Coil device and magnetic element

Abstract

The utility model discloses a coil device and a magnetic element. The high-voltage coil device can be used for electric power equipment such as reactors and transformers. Taking an electric reactor as an example, the coil device comprises an iron core, coils and a liquid cooling plate assembly, the coils are wound on the iron core, the coils are arranged in a single-layer or multi-layer mode in the direction perpendicular to the winding direction of the coils, a heat dissipation space and an insulating material are arranged between every two adjacent layers of coils, and the liquid cooling plate assembly is arranged in the heat dissipation space and is insulated from the iron core and the coils. Therefore, the liquid cooling plate assembly is prevented from being directly connected with the ground through the iron core, parasitic capacitance of the coil to the ground is reduced, and leakage current is reduced. And meanwhile, the liquid cooling plate assembly is suspended and limited between the coils, and the liquid cooling plate and the coils only need to be functionally insulated, so that the insulation requirement is reduced, the reliability is improved, the size is reduced, and the cost is reduced.

Description

Technical Field

[0001] The present application relates to the technical field of electronic components, and more specifically, to a wire package device and a magnetic component. Background Art

[0002] As the power level of equipment such as reactors and transformers continues to increase, higher requirements are placed on their appearance and heat dissipation. In related technologies, a liquid cooling plate is sandwiched between the coils of reactors and transformers, and the liquid cooling plate is connected to a fixed support (i.e., short-circuited to the iron core) through a metal connecting rod. The coil and the liquid cooling plate have a large overlapping area, forming a parallel plate capacitor. At the same time, since the liquid cooling plate is grounded, the liquid cooling plate and the coil must be designed according to basic insulation, and the insulation requirements are high. Utility Model Content

[0003] Embodiments of the present application provide a wire package device and a magnetic element.

[0004] The wire package device of the embodiment of the present application includes: an iron core, a wire package, and a liquid cooling plate assembly, wherein the wire package is wound on the iron core, and the wire package is arranged in a single layer or multiple layers perpendicular to the winding direction of the wire package, and a heat dissipation space is provided between adjacent layers of the wire packages, and the liquid cooling plate assembly is arranged in the heat dissipation space and is insulated from the iron core.

[0005] In the wire wrap device of the embodiment of the present application, the wire wrap device includes an iron core, a wire wrap, and a liquid cooling plate assembly. The wire wrap is wound on the iron core, and the wire wrap is arranged in a single layer or multiple layers perpendicular to the winding direction of the wire wrap. A heat dissipation space is provided between adjacent layers of wire wraps. The liquid cooling plate assembly is arranged in the heat dissipation space and is insulated from the iron core. In this way, the direct connection of the liquid cooling plate assembly to the ground through the iron core is avoided, the parasitic capacitance of the wire wrap to the ground is reduced, and thus the leakage current is reduced. At the same time, the liquid cooling plate assembly is suspended and confined between the wire wraps. The liquid cooling plate and the wire wrap only need to be functionally insulated, the insulation requirements are reduced, the reliability is improved, and the volume and cost are also reduced.

[0006] In certain embodiments, the coil device further includes an insulating support member, wherein the insulating support member is respectively connected to the iron core and the liquid cooling plate assembly.

[0007] In this way, the insulating support member can connect the liquid cooling plate assembly and support the liquid cooling plate assembly, thereby ensuring that the relative position of the liquid cooling plate assembly and the iron core is stable.

[0008] In some embodiments, the iron core is rectangular and passes through the coil.

[0009] Thus, the rectangular shape of the core can make the winding of the wire package around the core stable.

[0010] In some embodiments, the wire bundle further includes a first wire bundle layer and a second wire bundle layer, the first wire bundle layer and the second wire bundle layer are respectively arranged on opposite sides of the iron core, and the first wire bundle layer and the second wire bundle layer are equal in number and are connected in sequence.

[0011] Thus, the iron core is formed in a rectangular shape with two opposite surfaces, and the first wire sheath and the second wire sheath are respectively arranged on two opposite sides of the iron core and form equivalent capacitors with the two surfaces respectively.

[0012] In some embodiments, the liquid cooling plate assembly further includes a first liquid cooling plate and a second liquid cooling plate, wherein the first liquid cooling plate is disposed between two adjacent first wire sheaths, and the second liquid cooling plate is disposed between two adjacent second wire sheaths, and the first liquid cooling plate and the second liquid cooling plate are connected to each other.

