Energy storage device

Abstract

The embodiment of the utility model provides energy storage equipment, which comprises a box body, a connecting plate is arranged in the box body, and the connecting plate protrudes out of the wall surface of the inner wall of the box body; the battery module is arranged in the box body; the heat dissipation structure is arranged in the box body, the heat dissipation structure comprises a heat dissipation plate located at the top of the box body and heat dissipation fins arranged on one side of the heat dissipation plate, the other side of the heat dissipation plate abuts against the connecting plate, and the connecting plate is used for fixing the heat dissipation plate; and the circuit assembly is connected with the heat dissipation structure, the circuit assembly is electrically connected with the battery module, and the circuit assembly is hung at the bottom of the heat dissipation plate. According to the technical scheme, the circuit assembly generating heat and the heat dissipation structure are arranged in the top area of the whole box body, so that the temperature of the top of the box body is high, the possibility of generating condensation is low, the risk that key components such as a circuit board and an inverter contained in the circuit assembly are affected by condensation is effectively reduced, and the service life of the circuit assembly is prolonged. And the use safety of the product is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of electric energy storage, and in particular to an energy storage device. Background Art

[0002] At present, during the normal use of household energy storage equipment and outdoor energy storage equipment, condensation is easily generated due to the relative position of the battery, circuit board and radiator, and the dripping of condensation poses a risk of damage to the internal electronic components. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art or related technology.

[0004] In view of this, an embodiment of the present utility model provides an energy storage device.

[0005] In order to achieve the above-mentioned purpose, the utility model provides an embodiment of an energy storage device, including: a box body, a connecting plate is provided in the box body, and the connecting plate protrudes from the wall surface of the inner wall of the box body; a battery module is arranged in the box body; a heat dissipation structure is arranged in the box body, the heat dissipation structure includes a heat dissipation plate located at the top of the box body and heat dissipation fins arranged on one side of the heat dissipation plate, the other side of the heat dissipation plate is against the connecting plate, and the connecting plate is used to fix the heat dissipation plate; a circuit assembly is connected to the heat dissipation structure, the circuit assembly is electrically connected to the battery module, and the circuit assembly is hoisted at the bottom of the heat dissipation plate.

[0006] The energy storage device proposed by the utility model mainly includes a box body and a battery module, a heat dissipation structure and a circuit assembly located in the box body. By arranging a protruding connection plate in the box body and abutting the heat dissipation structure against the connection plate, the heat dissipation plate and the weight of the circuit assembly directly connected to the heat dissipation plate can be supported under the action of the connection plate, thereby reducing the extra force on the battery module located at the bottom. At the same time, the heat dissipation structure is placed at the top of the entire box body, which is conducive to the natural rise of heat. By arranging the heat source that generates a large amount of heat, that is, the circuit assembly at the top, the temperature at the top of the box body is higher, and the possibility of condensation at this position is lower, thereby avoiding damage to key parts such as the circuit board and inverter contained in the circuit assembly after condensation drips from the top, thereby improving the safety of the product. It should be added that in this solution, the device with a larger heat generation is arranged at the top, and the temperature near this position is higher, and condensation is not easy to generate. The position where condensation is easy to generate is the lower half of the side wall of the box body, where the temperature is lower. Since the circuit assembly is hoisted on the heat dissipation structure, even if the condensation on the side wall drips, it can only flow downward and cannot affect the circuit assembly.

[0007] It should be emphasized that in this solution, the heat dissipation structure, circuit components and battery modules are arranged in upper and lower layers. Compared with the front-to-back stacking solution adopted in the prior art, the heating elements will generate a large amount of heat. The circuit board is placed vertically, and electronic components are arranged at different positions in the height direction. The heat generated is widely distributed. When the hot air moves laterally to the other side with lower temperature, it will encounter cold and generate condensation. In the process of condensation dripping, there is a risk of dripping onto the circuit board. In this solution, the heat dissipation structure is set on the top of the entire box, and the circuit components are hoisted on the heat dissipation structure. During operation, the temperature on the top of the entire box is relatively high, and condensation is not easy to generate, thereby avoiding the risk of key components such as circuit boards and inverters contained in the circuit components being affected by condensation.

[0008] By providing an inwardly protruding connecting plate on the inner wall of the box, the weight of the heat-generating circuit components and the heat-dissipating heat dissipating structure is transferred from the battery module to the connecting plate. On the one hand, the use of the connecting plate can reduce the difficulty of installation and improve the assembly efficiency, that is, the heat dissipating structure connected to the circuit components only needs to be buckled on the inwardly protruding connecting plate to achieve assembly. On the other hand, the connecting plate can be hidden inside the box, so that the outer surface of the box can be provided with a more flexible functional interface according to needs.

[0009] It should be added that in this solution, by placing the heat dissipation structure inside the box and the other side of the heat sink against the connecting plate, the heat generated by the circuit components can be effectively transferred to the heat sink and dissipated through the heat sink fins, thereby keeping the temperature of the device within a safe range. In addition, the connecting plate is not only used to fix the heat sink, but also serves as a supporting structure inside the box to enhance the overall mechanical stability. The layout of the battery module and circuit components takes into account space utilization and heat dissipation efficiency. The circuit components are located at the bottom of the heat sink, which helps to utilize the cooling effect of the heat sink.

