged, the bidirectional hydraulic rod 23 drives the output shaft thereof to extend. At this time, the mesh cage 27 located at the bottom enters the acid leaching tank 12 to start the acid leaching operation, and the mesh cage 27 located at the top is raised from the top opening of the box body 11.

[0031] After the acid leaching is completed, the bidirectional hydraulic rod 23 drives its output shaft to retract, and then the hydraulic cylinder 14 drives the sealing plate 13 to seal the acid leaching tank 12, and then the nozzle 15 sprays the cleaning liquid to the adjacent mesh cage 27, thereby completing the cleaning operation. The cleaning liquid is discharged through the pipeline on the rear side of the box body 11. During this process, the single crystal silicon wafer is added to the upper mesh cage 27, and then the driving motor 22 drives the back plate 21 to reset, thereby resetting the two mesh cages 27. At this time, the box cover 31 is closed and the fan 32 and the heating rod 33 are started. The fan 32 and the heating rod 33 cooperate to dry the cleaned single crystal silicon wafer;

[0032] After drying is completed, the box cover 31 is opened and the fan 32 and the heating rod 33 are stopped, and then the hydraulic cylinder 14 drives the sealing plate 13 to release the blockage of the opening of the acid immersion tank 12. At this time, the bidirectional hydraulic rod 23 is again driven to extend its output shaft. At this time, the lower mesh cage 27 drives the single crystal silicon wafer to be processed into the acid immersion tank 12 for acid immersion, and the upper mesh cage 27 drives the dried single crystal silicon wafer to rise from the top opening of the box body 11. At this time, the operator can take out the dried single crystal silicon wafer from the top opening of the upper mesh cage 27 and replace it with a new single crystal silicon wafer to be processed.

[0033] Finally, it should be noted that the above is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art can still modify the technical solutions described in the aforementioned embodiments or make equivalent substitutions for some of the technical features therein. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A pickling device for producing semiconductor single crystal silicon wafers, comprising a pickling mechanism (1), wherein the top of the pickling mechanism (1) is connected to a drying mechanism (3), characterized in that: The pickling mechanism (1) is provided with a transposition and accommodation mechanism (2) inside; The transposition accommodating mechanism (2) comprises a back plate (21), a driving motor (22), a bidirectional hydraulic rod (23), a fixed sleeve plate (24), a connecting shaft (25), an ear plate (26) and a mesh cage (27); The back plate (21) is located inside the box body (11); the drive motor (22) is fixedly arranged on the rear side of the box body (11) and is transmission-connected to the back plate (21); the bidirectional hydraulic rod (23) is located in the middle of the front side of the back plate (21); two fixed sleeves (24) are provided; the two fixed sleeves (24) are respectively fixedly sleeved on the two ends of the outer side of the bidirectional hydraulic rod (23) and are both fixedly connected to the back plate (21); the connecting shaft (25) is fixedly arranged on the output shaft end of the bidirectional hydraulic rod (23); the ear plate (26) is rotatably sleeved on the outer side of the connecting shaft (25) through a bearing; and the mesh cage (27) is fixedly arranged at the bottom of the ear plate (26).

2. The pickling device for producing semiconductor single crystal silicon wafers according to claim 1, characterized in that: The pickling mechanism (1) comprises a box body (11), a pickling tank (12), a sealing plate (13), a hydraulic cylinder (14) and a spray head (15).

3. The pickling device for producing semiconductor single crystal silicon wafers according to claim 2, characterized in that: The pickling tank (12) is opened at the bottom of the inner cavity of the box (11), the sealing plate (13) is slidably arranged inside the box (11), the hydraulic cylinder (14) is fixedly arranged on the side of the box (11) and its output shaft is fixedly connected to the sealing plate (13), and the nozzle (15) is fixedly arranged through the inside of the box (11).

4. The pickling device for producing semiconductor single crystal silicon wafers according to claim 3, characterized in that: The drying mechanism (3) comprises a box cover (31), a fan (32) and a heating rod (33).

5. The pickling device for producing semiconductor single crystal silicon wafers according to claim 4, characterized in that: The box cover (31) is movably connected to the top of the box body (11) via a hinge, the fan (32) is fixedly nested on the top of the box cover (31), and a plurality of heating rods (33) are provided, and the plurality of heating rods (33) are evenly fixedly arranged on the inner side of the box cover (31).

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