Chip and substrate welding device with positioning function

By designing a welding device with a rotating mechanism and a three-axis moving mechanism, the problems of the inability to rotate the substrate and the chip in the prior art are solved, and flexible positioning and welding of the substrate and chip are realized, and the efficiency and practicality of welding are improved.

CN222547705UActive Publication Date: 2025-02-28CHENGDU ZHANYI ELECTRONIC TECH CO LTD

Patent Information

Application Number
CN202421232938.1
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-31
Publication Date
2025-02-28
Estimated Expiration
2034-05-31

AI Technical Summary

Technical Problem

When the existing welding devices position the substrate and the chip, they cannot drive the substrate to rotate, resulting in inconvenience in welding different positions and the inability to position the chip, which increases the workload.

Method used

A welding device with a rotating mechanism and a three-axis moving mechanism is designed, and the substrate positioning and clamping mechanism is driven to rotate through the rotating mechanism to achieve the change of the substrate position; through the three-axis moving mechanism and the vacuum suction cup, the adsorption and three-axis moving positioning of the chip are realized.

Benefits of technology

This device not only enables the base plate to be positioned, clamped and rotated, which facilitates welding of different positions, but also allows the chip to be adsorbed and three-axis moving positioning, which improves the flexibility and practicality of welding and reduces the workload.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model discloses a chip and substrate welding device with a positioning function, and relates to the technical field of welding devices, the chip and substrate welding device comprises a welding workbench, a rotating mechanism is installed at the center position of the upper surface of the welding workbench in a penetrating mode, and a substrate positioning and clamping mechanism is fixedly installed at the movable end of the rotating mechanism. A first side plate and a second side plate are symmetrically and fixedly connected to the two sides of the upper surface of the welding workbench, and a three-axis moving mechanism is installed on the outer surface of the first side plate in a penetrating mode. The position of the substrate can be changed, a user can weld different positions of the substrate conveniently, through the three-axis moving mechanism, a fourth motor and a vacuum chuck, a chip can be adsorbed and fixed, the chip can be driven to rotate, and therefore the chip can be positioned and welded conveniently.
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Description

Technical Field

[0001] The utility model relates to the technical field of welding devices, in particular to a chip and substrate welding device with a positioning function. Background Art

[0002] In the process of circuit board production, it is often necessary to solder various chips on the substrate. In order to facilitate soldering, the substrate is generally positioned. Therefore, a corresponding soldering device is needed to fix the substrate. After searching, the Chinese patent publication number CN220711737U discloses a fixing device for a patch circuit board, including a placement plate for placing the patch circuit board, both sides of the placement plate are movably connected with a clamping structure for clamping the patch circuit board, by placing the patch circuit board on the top of the placement plate, providing the clamping structure to clamp the patch circuit board, by moving the positioning frame, the positioning frame slides on the surface of the cylindrical guide rail, and the pressing structure is moved to the top of the electronic component to be soldered, and by rotating the pressing structure, the pressing structure limits the electronic component, thereby achieving the advantages of conveniently limiting the patch circuit board and conveniently positioning and fixing the electronic component.

[0003] Although the above technical solution is convenient for positioning the circuit board and electronic components, it is often necessary to weld different positions of the circuit board during use. The clamping structure in the above technical solution is fixed and cannot drive the substrate to rotate, so the substrate needs to be repeatedly disassembled and assembled, which increases the workload. The position of the electronic components also needs to be manually adjusted to be tightened, further increasing the workload. Utility Model Content

[0004] In view of the deficiencies of the prior art, the utility model provides a chip and substrate welding device with a positioning function, which solves the problems raised in the background technology.

[0005] To achieve the above purpose, the utility model is implemented through the following technical solutions: a chip and substrate welding device with positioning function, comprising a welding workbench, a rotating mechanism is installed through the center position of the upper surface of the welding workbench, a substrate positioning clamping mechanism is fixedly installed on the movable end of the rotating mechanism, a first side plate and a second side plate are symmetrically fixedly connected on both sides of the upper surface of the welding workbench, a three-axis moving mechanism is installed through the outer surface of the first side plate, a fourth motor is fixedly connected to the bottom end of the three-axis moving mechanism, a vacuum suction cup for adsorbing chips is fixedly connected to the bottom end of the output shaft of the fourth motor, and an air purification mechanism is installed through the outer surface of the second side plate;

[0006] The rotating mechanism comprises a first motor fixedly mounted on the lower surface of the welding workbench, the output shaft of the first motor is fixedly connected to a connecting plate, and the substrate positioning and clamping mechanism is fixedly mounted on the upper surface of the connecting plate.

