Coil component and magnetic element

Abstract

The utility model discloses a coil assembly and a magnetic element. The coil assembly comprises multiple layers of coils and first shielding layers, each first shielding layer is arranged between every two adjacent layers of coils, and the first shielding layers are made of semiconductor materials. The two adjacent layers of coils are connected to a first node and are arranged along a first direction from the first node, and the first shielding layer is arranged along the first direction from the first node. The first shielding layer may be made of a semiconductor material. Compared with a metal conductor material, the semiconductor material is lower in resistivity and lower in safety standard, no extra insulating tape needs to be added, and the manufacturing process is simpler. According to the coil assembly provided by the embodiment of the utility model, electromagnetic interference caused by parasitic capacitance among the layers of coils can be avoided, the safety problem caused by a metal shielding layer is also avoided, and the manufacturing cost of the coil assembly is reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of coil components, and more specifically, to a coil component and a magnetic element. Background Art

[0002] In the related art, the magnetic element may include a multi-turn coil, and the distance between the turns of the coil may be set very small to increase the coupling characteristics between the coils and reduce the leakage inductance of the magnetic element. In addition, the primary winding and the secondary winding of the transformer may be staggered, and this winding method may increase the coupling characteristics of the primary and secondary sides and reduce the leakage inductance of the transformer.

[0003] However, the smaller the distance between the turns of the coil, the greater the parasitic capacitance between the turns of the coil. The staggered winding of the primary and secondary windings of the transformer will also increase the parasitic capacitance of the primary and secondary sides, causing electromagnetic interference. Metal foil can be added between the layers of the coil to shield electromagnetic interference, but adding metal foil will change the EMC test specification requirements of the magnetic component. In order to reduce the safety issues caused by metal foil, the coil needs to be added with insulating tape, which increases the size and thickness of the coil. Utility Model Content

[0004] The utility model provides a coil assembly and a magnetic element.

[0005] The coil assembly provided in the embodiment of the utility model includes a multi-layer coil and a first shielding layer, wherein the first shielding layer is arranged between two adjacent layers of coils, and the material of the first shielding layer is a semiconductor material. The two adjacent layers of coils are connected to a first node, the two adjacent layers of coils are arranged from the first node along a first direction, and the first shielding layer is arranged from the first node along the first direction.

[0006] The parasitic capacitance between the coils of each layer is shielded by adding a first shielding layer between two adjacent layers of coils in the coil assembly. The two adjacent layers of coils are arranged along the first direction from the first node, and the potential difference between the two adjacent layers of coils along the first direction gradually increases. The first shielding layer is arranged along the first direction from the same potential point, which can achieve the offset of positive and negative charges, reduce the parasitic capacitance between the two adjacent layers of coils, and shield the electromagnetic interference caused by the parasitic capacitance. The first shielding layer can be made of semiconductor material. Compared with metal conductor materials, semiconductor materials have lower resistivity and lower safety standards. No additional insulating tape is required, and the manufacturing process is simpler.

[0007] In some embodiments, a length of the first shielding layer arranged from the first node along the first direction is shorter than a length of the coil arranged from the first node along the first direction.

[0008] In some embodiments, the coil assembly includes a plurality of first lead wires, one end of each of the first lead wires is connected to a corresponding first node, and the other end of each of the first lead wires is connected to a corresponding first shielding layer.

[0009] In some embodiments, the multiple layers of coils are arranged in parallel, and the head ends of the coils of two adjacent layers are connected to the first node, or the tail ends of the coils of two adjacent layers are connected to the first node. When the head ends of the coils of two adjacent layers are connected to the first node, the first direction is the direction from the head ends to the tail ends of the coils of two adjacent layers. When the tail ends of the coils of two adjacent layers are connected to the first node, the first direction is the direction from the tail ends to the head ends of the coils of two adjacent layers.

[0010] In some embodiments, the multiple layers of coils are arranged in series, and in the two adjacent layers of coils, the head end of one layer of coils and the tail end of another layer of coils are connected to a first node. The first direction is the direction from the head end of one layer of coils to the tail end, and the direction from the tail end of another layer of coils to the head end.

[0011] In some embodiments, the coil assembly also includes a second shielding layer, the material of the second shielding layer is a semiconductor material, the multi-layer coil is wound to form a primary coil winding and a secondary coil winding, and the second shielding layer is arranged between the primary coil winding and the secondary coil winding.

