Manufacturing apparatus for electronic components

Abstract

The present application provides an apparatus for manufacturing an electronic component connected to an external pressure source, the apparatus comprising: a process chamber having an extension space, one or more gas inlets, and one or more gas outlets, where the extension space is in communication with the process chamber, and the gas inlets are connected to the external pressure source; the cooler is arranged outside the processing chamber and is connected to the processing chamber through a pipeline; the heater is arranged in the processing chamber; a vacuum generator mounted outside the processing chamber and connected to the processing chamber; the controller is used for executing a series of steps.

Description

Technical Field

[0001] The present application relates to the field of electronic component manufacturing, and in particular to a manufacturing device for electronic components. Background Art

[0002] In the manufacturing process of electronic components (such as chips, etc.) in the prior art, the electronic components are usually fixed on a carrier through a plurality of conductive blocks, and a capillary underfill is applied from one or more sides of the electronic components, and then the capillary underfill is made to crawl along the gap between the electronic component and the carrier and fill the gap, so that the capillary underfill covers and isolates the conductive blocks between the electronic component and the carrier. However, there are usually many tiny bubbles in the capillary underfill. The capillary underfill crawls along one or more sides of the electronic component during the process of filling the gap, and the leading edge of the capillary underfill causes unfilled space due to various factors when advancing. Specifically, when the capillary underfill advances from at least one side of the electronic component toward the other end of the electronic component, the unfilled space is caused by various factors, such as the inconsistency of the flow rate of the leading edge of the filling glue crawling or the back-wrapping space caused by the convergence of the leading edges of the filling glue crawling on multiple sides (the industry calls this the back-wrapping phenomenon), and bubbles are formed. The bubbles generated by this phenomenon and the many tiny bubbles in the capillary underfill will eventually form voids in the capillary underfill.

[0003] In the prior art, the method of removing bubbles is to increase the temperature and evacuate to eliminate bubbles. However, this method is not the best recommended method for removing bubbles in advanced packaging chiplet packaging (small chip packaging) and system-level packaging (SiP: System in Package, multi-chip packaging) and low-temperature material filling glue. Because the higher the temperature, the lower the viscosity of the glue, the higher the fluidity will cause the risk of glue overflowing from the electronic components and the glue climbing onto the electronic components, resulting in glue overflow and glue climbing. In addition, polymer materials have the characteristic of easy diffusion. In the process of removing bubbles, it is easy to cause the material to be extracted too much due to the vacuum pressure difference inside and outside the bubble.

[0004] Therefore, in view of the problems existing in the structures of the above-mentioned prior art, how to develop an innovative structure that is more ideal and practical is what consumers are eagerly looking forward to, and it is also the goal and direction that related industries must strive to develop and break through.

[0005] In view of this, the inventor, based on his many years of experience in manufacturing, developing and designing related products, has designed and carefully evaluated the above-mentioned goals and finally obtained this application which is truly practical. Utility Model Content

[0006] In order to solve the above problems, according to one embodiment of the present application, there is provided an electronic component manufacturing device connected to an external pressure source, and its specific structure includes: a processing chamber having an extension space, one or more gas inlets, and one or more gas outlets, wherein the extension space is communicated with the processing chamber, and the gas inlet is connected to the external pressure source; a cooler installed outside the processing chamber and connected to the processing chamber through a pipeline; a heater installed in the processing chamber; a vacuum generator installed outside the processing chamber and connected to the processing chamber; a fan for generating an airflow flowing inside the processing chamber; and a controller for performing the following steps: using the cooler to cool the processing chamber; The temperature in the processing chamber is lowered to a first predetermined temperature lower than room temperature to increase the viscosity of the capillary bottom filling glue; the pressure in the processing chamber is lowered to a first predetermined pressure which is a vacuum pressure by the vacuum generator, and the vacuum pressure is maintained for a predetermined time to remove bubbles or reduce the volume of bubbles; the pressure in the processing chamber is increased to a second predetermined pressure which is not less than 1 atmospheric pressure by the external pressure source, and the second predetermined pressure is maintained for a predetermined time; the temperature in the processing chamber is increased to a second predetermined temperature by the heater and the fan to age the capillary bottom filling glue and / or further remove residual bubbles by increasing the fluidity of the capillary bottom filling glue.