[0010] Specifically, the housing provides physical protection to prevent external factors such as dust and moisture from damaging the internal components, ensuring the safety and stable operation of the internal components of the device. The connecting plate serves as a supporting structure for fixing the heat sink, and is also a heat conduction medium between the heat sink and the housing, ensuring the stable fixation of the heat sink and improving the heat conduction efficiency. The battery module is used to store electrical energy and provide power for the device. The heat dissipation structure is used to dissipate the heat generated by the circuit components to prevent overheating. Specifically, the heat dissipation efficiency can be improved and the life of the device can be extended through the design of the heat sink and the heat sink fin. Among them, the heat sink, as a heat conduction medium, conducts the heat of the circuit components to the heat sink fins, and increases the heat dissipation speed by increasing the heat dissipation area. The heat sink fins increase the heat dissipation area, improve the heat exchange efficiency with the surrounding air, and accelerate the heat dissipation through the fin design, reducing the operating temperature of the device. The circuit components are mainly used to control and adjust the charging and discharging process of the battery module and manage energy distribution. The effective heat dissipation of the circuit components can prevent performance degradation or damage caused by overheating.

[0011] By hanging the circuit assembly at the bottom of the heat sink, setting the heat dissipation structure at the top of the entire box, and hanging the circuit assembly on the heat dissipation structure, when working, the temperature on the top of the entire box is higher and condensation is not easy to occur, thereby avoiding the risk of key components such as circuit boards and inverters contained in the circuit assembly being affected by condensation.

[0012] In some technical solutions, optionally, it also includes: a first connecting hole, which is arranged on the outer periphery of the heat sink; a second connecting hole, which is arranged on the connecting plate, and a connecting member is passed through the first connecting hole and the second connecting hole to achieve the connection between the heat sink and the connecting plate.

[0013] In this technical solution, two types of connection holes are correspondingly arranged on the heat sink and the connection plate, that is, the first connection hole and the second connection hole are respectively arranged on the outer periphery of the heat sink and the connection plate, so that accurate positioning points are provided for the heat sink, ensuring that the heat sink is correctly aligned with the inner wall of the box. Through these holes, bolts, screws or other fasteners can be used as connecting members to firmly fix the heat sink to the connection plate, thereby improving the stability of the entire heat dissipation structure.

[0014] In addition, the design of the connection holes can also serve as a channel for heat conduction, allowing heat to be transferred from the circuit components to the connection board through the heat sink and finally dissipated to the outside of the box.

[0015] The first and second connection holes in the design allow for the use of different types of connectors, such as bolts of different lengths or diameters, to accommodate different installation requirements or adjust the position of the heat sink. Through these connection holes, the heat sink can be easily removed and reinstalled, facilitating future maintenance or replacement work. The connector passes through the connection holes, increasing the connection strength between the heat sink and the connection plate, helping to withstand the vibration and mechanical stress generated during the operation of the equipment.

[0016] Of course, the main function of the connector (such as bolts or screws) is to fix the heat sink tightly to the connecting plate to ensure that there is no relative movement between the two, thereby improving the heat dissipation efficiency. The connector can allow a certain degree of adjustment to compensate for tolerances in the manufacturing process or minor errors in the installation process.

[0017] In some technical schemes, optionally, a heat dissipation cavity and a heating cavity separated by a connecting plate are formed in the box, the heat dissipation cavity and the heating cavity are adjacently arranged along the gravity direction of the box, and the heat dissipation cavity is located above the heating cavity; wherein, at least part of the heat dissipation structure is arranged in the heat dissipation cavity, and the circuit component is arranged in the heating cavity.

[0018] In this technical solution, the interior of the box is designed to contain two main chambers, the heat dissipation chamber and the heating chamber, which helps to optimize the heat dissipation efficiency and thermal management of the device. Among them, the heat dissipation chamber is a structure specially used for heat dissipation, which can contain heat dissipation elements such as heat dissipation plates and heat dissipation fins. By placing the heat dissipation elements in the heat dissipation chamber, heat can be centrally managed and heat dissipation efficiency can be improved.

[0019] The heat chamber contains the main heat generating components, such as battery modules and circuit components. By concentrating the heat generating components in one chamber, it helps to control and reduce the impact of heat on other components.

[0020] By separating the heat dissipation cavity and the heat generation cavity through a connecting plate and connecting the heat dissipation plate to the connecting plate, direct heat transfer to areas outside the heat dissipation cavity can be reduced, thereby protecting other components from high temperature.

[0021] The heat dissipation cavity and the heating cavity are adjacently arranged along the gravity direction of the cabinet, with the heat dissipation cavity at the top and the heating cavity at the bottom, which can optimize space utilization while maintaining the independence of the two cavities.

[0022] In some technical solutions, optionally, at least one wall surface of the heat dissipation cavity formed in the box body is provided with a heat dissipation hole communicating with the outside.

[0023] In this technical solution, holes are punched on the wall of the box to form heat dissipation holes. The heat dissipation holes allow the hot air in the heat dissipation cavity to exchange with the external environment, helping to dissipate the heat accumulated inside. Among them, the heat dissipation holes are set on the wall of the heat dissipation cavity, which means that the heat can be directly transferred from the heat dissipation structure to the outside world, reducing the distance of heat transfer. At the same time, the heat dissipation holes provide a direct heat exchange path, which helps to improve the heat dissipation efficiency of the heat dissipation cavity, thereby reducing the operating temperature of the equipment. Of course, the heat dissipation holes can promote natural convection, so that the hot air rises and is discharged from the holes, while the cold air enters from the bottom of the box, forming an effective heat exchange.

[0024] As the heat continues to increase, the pressure inside the box will also increase. At this time, the heat dissipation holes can balance the pressure difference inside and outside the heat dissipation cavity, avoiding the increase in internal pressure due to continuous heating.

[0025] Of course, through the reasonable design of the heat dissipation holes, the humidity inside the heat dissipation cavity can be reduced, thereby reducing the risk of condensation.

[0026] It should be added that the heat dissipation holes need to have appropriate dust and water proof measures to prevent dust, moisture, etc. from invading the interior of the device.