[0012] In some embodiments, the coil assembly includes a second lead wire, the second shielding layer is connected to the first shielding layer at the second node through the second lead wire, and the second node is connected to the ground.

[0013] In some embodiments, the coil assembly further includes a third shielding layer, the material of the third shielding layer is a semiconductor material, and the third shielding layer is wound around the outside of the multi-layer coil.

[0014] In some embodiments, the coil assembly includes a third lead wire, the third shielding layer is connected to the first shielding layer at the third node through the third lead wire, and the third node is connected to the ground.

[0015] The utility model also provides a magnetic element, which includes the coil assembly of the above embodiment.

[0016] In some embodiments, the magnetic element includes a magnetic core, a frame, and a heat sink, and the heat sink includes a shell and a thermally conductive adhesive. The magnetic core is arranged on the inner side of the frame, and the coil assembly is wound on the outer side of the frame. The magnetic core and the frame are arranged on the inner side of the shell, and the thermally conductive adhesive is used to encapsulate the magnetic core and the frame on the inner side of the shell.

[0017] In some embodiments, the magnetic element includes a fourth shielding layer, the material of the fourth shielding layer is a semiconductor material, and the fourth shielding layer is disposed between the iron box and the coil assembly.

[0018] In some embodiments, the magnetic element includes a fourth shielding layer, the material of the fourth shielding layer is a semiconductor material, and the fourth shielding layer is disposed between the housing and the coil assembly.

[0019] The coil assembly provided in the embodiment of the utility model includes a multi-layer coil and a first shielding layer, wherein the first shielding layer is arranged between two adjacent layers of coils, and the material of the first shielding layer is a semiconductor material. The two adjacent layers of coils are connected to a first node, the two adjacent layers of coils are arranged from the first node along a first direction, and the first shielding layer is arranged from the first node along the first direction.

[0020] The parasitic capacitance between each layer of coils is shielded by adding a first shielding layer between two adjacent layers of coils in the coil assembly. The two adjacent layers of coils are arranged from the first node along the first direction, and the potential difference between the two adjacent layers of coils along the first direction gradually increases. The first shielding layer is arranged from the same potential point along the first direction, which can achieve the offset of positive and negative charges, reduce the parasitic capacitance between the two adjacent layers of coils, and shield the electromagnetic interference caused by the parasitic capacitance. The first shielding layer can be made of semiconductor material. Compared with metal conductor materials, semiconductor materials have lower resistivity and lower safety standards. There is no need to add additional insulating tape, and the manufacturing process is simpler. The coil assembly provided by the embodiment of the utility model can avoid electromagnetic interference caused by parasitic capacitance between each layer of coils, and also avoid safety problems caused by the metal shielding layer, reducing the manufacturing cost of the coil assembly.

[0021] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0023] Figure 1 It is a schematic diagram of the coil assembly of the utility model;

[0024] Figure 2 It is a schematic diagram of the magnetic element of the utility model;

[0025] Figure 3 It is a schematic diagram of a first embodiment of the coil assembly of the utility model;

[0026] Figure 4 It is a schematic diagram of a first embodiment of the coil assembly of the utility model;

[0027] Figure 5 is a schematic diagram of a second embodiment of the coil assembly of the utility model;

[0028] Figure 6 is a schematic diagram of a third embodiment of the coil assembly of the utility model;

[0029] Figure 7 It is a circuit equivalent schematic diagram of the third embodiment of the coil assembly of the utility model;

[0030] Figure 8 is a schematic diagram of a fourth embodiment of the coil assembly of the utility model;

[0031] Fig. 9 It is a schematic diagram of the magnetic element of the utility model.

[0032] Description of main component symbols:

[0033] Coil assembly 100, first shielding layer 11, second shielding layer 12, third shielding layer 13, coil 20, head end 21, tail end 22, primary coil winding 23, secondary coil winding 24, magnetic core 200, skeleton 300, heat dissipation glue 400, shell 500, fourth shielding layer 600. DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] In the related art, the magnetic element may include a multi-turn coil, and the distance between the turns of the coil may be set very small to increase the coupling characteristics between the coils and reduce the leakage inductance of the magnetic element. In addition, the primary winding and the secondary winding of the transformer may be staggered, and this winding method may increase the coupling characteristics of the primary and secondary sides and reduce the leakage inductance of the transformer.

[0036] However, the smaller the distance between turns of the coil, the greater the parasitic capacitance between each turn of the coil. The staggered winding of the primary and secondary windings of the transformer will also increase the parasitic capacitance of the primary and secondary sides, causing electromagnetic interference.

