Equipment heat dissipation mechanism for information storage

Abstract

The utility model discloses an equipment heat dissipation mechanism for information storage, which relates to the technical field of computers and comprises a lower clamping plate, threaded holes are respectively formed in four ends of the top surface of the lower clamping plate in a penetrating manner, an opening is formed in the bottom surface of the lower clamping plate in a penetrating manner, and passive heat dissipation components are arranged on the outer edge of the top surface and the outer edge of the bottom surface of the opening. A clamping assembly is arranged on the top face of the lower clamping plate. After the solid state disk is installed through the lower clamping plate and the upper clamping plate, the upper heat conduction pad and the lower heat conduction pad can be attached to the solid state disk, the solid state disk is installed on the main board after the solid state disk is clamped, and the connecting joint is inserted into the FAN port of the main board, so that passive heat dissipation can be conducted on the bottom of the solid state disk through the lower heat conduction pad and the lower heat dissipation fins when the solid state disk runs. Heat generated by particles of the solid state disk is conducted to the upper heat dissipation fins through the upper heat conduction pad on the top, then active heat dissipation is conducted on the upper heat dissipation fins through the heat dissipation fan, an air channel is formed in the heat dissipation housing through the arrangement of the heat dissipation housing and the air outlet, and the active heat dissipation effect is better.

Description

Technical Field

[0001] The utility model relates to the technical field of computers, in particular to a heat dissipation mechanism for equipment used for information storage. Background Art

[0002] Information storage devices are devices used to store digital information. They use electrical, magnetic or optical technologies to save data. The large-capacity device used to store information in a computer is a hard disk. A computer hard disk is a device used to store data. It has a large storage capacity and can store operating systems, applications, documents, and media files. Since it is much faster than traditional mechanical hard disks, solid-state hard disks are mostly used for mass storage in today's computers.

[0003] After installation, an existing solid-state hard drive usually has a thermally conductive pad pasted on its top surface, and then a heat sink fin is pasted on the top surface of the thermally conductive pad, so that the solid-state hard drive can increase the heat dissipation area through the thermally conductive pad and the heat sink fins when it is running, and perform passive heat dissipation through the air flow inside the chassis. However, the heat dissipation effect of passive heat dissipation alone is not good, and the installation effect of the thermally conductive pad and the heat sink fins is likely to affect its heat dissipation performance. At the same time, after long-term use, the connecting glue connecting the thermally conductive pad and the heat sink fins ages, making it easy for the heat sink fins to not fit the thermally conductive pad, resulting in a decrease in heat dissipation performance, so it needs to be improved. Utility Model Content

[0004] The purpose of the utility model is to make up for the deficiencies of the prior art and provide a heat dissipation mechanism for information storage equipment.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a heat dissipation mechanism for information storage equipment, comprising a lower clamping plate, wherein the four ends of the top surface of the lower clamping plate are respectively penetrated with threaded holes, the bottom surface of the lower clamping plate is penetrated with an opening, and the outer edges of the top surface and the bottom surface of the opening are both provided with passive heat dissipation components, and the top surface of the lower clamping plate is provided with a clamping component;

[0006] The clamping assembly comprises an upper clamping plate, a fixing bolt and a spring, and limiting holes are respectively provided at the four ends of the top surface of the upper clamping plate corresponding to the threaded holes of the lower clamping plate, the threaded column part of the fixing bolt passes through the limiting holes of the upper clamping plate and is threadedly connected with the threaded holes of the lower clamping plate, an annular groove is provided on the outer edge of the top surface of the threaded hole of the lower clamping plate, and an annular groove is provided on the outer edge of the bottom surface of the limiting hole of the upper clamping plate, the top end of the spring abuts against the inner wall of the annular groove of the upper clamping plate, and the bottom end of the spring abuts against the inner wall of the annular groove of the lower clamping plate, an opening is provided through the top surface of the upper clamping plate, and the outer edges of the top surface and the bottom surface of the opening are both provided with heat dissipation auxiliary components, the top surface of the upper clamping plate is provided with a heat dissipation component, and the top surface of the upper clamping plate is provided with a notch.

[0007] As mentioned above, a positioning groove is fixedly installed on the top surface of the lower clamping plate, an opening is penetrated through the front end of the positioning groove, a semicircular notch is penetrated through the rear end of the positioning groove, and the semicircular notch penetrates the lower clamping plate.