[0027] In some technical solutions, optionally, the circuit assembly specifically includes: at least one circuit board, each circuit board is provided with at least one electronic component; wherein, at least one heat conductive sheet is provided on the heat sink, and each heat conductive sheet is in contact with at least one electronic component.

[0028] In this technical solution, the circuit assembly includes a circuit board and electronic components. A heat conductive sheet is provided on the heat sink. The circuit board is the carrier of the electronic components and provides a platform for fixing and connecting the electronic components. The electronic components on the circuit board are responsible for controlling and regulating the charging and discharging process of the battery module and managing energy distribution. Electronic components are the basic components on the circuit board and are responsible for performing specific electronic functions such as switching, amplification, filtering, etc. Electronic components include but are not limited to transformers, transistors, etc. Electronic components generate heat when working and require effective heat dissipation measures to maintain their normal operation. By providing a heat conductive sheet that fits the electronic components on the heat sink, the heat generated by the electronic components is conducted to the heat sink. Through direct contact with the electronic components, the heat conductive sheet can quickly disperse the heat and reduce the operating temperature of the components.

[0029] It can be understood that the electronic components and the thermal pads are in surface contact. The use of thermal pads and electronic components can provide a more efficient heat conduction path, accelerating the conduction of heat from the heat source to the heat sink. By evenly distributing heat, thermal pads help reduce hot spots on the circuit board and improve the stability of the entire circuit assembly. Of course, the use of thermal pads simplifies the heat dissipation design because they can directly contact the electronic components without the need for complex heat dissipation structures.

[0030] In some technical solutions, optionally, there are multiple circuit boards, and the circuit boards include a first board and a second board at different distances from the heat sink, the electronic components of the first board are attached to at least one heat conductive sheet, the second board is spaced apart from the first board, and the second board is detachably connected to the first board.

[0031] In this technical solution, multiple circuit boards are provided, and the multiple circuit boards are divided into a first board and a second board according to the distance between the circuit boards and the heat sink, wherein the electronic components on the first board are in direct contact with the heat conducting sheet and fit each other, and the second board is spaced apart from the first board and the two are detachably connected, and there is a possibility of providing multiple second boards, that is, the second board is a circuit board that is not fitted with the heat conducting sheet, and the second board includes a single-layer board or a multi-layer board. By stacking the first board and the second board, the density of the circuit components can be increased in a limited space, and the space utilization rate can be improved. It can be understood that the multi-layer design allows for a more complex circuit design and can integrate more electronic components.

[0032] The close contact between the first plate and the heat sink can achieve better heat dissipation through the heat conductive sheet, while the second plate may be designed with a certain interval to adapt to different heat dissipation requirements. This design allows differentiated heat dissipation management for electronic components with different heat generation.

[0033] Through the detachable connection, the circuit boards can be treated as independent modules, which are easy to upgrade or replace separately, improving the flexibility and maintainability of the equipment. The spacing and detachable connection of the second board to the first board simplifies the maintenance process because the second board can be removed separately for inspection or replacement.

[0034] In some technical solutions, optionally, it also includes: a heat dissipation duct, which is arranged in the box body, and the heat dissipation duct is located on the side of the heat dissipation structure facing the circuit component.

[0035] In this technical solution, by setting a heat dissipation duct in the box, it helps to improve the heat dissipation efficiency and maintain the temperature balance inside the device. The heat dissipation duct is a specially designed air flow channel used to guide the air flow to take away the heat generated by the heat dissipation structure and circuit components. The heat dissipation duct is located on the side of the heat dissipation structure facing the circuit components, effectively guiding the heat generated by the circuit components to the heat dissipation structure, and then dissipating it to the external environment.

[0036] The design of the heat dissipation duct can enhance the convection of internal air, especially when natural convection is not sufficient to meet the heat dissipation requirements, which can improve the heat dissipation efficiency.

[0037] Through the properly designed air duct, the temperature distribution inside the equipment can be more uniform, avoiding local overheating. The heat dissipation air duct can reduce the thermal resistance on the heat dissipation path, allowing heat to be transferred from the heat source to the heat dissipation surface more quickly.

[0038] In some technical solutions, optionally, it also includes: a fan, which is arranged in the heat dissipation duct.

[0039] In this technical solution, by arranging a fan in the heat dissipation duct, forced convection can be used to accelerate the air flow, helping the heat dissipation duct to transfer heat more effectively. At the same time, the fan can ensure the directionality and efficiency of the air flow, and directly discharge the heat from the heat source area.

[0040] As you can understand, when the fan is running, it can significantly increase the air flow speed, speeding up the transfer of heat from electronic components to the heat sink, and then from the heat sink to the external environment. Under high load or high ambient temperature, the fan can maintain the internal temperature of the device stable and prevent overheating.

[0041] In some technical solutions, optionally, a mounting opening is provided on the top side of the box body in the gravity direction, and the connecting plate is arranged close to the mounting opening. The energy storage device also includes: a top cover, which is detachably connected to the mounting opening.

[0042] In this technical solution, an installation port is provided on the top side of the box body so that the heat dissipation structure and circuit components can be placed in the box body through the installation port. At the same time, the installation port can also be used as a maintenance channel to facilitate technicians to inspect, maintain or replace internal components of the equipment. In addition, placing the connecting plate close to the installation port helps with thermal management, especially if the installation port area is designed with ventilation or heat dissipation functions. Such a layout can optimize the use of space, make the connecting plate and the heat dissipation structure more compact, and reduce the overall volume of the equipment. The connecting plate is close to the installation port, which is convenient for fixing together during installation, simplifying the installation process.