[0037] In recent years, with the development of semiconductor power devices and technological advancement, magnetic devices have been developing towards high frequency, high power and miniaturization. In various electrical topologies, power magnetic devices mainly include inductors and transformers, and coils are important components of transformers and inductors.

[0038] In order to meet the requirements of high coupling characteristics of the transformer, the coil part of the transformer can adopt the staggered winding method of the primary winding and the secondary winding. The advantages of the winding method increase the coupling characteristics of the primary and secondary sides and reduce leakage inductance. However, it will also increase the parasitic capacitance of the primary and secondary sides, causing electromagnetic compatibility (EMC) interference. As the power device operates, the parasitic capacitance of the primary and secondary sides causes voltage mutations, which will bring common mode interference problems. The interference current can pass through the parasitic capacitance, affecting the performance of the electronic equipment, and even causing the equipment to stop working.

[0039] The parasitic capacitance characteristics of the primary and secondary sides can be optimized by changing the arrangement and winding method of the windings, but this will lead to problems such as increased leakage inductance and cumbersome winding work. Copper foil can also be added between the layers of the coil to shield electromagnetic interference, but the cost of copper foil is high. In addition, adding copper foil will change the EMC test specification requirements of magnetic components. In order to reduce the safety issues caused by copper foil, the coil needs to be added with insulating tape, which increases the size and thickness of the coil.

[0040] Reference Figure 1 The embodiment of the utility model provides a coil component 100, which includes a first shielding layer 11 and a multi-layer coil 20. The first shielding layer 11 is arranged between two adjacent layers of coils 20, and the material of the first shielding layer 11 is a semiconductor material.

[0041] Reference Figure 2 The present utility model also provides a magnetic element 1000, which includes the coil assembly 100 of the above embodiment. The magnetic element 1000 can be a transformer, an inductor, or other components. The magnetic element 1000 includes a magnetic core 200 and a skeleton 300, wherein the magnetic core 200 is disposed inside the skeleton 300, and the coil assembly 100 can be wound outside the skeleton 300.

[0042] By adding the first shielding layer 11 between the coils 20 of each layer of the coil assembly 100 , the parasitic capacitance between the coils 20 of each layer is shielded, the electromagnetic interference caused by the parasitic capacitance is shielded, and the power loss of the coil assembly 100 during operation is reduced.

[0043] The first shielding layer 11 may be made of semiconductor material. Compared with metal conductor materials, semiconductor materials have lower resistivity and lower safety standards, and do not require additional insulating tape, making the manufacturing process simpler.

[0044] Specifically, the first shielding layer 11 may be disposed between coils 20 of various layers to reduce the interlayer capacitance of the coil assembly 100. The material of the coils 20 of various layers may be a metal conductor material, and a parasitic capacitance may be formed between two metal coils 20.

[0045] The first shielding layer 11 can be arranged between every two adjacent coils 20 to shield the parasitic capacitance between every two adjacent layers of coils 20, and further shield the parasitic capacitance between each layer of coils 20. For example, the coil assembly 100 may include n layers of coils 20 arranged in a stacked manner, and the n layers of coils 20 can be sequentially recorded as coil M1, coil M2, coil M3 to coil Mn-1, and coil Mn from the inside to the outside. The first shielding layer 11 can be arranged in n-1 layers, and the n-1 layers of the first shielding layer 11 can be sequentially recorded as first shielding layer A1 to first shielding layer An-1 from the inside to the outside. The first shielding layer A1 is arranged between coil M1 and coil M2, the first shielding layer A2 is arranged between coil M2 and coil M3, and the first shielding layer An-1 is arranged between coil Mn-1 and coil Mn, which can effectively reduce the parasitic capacitance between each layer of coils 20 and suppress electromagnetic interference.

[0046] The material of the first shielding layer 11 can be semi-conductive paint. Semi-conductive paint can be obtained by adding organic conductor powder to cable pulp. The resistivity of the semi-conductive paint is 10 2 ~10 11 The resistivity of the semi-conductive paint can be set according to the actual use requirements. Semi-conductive paints with different resistivities can be obtained by adding organic conductor powders of different materials into the cable pulp, and different concentrations of the organic conductor powder can also be used to obtain semi-conductive paints with different resistivities.