[0007] The first predetermined temperature and the first predetermined pressure can avoid the risk of excessive overflow of the capillary bottom filling glue outside the electronic component and the problem of the glue creeping onto the electronic component, and promote the reduction of the volume of bubbles caused by the back-packing phenomenon caused by applying the capillary bottom filling glue from multiple sides of the electronic component; and the second predetermined temperature and the second predetermined pressure can be used to completely eliminate the bubbles with reduced volume in the gap between the electronic component and the carrier through gas dissolution and diffusion. The second predetermined temperature and the second predetermined pressure can be changed in parameters and sequence according to the process requirements, so that the bubbles generated by the back-packing phenomenon can be eliminated in order from large to small.

[0008] In addition, as mentioned above, polymer materials have the property of being easy to diffuse, so as long as the vacuum pressure difference between the inside and outside of the bubble does not cause excessive material to be extracted during the process of removing bubbles, the greater the pressure difference, the faster the bubble removal will be. Lowering the temperature of the material, that is, increasing the viscosity of the material, is an action taken to prevent the material from being extracted during the process of removing bubbles from the material. Although increasing the viscosity of the material will reduce the speed of bubble removal, from a microscopic point of view, before the material is completely aged, increasing the vacuum pressure difference between the inside and outside of the bubble allows the bubble to penetrate the material more quickly (dissolve) and remove the bubble through the moving force generated by the concentration (gradient) toward the edge of the electronic component.

[0009] As a possible implementation, the electronic component manufacturing equipment further includes: a pressure regulating component, which is arranged between the external pressure source and the gas inlet and is used to cause the pressure in the processing chamber to reach and be maintained at the second predetermined pressure.

[0010] As a possible implementation, the manufacturing equipment of electronic components further includes: a vacuum sensor connected to the processing chamber and used to detect the vacuum pressure in the processing chamber, and electrically connected to the controller.

[0011] As a possible implementation, the manufacturing equipment of the electronic component further includes: a pressure sensor connected to the processing chamber and used to detect the pressure in the processing chamber, and electrically connected to the controller.

[0012] As a possible implementation, the manufacturing equipment of the electronic component further includes: a temperature sensor connected to the processing chamber and used to detect the temperature in the processing chamber, and electrically connected to the controller.

[0013] The technology, means and effects adopted in this application will be described in detail below with an example of a preferred embodiment and accompanying drawings. It is believed that the above-mentioned purpose, structure and characteristics of this application can be deeply and specifically understood from the following content. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The various technical features of the present application and the relationship between them are further explained below with reference to the accompanying drawings. The accompanying drawings are exemplary, and some technical features are not shown in actual proportion. In addition, some drawings may omit technical features that are commonly used in the technical field to which the present application belongs and are not essential for understanding and implementing the present application, or additional technical features that are not essential for understanding and implementing the present application may be shown. In other words, the combination of the various technical features shown in the accompanying drawings is not used to limit the present application. In addition, throughout the present application, the same figure numbers refer to the same content. The specific description of the drawings is as follows:

[0015] Figure 1 A flowchart of a method for manufacturing an electronic component according to an embodiment of the present application;

[0016] Figure 2 A schematic diagram of a manufacturing device for electronic components according to an embodiment of the present application;

[0017] Figure 3A-3C A schematic diagram of the manufacturing process of the display electronic component involved in this application;

[0018] Figure 3DA schematic diagram of the back-wrapping phenomenon generated when the leading edges of the capillary bottom filling glue merge in the three-side filling process involved in the present application;

[0019] Figure 3E A schematic diagram of the force exerted on bubbles in the capillary bottom filling adhesive involved in the present application during the process of removing bubbles by vacuum pressure difference;

[0020] Figure 4A and Figure 4B Schematic diagrams showing different filling methods of the capillary bottom filling glue involved in the present application;

[0021] Figure 5 This is a chart showing the relationship among process temperature, process pressure, and process time involved in one embodiment of the present application.