[0013] Thus, the first liquid cooling plate is arranged in two adjacent first wire bundle layers, and the second liquid cooling plate is arranged in two adjacent second wire bundle layers. Thus, the first liquid cooling plate and the second liquid cooling plate can cool the wire bundle respectively to ensure stable operation of the wire bundle device.

[0014] In some embodiments, the ratio of the number of the first wire sheath to the first liquid cooling plate is 2:1, and the ratio of the number of the second wire sheath to the second liquid cooling plate is 2:1.

[0015] Thus, by setting the ratio between the wire package and the liquid cooling plate in this way, the number of liquid cooling plates can be reduced while ensuring the heat dissipation effect, thereby reducing the cost and the volume of the wire package device.

[0016] In certain embodiments, the liquid cooling plate assembly is fixed in the wire package by bonding with a thermally conductive adhesive.

[0017] In this way, thermal conductive adhesive can be filled in the heat dissipation space between the wire packages, so that the liquid cooling plate assembly can rely on the thermal conductive adhesive for support and heat conduction, thereby improving the heat dissipation efficiency while ensuring the stability of the setting between the liquid cooling plate assembly and the wire packages.

[0018] In certain embodiments, the heat dissipation medium of the liquid cooling plate assembly is insulating oil or high-purity water.

[0019] In this way, the heat dissipation medium in the liquid cooling plate assembly is insulating oil or high-purity water, which will not interfere with the electromagnetic field of the coil and the core, thereby ensuring the normal operation of the coil device.

[0020] In certain embodiments, the core is grounded.

[0021] In this way, the core is grounded so that the potential of the core is always at zero potential.

[0022] In certain embodiments, the coil and the liquid cooling plate assembly are electrically connected in a single phase.

[0023] In this way, the coil device can be connected to single-phase electricity and drive the equipment through single-phase electricity.

[0024] In certain embodiments, the coil and the liquid cooling plate assembly are electrically connected in three phases.

[0025] In this way, the coil device can be connected to three-phase electricity and drive the equipment through three-phase electricity.

[0026] The magnetic element of the embodiment of the present application includes the wire package device described in any one of the above embodiments.

[0027] In the wire wrap device and magnetic element of the implementation mode of the present application, the wire wrap device includes an iron core, a wire wrap, and a liquid cooling plate assembly. The wire wrap is wound on the iron core, and the wire wrap is arranged in a single layer or multiple layers perpendicular to the winding direction of the wire wrap. A heat dissipation space is provided between adjacent layers of wire wraps. The liquid cooling plate assembly is arranged in the heat dissipation space and is insulated from the iron core. In this way, the liquid cooling plate assembly is avoided from being connected to the ground through the iron core, and the parasitic capacitance of the wire wrap to the ground is reduced, thereby reducing the leakage current. At the same time, the liquid cooling plate assembly is suspended and confined between the wire wraps. The liquid cooling plate and the wire wrap only need to be functionally insulated to reduce costs.

[0028] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0030] Figure 1 is a schematic structural diagram of a wire package device according to an embodiment of the present application;

[0031] Figure 2 is another structural schematic diagram of the wire package device according to an embodiment of the present application;

[0032] Figure 3 It is another structural schematic diagram of the wire package device according to the embodiment of the present application;

[0033] Figure 4 It is a schematic diagram of the module structure of the wire package device according to the embodiment of the present application;

[0034] Figure 5 is another schematic diagram of the module structure of the wire package device according to the embodiment of the present application;

[0035] Figure 6 It is another schematic diagram of the module structure of the wire package device according to the embodiment of the present application;

[0036] Figure 7 is a schematic diagram of the module structure of the reactor according to the embodiment of the present application;

[0037] Figure 8 is a schematic diagram of a module structure of a transformer according to an embodiment of the present application;

[0038] Fig. 9 It is a schematic diagram of the module structure of the magnetic element of the implementation mode of the present application.

[0039] Description of main component symbols:

[0040] Wire package device 100;

[0041] The iron core 10 , the coil 20 , the first coil layer 21 , the second coil layer 22 , the heat dissipation space 23 , the liquid cooling plate assembly 30 , the first liquid cooling plate 31 , the second liquid cooling plate 32 , the insulating support 40 , the thermal conductive adhesive 50 , the reactor 200 , the transformer 300 , and the magnetic element 400 . DETAILED DESCRIPTION

[0042] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.