[0043] When a mounting port is set, in order to prevent dust, moisture and other external contaminants from entering the interior of the device, a top cover is set to provide a sealing effect. In addition, the top cover provides additional mechanical protection for the internal components of the device, reducing the risk of damage caused by accidental impact or pressure.

[0044] It should be added that the detachable top cover design makes it easier to maintain the equipment and replace internal components without disassembling the entire box. The opening method of the top cover includes but is not limited to buckles, screws or locks to facilitate quick disassembly and installation.

[0045] Of course, the size, shape and strength of the installation opening must meet the installation requirements without compromising the sealing and protection of the box.

[0046] In some technical solutions, optionally, it also includes: a protrusion, which is arranged on the inner wall of the box body, and the connecting plate is connected to the protrusion; wherein the protrusion and the box body are integrally injection molded.

[0047] In this technical solution, a protrusion that is integrally molded with the box body is provided on the inner side wall of the box body, and a whole is formed during the manufacturing process, which reduces the assembly steps and improves the production efficiency. The protrusion, as a part of the inner side wall of the box body, can enhance the structural strength of the entire box body, especially in the part that needs to bear extra weight or mechanical stress. The connecting plate and the protrusion are interconnected, and the direct connection can provide a stable fixing point for the subsequent installation or fixing of the heat sink or other components.

[0048] In some technical solutions, optionally, the box body is made of metal, and the connecting plate is welded to the inner wall of the box body.

[0049] In this technical solution, the box is made of metal material, which provides high mechanical strength and can withstand greater external pressure and impact to protect internal components. Among them, metal materials usually have good thermal conductivity, which helps to quickly disperse the heat generated inside.

[0050] In addition, the metal box can provide a certain degree of electromagnetic shielding, reducing the impact of electromagnetic interference on internal electronic components.

[0051] By directly welding the connecting plate to the box, it can be ensured that the connection between the connecting plate and the box is very firm and not easy to loosen. In addition, the welding connection helps to improve the heat conduction efficiency between the connecting plate and the box.

[0052] In some technical solutions, optionally, it also includes: a seal, which is arranged between the heat dissipation structure and the connecting plate.

[0053] In this technical solution, by providing a seal between the heat dissipation structure and the connecting plate, the gap between the two can be reduced, which can effectively reduce the possibility of condensation generated on the heat dissipation structure dripping along the gap to the connecting plate, thereby reducing the impact on the circuit components below.

[0054] Additional aspects and advantages of the present invention will become apparent in the following description or will be understood through practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0055] Figure 1 An exploded schematic diagram of an energy storage device according to an embodiment of the utility model is shown;

[0056] Figure 2 A schematic diagram of the assembly structure of a heat dissipation structure and a circuit component according to an embodiment of the utility model is shown;

[0057] Figure 3 A schematic diagram of the assembly structure of a heat dissipation structure and a circuit component according to an embodiment of the utility model is shown;

[0058] Figure 4 A schematic structural diagram of a heat dissipation structure according to an embodiment of the utility model is shown;

[0059] Figure 5 A schematic diagram of the combined structure of a sealing member according to an embodiment of the utility model is shown;

[0060] Figure 6 A schematic diagram of the structure of an energy storage device according to an embodiment of the utility model is shown;

[0061] Figure 7 A schematic diagram of the combined structure of the protrusion and the connecting plate according to an embodiment of the utility model is shown;

[0062] Figure 8 A schematic structural diagram of an energy storage device according to an embodiment of the utility model is shown;

[0063] Fig. 9 A schematic diagram of the assembly structure of a heat dissipation structure and a circuit component according to an embodiment of the utility model is shown.

[0064] in, Figures 1 to 9 The corresponding relationship between the reference numerals and the component names is as follows:

[0065] 100: energy storage device; 102: housing; 1021: raised portion; 1022: connecting plate; 1024: heat dissipation cavity; 1026: heat dissipation cavity; 1028: heat dissipation hole; 1032: installation port; 1034: top cover; 104: battery module; 106: heat dissipation structure; 1062: heat dissipation plate; 1063: heat conductive sheet; 1064: heat dissipation fin; 108: circuit assembly; 1082: circuit board; 1084: electronic component; 1092: first board; 1094: second board; 1102: first connecting hole; 1104: second connecting hole; 112: heat dissipation duct; 1122: fan; 114: seal; 116: transformer. DETAILED DESCRIPTION

[0066] In order to more clearly understand the above-mentioned purposes, features and advantages of the embodiments of the present invention, the embodiments of the present invention are further described in detail below in conjunction with the accompanying drawings and specific implementation methods. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0067] In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the embodiments of the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present application is not limited to the specific embodiments disclosed below.

[0068] Refer to the following Figures 1 to 9 Some embodiments according to the present invention are described.

[0069] like Figure 1 , Figure 2 and Figure 8As shown, an energy storage device 100 proposed in this embodiment mainly includes a box body 102 and a battery module 104, a heat dissipation structure 106 and a circuit assembly 108 located in the box body 102. By arranging a protruding connecting plate 1022 in the box body 102 and abutting the heat dissipation structure 106 against the connecting plate 1022, the heat dissipation plate 1062 and the weight of the circuit assembly 108 directly connected to the heat dissipation plate 1062 can be supported under the action of the connecting plate 1022, thereby reducing the additional force on the battery module 104 located at the bottom. At the same time, the heat dissipation structure 106 is placed at the top of the entire box body 102, which is conducive to the natural rise of heat. By arranging a heat source that generates a large amount of heat, that is, the circuit assembly 108, at the top, the temperature at the top of the box body 102 is higher, and the possibility of condensation at this position is lower, thereby avoiding damage to key parts such as the circuit board and inverter contained in the circuit assembly 108 after condensation drips from the top, thereby improving the safety of product use. It should be added that, in the present solution, the device that generates more heat is arranged at the top. The temperature near this position is relatively high and condensation is not easy to occur. The position where condensation is prone to occur is the lower half of the side wall of the box body 102 where the temperature is relatively low. Since the circuit component 108 is suspended on the heat dissipation structure 106, even if the condensation on the side wall drips, it can only flow downward and cannot affect the circuit component 108.