[0022] Explanation of the reference numerals: 1-processing chamber; 3-extension space; 5-gas inlet; 7-gas outlet; 9-cooler; 10-heater; 11-vacuum generator; 12-facility pressure; 13-pressure regulating assembly; 15-controller; 17-fan; 17a-drive motor; 17b-drive shaft; 19-vacuum sensor; 21-pressure sensor; 23-temperature sensor; 100-carrier; 100a-first surface; 101-electronic component; 103-conductive block; 105-capillary bottom filling glue; 107-bubble; 109-bubble (backpacking space); A-gap; B-spacing; C-filling glue front edge; D-filling glue front edge; E-filling glue front edge; M1-step one; M2-step two; M3-step three; M4-step four. DETAILED DESCRIPTION

[0023] Below, the specific implementation methods of the present application are described in detail with reference to the accompanying drawings.

[0024] According to one embodiment of the present application, referring to FIGS. 3A-3C , a method for manufacturing an electronic component is provided, which may include the following steps:

[0025] A carrier 100 is provided, which has a first surface 100a; an electronic component 101 is provided, and at least one side of the electronic component 101 has a conductive block 103; the conductive block 103 located on at least one side of the electronic component 101 is fixed to the first surface 100a of the carrier 100 to form an integral component, wherein the conductive blocks 103 are spaced B apart, and there is a gap A between the electronic component 101 and the carrier 100; a capillary bottom filling glue 105 is applied from at least one side of the electronic component 101, so that the capillary bottom filling glue 105 crawls along the gap A between the electronic component 101 and the carrier 100 and fills the gap A, so that the capillary bottom filling glue 105 covers and isolates the conductive blocks 103 located between the electronic component 101 and the carrier 100 from each other, so as to form protection for the conductive blocks 103. Afterwards, the whole assembly is placed in a processing chamber 1 shown in FIG. 2; referring to FIG. 1 and FIG. 5, the temperature in the processing chamber 1 is lowered to a first predetermined temperature lower than room temperature to increase the viscosity of the capillary bottom filling glue 105, that is, to reduce the fluidity of the capillary bottom filling glue 105; the pressure in the processing chamber 1 is lowered to a first predetermined pressure which is a vacuum pressure, and the vacuum pressure is maintained for a predetermined time to remove most of the bubbles 107 and the bubbles (return spaces) 109 or reduce the volume of the bubbles, and then the pressure in the processing chamber 1 is increased to a second predetermined pressure which is not less than 1 atmospheric pressure, and the second predetermined pressure is maintained for a predetermined time; and the temperature in the processing chamber 1 is increased to a second predetermined temperature to age the capillary bottom filling glue and / or further remove the residual bubbles 107 and the bubbles (return spaces) 109 by increasing the fluidity of the capillary bottom filling glue 105. For example, in one embodiment of the present application, the second predetermined pressure may be not less than 1 atmospheric pressure and less than or equal to 50 atmospheric pressures, but is not limited thereto.

[0026] FIG. 5 is a diagram showing the relationship among process temperature, process pressure, and process time according to one embodiment of the present application. Figure 5 The process parameters shown are for demonstration only and are not intended to be limiting of the present application.

[0027] In an embodiment of the present application, the first predetermined temperature may be reduced to below room temperature (30°C) to between -40°C; the second predetermined temperature may be between 40°C and 300°C; the first predetermined pressure may be reduced to below less than 1 atmosphere (atm) to between 10-4 torr; the second predetermined pressure may be between not less than 1 atmosphere (atm) and 50 atmospheres (atm). In an embodiment of the present application, step one (M1) may include: reducing the temperature in the processing chamber 1 to a first predetermined temperature below room temperature. Step two (M2) includes: reducing the pressure in the processing chamber 1 to a first predetermined pressure of vacuum pressure, and maintaining the vacuum pressure for a predetermined time. Step three (M3) may include: increasing the pressure in the processing chamber 1 to a second predetermined pressure of not less than 1 atmosphere, and maintaining the second predetermined pressure for a predetermined time. Step four (M4) may include: increasing the temperature in the processing chamber 1 to a second predetermined temperature.