[0043] In the present application, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0044] The disclosure below provides many different embodiments or examples to realize the different structures of the present application. In order to simplify the disclosure of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the present application. In addition, the present application can repeat reference numbers and / or reference letters in different examples, and this repetition is for the purpose of simplification and clarity, which itself does not indicate the relationship between the various embodiments and / or settings discussed. In addition, the various specific processes and examples of materials provided in the present application, but those of ordinary skill in the art can be aware of the application of other processes and / or the use of other materials.

[0045] See also Figure 1 , Figure 2 and Figure 3 The coil device 100 of the embodiment of the present application can be used for power equipment such as a reactor 200 and a transformer 300. The following description takes the reactor 200 as an example. The coil device 100 includes an iron core 10, a coil 20, and a liquid cooling plate assembly 30. The coil 20 is wound on the iron core 10. The coil 20 is arranged in a single layer or multiple layers perpendicular to the winding direction of the coil 20. A heat dissipation space 23 is provided between adjacent layers of coils 20. The liquid cooling plate assembly 30 is arranged in the heat dissipation space 23 and is insulated from the iron core 10.

[0046] In the wire wrap device 100 of the embodiment of the present application, the wire wrap device 100 includes an iron core 10, a wire wrap 20, and a liquid cooling plate assembly 30. The wire wrap 20 is wound on the iron core 10. The wire wrap 20 is arranged in a single layer or multiple layers perpendicular to the winding direction of the wire wrap 20. A heat dissipation space 23 is provided between adjacent layers of wire wraps 20. The liquid cooling plate assembly 30 is arranged in the heat dissipation space 23 and is insulated from the iron core 10. In this way, the liquid cooling plate assembly 30 is avoided from being connected to the ground through the iron core 10, and the parasitic capacitance of the wire wrap 20 to the ground is reduced, thereby reducing the leakage current. At the same time, the liquid cooling plate assembly 30 is suspended and confined between the wire wraps 20. The liquid cooling plate and the wire wrap 20 only need to be functionally insulated, the insulation requirements are reduced, the reliability is improved, and the volume and cost are also reduced.

[0047] In the related art, grid-connected reactors are indispensable in high-voltage and high-power converters. However, due to the limitation of loss and volume, most reactors adopt the solution of water-electricity separation, which can reduce the loss of the coil and the volume of the device. At present, the conventional practice is to sandwich a liquid cooling plate between the coils, and the liquid cooling plate is connected to the fixed support by a metal connecting rod, that is, the liquid cooling plate is short-circuited with the ground through the iron core. The coil and the liquid cooling plate have a large overlapping area, forming a parallel plate capacitor. In order to improve the heat dissipation effect, it is necessary to reduce the distance between the two. The smaller the distance, the greater the parasitic capacitance, which leads to a large leakage current during the AC withstand voltage test. In addition, since the liquid cooling plate is grounded, the liquid cooling plate and the coil must be designed according to the basic insulation, which further increases the cost and volume of the reactor.

[0048] In the embodiment of the present application, the liquid cooling plate assembly 30 is spaced apart from the iron core 10, so that the liquid cooling plate assembly 30 is insulated from the iron core 10, reducing the parasitic capacitance of the high-voltage wire package 20 to the ground, thereby reducing the leakage current relative to the ground. At the same time, the insulation requirements of the high-voltage wire package 20 to the liquid cooling plate can be reduced, and the insulation reliability of the wire package device 100 is improved. Specifically, the iron core 10 and the liquid cooling plate assembly 30 can be connected or directly disconnected by using insulating materials to prevent the iron core 10 from pulling down the potential of the liquid cooling plate, so that the potential of the liquid cooling plate is suspended, which can greatly reduce the parasitic capacitance of the wire package 20 to the ground. On the other hand, after the liquid cooling plate assembly 30 is suspended, it is confined between the wire package 20, and the liquid cooling plate assembly 30 and the wire package 20 only need to be functionally insulated. In the embodiment of the present application, the wire package 20 can be a single-layer winding or a multi-layer winding, and the number of layers of the wire package 20 is not specifically limited here to meet different needs.

