Packaging structure for electronic chip processing

Abstract

The utility model discloses a packaging structure for electronic chip processing, and relates to the technical field of chip processing and packaging. A moving assembly is arranged on the table top of the workbench and comprises a containing table. A placing plate is cooperatively arranged at the top of the placing table; a groove convenient for placing the electronic chip is formed in the center of the placing plate; a bottom plate is cooperatively arranged at the bottom of the placement table; a plurality of pushing devices are arranged on the side, away from the containing table, of the bottom plate. The bottom of the bottom plate is matched with the sliding rails through sliding blocks. A vertical electric push cylinder drives a scraper to move, the scraper moves to one side of a packaging through groove and is attached to a packaging plate, then a second stroke belt drives a moving block to move, the moving block is installed on a sliding plate, and when the second stroke belt drives the moving block to move, the moving block drives the sliding plate to transversely move along a cross beam along a guide rod. And the solder paste in the packaging plate is scraped to the placement plate through the packaging through groove by the scraper.

Description

Technical Field

[0001] The utility model specifically relates to the technical field of chip processing and packaging, in particular to a packaging structure for electronic chip processing. Background Art

[0002] The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chips and enhancing the electrical and thermal performance. It is also a bridge between the internal world of the chip and the external circuit - the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through wires on the printed circuit board. Therefore, packaging plays an important role for CPUs and other LSI integrated circuits.

[0003] At present, traditional electronic chips need to be tinned during processing, so that the connection between components and circuit boards can be achieved through soldering in the connection of semiconductors. However, traditional chips are tinned manually during tinning, which has low processing efficiency and is affected by human factors during processing. During tinning, false connections may be caused, so the chip will be easily damaged in later use, and the quality of chip use cannot be effectively guaranteed.

[0004] After searching, Chinese patent publication number CN202021909320.6 discloses a printing positioning table of a solder paste printer; comprising a table body; a station table, slidably arranged on the table body, the station table having two stations, and a chip clamping member is provided on the station table corresponding to each station; a lifting component, slidably arranged on the table body, and the lifting component supports the station table from the bottom; wherein: when the chip on one station is printing solder paste, the other station is exposed;

[0005] The structure in the above patent effectively positions the chip through the chip clamp when positioning the workbench, so that when the top block rises, the workbench drives the chip clamp to move at the same time, so that the chip clamp drives the chip to move upward at the same time, so that when positioning, the workbench and the accommodating groove will be offset, so that when processing the chip, the offset will occur; the processing quality cannot be effectively guaranteed;

[0006] In view of the above situation, we provide a packaging structure for electronic chip processing. In this device, the base plate and the placement table are driven to move by the first stroke belt. During the movement, the position of the packaging plate is effectively positioned by the positioning block fixedly installed on the base plate. After moving into place, the placement table and the packaging plate are driven to move upward by the pusher installed on the base plate, so that the top of the chip and the bottom of the packaging plate are fitted together, and then the scraper is moved to the side of the packaging groove opened on the packaging plate by the vertical electric push cylinder. The moving block is mobilized to move by the second stroke belt to realize the simultaneous movement of the scraper at the bottom of the vertical electric push cylinder, so that the solder paste inside the packaging plate is scraped onto the chip. In this way, automatic scraping can effectively avoid the situation of false connection and effectively ensure the quality of chip use. Utility Model Content

[0007] The purpose of the utility model is to provide a packaging structure for electronic chip processing. A pusher installed on the bottom plate drives the placement table and the packaging plate to move upward, so that the top of the chip is fitted with the bottom of the packaging plate, and then the scraper is moved to the side of the packaging groove opened on the packaging plate by a vertical electric push cylinder. The moving block is mobilized to move by the second stroke belt, so that the scraper at the bottom of the vertical electric push cylinder can move simultaneously, so that the solder paste inside the packaging plate can be scraped onto the chip, so as to solve the problems of the above-mentioned background technology.

[0008] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0009] A packaging structure for processing electronic chips, comprising a workbench; a movable assembly is arranged on the workbench surface, and the movable assembly comprises a placement table; a placement plate is arranged on the top of the placement table; a groove is provided at the center of the placement plate for convenient placement of electronic chips; a bottom plate is arranged on the bottom of the placement table; the bottom plate is movably mounted between the placement table and the placement plate through a sliding rod; a plurality of pushers are arranged on the side of the bottom plate away from the placement table; the bottom of the bottom plate is mounted in cooperation with a slide rail through a slider;

[0010] As a further technical solution of the utility model, a packaging component is arranged on the top of the moving component; the packaging component includes a packaging plate; the packaging plate is fixedly installed on the inner wall of the workbench support plate; a packaging through groove is opened in the center of the packaging plate;

[0011] As a further technical solution of the utility model, a slider is provided between the packaging plate and the top plate of the workbench; the slider is fixedly installed with the push rod of the vertical electric push cylinder; the vertical electric push cylinder is installed in cooperation with the crossbeam through the slide plate;

[0012] As a further technical solution of the utility model, a scraper is provided at the top of the packaging plate; the scraper is fixedly installed with the push rod of the vertical electric push cylinder; the two ends of the guide rod are fixedly installed with the workbench through a mounting frame;

[0013] As a further technical solution of the utility model, the moving block is installed in cooperation with the second travel belt; the second travel belt is arranged parallel to the crossbeam;

[0014] As a further technical solution of the utility model, two slide rails are provided and are symmetrically arranged; a positioning block for positioning the edge placement platform is provided between the two slide rails.