[0008] As mentioned above, the passive heat dissipation component includes a lower thermal pad and a lower heat dissipation fin, the lower thermal pad is fixedly installed on the outer edge of the open top surface of the lower clamping plate, the top surface of the lower heat dissipation fin is fixedly connected with a heat conductive block, the lower heat dissipation fin is fixedly installed on the outer edge of the open bottom surface of the lower clamping plate, and the heat conductive block of the lower heat dissipation fin passes through the opening of the lower clamping plate and fits with the bottom surface of the lower thermal pad.

[0009] As mentioned above, the heat dissipation auxiliary component includes an upper thermal pad and an upper heat dissipation fin, the upper thermal pad is fixedly installed on the outer edge of the open bottom surface of the upper clamp, the bottom surface of the upper heat dissipation fin is fixedly installed with a thermal block, the upper heat dissipation fin is fixedly installed on the outer edge of the open top surface of the upper clamp, and the thermal block of the upper heat dissipation fin passes through the opening of the upper clamp and fits with the top surface of the upper thermal pad.

[0010] As mentioned above, the heat dissipation assembly includes a heat dissipation cover, a heat dissipation fan and an air outlet. The heat dissipation cover is fixedly installed on the top surface of the upper clamping plate. Two installation openings are respectively penetrated at both ends of the top surface of the heat dissipation cover. The heat dissipation fan is fixedly installed on the inner wall of the installation opening of the heat dissipation cover. An air outlet is penetrated on the side of the heat dissipation cover. The air outlet is a strip-shaped opening. A dustproof assembly is arranged on the outer edge of the top surface of the installation opening of the heat dissipation cover.

[0011] As mentioned above, the lead wire of the heat dissipation fan passes through the side surface of the heat dissipation cover, and one end of the lead wire is electrically connected to a connection connector.

[0012] As mentioned above, the dustproof component includes a limiting groove, a soft magnetic strip frame and a flexible dustproof net. The limiting groove is opened on the top outer edge of the heat dissipation cover mounting port, the inner wall of the limiting groove is fixedly connected with a metal strip, the top surface of the soft magnetic strip frame is fixedly installed with a flexible dustproof net, and the soft magnetic strip frame is placed on the inner wall of the limiting groove.

[0013] Compared with the prior art, the heat dissipation mechanism of the device for information storage has the following beneficial effects:

[0014] 1. The utility model provides a lower clamping plate, an upper clamping plate, a fixing bolt, a spring, a positioning groove, a lower thermal pad, a lower heat dissipation fin, an upper thermal pad, an upper heat dissipation fin, a heat dissipation cover, an air outlet, a heat dissipation fan and a connecting joint, so that the solid-state hard disk to be installed can be placed in the positioning groove of the lower clamping plate, and the notch at the rear end of the solid-state hard disk is aligned with the notch of the positioning groove, and then the upper clamping plate is moved downward by rotating the fixing bolt to clamp the solid-state hard disk, so that the upper thermal pad and the lower thermal pad are both in contact with the solid-state hard disk, and after the solid-state hard disk is clamped, the solid-state hard disk is The hard disk is installed on the motherboard, and the connecting connector is inserted into the FAN port of the motherboard, so that when the solid-state hard disk is in operation, the bottom can passively dissipate heat through the lower thermal pad and the lower heat dissipation fins, and the top can transfer the heat generated by the particles of the solid-state hard disk to the upper heat dissipation fins through the upper thermal pad, and then the upper heat dissipation fins are actively dissipated through the heat dissipation fan, and the setting of the heat dissipation cover and the air outlet forms an air duct inside the heat dissipation cover, so that the active heat dissipation effect is better, and at the same time, the setting of the spring makes it difficult for the upper clamping plate to shake during active heat dissipation, so that the heat dissipation effect is not easy to decrease after long-term use.

[0015] 2. The utility model provides a limit groove, a soft magnetic strip frame and a flexible dustproof net, so that the soft magnetic strip frame can be placed on the inner wall of the limit groove, and the soft magnetic strip frame can be adsorbed on the metal strip on the inner wall of the limit groove for fixation, so that the flexible dustproof net can greatly reduce the dust entering the cooling fan and affecting the operation of the cooling fan, and the soft magnetic strip frame can be directly taken out of the limit groove when cleaning, making cleaning very convenient.

[0016] Other advantages, objectives and features of the present invention will be described in the following description to some extent, and will be apparent to those skilled in the art based on the following examination and study, or may be taught from the practice of the present invention to some extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0018] Figure 2 It is a rear view structural schematic diagram of the utility model;

[0019] Figure 3 It is a bottom view structural schematic diagram of the utility model;

[0020] Figure 4 This is a schematic diagram of the structure when the soft magnetic strip frame is not installed.