[0049] See also Figure 2 and Figure 4 In some embodiments, the wire package 20 and the liquid cooling plate assembly 30 are connected in single-phase electricity.

[0050] In this way, the coil device 100 can be connected to a single-phase electricity and drive the device through the single-phase electricity.

[0051] Exemplarily, taking the liquid-cooled coil device 100 used in a single-phase 0.5mH / 2500A 3.3kV system as an example, in the relevant technology, since the capacitance between the coil 20 and the liquid cooling plate can reach 8nF, the capacitance between the core 10 and the coil 20 can reach 0.4nF, and the total parasitic capacitance is the sum of the two 8.4nF. In this way, the leakage current of the coil device 100 under the 10kV power frequency AC withstand voltage reaches ωCU=100π*8.4*10=26.38mA, and the leakage current is relatively large. In the embodiment of the present application, the core 10 is connected or directly disconnected with an insulating material, and the equivalent parasitic capacitance is only 0.4nF. At this time, the leakage current under the 10kV power frequency AC withstand voltage is theoretically about ωCU=100π*0.4*10=1.26mA, and the leakage current is relatively small. The leakage current is reduced from the initial 26.38mA / 10kV to 1.26mA / 10kV, which is a significant effect. At this time, the wire package 20 and the liquid cooling plate assembly 30 only need to meet the functional insulation. Specifically, the wire package 20 needs to meet the functional insulation of ωLI=100π*0.5*2500=393V for the liquid cooling plate assembly 30, which is much lower than the relative withstand voltage of 10kV before the improvement. The insulation requirements are significantly reduced and the reliability is improved.

[0052] In addition, in the embodiments of the present application, functional insulation refers to the functional insulation between conductors, which is only sufficient to ensure the proper operation of the appliance, while the insulation between insulated conductors between conductive parts at different potentials does not provide insulation against electric shock. Functional insulation is the insulation between conductive parts to complete the functional settings of the appliance itself, which only maintains the normal operation of the product and does not have any safety function.

[0053] See also Figure 2 and Figure 4 In some embodiments, the wire package device 100 further includes an insulating support member 40 , and the insulating support member 40 is respectively connected to the iron core 10 and the liquid cooling plate assembly 30 .

[0054] In this way, the insulating support member 40 can be connected to the liquid cooling plate assembly 30 and support the liquid cooling plate assembly 30 to ensure that the relative position of the liquid cooling plate assembly 30 and the iron core 10 is stable.

[0055] See also Figure 1 and Figure 2 In some embodiments, the core 10 is rectangular and passes through the coil 20 .

[0056] In this way, the core 10 is rectangular in shape so that the coil 20 can be stably wound around the core 10 , and the core 10 is grounded so that the potential of the core 10 is always at zero potential.

[0057] See also Figure 1 and Figure 2 In some embodiments, the core 10 is grounded.

[0058] In this way, the iron core 10 is grounded so that the potential of the iron core 10 is always at zero potential.

[0059] Specifically, the iron core 10 is rectangular, and the coil 20 is wound on the iron core 10. At this time, the four surfaces of the iron core 10 and the coil 20 may include two surfaces with larger areas and two surfaces with smaller areas. The parasitic capacitance can be calculated by considering the equivalent capacitance between the two larger surfaces and the coil 20.

[0060] See also Figure 2 and Figure 3 In some embodiments, the wire bundle 20 further includes a first wire bundle layer 21 and a second wire bundle layer 22, and the first wire bundle layer 21 and the second wire bundle layer 22 are respectively arranged on opposite sides of the iron core 10, and the number of the first wire bundle layer 21 and the second wire bundle layer 22 are equal and connected in sequence.

[0061] Thus, the core 10 is formed in a rectangular shape with two opposite surfaces. The first wire sheath 21 and the second wire sheath 22 are respectively arranged on two opposite sides of the core 10 and form equivalent capacitors with the two surfaces respectively.

[0062] For further information, see Figure 2 and Figure 3 In some embodiments, the liquid cooling plate assembly 30 further includes a first liquid cooling plate 31 and a second liquid cooling plate 32 , wherein the first liquid cooling plate 31 is disposed between two adjacent first wire sheaths 21 , and the second liquid cooling plate 32 is disposed between two adjacent second wire sheaths 22 .