[0007] Preferably, the substrate positioning and clamping mechanism includes a rectangular plate fixedly connected to the upper surface of the connecting plate, two sliding grooves are symmetrically provided on the upper surface of the rectangular plate, a second motor is fixedly installed on one side of the outer surface of the rectangular plate, an output shaft of the second motor is fixedly connected to a bidirectional screw rod rotatably connected to the inside of the rectangular plate, an outer surface of the bidirectional screw rod is symmetrically threadedly connected to two vertical plates slidably connected to the inner wall of the sliding groove, and a horizontal plate is fixedly connected to one side of the outer surface of the vertical plate to facilitate clamping of the substrate.

[0008] Preferably, a latch is slidably connected through the top outer surface of the vertical plate, one end of the latch is fixedly connected to a clamping plate slidably connected to the upper surface of the horizontal plate, and one end of the latch is fixedly connected to the outer surface of the vertical plate with a spring, which can provide buffering protection for the substrate when clamping the substrate.

[0009] Preferably, the three-axis movement mechanism includes a third motor fixedly connected to one side of the outer surface of the first side plate, the output shaft of the third motor is fixedly connected to a one-way screw, the outer surface of the one-way screw is threadedly connected to a moving block slidably connected to the inner wall of the first side plate, the outer surface of the moving block is fixedly connected to a first electric push rod, the movable end of the first electric push rod is fixedly connected to a second electric push rod, and the fourth motor is fixedly installed at the bottom end of the second electric push rod to facilitate driving the chip to perform three-axis movement.

[0010] Preferably, the air purification mechanism includes a vacuum cleaner fixedly connected to one side of the outer surface of the second side panel, the suction end of the vacuum cleaner is fixedly connected to a gooseneck tube, one end of the gooseneck tube passes through the second side panel and is fixedly connected to a dust hood, which can absorb the smoke generated during welding.

[0011] Preferably, the air outlet end of the vacuum cleaner is fixedly connected to an air purifier, which can purify harmful gases in the smoke and dust.

[0012] The utility model provides a chip and substrate welding device with positioning function. It has the following beneficial effects:

[0013] 1. This chip and substrate welding device with positioning function can not only position and clamp the substrate through the provided rotating mechanism and clamping mechanism, but also drive the substrate to rotate, and can change the position of the substrate, so that the user can weld at different positions of the substrate, thereby solving the problem that the existing device structure is fixed and cannot drive the substrate to rotate and is inconvenient for welding at different positions.

[0014] 2. This chip and substrate welding device with positioning function can not only adsorb and fix the chip through a three-axis moving mechanism, a fourth motor and a vacuum suction cup, but also drive the chip to rotate, so as to facilitate the positioning welding of the chip, thereby solving the problem that the existing device can only position the substrate but not the chip, thereby reducing the practicality. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0016] Figure 2 It is a structural schematic diagram of the rotating mechanism of the utility model;

[0017] Figure 3 For the utility model Figure 1 Enlarged view of point A in the middle.

[0018] In the figure, 1. welding workbench; 2. rotating mechanism; 21. first motor; 22. connecting plate; 3. substrate positioning and clamping mechanism; 31. rectangular plate; 32. slide groove; 33. second motor; 34. vertical plate; 35. horizontal plate; 36. latch; 37. clamping plate; 38. spring; 4. first side plate; 5. second side plate; 6. three-axis moving mechanism; 61. third motor; 62. one-way screw; 63. moving block; 64. first electric push rod; 65. second electric push rod; 7. fourth motor; 8. vacuum suction cup; 9. air purification mechanism; 91. vacuum cleaner; 92. gooseneck; 93. dust hood; 94. air purifier. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] Embodiment 1:

[0021] like Figures 1 to 3As shown, a chip and substrate welding device with positioning function includes a welding workbench 1, and the upper surface of the welding workbench 1 is symmetrically fixedly connected with a first side plate 4 and a second side plate 5 on both sides, and a rotating mechanism 2 is installed through the center of the upper surface of the welding workbench 1, and a substrate positioning clamping mechanism 3 is fixedly installed at the movable end of the rotating mechanism 2, and the rotating mechanism 2 includes a first motor 21 fixedly installed on the lower surface of the welding workbench 1, and the output shaft of the first motor 21 is fixedly connected with a connecting plate 22, and the substrate positioning clamping mechanism 3 is fixedly installed on the upper surface of the connecting plate 22. The rotation of the first motor 21 can drive the substrate positioning clamping mechanism 3 to rotate through the connecting plate 22, so that the position of the substrate can be changed, which is convenient for users to weld different positions of the substrate, thereby solving the problem that the existing device structure is fixed and cannot drive the substrate to rotate, making it inconvenient to weld different positions.