[0021] In the figure: 1. lower clamping plate; 2. upper clamping plate; 3. fixing bolt; 4. spring; 5. lower thermal pad; 6. lower heat sink fin; 7. upper thermal pad; 8. heat sink cover; 9. heat sink fan; 10. connecting joint; 11. upper heat sink fin; 12. air outlet; 13. positioning slot; 14. soft magnetic strip frame; 15. flexible dustproof net; 16. limit slot. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] like Figure 1-4 As shown, the utility model provides a technical solution: a heat dissipation mechanism for information storage equipment, comprising a lower clamping plate 1, threaded holes are respectively opened through the four ends of the top surface of the lower clamping plate 1, an opening is opened through the bottom surface of the lower clamping plate 1, and the outer edges of the top surface and the bottom surface of the opening are both provided with passive heat dissipation components, and the top surface of the lower clamping plate 1 is provided with a clamping component;

[0024] The clamping assembly includes an upper clamping plate 2, a fixing bolt 3 and a spring 4. The four ends of the top surface of the upper clamping plate 2 are respectively provided with limiting holes corresponding to the threaded holes of the lower clamping plate 1. The threaded column part of the fixing bolt 3 passes through the limiting hole of the upper clamping plate 2 and is threadedly connected with the threaded hole of the lower clamping plate 1. An annular groove is provided on the outer edge of the top surface of the threaded hole of the lower clamping plate 1, and an annular groove is provided on the outer edge of the bottom surface of the limiting hole of the upper clamping plate 2. The top end of the spring 4 abuts against the inner wall of the annular groove of the upper clamping plate 2, and the bottom end of the spring 4 abuts against the inner wall of the annular groove of the lower clamping plate 1. An opening is opened through the top surface of the upper clamping plate 2, and the outer edges of the top surface and the bottom surface of the opening are both provided with heat dissipation auxiliary components. The top surface of the upper clamping plate 2 is provided with a heat dissipation component, and the top surface of the upper clamping plate 2 is opened through a notch.

[0025] According to the overall structure of the device, the solid state drive to be installed is placed in the positioning groove 13 of the lower clamping plate 1, and the notch at the rear end of the solid state drive is aligned with the notch of the positioning groove 13, and then the upper clamping plate 2 is moved downward by rotating the fixing bolt 3 to clamp the solid state drive, so that the upper thermal pad 7 and the lower thermal pad 5 are both in contact with the solid state drive. After the solid state drive is clamped, the solid state drive is installed on the motherboard, and the connecting connector 10 is inserted into the FAN port of the motherboard, so that when the solid state drive is running, the bottom can be connected through the lower thermal pad 5 and the lower heat dissipation fin 6. Passive heat dissipation, the heat generated by the particles of the solid state drive is conducted to the upper heat dissipation fins 11 through the upper thermal pad 7 on the top, and then the upper heat dissipation fins 11 are actively dissipated through the heat dissipation fan 9, and the setting of the heat dissipation cover 8 and the air outlet 12 forms an air duct inside the heat dissipation cover 8, so that the active heat dissipation effect is better, and the heat dissipation effect is not easy to decline after long-term use, and when the heat dissipation fan 9 is running, dust is prevented through the flexible dustproof net 15 in the soft magnetic strip frame 14, and when the flexible dustproof net 15 needs to be cleaned, it can be directly taken out from the limit slot 16.

[0026] like Figure 2 As shown, a positioning groove 13 is fixedly installed on the top surface of the lower clamping plate 1 , an opening is penetrated through the front end of the positioning groove 13 , a semicircular notch is penetrated through the rear end of the positioning groove 13 , and the semicircular notch penetrates the lower clamping plate 1 .

[0027] By providing the positioning groove 13 , the solid state hard disk can be placed in the positioning groove 13 , and the notch at the rear end of the solid state hard disk is aligned with the notch of the positioning groove 13 to complete the positioning.

[0028] like Figure 3 As shown, the passive heat dissipation component includes a lower thermal pad 5 and a lower heat dissipation fin 6. The lower thermal pad 5 is fixedly installed on the outer edge of the open top surface of the lower clamping plate 1. The top surface of the lower heat dissipation fin 6 is fixedly connected with a heat conductive block. The lower heat dissipation fin 6 is fixedly installed on the outer edge of the open bottom surface of the lower clamping plate 1, and the heat conductive block of the lower heat dissipation fin 6 passes through the opening of the lower clamping plate 1 and fits with the bottom surface of the lower thermal pad 5.