[0063] In this way, the first liquid cooling plate 31 is arranged in two adjacent first wire wrap layers 21, and the second liquid cooling plate 32 is arranged in two adjacent second wire wrap layers 22. In this way, the first liquid cooling plate 31 and the second liquid cooling plate 32 can cool the wire wrap 20 respectively to ensure the stable operation of the wire wrap device 100.

[0064] Specifically, the first liquid cooling plate 31 and the second liquid cooling plate 32 correspond to two larger surfaces of the iron core 10 , respectively, so as to improve the heat conduction efficiency of the liquid cooling plate assembly 30 .

[0065] See also Figure 2 and Figure 3 In some embodiments, the ratio of the number of the first wire sheath 21 to the number of the first liquid cooling plate 31 is 2:1, and the ratio of the number of the second wire sheath 22 to the number of the second liquid cooling plate 32 is 2:1.

[0066] Thus, by setting the ratio between the wire package 20 and the liquid cooling plate in this way, the number of liquid cooling plates can be reduced while ensuring the heat dissipation effect, thereby reducing the cost and the volume of the wire package device 100.

[0067] Of course, in other embodiments, the specific number of wire sheaths and liquid cooling plates can be other ratios. For example, the first wire sheath 21 has one more layer than the number of first liquid cooling plates 31, the second wire sheath 22 has one more layer than the number of second liquid cooling plates 32, and each two adjacent first wire sheaths 21 are provided with a first liquid cooling plate 31, and each two adjacent second wire sheaths 22 are provided with a second liquid cooling plate 32, thereby improving the cooling capacity of the liquid cooling plate assembly 30.

[0068] In the implementation of the present application, the specific number of wire sheath layers and liquid cooling plates is not limited, and the number of wire sheath layers only needs to be greater than or equal to the number of liquid cooling plates to meet different needs. For example, the number of the first wire sheath layer 21 and the second wire sheath layer 22 are both four layers, the number of the first liquid cooling plate 31 and the second liquid cooling plate 32 can be three layers, and the number of the first liquid cooling plate 31 and the second liquid cooling plate 32 can also be two layers, and the liquid cooling plates need to be sandwiched between adjacent wire sheath layers.

[0069] See also Figure 2 and Figure 5 In some embodiments, the liquid cooling plate assembly 30 is bonded and fixed in the wire package 20 by a thermally conductive adhesive 50 .

[0070] In this way, the heat dissipation space 23 between the wire packages 20 can be filled with thermal conductive adhesive 50, so that the liquid cooling plate assembly 30 can rely on the thermal conductive adhesive 50 for support and heat conduction, thereby improving the heat dissipation efficiency and ensuring the stability of the setting between the liquid cooling plate assembly 30 and the wire package 20.

[0071] Specifically, the heat-dissipating space 23 may be filled with a thermally conductive adhesive 50, which can form a support for the liquid-cooling plate assembly 30 after solidification, and at this time, there is no need to fix the iron core 10 and the liquid-cooling plate assembly 30. At the same time, the liquid-cooling plate assembly 30 can dissipate heat from the wire package 20 through the thermally conductive adhesive 50, and the thermally conductive adhesive 50 also has insulation properties to prevent short circuits between the wire package 20 and the liquid-cooling plate assembly 30.

[0072] In some embodiments, the heat dissipation medium of the liquid cooling plate assembly 30 is insulating oil or high-purity water.

[0073] In this way, the heat dissipation medium in the liquid cooling plate assembly 30 is insulating oil or high-purity water, which will not interfere with the electromagnetic field of the coil 20 and the iron core 10, thereby ensuring the normal operation of the coil device 100.

[0074] See also Figure 6 In some embodiments, the wire package 20 and the liquid cooling plate assembly 30 are electrically connected in three phases.

[0075] In this way, the coil device 100 can be connected to three-phase electricity and drive the equipment through three-phase electricity.

[0076] In addition, please combine Figure 6 The same effect is also achieved for the single-phase coil device 100 composed of multiple layers of coils and multiple layers of liquid cooling plates, and the three-phase liquid cooling coil 20. Taking the three-phase liquid cooling coil 20 as an example, the capacitance between the A-phase coil 20, the B-phase coil 20, and the C-phase coil 20 and the iron core 10 is 0.4 nF, so the total equivalent capacitance is the sum of the three, 1.2 nF.