[0022] The substrate positioning and clamping mechanism 3 comprises a rectangular plate 31 fixedly connected to the upper surface of the connecting plate 22, and two slide grooves 32 are symmetrically provided on the upper surface of the rectangular plate 31. A second motor 33 is fixedly installed on one side of the outer surface of the rectangular plate 31, and the output shaft of the second motor 33 is fixedly connected to a bidirectional screw connected to the inside of the rectangular plate 31 for rotation. The outer surface of the bidirectional screw is symmetrically threaded with two vertical plates 34 connected to the inner wall of the slide groove 32, and a horizontal plate 35 is fixedly connected to one side of the outer surface of the vertical plate 34. A latch 36 is slidably connected to the outer surface of the top of the vertical plate 34, and one end of the latch 36 is fixedly connected to a clamping plate 37 connected to the upper surface of the horizontal plate 35 for sliding, and a spring 38 is fixedly connected between one end of the latch 36 and the outer surface of the vertical plate 34. The rotation of the second motor 33 drives the bidirectional screw to rotate, and the vertical plates 34 on both sides are driven to move relative to each other through the thread, so that the clamping plate 37 can be driven to move relative to each other, thereby clamping the substrate, and the substrate can be buffered under the action of the spring 38 to avoid the substrate from being damaged during processing.

[0023] Embodiment 2:

[0024] like Figure 1As shown, a three-axis moving mechanism 6 is installed through the outer surface of the first side plate 4, and a fourth motor 7 is fixedly connected to the bottom end of the three-axis moving mechanism 6, and a vacuum suction cup 8 for adsorbing chips is fixedly connected to the bottom end of the output shaft of the fourth motor 7. The three-axis moving mechanism 6 includes a third motor 61 fixedly connected to one side of the outer surface of the first side plate 4, and the output shaft of the third motor 61 is fixedly connected to a one-way screw rod 62, and the outer surface of the one-way screw rod 62 is threadedly connected to a moving block 63 that is slidably connected to the inner wall of the first side plate 4, and one side of the outer surface of the moving block 63 is fixedly connected to a first electric push rod 64, and the movable end of the first electric push rod 64 is fixedly connected to the second electric push rod 65, and the fourth motor 7 is fixedly installed at the bottom end of the second electric push rod 65. The operation of the three-axis moving mechanism 6 can respectively drive the chip to move forward and backward, left and right, and up and down, so as to facilitate the positioning of the chip. The fourth motor 7 drives the vacuum suction cup 8 to rotate, which can not only adsorb and fix the chip, but also drive the chip to rotate, so as to facilitate the positioning and welding of the chip, thereby solving the problem that the existing device can only position the substrate but not the chip, thereby reducing the practicality.

[0025] Embodiment 3:

[0026] like Figure 1 As shown, an air purification mechanism 9 is installed through the outer surface of the second side plate 5, and the air purification mechanism 9 includes a vacuum cleaner 91 fixedly connected to one side of the outer surface of the second side plate 5, and a gooseneck tube 92 is fixedly connected to the suction end of the vacuum cleaner 91, and one end of the gooseneck tube 92 penetrates the second side plate 5 and is fixedly connected to a dust hood 93. The air outlet end of the vacuum cleaner 91 is fixedly connected to an air purifier 94, and the position of the dust hood 93 can be arbitrarily changed by the set gooseneck tube 92, and the dust hood 93 can be moved to the welding position. The operation of the vacuum cleaner 91 can absorb the smoke generated during welding to avoid affecting the user, and the filtered gas is purified by the air purifier 94 to avoid air pollution.