[0015] Compared with the prior art, the beneficial effects of the utility model are:

[0016] 1. When the utility model is in use, the electronic chip to be processed is placed in the groove at the center of the placement plate, and the first travel belt drives the bottom plate to move along the slide rail through the slider to move the chip on the placement plate to the bottom of the packaging plate. During the movement, the position of the placement plate is effectively positioned by the positioning block installed at the bottom of the bottom plate, ensuring that the chip placed on the placement plate is accurately positioned;

[0017] 2. In the utility model, after the chip positioning is completed, the scraper is driven to move by the vertical electric push cylinder to move the scraper to one side of the packaging groove, and the scraper is fitted with the packaging plate, and then the moving block is driven to move by the second stroke belt. The moving block is installed on the slide plate. When the second stroke belt drives the moving block to move, the moving block drives the slide plate to move horizontally along the crossbeam along the guide rod. In this way, when packaging, the solder paste inside the packaging plate is scraped onto the placement plate through the packaging groove by the scraper. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional structural schematic diagram of the utility model.

[0019] Figure 2 This utility model Figure 1 Another perspective structural diagram of .

[0020] Figure 3 This utility model Figure 1 Schematic diagram of the rear structure.

[0021] Figure 4 This utility model Figure 1 Schematic diagram of the splitting.

[0022] Figure 5 This utility model Figure 4 Schematic diagram of the bottom of the mobile component.

[0023] Figure 6 This utility model Figure 1 Bottom view of the bottom structure of the packaging component.

[0024] In the figure: 1-workbench, 2-moving component, 20-placing table, 21-slide rail, 22-first stroke belt, 23-placing plate, 24-bottom plate, 25-thruster, 26-slider, 27-positioning block, 3-packaging component, 30-packaging plate, 31-vertical electric push cylinder, 32-mounting frame, 33-guide rod, 34-second stroke belt, 35-packaging slot, 36-scraper, 37-moving block, 38-crossbeam, 39-slide plate. DETAILED DESCRIPTION

[0025] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0026] See also Figure 1-6 In an embodiment of the utility model, a packaging structure for processing electronic chips includes a workbench 1; a movable component 2 is arranged on the surface of the workbench 1, and the movable component 2 includes a placement table 20; a placement plate 23 is arranged on the top of the placement table 20; a groove is provided at the center of the placement plate 23 for convenient placement of electronic chips; a bottom plate 24 is arranged at the bottom of the placement table 20; the bottom plate 24 is movably installed between the placement table 20 and the placement plate 23 through a sliding rod; a plurality of pushers 25 are arranged on the side of the bottom plate 24 away from the placement table 20; the bottom of the bottom plate 24 is installed in cooperation with the slide rail 21 through a slider 26.

[0027] More specifically, a packaging component 3 is provided on the top of the moving component 2; the packaging component 3 includes a packaging plate 30; the packaging plate 30 is fixedly installed on the inner wall of the support plate of the workbench 1; and a packaging through groove 35 is opened in the center of the packaging plate 30.

[0028] By adopting the above technical solution, when in use, the electronic chip to be processed is placed in the groove at the center of the placement plate 23, and the first travel belt 22 drives the bottom plate 24 to move along the slide rail 21 through the slider 26, so as to move the chip on the placement plate 23 to the bottom of the packaging plate 30. During the movement, the position of the placement plate 23 is effectively positioned by the positioning block 27 installed at the bottom of the bottom plate 24, so as to ensure that the chip placed on the placement plate 23 is accurately positioned;

[0029] A scraper 36 is provided at the top of the packaging plate 30 ; the scraper 36 is fixedly mounted on the push rod of the vertical electric push cylinder 31 ; the vertical electric push cylinder 31 is mounted in cooperation with the crossbeam 38 via a slide plate 39 .

[0030] In this embodiment, the slide plate 39 is provided with a moving block 37 on one side of the vertical electric push cylinder 31; the end of the moving block 37 away from the slide plate 39 is installed in cooperation with the guide rod 33; the two ends of the guide rod 33 are fixedly installed with the workbench 1 through the mounting frame 32.