[0070] It should be emphasized that in the present solution, the heat dissipation structure, circuit components and battery modules are arranged in upper and lower layers. Compared with the front-to-back stacking solution adopted in the prior art, the heating element will generate a large amount of heat. The circuit board is placed vertically, and electronic components are arranged at different positions in the height direction. The heat generated is widely distributed. When the hot air moves laterally to the other side with lower temperature, it will encounter cold and generate condensation. In the process of condensation dripping, there is a risk of dripping onto the circuit board. In the present solution, the heat dissipation structure 106 is arranged on the top of the entire box 102, and the circuit component 108 is hoisted on the heat dissipation structure 106. During operation, the top temperature of the entire box 102 is relatively high, and condensation is not easy to generate, thereby avoiding the risk of key components such as the circuit board and inverter contained in the circuit component 108 being affected by condensation.

[0071] In this solution, an inwardly protruding connecting plate 1022 is provided on the inner wall of the box body 102, so that the weight of the heat-generating circuit component 108 and the heat-dissipating heat dissipating structure 106 are transferred from the battery module 104 to the connecting plate 1022. On the one hand, the connecting plate 1022 can reduce the difficulty of installation and improve the assembly efficiency, that is, the heat dissipating structure 106 connected with the circuit component 108 only needs to be buckled on the inwardly protruding connecting plate 1022 to achieve assembly. On the other hand, the connecting plate 1022 can be hidden inside the box body 102, so that the outer surface of the box body 102 can be provided with a more flexible functional interface according to needs.

[0072] In some embodiments, the energy storage device 100 may be a balcony photovoltaic energy storage device. The balcony photovoltaic energy storage device can be charged and stored through photovoltaic panel photoelectric conversion and / or city electricity, and can provide power to electrical devices. Compared with traditional household energy storage devices, the balcony photovoltaic energy storage device is relatively small and easy to carry and move. Users can move the location according to their power needs, for example, from the balcony to the garage or even outdoors.

[0073] It should be added that in this solution, by placing the heat dissipation structure 106 in the box 102, and the other side of the heat sink 1062 is against the connecting plate 1022, the heat generated by the circuit component 108 can be effectively transferred to the heat sink 1062, and the heat is dissipated through the heat dissipation fins 1064, thereby keeping the temperature of the device within a safe range. In addition, the connecting plate 1022 is not only used to fix the heat sink 1062, but also serves as a supporting structure inside the box 102 to enhance the overall mechanical stability. The layout of the battery module 104 and the circuit component 108 takes into account space utilization and heat dissipation efficiency. The circuit component 108 is located at the bottom of the heat sink 1062, which helps to utilize the cooling effect of the heat sink 1062.

[0074] Specifically, the housing 102 provides physical protection to prevent external factors such as dust, moisture, etc. from damaging the internal components, thereby ensuring the safety and stable operation of the internal components of the device. The connecting plate 1022 serves as a supporting structure for fixing the heat sink 1062, and is also a heat conduction medium between the heat sink 1062 and the housing 102, thereby ensuring the stable fixation of the heat sink 1062 and improving the heat conduction efficiency. The battery module 104 is used to store electrical energy and provide power for the device. The heat dissipation structure 106 is used to dissipate the heat generated by the circuit component 108 to prevent overheating. Specifically, the heat dissipation efficiency can be improved and the life of the device can be extended through the design of the heat sink 1062 and the heat dissipation fins 1064. Among them, the heat sink 1062 serves as a heat conduction medium to conduct the heat of the circuit component 108 to the heat dissipation fins 1064, thereby increasing the heat dissipation area and increasing the heat dissipation speed. The heat dissipation fins 1064 increase the heat dissipation area, improve the heat exchange efficiency with the surrounding air, and accelerate the heat dissipation through the fin design to reduce the operating temperature of the device. The circuit assembly 108 is mainly used to control and regulate the charging and discharging process of the battery module and manage energy distribution. The effective heat dissipation of the circuit assembly 108 can prevent performance degradation or damage caused by overheating.

[0075] By hanging the circuit assembly at the bottom of the heat sink, setting the heat dissipation structure 106 at the top of the entire box 102, and hanging the circuit assembly 108 on the heat dissipation structure 106, during operation, the temperature at the top of the entire box 102 is higher and condensation is not easy to occur, thereby avoiding the risk of key components such as circuit boards and inverters contained in the circuit assembly 108 being affected by condensation.

[0076] In some embodiments, optionally, two types of connection holes are correspondingly provided on the heat dissipation plate 1062 and the connection plate 1022, that is, the first connection hole 1102 and the second connection hole 1104 are respectively provided on the outer periphery of the heat dissipation plate 1062 and the connection plate 1022, providing accurate positioning points for the heat dissipation plate 1062, ensuring that the heat dissipation plate 1062 is correctly aligned with the inner wall of the box body 102. Through these holes, bolts, screws or other fasteners can be used as connectors to firmly fix the heat dissipation plate 1062 on the connection plate 1022, thereby improving the stability of the entire heat dissipation structure 106.

[0077] In addition, the design of the connection holes can also serve as a heat conduction channel, allowing heat to be transferred from the circuit component 108 to the connection plate 1022 through the heat sink 1062 and finally dispersed to the outside of the box 102 .