[0028] Figures 3A-3C show schematic diagrams of the manufacturing process of an electronic component. As shown in Figures 3A-3C, during the manufacturing process of the electronic component, a conductive block 103 located on at least one side of the electronic component 101 is fixed to the first surface 100a of the carrier 100 (Figure 3A), and then a capillary underfill 105 is applied from at least one side of the electronic component 101 (Figure 3B), and then the capillary underfill 105 crawls along the gap between the electronic component 101 and the carrier 100 and flows in the gap to fill the gap, thereby forming protection for the conductive block 103 (Figure 3C). However, there are usually many tiny bubbles 107 in the capillary underfill 105 and bubbles (recapture space) 109 formed by the backpacking phenomenon when the leading edges of the capillary underfill meet. Afterwards, these bubbles 107 and bubbles (returned spaces) 109 will form gaps in the capillary bottom filler, and these gaps will cause the reliability of the electronic component to decrease and the electrical failure problem. As shown in Figure 3D, when the capillary bottom filler 105 fills the gap, the capillary bottom filler 105 crawls along the three sides of the electronic component 101, and the front edges C, D, and E of the capillary bottom filler form an unfilled space when they move forward and meet (i.e., the bubbles (returned spaces) 109 in Figure 3C). In the prior art, it is known that after solving the problem of forming gaps in the capillary bottom filler 105 with high temperature and high pressure, it also brings about the problem of the capillary bottom filler 105 crawling onto the electronic component 101 due to the increase in fluidity during the degassing process. Therefore, in order to solve this problem, the temperature is lowered to below room temperature to increase the viscosity of the capillary bottom filler 105, and then vacuum is drawn to avoid the problem of the capillary bottom filler 105 creeping onto the top of the electronic component 101. The effect of vacuum on the bubbles not only generates bubble movement and pulling due to Newton's law of motion, but also has the effect of promoting dissolution and diffusion. The process of first lowering the temperature to below room temperature to increase the viscosity of the capillary bottom filler 105 and then vacuuming is more suitable for chiplets (small chip packages) with tiny gaps between chips. This process can avoid the capillary bottom filler 105 creeping when degassing the tiny gaps between electronic components 101. It is suitable for degassing chiplets (small chip packages), multi-chip packages, system-in-package (SiP: System in Package), and capillary bottom filler 105 filled with low-temperature materials. The capillary bottom filling glue is a polymer material, and gas molecules can easily diffuse in the polymer material. Therefore, as long as the polymer material is not drawn out due to the vacuum pressure difference inside and outside the bubble during the bubble removal process, the greater the pressure difference, the faster the bubble removal will be. Figure 3E shows a schematic diagram of the stress on the bubbles in the capillary bottom filling glue 105 during the vacuum pressure difference process of removing bubbles.Lowering the temperature of the polymer material, i.e. increasing the viscosity of the polymer material, is an action taken to prevent the polymer material from being drawn out during the process of removing the bubbles in the polymer material. Usually, after the vacuum degassing process, the process will also include raising the temperature and placing it in a high-pressure environment. The reason is that vacuum degassing may not be able to remove all the bubbles. High temperature is used to reduce the viscosity of the capillary bottom filling glue 105, and high pressure promotes the dissolution and diffusion of bubbles, which helps to shrink or even eliminate the bubbles.

[0029] In an embodiment of the present application, at least one of the methods shown in FIGS. 4A-4B can be used to apply a capillary bottom filler 105 from at least one side of the electronic component 101, so that the capillary bottom filler 105 crawls along the gap A between the electronic component 101 and the carrier 100 and fills the gap A. Although the rectangular carrier 100 and the electronic component 101 are shown in FIGS. 4A-4B, the present application can be applied to carriers and electronic components of various shapes. In one embodiment of the present application, the electronic component 101 can be, for example, a chip.