[0047] The first shielding layer 11 is close to each layer of coils 20. When each layer of coils 20 is connected to a high-frequency current, the high-frequency magnetic field generated by each layer of coils 20 will pass through the first shielding layer 11, generating eddy current losses. The first shielding layer 11 can be a low-resistivity semi-conductive paint with a resistivity of 10 2 ~10 6 The eddy current loss generated by the first shielding layer 11 is small, and the coil assembly 100 does not generate heat.

[0048] Compared with metal materials, the first shielding layer 11 has lower resistivity and lower safety standards, does not require additional insulating tape, is thin, and is conducive to miniaturization of the magnetic element 1000. The material of the first shielding layer 11 can be semi-conductive paint, which has lower cost than metal materials and a simple manufacturing process.

[0049] Reference Figure 3 as well as Figure 4 In some embodiments, two adjacent layers of coils 20 are connected to a first node, the two adjacent layers of coils 20 are arranged from the first node along a first direction, and the first shielding layer 11 is arranged from the first node along the first direction.

[0050] Two adjacent layers of coils 20 are connected to a first node, which is the same potential point of the two adjacent layers of coils 20. The two adjacent layers of coils 20 are arranged from the first node along the first direction, and the potential difference of the two adjacent layers of coils 20 along the first direction gradually increases. The first shielding layer 11 is arranged from the same potential point along the first direction, which can achieve the offset of positive and negative charges and reduce the parasitic capacitance between the two adjacent layers of coils 20.

[0051] In some embodiments, multiple layers of coils 20 are arranged in series, and in two adjacent layers of coils 20, the head end 21 of one layer of coils 20 and the tail end 22 of the other layer of coils 20 are connected to a first node; the first direction is from the head end 20 of one layer of coils to the tail end 21, and from the tail end 21 of the other layer of coils to the head end 20.

[0052] For example, refer to Figure 3 The coil assembly 100 may include four layers of coils 20. The tail end 22 of the first layer coil M1 may be connected to the head end 21 of the second layer coil M2, the tail end 22 of the second layer coil M2 may be connected to the head end 21 of the third layer coil M3, and the tail end 22 of the third layer coil M3 may be connected to the head end 21 of the fourth layer coil M4.

[0053] Assume that the total potential of the four-layer coil 20 is U, and the potential of each layer of coil 20 is 1 / 4U. For the first layer of coil M1, the potential of the head end 21 is 0, and the potential of the tail end 22 is 1 / 4U. For the second layer of coil M2, the potential of the head end 21 is 1 / 4U, and the potential of the tail end 22 is 1 / 2U. For the third layer of coil M3, the potential of the head end 21 is 1 / 2U, and the potential of the tail end 22 is 3 / 4U. For the fourth layer of coil M4, the potential of the head end 21 is 3 / 4U, and the potential of the tail end 22 is U.

[0054] The first layer coil M1 and the second layer coil M2 are two adjacent layers of coils. Along the direction from the head end 20 to the tail end 21 of the first layer coil M1 and the direction from the tail end 21 to the head end 20 of the second coil M2, the potential difference between the first layer coil M1 and the second layer coil M2 gradually increases. The first shielding layer 11 is arranged along the direction from the head end 20 to the tail end 21 of the first layer coil M1 and the direction from the tail end 21 to the head end 20 of the second coil M2, which is conducive to reducing the parasitic capacitance between the first layer coil M1 and the second layer coil M2.

[0055] For the second layer coil M2 and the third layer coil M3, the potential difference between the two adjacent layers gradually increases along the direction from the head end 20 to the tail end 21 of the second layer coil M2 and the direction from the tail end 21 to the head end 20 of the third layer coil M3. The first shielding layer 11 is arranged along the direction from the head end 20 to the tail end 21 of the second layer coil M2 and the direction from the tail end 21 to the head end 20 of the third layer coil M3, which is beneficial to reduce the parasitic capacitance between the second layer coil M2 and the third layer coil M3.

[0056] Reference Figure 3 as well as Figure 4 In some embodiments, the length of the first shielding layer 11 arranged from the first node along the first direction is less than the length of the coil 20 arranged from the first node along the first direction.

[0057] A portion of the length of the coil 20 arranged along the first direction from the first node is covered by the first shielding layer 11, and the other portion is not covered by the first shielding layer 11. In the portion between the first layer coil M1 and the second layer coil M2 covered by the first shielding layer 11, the second layer coil M2 forms a positive charge Q on the first shielding layer 11. In the portion between the first layer coil M1 and the second layer coil M2 not covered by the first shielding layer 11, the second layer coil M2 forms a negative charge Q on the first layer coil M1. The positive charge Q can offset the negative charge Q, reduce the electric field energy, and reduce the parasitic capacitance between the first layer coil M1 and the second layer coil M2.