[0077] See also Figure 8 The magnetic element 400 of the embodiment of the present application includes the coil device 100 of any one of the above embodiments. In addition, the magnetic element 400 may be a reactor 200 or a transformer 300. The reactor 200 is used as an example in the present application.

[0078] See also Figure 7 The reactor 200 according to the embodiment of the present application includes the coil device 100 according to any one of the above embodiments.

[0079] See also Figure 8 The transformer 300 of the embodiment of the present application includes the wire package device 100 of any one of the above embodiments.

[0080] See also Fig. 9The magnetic element 400 of the embodiment of the present application includes the coil device 100 of any one of the above embodiments. In addition, the magnetic element 400 may be a reactor 200 or a transformer 300. The reactor 200 is used as an example in the present application.

[0081] In the coil device 100, the reactor 200, the transformer 300 and the magnetic element 400 of the embodiment of the present application, the coil device 100 includes an iron core 10, a coil 20, and a liquid cooling plate assembly 30. The coil 20 is wound on the iron core 10. The coil 20 is arranged in a single layer or multiple layers perpendicular to the winding direction of the coil 20. A heat dissipation space 23 is provided between adjacent layers of coils 20. The liquid cooling plate assembly 30 is arranged in the heat dissipation space 23 and is insulated from the iron core 10. In this way, the liquid cooling plate assembly 30 is avoided from being connected to the ground through the iron core 10, and the parasitic capacitance of the coil 20 to the ground is reduced, thereby reducing the leakage current. At the same time, the liquid cooling plate assembly 30 is suspended and confined between the coils 20. The liquid cooling plate and the coil 20 only need to be functionally insulated, the insulation requirements are reduced, the reliability is improved, and the volume and cost are also reduced.

[0082] Of course, in other embodiments, the wire package device 100 of the embodiment of the present application can also be set on other power equipment, which is not specifically limited here.

[0083] In the description of the embodiments of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the embodiments of the present application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0084] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0085] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.

Claims

1. A wire package device, characterized in that: include: An iron core, a coil, and a liquid cooling plate assembly, wherein the coil is wound on the iron core, the coil is arranged in a single layer or multiple layers perpendicular to the winding direction of the coil, a heat dissipation space is provided between adjacent layers of the coil, and the liquid cooling plate assembly is arranged in the heat dissipation space and is insulated from the iron core.

2. The wire package device according to claim 1, characterized in that: The coil device further includes an insulating support member, and the insulating support member is respectively connected to the iron core and the liquid cooling plate assembly.

3. The wire package device according to claim 2, characterized in that: The iron core is rectangular and passes through the coil.

4. The wire package device according to claim 1, characterized in that: The wire package further includes a first wire package layer and a second wire package layer, wherein the first wire package layer and the second wire package layer are respectively arranged on two opposite sides of the iron core, and the first wire package layer and the second wire package layer are equal in number and are connected in sequence.

5. The wire package device according to claim 4, characterized in that: The liquid cooling plate assembly further includes a first liquid cooling plate and a second liquid cooling plate, wherein the first liquid cooling plate is arranged between two adjacent first wire sheaths, and the second liquid cooling plate is arranged between two adjacent second wire sheaths, and the first liquid cooling plate and the second liquid cooling plate are connected to each other.

6. The wire package device according to claim 5, characterized in that: The ratio of the number of the first wire sheath layers to the number of the first liquid cooling plates is 2:1, and the ratio of the number of the second wire sheath layers to the number of the second liquid cooling plates is 2:

1.

7. The wire package device according to claim 5, characterized in that: The liquid cooling plate assembly is fixed in the wire package by bonding with heat-conducting adhesive.

8. The wire package device according to claim 1, characterized in that: The heat dissipation medium of the liquid cooling plate assembly is insulating oil or high-purity water.

9. The wire package device according to claim 1, characterized in that: The iron core is grounded.

10. The wire package device according to claim 1, characterized in that: The coil and the liquid cooling plate assembly are connected in single-phase electricity.

11. The wire package device according to claim 1, characterized in that: The coil and the liquid cooling plate assembly are electrically connected in three phases.

12. A magnetic element, characterized in that: The wire wrapping device comprises the wire wrapping device according to any one of claims 1 to 11.

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