[0078] The first connection hole 1102 and the second connection hole 1104 in the design allow for the use of different types of connectors, such as bolts of different lengths or diameters, to accommodate different installation requirements or adjust the position of the heat sink 1062. Through these connection holes, the heat sink 1062 can be easily removed and reinstalled, which is convenient for future maintenance or replacement work. The connector passes through the connection hole, which increases the connection strength between the heat sink 1062 and the connection plate 1022, helping to withstand the vibration and mechanical stress generated when the equipment is running.

[0079] Of course, the main function of the connector (such as bolts or screws) is to tightly fix the heat sink 1062 to the connecting plate 1022 to ensure that there is no relative movement between the two, thereby improving the heat dissipation efficiency. The connector can allow a certain degree of adjustment to compensate for tolerances in the manufacturing process or minor errors in the installation process.

[0080] Optionally, the interior of the housing 102 is designed to include two main chambers, a heat dissipation chamber 1024 and a heat dissipation chamber 1026, which helps optimize the heat dissipation efficiency and thermal management of the device. The heat dissipation chamber 1024 is a structure specifically used for heat dissipation, and may include heat dissipation elements such as a heat dissipation plate 1062 and heat dissipation fins 1064. By placing the heat dissipation elements in the heat dissipation chamber 1024, heat can be centrally managed and heat dissipation efficiency can be improved.

[0081] The heat generating chamber 1026 contains the main heat generating components, such as the battery module 104 and the circuit components 108. By concentrating the heat generating components in one chamber, it helps to control and reduce the impact of heat on other components.

[0082] By separating the heat dissipation cavity 1024 and the heat generation cavity 1026 through the connection plate 1022 and connecting the heat dissipation plate 1062 to the connection plate 1022, the heat directly transferred to the area outside the heat dissipation cavity 1024 can be reduced, thereby protecting other components from high temperature.

[0083] The heat dissipation cavity 1024 and the heating cavity 1026 are adjacently arranged along the gravity direction of the box body 102, with the heat dissipation cavity 1024 being on the top and the heating cavity 1026 being on the bottom, so as to optimize the space utilization while maintaining the independence of the two cavities.

[0084] In a specific embodiment, holes are punched on the wall of the housing 102 to form heat dissipation holes 1028 for heat dissipation. The heat dissipation holes 1028 allow the hot air in the heat dissipation cavity 1024 to exchange with the external environment, helping to dissipate the heat accumulated inside. Among them, the heat dissipation holes 1028 are arranged on the wall of the heat dissipation cavity 1024, which means that the heat can be directly transferred from the heat dissipation structure 106 to the outside world, reducing the distance of heat transfer. At the same time, the heat dissipation holes 1028 provide a direct heat exchange path, which helps to improve the heat dissipation efficiency of the heat dissipation cavity 1024, thereby reducing the operating temperature of the device. Of course, the heat dissipation holes 1028 can promote natural convection, so that the hot air rises and is discharged from the hole, while the cold air enters from the bottom of the housing 102, forming an effective heat exchange.

[0085] When the heat continues to increase, the pressure in the box body 102 will also increase. At this time, the heat dissipation holes 1028 can balance the pressure difference between the inside and outside of the heat dissipation cavity 1024 to avoid the increase of internal pressure due to continuous heating.

[0086] Of course, through the reasonable design of the heat dissipation holes 1028, the humidity inside the heat dissipation cavity 1024 can be reduced, thereby reducing the risk of condensation.

[0087] It should be added that the heat dissipation holes 1028 need to have appropriate dust and water proof measures to prevent dust, moisture, etc. from invading the interior of the device.

[0088] In one embodiment, optionally, Figure 2 and Figure 4As shown, the circuit assembly 108 includes a circuit board 1082 and an electronic component 1084. A heat conducting sheet 1063 is provided on the heat dissipation plate 1062. The circuit board 1082 is a carrier of the electronic component 1084, providing a platform for fixing and connecting the electronic component 1084. The electronic component 1084 on the circuit board 1082 is responsible for controlling and regulating the charging and discharging process of the battery module 104 and managing energy distribution. The electronic component 1084 is a basic component on the circuit board 1082, responsible for performing specific electronic functions, such as switching, amplification, filtering, etc. The electronic component 1084 includes but is not limited to the transformer 116, transistors, etc. The electronic component 1084 generates heat when working, and effective heat dissipation measures are required to maintain its normal operation. By providing a heat conducting sheet 1063 that fits the electronic component 1084 on the heat dissipation plate 1062, the heat generated by the electronic component 1084 is conducted to the heat dissipation plate 1062. Through direct contact with the electronic component 1084, the heat conducting sheet 1063 can quickly disperse the heat and reduce the operating temperature of the component.

[0089] The electronic component 1084 includes a diode, and the heat conducting sheet 1063 can be made of insulating heat conducting materials, such as an alumina ceramic sheet, etc., which can be conducted to the air by natural heat dissipation.

[0090] It can be understood that the electronic component 1084 and the heat conductive sheet 1063 are in surface contact, and the bonding of the heat conductive sheet 1063 and the electronic component 1084 can provide a more efficient heat conduction path, accelerating the conduction of heat from the heat source to the heat sink 1062. By evenly distributing heat, the heat conductive sheet 1063 helps reduce hot spots on the circuit board 1082 and improve the stability of the entire circuit assembly 108. Of course, the use of the heat conductive sheet 1063 simplifies the heat dissipation design because they can directly contact the electronic component 1084 without the need for a complex heat dissipation structure 106.

[0091] In one embodiment, Fig. 9 As shown, the circuit board 1082 can be connected to the heat sink 1062 via studs.