[0058] In the portion between the second layer coil M2 and the third layer coil M3 covered by the first shielding layer 11, the third layer coil M3 forms a positive charge Q on the first shielding layer 11. In the portion between the second layer coil M2 and the third layer coil M3 not covered by the first shielding layer 11, the third layer coil M3 forms a negative charge Q on the second layer coil M2. The positive charge Q can offset the negative charge Q, reduce the electric field energy, and reduce the parasitic capacitance between the second layer coil M2 and the third layer coil M3.

[0059] In some embodiments, the multi-layer coils 20 are arranged in parallel, and the head ends 21 of two adjacent layers of coils 20 are connected to the first node, or the tail ends 22 of two adjacent layers of coils 20 are connected to the first node. When the head ends 21 of two adjacent layers of coils 20 are connected to the first node, the first direction is the direction from the head ends 21 to the tail ends 22 of the two adjacent layers of coils 20. When the tail ends 22 of two adjacent layers of coils 20 are connected to the first node, the first direction is the direction from the tail ends 22 to the head ends 21 of the two adjacent layers of coils 20.

[0060] For example, refer to Figure 4 When the magnetic element 1000 is a transformer, the coils 20 of two adjacent layers can be primary windings or secondary windings, the head end 21 of the primary winding and the head end 21 of the secondary winding can be the same potential ends with the same polarity, and the two adjacent layers of coils 20 are arranged in parallel.

[0061] Assuming that the transformer is a step-down transformer, the primary winding P1 and the secondary winding S1 of the transformer are two adjacent layers of coils 20. The potential of the head end 21 of the primary winding P1 and the secondary winding S1 can be 0V, the potential of the tail end 22 of the primary winding P1 can be 5V, and the potential of the tail end 22 of the secondary winding S1 can be 10V.

[0062] The head end 21 of the primary winding P1 and the secondary winding S1 is the same potential point, and the first direction is from the head end of the primary winding P1 and the secondary winding S1 to the tail end of the primary winding P1 and the secondary winding S1. The first shielding layer 11 can be arranged between the primary winding P1 and the secondary winding S1, and the first shielding layer 11 is arranged along the head end of the primary winding P1 and the secondary winding S1 to the tail end of the primary winding P1 and the secondary winding S1.

[0063] At the position between the primary winding P1 and the secondary winding S1 covered by the first shielding layer 11, the secondary winding S1 forms a positive charge Q on the first shielding layer 11. At the position between the primary winding P1 and the secondary winding S1 not covered by the first shielding layer 11, the secondary winding S1 forms a positive charge Q on the primary winding P1. The positive charge Q can offset the negative charge Q, reduce the electric field energy, suppress the primary and secondary common mode interference of the transformer, and reduce EMC interference.

[0064] Reference Figure 3 as well as Figure 4 In some embodiments, the coil assembly 100 includes a plurality of first lead wires, one end of each first lead wire is connected to a corresponding first node, and the other end of each first lead wire is connected to a corresponding first shielding layer 11.

[0065] The first shielding layer 11 can be connected to the same potential as the two adjacent layers of coils 20 through a wire, which can reduce the risk of electric shock caused by the potential difference and is conducive to eliminating fault interference.

[0066] Specifically, refer to Figure 3 When the tail end 22 of the first layer coil M1 can be connected to the head end 21 of the second layer coil M2, the first shielding layer 11 disposed between the first layer coil M1 and the second layer coil M2 is connected to the tail end 22 of the first layer coil M1 and the head end 21 of the second layer coil M2 in sequence through a wire. The first shielding layer 11 is connected to the first layer coil M1 and the second layer coil M2 at the same potential through the wire.

[0067] When the tail end 22 of the second layer coil M2 can be connected to the head end 21 of the third layer coil M3, the first shielding layer 11 disposed between the second layer coil M2 and the third layer coil M3 is connected to the tail end 22 of the second layer coil M2 and the head end 21 of the third layer coil M3 in sequence through a wire. The tail end 22 of the second layer coil M2 and the head end 21 of the third layer coil M3 are equipotential points, and the first shielding layer 11 is equipotentially connected to the second layer coil M2 and the third layer coil M3 through a wire.