[0029] By providing the lower thermal pad 5 and the lower heat sink fin 6 , the heat at the bottom of the solid state hard disk can be passively dissipated through the lower thermal pad 5 and the lower heat sink fin 6 when the solid state hard disk is running.

[0030] like Figure 4The heat dissipation device is a heat dissipation device, and a heat dissipation device is used to dissipate heat from the bottom of the heat dissipation plate 2 to the bottom of the heat dissipation plate 2. The heat dissipation device is a heat dissipation device, and a heat dissipation device is used to dissipate heat from the bottom of the heat dissipation plate 2 to the bottom of the heat dissipation plate 2 to the bottom of the heat dissipation plate 2 to the bottom of the heat dissipation plate 2 to the bottom of the heat dissipation plate 2 to the bottom of the heat dissipation plate 7 ...

[0031] By providing an upper thermal pad 7, an upper heat sink fin 11, a heat sink shell 8, a heat sink fan 9, an air outlet 12 and a connecting joint 10, the connecting joint 10 is inserted into the FAN port of the mainboard, so that when the solid state hard disk is running, the bottom can passively dissipate heat through the lower thermal pad 5 and the lower heat sink fin 6, and the top can transfer the heat generated by the particles of the solid state hard disk to the upper heat sink fin 11 through the upper thermal pad 7, and then the upper heat sink fin 11 is actively dissipated through the heat sink fan 9, and the heat sink shell 8 and the air outlet 12 are provided so that an air duct is formed inside the heat sink shell 8, so that the active heat dissipation effect is better.

[0032] like Figure 4 As shown, the dustproof component includes a limiting groove 16, a soft magnetic strip frame 14 and a flexible dustproof net 15. The limiting groove 16 is opened on the top outer edge of the mounting opening of the heat dissipation cover 8. The inner wall of the limiting groove 16 is fixedly connected with a metal strip. The top surface of the soft magnetic strip frame 14 is fixedly installed with a flexible dustproof net 15. The soft magnetic strip frame 14 is placed on the inner wall of the limiting groove 16.

[0033] By setting the limiting groove 16, the soft magnetic strip frame 14 and the flexible dustproof net 15, when the heat dissipation fan 9 is running, dust is prevented by the flexible dustproof net 15 in the soft magnetic strip frame 14, and the flexible dustproof net 15 can be directly taken out from the limiting groove 16 when it is necessary to clean it.

[0034] Working principle: place the solid state drive to be installed in the positioning groove 13 of the lower clamping plate 1, and align the notch at the tail end of the solid state drive with the notch of the positioning groove 13, and then move the upper clamping plate 2 downward by rotating the fixing bolt 3 to clamp the solid state drive, so that the upper thermal pad 7 and the lower thermal pad 5 are both in contact with the solid state drive. After clamping the solid state drive, install the solid state drive to the motherboard, and insert the connecting connector 10 into the FAN port of the motherboard, so that when the solid state drive is running, the bottom can be passively cooled through the lower thermal pad 5 and the lower heat dissipation fin 6, and the top can transfer the heat generated by the particles of the solid state drive to the upper heat dissipation fin 11 through the upper thermal pad 7, and then the upper heat dissipation fin 11 is actively cooled through the heat dissipation fan 9, and the setting of the heat dissipation cover 8 and the air outlet 12 forms an air duct inside the heat dissipation cover 8, so that the active heat dissipation effect is better, and when the heat dissipation fan 9 is running, dust is prevented through the flexible dustproof net 15 in the soft magnetic strip frame 14, and the flexible dustproof net 15 is directly taken out from the limiting groove 16 when it needs to be cleaned.

[0035] It should be noted that, in this article, the orientation or position relationship indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. is based on the orientation or position relationship shown in the drawings, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the utility model; the terms "first", "second", and "third" are only used for descriptive purposes and cannot be understood as indicating or implying relative importance. In addition, unless otherwise clearly specified and limited, the terms "fixed", "installed", "connected", and "connected" should be understood in a broad sense. For example, "installed" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a mechanical connection or an electrical connection; "connected" can be a direct connection, an indirect connection through an intermediate medium, or a connection between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the utility model can be understood according to specific circumstances.