[0031] By adopting the above technical solution, after the chip positioning is completed, the scraper 36 is driven to move by the vertical electric push cylinder 31 to move the scraper to one side of the packaging groove 35, and the scraper 36 is fitted with the packaging plate 30, and then the moving block 37 is driven to move by the second stroke belt 34. The moving block 37 is installed on the slide plate 39. When the second stroke belt 34 drives the moving block 37 to move, the moving block 37 drives the slide plate 39 to move laterally along the guide rod 33 along the crossbeam 38. In this way, when packaging, the solder paste inside the packaging plate 30 is scraped onto the placement plate 23 through the packaging groove 35 by the scraper 36.

[0032] In this embodiment, the moving block 37 is installed in cooperation with the second travel belt 34; the second travel belt 34 is arranged parallel to the crossbeam 38;

[0033] There are two slide rails 21 symmetrically arranged; a positioning block 27 for positioning the edge placement platform 20 is arranged between the two slide rails 21 .

[0034] By adopting the above technical solution, when the first travel belt 22 drives the bottom plate 24 to move, the bottom plate 24 is effectively positioned by the positioning block 27, thereby effectively ensuring the accurate positioning of the placement plate 23.

[0035] The working principle of the utility model is as follows: when in use, the electronic chip to be processed is placed in the groove at the center of the placement plate 23, and the first travel belt 22 drives the bottom plate 24 to move along the slide rail 21 through the slider 26, so as to move the chip on the placement plate 23 to the bottom of the packaging plate 30. During the movement, the position of the placement plate 23 is effectively positioned by the positioning block 27 installed at the bottom of the bottom plate 24, so as to ensure that the chip placed on the placement plate 23 is accurately positioned;

[0036] After the chip positioning is completed, the scraper 36 is driven to move by the vertical electric push cylinder 31 to move the scraper to one side of the packaging groove 35, and the scraper 36 is fitted with the packaging plate 30, and then the moving block 37 is driven to move by the second stroke belt 34. The moving block 37 is installed on the slide plate 39. When the second stroke belt 34 drives the moving block 37 to move, the moving block 37 drives the slide plate 39 to move horizontally along the crossbeam 38 along the guide rod 33. In this way, when packaging, the solder paste inside the packaging plate 30 is scraped onto the placement plate 23 through the packaging groove 35 by the scraper 36;

[0037] After the packaging is completed, the vertical electric push cylinder 31 drives the scraper 36 to move upward to separate the scraper 36 from the packaging plate 30, and then drives the moving block 37 to move in the opposite direction through the second stroke belt 34 to reset the scraper 36.

[0038] It is obvious to those skilled in the art that the present invention is not limited to the details of the exemplary embodiments described above, and that the present invention can be implemented in other specific forms without departing from the spirit or essential features of the present invention. Therefore, the embodiments should be regarded as exemplary and non-restrictive from any point of view, and the scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims be included in the present invention. Any reference numeral in a claim should not be regarded as limiting the claim to which it relates.

[0039] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A packaging structure for electronic chip processing, characterized in that: The invention comprises a workbench (1); a movable component (2) is arranged on the surface of the workbench (1), and the movable component (2) comprises a placement table (20); a placement plate (23) is arranged on the top of the placement table (20); a groove for facilitating the placement of electronic chips is provided at the center of the placement plate (23); a bottom plate (24) is arranged on the bottom of the placement table (20); the bottom plate (24) is movably mounted on the placement table (20) and the placement plate (23) via a sliding rod; a plurality of pushers (25) are arranged on the side of the bottom plate (24) away from the placement table (20); the bottom of the bottom plate (24) is mounted in cooperation with the slide rail (21) via a sliding block (26).

2. The packaging structure for electronic chip processing according to claim 1, characterized in that: A packaging component (3) is arranged on the top of the moving component (2); the packaging component (3) comprises a packaging plate (30); the packaging plate (30) is fixedly mounted on the inner wall of the support plate of the workbench (1); and a packaging through groove (35) is provided at the center of the packaging plate (30).

3. The packaging structure for electronic chip processing according to claim 2, characterized in that: A scraper (36) is provided at the top of the packaging plate (30); the scraper (36) is fixedly installed with the push rod of the vertical electric push cylinder (31); the vertical electric push cylinder (31) is installed in cooperation with the crossbeam (38) through a slide plate (39).

4. The packaging structure for electronic chip processing according to claim 3, characterized in that: The slide plate (39) is provided with a moving block (37) on one side of the vertical electric push cylinder (31); the end of the moving block (37) away from the slide plate (39) is installed in cooperation with the guide rod (33); the two ends of the guide rod (33) are fixedly installed on the workbench (1) through the mounting frame (32).

5. The packaging structure for electronic chip processing according to claim 4, characterized in that: The moving block (37) is installed in cooperation with the second travel belt (34); the second travel belt (34) is arranged in parallel with the crossbeam (38).

6. The packaging structure for electronic chip processing according to claim 1, characterized in that: Two of the slide rails (21) are provided and are symmetrically arranged; a positioning block (27) for positioning the edge placement platform (20) is provided between the two slide rails (21).

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