[0068] Reference Figure 4 The potential of the primary winding P1 and the head end 21 of the secondary winding S1 can be 0V. At this time, the first shielding layer 11 can be grounded through a wire, so that the charges of the primary winding P1 and the secondary winding S1 can flow freely to the ground to reduce EMC interference.

[0069] Reference Figure 4 In some embodiments, the coil 20 includes a primary coil winding and a secondary coil winding, and the primary coil winding and the secondary coil winding are wound alternately.

[0070] Alternating the winding of the primary coil winding and the secondary coil winding is beneficial to improving the coupling coefficient between the primary coil winding and the secondary coil winding of the transformer, and is beneficial to improving the efficiency of energy transmission of the transformer.

[0071] Specifically, the coil 20 may include 2n layers of coils 20 from the inside to the outside in sequence, wherein the first layer of coils 20 may form a primary winding P1, the second layer of coils 20 may form a secondary winding S1, the third layer of coils 20 may form a primary winding P2, the fourth layer of coils 20 may form a secondary winding S2, the 2n-1th layer of coils 20 may form a primary winding Pn, and the 2nth layer of coils 20 may form a primary winding Sn.

[0072] Reference Figure 5 In some embodiments, the first shielding layer 11 is wrapped around the outside of the primary coil winding. The first shielding layer 11 can also be arranged between the primary coil winding and the secondary coil winding to reduce the parasitic capacitance between the primary coil winding and the secondary coil winding.

[0073] Reference Figure 6In some embodiments, the coil assembly 100 further includes a second shielding layer 12, and the material of the second shielding layer 12 is a semiconductor material. The coil 20 includes a primary coil winding 23 and a secondary coil winding 24, and the second shielding layer 12 is disposed between the primary coil winding 23 and the secondary coil winding 24.

[0074] Specifically, the primary coil winding 23 and the secondary coil winding 24 can be two sets of coil windings arranged in parallel. The multi-layer coil 20 forms the primary coil winding 23, which is arranged on one side of the transformer. The multi-layer coil 20 forms the secondary coil winding 24, which is arranged on the other side of the transformer. The second shielding layer 12 is arranged between the primary coil winding 23 and the secondary coil winding 24, which can reduce the parasitic capacitance between the primary coil winding 23 and the secondary coil winding 24.

[0075] Reference Figure 7 At the position between the primary coil winding 23 and the secondary coil winding 24 covered by the second shielding layer 12, the secondary coil winding 24 forms a positive charge Q on the second shielding layer 12. At the position between the primary coil winding 23 and the secondary coil winding 24 not covered by the second shielding layer 12, the secondary coil winding 24 forms a positive charge Q on the primary coil winding 23. The positive charge Q can offset the negative charge Q, reduce the electric field energy, suppress the primary and secondary common mode interference of the transformer, and reduce EMC interference.

[0076] The material of the second shielding layer 12 can also be a semiconductor material. The advantages of the second shielding layer 12 using semiconductor materials can refer to the first shielding layer 11, and the working principle of the second shielding layer 12 reducing the parasitic capacitance between the primary coil winding 23 and the secondary coil winding 24 can refer to the first shielding layer 11 reducing the parasitic capacitance of each layer of coil 20, which will not be repeated here.

[0077] In some embodiments, the coil assembly 100 includes a second lead wire, the second shielding layer 12 is connected to the first shielding layer 11 at a second node through the second lead wire, and the second node is connected to the ground.

[0078] The first shielding layer 11 and the second shielding layer 12 are connected to the ground via the second node, so as to suppress electromagnetic interference.

[0079] Reference Figure 8 In some embodiments, the coil assembly 100 further includes a third shielding layer 13 , the material of the third shielding layer 13 is a semiconductor material, and the third shielding layer 13 is wound around the outside of the multi-layer coil 20 .

[0080] Specifically, the third shielding layer 13 is wound outside the coil 20. The third shielding layer 13 can effectively suppress the external electromagnetic interference of the magnetic element 1000, and can also reduce the electromagnetic radiation of the magnetic element 1000 itself to the outside world.

[0081] The material of the third shielding layer 13 may also be semiconductor material. The advantages of the third shielding layer 13 using semiconductor material can be referred to the first shielding layer 11, which will not be elaborated here.

[0082] In some embodiments, the coil assembly 100 includes a third lead wire, the third shielding layer 13 is connected to the first shielding layer 11 at a third node through the third lead wire, and the third node is connected to the ground.