[0030] According to an embodiment of the present application, a manufacturing device for electronic components is provided, as shown in FIG. 2, and the manufacturing device can be connected to a facility pressure 12, that is, an external pressure source. "Facility pressure" generally refers to the pressure provided by the factory. The manufacturing device may include: a processing chamber 1 for processing, having an extension space 3, one or more gas inlets 5, and one or more gas outlets 7, wherein the extension space 3 is connected to the processing chamber 1, and the gas inlet 5 is connected to the facility pressure 12; a cooler 9, installed outside the processing chamber 1 and connected to the processing chamber 1 by a pipeline; a heater 10, installed in the processing chamber 1; a vacuum generator 11, installed outside the chamber and connected to the processing chamber 1 through the gas outlet 7; a controller 15; and a fan 17 for generating an airflow flowing toward the inside of the processing chamber 1. The cooler 9, the heater 10, the vacuum generator 11, and the fan 17 can be electrically connected to the controller 15 and transmit signals to be controlled by the controller 15. The controller 15 can be used to perform the following steps: by lowering the temperature in the processing chamber 1 to a first predetermined temperature lower than room temperature through the cooler 9, so as to increase the viscosity of the capillary bottom filling glue 105; by lowering the pressure in the processing chamber 1 to a first predetermined pressure which is a vacuum pressure through the vacuum generator 11, and maintaining this vacuum pressure for a predetermined time, so as to remove most of the bubbles 107 and the bubbles (backpacking space) 109 or reduce the volume of the bubbles; by raising the pressure in the processing chamber 1 to a second predetermined pressure which is not less than 1 atmospheric pressure through this external pressure source, and maintaining this second predetermined pressure for a predetermined time; and by adjusting the temperature in the processing chamber 1 to a second predetermined temperature through the heater 10 and the fan 17, so as to age the capillary bottom filling glue 105 and / or further remove the residual bubbles 107 and the bubbles (backpacking space) 109 by increasing the fluidity of the capillary bottom filling glue 105.

[0031] In an embodiment of the present application, the controller 15 may be a programmable logic controller (PLC). In one embodiment of the present application, the external pressure source (i.e., the facility pressure 12) may be connected to a pressure regulating component 13, for example, and the pressure regulating component 13 may be electrically connected to the controller 15 and transmit a signal, so as to be controlled by the controller 15 to complete the predetermined pressure setting in the processing chamber 1. When the external pressure source (facility pressure) is insufficient or unstable, the pressure leading to the inside of the processing chamber 1 may be strengthened or stabilized by the pressure regulating component 13, so as to cause the pressure in the processing chamber 1 to reach and maintain a second predetermined pressure of not less than 1 atmospheric pressure. In one embodiment of the present application, the pressure regulating component 13 may be a component such as a pressure pump or a booster cylinder. The manufacturing apparatus may further include a vacuum sensor 19 connected to the processing chamber 1 and used to detect the vacuum pressure in the processing chamber 1; a pressure sensor 21 connected to the processing chamber 1 and used to detect the pressure in the processing chamber 1; and a temperature sensor 23 connected to the processing chamber 1 and used to detect the temperature in the processing chamber 1. The vacuum sensor 19, the pressure sensor 21, and the temperature sensor 23 may be electrically connected to the controller 15 and transmit signals, so as to be controlled by the controller 15.

[0032] In an embodiment of the present application, the vacuum sensor 19 may be, for example, a vacuum gauge, and the pressure sensor 21 may be, for example, a pressure gauge. In one embodiment of the present application, the vacuum generator 11 may be, for example, a vacuum pump. As described above, the fan 17 may be used to generate an airflow flowing toward the inside of the processing chamber 1, so as to promote temperature regulation inside the processing chamber 1, for example, when the heater 10 turns on the heating function, a convection heating effect can be achieved, and when the cooler 9 turns on the cooling function, a convection cooling effect can be achieved. The fan 17 is located in the processing chamber 1 and is connected to the drive motor 17a through the transmission shaft 17b, wherein the drive motor 17a is arranged in the extension space 3 connected to the processing chamber 1, and the processing chamber 1 and the extension space 3 are a shaft seal-free design.