[0092] Alternatively, if Figure 3As shown, the circuit board 1082 is designed in multiple layers, and multiple circuit boards 1082 are set. According to the distance between the circuit board 1082 and the heat sink 1062, the multiple circuit boards 1082 are divided into a first board 1092 and a second board 1094, wherein the electronic components 1084 on the first board 1092 are in direct contact with the heat conducting sheet 1063 and are attached to each other, and the second board 1094 is arranged at a distance from the first board 1092 and the two are detachably connected. There is a possibility of setting multiple second boards 1094, that is, the second board 1094 is a circuit board 1082 that is not attached to the heat conducting sheet 1063, and the second board 1094 includes a single-layer board or a multi-layer board. By stacking the first board 1092 and the second board 1094, the density of the circuit assembly 108 can be increased in a limited space, and the space utilization rate can be improved. It can be understood that the multi-layer design allows a more complex circuit design and can integrate more electronic components 1084.

[0093] The close contact between the first plate 1092 and the heat sink 1062 can achieve better heat dissipation through the heat conductive sheet 1063, while the second plate 1094 may be designed with a certain interval to adapt to different heat dissipation requirements. This design allows differentiated heat dissipation management for electronic components 1084 with different heat generation.

[0094] Through the detachable connection, the circuit board 1082 can be regarded as an independent module, which is convenient for individual upgrade or replacement, and improves the flexibility and maintainability of the equipment. The spacing and detachable connection between the second board 1094 and the first board 1092 simplifies the maintenance process because the second board 1094 can be removed separately for inspection or replacement.

[0095] In a specific embodiment, a two-layer circuit board 1082 is selected, and the heat dissipation structure 106, the circuit component 108 and other structures are first assembled into a whole. Specifically, the first board 1092 is first connected to the heat dissipation plate 1062 by studs, and then the second board 1094 is connected to the first board 1092 by studs. Finally, the transformer box or other structures that need to be directly connected to the heat dissipation plate 1062 are connected to the heat dissipation plate 1062 to form a hanging assembly. Finally, the hanging assembly is turned upside down on the connecting plate 1022 of the box body 102, that is, the second board 1094 is located at the bottom, the first board 1092 is located in the middle, and the heat dissipation structure 106 is located at the top. The heat dissipation plate 1062 and the connecting plate 1022 in the hanging assembly are fixed by screws, wherein the connecting plate 1022 can be considered to have the same function as the flange, which is used for connection and support. After the assembly is completed, the top cover 1034 is covered to form the energy storage device 100 as a whole.

[0096] In one embodiment, optionally, Figure 6As shown, a heat dissipation duct 112 is provided in the housing 102, which helps to improve the heat dissipation efficiency and maintain the temperature balance inside the device. The heat dissipation duct 112 is a specially designed airflow channel for guiding air flow to take away the heat generated by the heat dissipation structure 106 and the circuit assembly 108. The heat dissipation duct 112 is located on the side of the heat dissipation structure 106 facing the circuit assembly 108, and effectively guides the heat generated by the circuit assembly 108 to the heat dissipation structure 106, and then dissipates it to the external environment.

[0097] The design of the heat dissipation duct 112 can enhance the convection of the internal air, especially when natural convection is insufficient to meet the heat dissipation demand, thereby improving the heat dissipation efficiency.

[0098] By properly designing the air duct, the temperature distribution inside the device can be made more uniform, avoiding local overheating. The heat dissipation air duct 112 can reduce the thermal resistance on the heat dissipation path, so that the heat is transferred from the heat source to the heat dissipation surface more quickly.

[0099] Furthermore, a fan 1122 is provided in the heat dissipation duct 112 to force convection to accelerate air flow and help the heat dissipation duct 112 to transfer heat more effectively. At the same time, the directionality and efficiency of air flow can be ensured under the action of the fan 1122, and heat can be directly discharged from the heat source area.

[0100] It is understood that the fan 1122 can significantly increase the air flow speed when running, accelerating the transfer of heat from the electronic components 1084 to the heat sink 1062, and then from the heat sink 1062 to the external environment. Under high load or high ambient temperature, the fan 1122 can maintain the internal temperature of the device stable to prevent overheating.

[0101] In a specific embodiment, Figure 1 As shown, an installation opening 1032 is provided on the top side of the housing 102, so that the heat dissipation structure 106 and the circuit assembly 108 can be placed in the housing 102 through the installation opening 1032. At the same time, the installation opening 1032 can also be used as a maintenance channel, which is convenient for technicians to inspect, maintain or replace internal components of the equipment. In addition, arranging the connecting plate 1022 close to the installation opening 1032 is helpful for thermal management, especially if the installation opening 1032 area is designed with ventilation or heat dissipation functions. Such a layout can optimize the use of space, making the connecting plate 1022 and the heat dissipation structure 106 more compact and reducing the overall volume of the equipment. The connecting plate 1022 is close to the installation opening 1032, which is convenient for fixing together during installation, simplifying the installation process.

[0102] When the mounting port 1032 is provided, in order to prevent dust, moisture and other external contaminants from entering the interior of the device, a top cover 1034 is provided to provide a sealing effect. In addition, the top cover 1034 provides additional mechanical protection for the internal components of the device, reducing the risk of damage caused by accidental impact or pressure.

[0103] The top cover 1034 may be made of plastic material, and a mesh structure may be provided on the top cover 1034 .

[0104] It should be added that the detachable top cover 1034 design makes equipment maintenance and internal component replacement easier without disassembling the entire box 102. The opening method of the top cover 1034 includes but is not limited to buckles, screws or locks, so as to facilitate quick disassembly and installation.

[0105] Of course, the size, shape and strength of the installation opening 1032 must meet the installation requirements while not damaging the sealing and protective properties of the box body 102 .