[0083] The first shielding layer 11 and the third shielding layer 13 are connected to the ground via the third node. The first shielding layer 11, the second shielding layer 12 and the third shielding layer 13 can also be grounded simultaneously via their respective lead wires, which is beneficial to suppress electromagnetic interference.

[0084] Reference Fig. 9 In some embodiments, the magnetic element 1000 includes a magnetic core 200, a skeleton 300 and a heat sink. The heat sink includes a thermally conductive adhesive 400 and a housing 500. The magnetic core 200 is disposed inside the skeleton 300, and the coil assembly 100 is wound outside the skeleton 300. The magnetic core 200 and the skeleton 300 are disposed inside the housing 500, and the thermally conductive adhesive 400 is used to encapsulate the magnetic core 200 and the skeleton 300 inside the housing 500.

[0085] Specifically, the material of the housing 500 may be a metal material with good thermal conductivity, which is beneficial to the heat dissipation of the magnetic element 1000 and prevents the magnetic core 200 and the coil assembly 100 from being overheated during operation.

[0086] The thermal conductive adhesive 400 can be used to seal the magnetic core 200 and the frame 300 and tighten and fix them inside the shell 500. The material of the thermal conductive adhesive 400 can be thermal conductive silica gel or silicone glue. The thermal conductive adhesive 400 has excellent thermal conductivity and is more conducive to the heat dissipation of the magnetic element 1000.

[0087] Reference Fig. 9 In some embodiments, the magnetic element 1000 includes a fourth shielding layer 600 , the material of the fourth shielding layer 600 is a semiconductor material, and the fourth shielding layer 600 is disposed between the iron box and the coil assembly 100 .

[0088] The fourth shielding layer 600 can reduce EMC interference and reduce the parasitic capacitance of the magnetic element 1000 to the ground.

[0089] Specifically, the fourth shielding layer 600 partially covers the outside of the coil assembly 100. At the position where the fourth shielding layer 600 covers the outside of the coil assembly 100, the housing 500 can form a positive charge Q on the fourth shielding layer 600. At the position where the fourth shielding layer 600 does not cover the outside of the coil assembly 100, the iron box can form a negative charge Q on the coil assembly 100. The positive charge Q can offset the negative charge Q, reduce the electric field energy, reduce EMC interference, and reduce the parasitic capacitance of the magnetic element 1000 to the ground.

[0090] In some embodiments, the magnetic element 100 includes a fourth lead wire, the fourth shielding layer 600 is connected to the first shielding layer 11 at a fourth node through the fourth lead wire, and the fourth node is connected to the ground.

[0091] The first shielding layer 11 and the fourth shielding layer 600 are connected to the ground via the fourth node. The first shielding layer 11, the second shielding layer 12, the third shielding layer 13 and the fourth shielding layer 600 can also be grounded simultaneously via their respective lead wires, which is beneficial to suppress electromagnetic interference.

[0092] The coil 20 assembly 100 provided in the embodiment of the utility model includes a multi-layer coil 20 and a first shielding layer 11, wherein the first shielding layer 11 is disposed between two adjacent layers of coils 20, and the material of the first shielding layer 11 is a semiconductor material. The two adjacent layers of coils 20 are connected to a first node, the two adjacent layers of coils 20 are arranged from the first node along a first direction, and the first shielding layer 11 is arranged from the first node along the first direction.

[0093] By adding a first shielding layer 11 between two adjacent layers of coils 20 of the coil 20 assembly 100, the parasitic capacitance between each layer of coils 20 is shielded. The two adjacent layers of coils 20 are arranged from the first node along the first direction, and the potential difference between the two adjacent layers of coils 20 along the first direction gradually increases. The first shielding layer 11 is arranged from the same potential point along the first direction, which can achieve the offset of positive and negative charges, reduce the parasitic capacitance between the two adjacent layers of coils 20, and shield the electromagnetic interference caused by the parasitic capacitance. The first shielding layer 11 can be made of semiconductor material. Compared with metal conductor materials, semiconductor materials have lower resistivity and lower safety standards. There is no need to add additional insulating tape, and the manufacturing process is simpler. The coil 20 assembly 100 provided in the embodiment of the utility model can avoid electromagnetic interference caused by parasitic capacitance between each layer of coils 20, and also avoid safety problems caused by the metal shielding layer, reducing the manufacturing cost of the coil 20 assembly 100.