[0027] Working principle: when in use, first place the substrate on the two horizontal plates 35, then start the second motor 33, the second motor 33 rotates to drive the bidirectional screw to rotate, and drives the vertical plates 34 on both sides to move relative to each other through the thread, so as to drive the clamping plate 37 to move relative to each other, and then clamp the substrate, and the substrate can be buffered under the action of the spring 38 to avoid damage to the processed substrate, and then the chip is adsorbed by the vacuum suction cup 8, and the chip is driven to move and position through the three-axis moving mechanism 6, so as to facilitate the positioning and welding of the chip, thereby solving the problem that the existing device can only position the substrate but not the chip, thus reducing the practicality, and starting the first motor 21 when welding at different positions, the first motor 21 rotates to drive the substrate positioning clamping mechanism 3 to rotate through the connecting plate 22, thereby changing the position of the substrate, which is convenient for the user to weld at different positions of the substrate, thereby solving the problem that the existing device structure is fixed and cannot drive the substrate to rotate and is inconvenient to weld at different positions.

[0028] The above shows and describes the basic principles and main features of the utility model and the advantages of the utility model. For those skilled in the art, it is obvious that the utility model is not limited to the details of the above exemplary embodiments, and can be implemented in other specific forms without departing from the spirit or basic features of the utility model. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the utility model is defined by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims. Any figure mark in the claims should not be regarded as limiting the claims involved.

[0029] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip and substrate welding device with positioning function, comprising a welding workbench (1), characterized in that: A rotating mechanism (2) is installed through the center of the upper surface of the welding workbench (1); a substrate positioning clamping mechanism (3) is fixedly installed on the movable end of the rotating mechanism (2); a first side plate (4) and a second side plate (5) are symmetrically fixedly connected on both sides of the upper surface of the welding workbench (1); a three-axis moving mechanism (6) is installed through the outer surface of the first side plate (4); a fourth motor (7) is fixedly connected to the bottom end of the three-axis moving mechanism (6); a vacuum suction cup (8) for adsorbing chips is fixedly connected to the bottom end of the output shaft of the fourth motor (7); and an air purification mechanism (9) is installed through the outer surface of the second side plate (5); The rotating mechanism (2) comprises a first motor (21) fixedly mounted on the lower surface of the welding workbench (1), the output shaft of the first motor (21) being fixedly connected to a connecting plate (22), and the substrate positioning clamping mechanism (3) being fixedly mounted on the upper surface of the connecting plate (22).

2. The chip and substrate welding device with positioning function according to claim 1, characterized in that: The substrate positioning and clamping mechanism (3) comprises a rectangular plate (31) fixedly connected to the upper surface of the connecting plate (22), the upper surface of the rectangular plate (31) symmetrically provided with two slide grooves (32), a second motor (33) fixedly mounted on one side of the outer surface of the rectangular plate (31), an output shaft of the second motor (33) fixedly connected to a bidirectional screw rod rotatably connected to the inside of the rectangular plate (31), the outer surface of the bidirectional screw rod symmetrically threadedly connected to two vertical plates (34) slidably connected to the inner wall of the slide groove (32), and a horizontal plate (35) fixedly connected to one side of the outer surface of the vertical plate (34).

3. The chip and substrate welding device with positioning function according to claim 2, characterized in that: A latch (36) is slidably connected to the top outer surface of the vertical plate (34), one end of the latch (36) is fixedly connected to a clamp (37) slidably connected to the upper surface of the horizontal plate (35), and a spring (38) is fixedly connected between one end of the latch (36) and the outer surface of the vertical plate (34).

4. The chip and substrate welding device with positioning function according to claim 1, characterized in that: The three-axis moving mechanism (6) comprises a third motor (61) fixedly connected to one side of the outer surface of the first side plate (4); the output shaft of the third motor (61) is fixedly connected to a one-way screw rod (62); the outer surface of the one-way screw rod (62) is threadedly connected to a moving block (63) slidably connected to the inner wall of the first side plate (4); one side of the outer surface of the moving block (63) is fixedly connected to a first electric push rod (64); the movable end of the first electric push rod (64) is fixedly connected to a second electric push rod (65); and the fourth motor (7) is fixedly mounted on the bottom end of the second electric push rod (65).

5. The chip and substrate welding device with positioning function according to claim 1, characterized in that: The air purification mechanism (9) comprises a vacuum cleaner (91) fixedly connected to one side of the outer surface of the second side plate (5); a suction end of the vacuum cleaner (91) is fixedly connected to a gooseneck tube (92); one end of the gooseneck tube (92) passes through the second side plate (5) and is fixedly connected to a dust cover (93).

6. The chip and substrate welding device with positioning function according to claim 5, characterized in that: The air outlet end of the vacuum cleaner (91) is fixedly connected to an air purifier (94).

Citation Information

Patent Citations

  • Fixing device for patch circuit board

    CN220711737U

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