[0033] In one embodiment of the present application, pressure and / or temperature regulation can be achieved through the controller 15. For example, if the pressure inside the processing chamber 1 is reduced to a predetermined vacuum pressure, the controller 15 can first activate the vacuum setting value and instruct the vacuum generator 11 to evacuate the inside of the chamber. Then, when the controller 15 receives a measurement signal from the vacuum sensor 19 indicating that the pressure inside the chamber has dropped to the vacuum setting value, the vacuum generator 11 is stopped. Of course, as described above, we can also use this method to achieve a pressurization operation inside the processing chamber 1, or a temperature increase / reduction operation inside the processing chamber 1.

[0034] In addition, as described above, we can also achieve linear pressure and / or temperature modulation by controlling the controller 15. For example, a linear rising / falling curve function can be used to design the controller 15, so as to achieve linear rising / falling modulation of the pressure and / or temperature inside the chamber. Since the design of the controller is well known to those skilled in the art of automatic control, its design principle and method will not be described in detail here.

[0035] The term "comprising" used throughout the present application should not be interpreted as being limited to what is listed thereafter; it does not exclude other structural elements or steps.

[0036] It can be understood that those skilled in the art can combine the features mentioned in one or more embodiments mentioned in the entire application with the features in other embodiments in any appropriate manner to implement the application.

[0037] Note that the above are only preferred embodiments of the present application and the technical principles used. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present application. Therefore, although the present application is described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may also include more other equivalent embodiments without departing from the technical concept of the present application, all of which belong to the protection scope of the present application.

Claims

1. A manufacturing device for electronic components, connected to an external pressure source, characterized in that: include: a processing chamber having an extension space, one or more gas inlets, and one or more gas outlets, wherein the extension space is in communication with the processing chamber, and the gas inlet is connected to the external pressure source; a cooler installed outside the processing chamber and connected to the processing chamber via a pipeline; a heater installed in the processing chamber; a vacuum generator installed outside the processing chamber and connected to the processing chamber; and A controller is used to perform the following steps: The temperature in the processing chamber is lowered to a first predetermined temperature lower than room temperature by the cooler to increase the viscosity of the capillary bottom filling glue in the electronic component; The vacuum generator is used to reduce the pressure in the processing chamber to a first predetermined vacuum pressure, and the vacuum pressure is maintained for a predetermined time to remove bubbles or reduce the volume of bubbles; Raising the pressure in the processing chamber to a second predetermined pressure not less than 1 atmosphere by the external pressure source, and maintaining the second predetermined pressure for a predetermined time; and The temperature in the processing chamber is raised to a second predetermined temperature by the heater to age the capillary bottom filling glue and / or to further remove residual bubbles by increasing the fluidity of the capillary bottom filling glue.

2. The electronic component manufacturing equipment according to claim 1, characterized in that: It further comprises: a pressure regulating component, which is arranged between the external pressure source and the gas inlet and is used to cause the pressure in the processing chamber to reach and be maintained at the second predetermined pressure.

3. The electronic component manufacturing equipment according to claim 1, characterized in that: The invention further comprises a vacuum sensor connected to the processing chamber and used for detecting the vacuum pressure in the processing chamber, and electrically connected to the controller.

4. The electronic component manufacturing equipment according to claim 1, characterized in that: The invention further comprises: a pressure sensor connected to the processing chamber and used for detecting the pressure in the processing chamber, and electrically connected to the controller.

5. The electronic component manufacturing equipment according to claim 1, characterized in that: The invention further comprises: a temperature sensor connected to the processing chamber and used for detecting the temperature in the processing chamber, and electrically connected to the controller.

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