[0094] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention.

[0095] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples" or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiments or examples are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, those skilled in the art may combine and combine different embodiments or examples described in this specification and the features of different embodiments or examples without contradiction.

[0096] In addition, the term "connection" should be understood in a broad sense, for example, it can include fixed connection, detachable connection, or integral connection; it can include direct connection, indirect connection through an intermediate medium, and internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this utility model can be understood according to specific circumstances.

[0097] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0098] Any process or method description in the flowchart or otherwise described herein may be understood to represent a module, fragment or portion of code that includes one or more executable instructions for implementing the steps of a specific logical function or process, and the scope of the preferred embodiments of the present invention includes alternative implementations in which functions may not be performed in the order shown or discussed, including performing functions in a substantially simultaneous manner or in the reverse order depending on the functions involved, which should be understood by technicians in the technical field to which the embodiments of the present invention belong.

[0099] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. A coil assembly, characterized in that: The coil assembly comprises: Multiple layers of coils, two adjacent layers of coils are connected to a first node, and the two adjacent layers of coils are arranged from the first node along a first direction; The first shielding layer is arranged between two adjacent layers of coils. The material of the first shielding layer is semiconductor material. The first shielding layer is arranged from the first node along the first direction.

2. The coil assembly according to claim 1, characterized in that: A length of the first shielding layer arranged from the first node along the first direction is shorter than a length of the coil arranged from the first node along the first direction.

3. The coil assembly according to claim 1, characterized in that: The coil assembly includes a plurality of first lead wires, one end of each of the first lead wires is connected to a corresponding first node, and the other end of each of the first lead wires is connected to a corresponding first shielding layer.

4. The coil assembly according to any one of claims 1 to 3, characterized in that: The multiple layers of coils are arranged in parallel, and the head ends of the coils of two adjacent layers are connected to the first node, or the tail ends of the coils of two adjacent layers are connected to the first node; When the head ends of the coils in two adjacent layers are connected to the first node, the first direction is the direction from the head ends to the tail ends of the coils in two adjacent layers; When the tail ends of the coils in two adjacent layers are connected to the first node, the first direction is the direction from the tail ends to the head ends of the coils in two adjacent layers.

5. The coil assembly according to any one of claims 1 to 3, characterized in that: The multiple layers of coils are arranged in series, and in the two adjacent layers of coils, the head end of the coil of one layer and the tail end of the coil of the other layer are connected to the first node; The first direction is the direction from the head end to the tail end of one layer of the coils, and the direction from the tail end to the head end of another layer of the coils.

6. The coil assembly according to claim 1, characterized in that: The coil assembly further comprises a second shielding layer, wherein the material of the second shielding layer is a semiconductor material; The multi-layer coil is wound to form a primary coil winding and a secondary coil winding, and the second shielding layer is arranged between the primary coil winding and the secondary coil winding.

7. The coil assembly according to claim 6, characterized in that: The coil assembly includes a second lead-out wire, the second shielding layer is connected to the first shielding layer at a second node via the second lead-out wire, and the second node is connected to the ground.

8. The coil assembly according to claim 1, characterized in that: The coil component also includes a third shielding layer. The material of the third shielding layer is semiconductor material. The third shielding layer is wound around the outside of the multi-layer coil.

9. The coil assembly according to claim 8, characterized in that: The coil component includes a third lead-out wire, the third shielding layer is connected to the first shielding layer at a third node through the third lead-out wire, and the third node is connected to the ground.

10. A magnetic element, characterized in that: The magnetic element comprises the coil assembly according to any one of claims 1-9.

11. The magnetic element according to claim 10, characterized in that: The magnetic element comprises: A magnetic core and a frame, wherein the magnetic core is arranged inside the frame, and the coil assembly is wound around the outside of the frame; The heat dissipation device comprises a shell and a thermally conductive adhesive, wherein the magnetic core and the skeleton are arranged inside the shell, and the thermally conductive adhesive is used for encapsulating the magnetic core and the skeleton inside the shell.

12. The magnetic element according to claim 11, characterized in that: The magnetic element comprises a fourth shielding layer, the material of the fourth shielding layer is a semiconductor material, and the fourth shielding layer is arranged between the shell and the coil assembly.

13. The magnetic element according to claim 12, characterized in that: The magnetic element includes a fourth lead wire, the fourth shielding layer is connected to the first shielding layer at a fourth node through the fourth lead wire, and the fourth node is connected to the ground.

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