[0036] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A heat dissipation mechanism for information storage equipment, comprising a lower clamping plate (1), characterized in that: The four ends of the top surface of the lower clamping plate (1) are respectively penetrated with threaded holes, the bottom surface of the lower clamping plate (1) is penetrated with an opening, and the outer edges of the top surface and the bottom surface of the opening are both provided with passive heat dissipation components, and the top surface of the lower clamping plate (1) is provided with a clamping component; The clamping assembly comprises an upper clamping plate (2), a fixing bolt (3) and a spring (4); the four ends of the top surface of the upper clamping plate (2) are respectively provided with limiting holes corresponding to the threaded holes of the lower clamping plate (1); the threaded column part of the fixing bolt (3) passes through the limiting hole of the upper clamping plate (2) and is threadedly connected with the threaded hole of the lower clamping plate (1); an annular groove is provided on the outer edge of the top surface of the threaded hole of the lower clamping plate (1); an annular groove is provided on the outer edge of the bottom surface of the limiting hole of the upper clamping plate (2); the top end of the spring (4) abuts against the inner wall of the annular groove of the upper clamping plate (2); the bottom end of the spring (4) abuts against the inner wall of the annular groove of the lower clamping plate (1); an opening is provided through the top surface of the upper clamping plate (2), and the outer edges of the top surface and the bottom surface of the opening are both provided with heat dissipation auxiliary components; the top surface of the upper clamping plate (2) is provided with a heat dissipation component; and the top surface of the upper clamping plate (2) is provided with a notch.

2. The heat dissipation mechanism for information storage equipment according to claim 1, characterized in that: A positioning groove (13) is fixedly mounted on the top surface of the lower clamping plate (1), an opening is penetrated through the front end of the positioning groove (13), a semicircular notch is penetrated through the rear end of the positioning groove (13), and the semicircular notch penetrates the lower clamping plate (1).

3. The heat dissipation mechanism for information storage equipment according to claim 1, characterized in that: The passive heat dissipation component comprises a lower thermal pad (5) and a lower heat dissipation fin (6); the lower thermal pad (5) is fixedly mounted on the outer edge of the open top surface of the lower clamping plate (1); the top surface of the lower heat dissipation fin (6) is fixedly connected with a heat conduction block; the lower heat dissipation fin (6) is fixedly mounted on the outer edge of the open bottom surface of the lower clamping plate (1); and the heat conduction block of the lower heat dissipation fin (6) passes through the opening of the lower clamping plate (1) and fits with the bottom surface of the lower thermal pad (5).

4. The heat dissipation mechanism for information storage equipment according to claim 1, characterized in that: The heat dissipation auxiliary component comprises an upper thermal pad (7) and an upper heat dissipation fin (11); the upper thermal pad (7) is fixedly mounted on the outer edge of the bottom opening of the upper clamping plate (2); a heat conduction block is fixedly mounted on the bottom surface of the upper heat dissipation fin (11); the upper heat dissipation fin (11) is fixedly mounted on the outer edge of the top opening of the upper clamping plate (2); and the heat conduction block of the upper heat dissipation fin (11) passes through the opening of the upper clamping plate (2) and fits with the top surface of the upper thermal pad (7).

5. The heat dissipation mechanism for information storage equipment according to claim 1, characterized in that: The heat dissipation component comprises a heat dissipation shell (8), a heat dissipation fan (9) and an air outlet (12); the heat dissipation shell (8) is fixedly mounted on the top surface of the upper clamping plate (2); two mounting openings are respectively provided at both ends of the top surface of the heat dissipation shell (8); the heat dissipation fan (9) is fixedly mounted on the inner wall of the mounting opening of the heat dissipation shell (8); an air outlet (12) is provided on the side surface of the heat dissipation shell (8); the air outlet (12) is a strip-shaped opening; and a dustproof component is provided on the outer edge of the top surface of the mounting opening of the heat dissipation shell (8).

6. The heat dissipation mechanism for information storage equipment according to claim 5, characterized in that: The lead wire of the heat dissipation fan (9) passes through the side surface of the heat dissipation housing (8), and one end of the lead wire is electrically connected to a connection connector (10).

7. The heat dissipation mechanism for information storage equipment according to claim 5, characterized in that: The dustproof component comprises a limiting groove (16), a soft magnetic strip frame (14) and a flexible dustproof net (15); the limiting groove (16) is arranged on the top outer edge of the mounting opening of the heat dissipation cover shell (8); a metal strip is fixedly connected to the inner wall of the limiting groove (16); a flexible dustproof net (15) is fixedly installed on the top surface of the soft magnetic strip frame (14); and the soft magnetic strip frame (14) is placed on the inner wall of the limiting groove (16).

Images