[0106] In a specific embodiment, Figure 7 As shown, a protrusion 1021 is provided on the inner side wall of the box body 102, which is integrally molded with the box body 102, so that a whole is formed during the manufacturing process, which reduces the assembly steps and improves the production efficiency. The protrusion 1021, as a part of the inner side wall of the box body 102, can enhance the structural strength of the entire box body 102, especially in the part that needs to bear extra weight or mechanical stress. The connecting plate 1022 and the protrusion 1021 are interconnected, and the direct connection can provide a stable fixing point for subsequent installation or fixing of the heat sink 1062 or other components.

[0107] In a specific embodiment, the housing 102 can be made of metal to provide high mechanical strength, withstand greater external pressure and impact, and protect internal components. Metal materials usually have good thermal conductivity, which helps to quickly disperse the heat generated inside.

[0108] In addition, the metal housing 102 can provide a certain degree of electromagnetic shielding, thereby reducing the impact of electromagnetic interference on the internal electronic components 1084 .

[0109] By directly welding the connecting plate 1022 to the box body 102, it can be ensured that the connection between the connecting plate 1022 and the box body 102 is very firm and not easy to loosen. In addition, the welding connection helps to improve the heat conduction efficiency between the connecting plate 1022 and the box body 102.

[0110] Based on any of the above embodiments, Figure 5As shown, a sealant 114 is provided between the heat dissipation structure 106 and the connecting plate 1022 to reduce the gap therebetween, and effectively reduce the possibility of condensation generated on the heat dissipation structure 106 dripping along the gap to the connecting plate 1022, thereby reducing the impact on the circuit components 108 below.

[0111] According to the energy storage device provided by the utility model, by arranging the heat-generating circuit components and the heat dissipation structure in the top area of ​​the entire box, the temperature at the top of the box is higher and the possibility of generating condensation is lower, which effectively reduces the risk of key components such as circuit boards and inverters contained in the circuit components being affected by condensation, thereby improving the safety of product use.

[0112] In the present invention, the terms "first", "second", and "third" are used for descriptive purposes only and should not be understood as indicating or implying relative importance; the term "plurality" refers to two or more, unless otherwise clearly defined. The terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense. For example, "connected" can be a fixed connection, a detachable connection, or an integral connection; "connected" can be a direct connection or an indirect connection through an intermediate medium. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to the specific circumstances.

[0113] In the description of the present invention, it is necessary to understand that the directions or positional relationships indicated by terms such as "up", "down", "left", "right", "front" and "back" are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or unit referred to must have a specific direction, be constructed and operated in a specific orientation, and therefore, cannot be understood as a limitation on the present invention.

[0114] In the description of this specification, the description of the terms "one embodiment", "some embodiments", "specific embodiments", etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0115] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. For those skilled in the art, the present invention may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. An energy storage device, characterized in that: include: A box body, wherein a connecting plate is provided in the box body, and the connecting plate protrudes from the wall surface of the inner wall of the box body; A battery module is arranged in the box; A heat dissipation structure is arranged in the box body, the heat dissipation structure comprises a heat dissipation plate located at the top of the box body and heat dissipation fins arranged on one side of the heat dissipation plate, the other side of the heat dissipation plate is against the connecting plate, and the connecting plate is used to fix the heat dissipation plate; The circuit assembly is connected to the heat dissipation structure, the circuit assembly is electrically connected to the battery module, and the circuit assembly is hoisted at the bottom of the heat dissipation plate.

2. The energy storage device according to claim 1, characterized in that: Also includes: A first connection hole is provided at the outer periphery of the heat dissipation plate; A second connection hole is provided on the connection plate, and a connection piece passes through the first connection hole and the second connection hole to realize the connection between the heat dissipation plate and the connection plate.

3. The energy storage device according to claim 1, characterized in that: A heat dissipation cavity and a heat generation cavity separated by the connection plate are formed in the box body, the heat dissipation cavity and the heat generation cavity are adjacently arranged along the gravity direction of the box body, and the heat dissipation cavity is located above the heat generation cavity; Wherein, at least part of the heat dissipation structure is arranged in the heat dissipation cavity, and the circuit component is arranged in the heat dissipation cavity.

4. The energy storage device according to claim 3, characterized in that: At least one wall surface of the box body forming the heat dissipation cavity is provided with a heat dissipation hole communicating with the outside.

5. The energy storage device according to claim 1, characterized in that: The circuit assembly specifically includes: at least one circuit board, each of which is provided with at least one electronic component; Wherein, at least one heat conducting sheet is disposed on the heat dissipation plate, and each of the heat conducting sheets is attached to at least one of the electronic components.

6. The energy storage device according to claim 5, characterized in that: There are multiple circuit boards, each of which includes a first board and a second board at different distances from the heat sink, the electronic components of the first board are attached to at least one of the heat conductive sheets, the second board is spaced apart from the first board, and the second board is detachably connected to the first board.

7. The energy storage device according to claim 1, characterized in that: Also includes: A heat dissipation duct is provided in the box body, and the heat dissipation duct is located on a side of the heat dissipation structure facing the circuit component; The fan is arranged in the heat dissipation duct.

8. The energy storage device according to claim 1, characterized in that: The top side of the box body in the gravity direction is provided with a mounting opening, the connecting plate is arranged close to the mounting opening, and the energy storage device further comprises: A top cover is detachably connected to the mounting opening.

9. The energy storage device according to claim 1, characterized in that: Also includes: A raised portion is provided on the inner side wall of the box body, and the connecting plate is connected to the raised portion; Wherein, the protrusion and the box body are integrally injection molded.

10. The energy storage device according to claim 1, characterized in that: Also includes: A sealing member is arranged between the heat dissipation structure and the connecting plate.

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