Heat dissipation layer preparation device

Abstract

The utility model provides a heat dissipation layer preparation device which is used for coating a heat dissipation layer on an LED support, the LED support comprises a substrate and a side plate arranged around the outer side edge of the substrate, the substrate and the side plate define a containing cavity, the preparation device comprises a base, a lifting mechanism and a mold core, the LED support and the lifting mechanism are arranged on the base, and the mold core is arranged on the base. The end, back to the base, of the lifting mechanism is connected with the mold core so that the mold core can enter or be separated from the containing cavity in the vertical direction, a liquid injection hole is formed in the face, back to the base, of the mold core, and the liquid injection hole penetrates through the mold core. An interval space is formed between the outer side wall of the mold core and the inner side wall of the side plate, the liquid injection hole is communicated with the interval space, when a liquid heat dissipation material is injected into the liquid injection hole, the liquid heat dissipation material enters the interval space through the liquid injection hole, and a heat dissipation layer with the same shape as the interval space is formed after cooling forming.

Description

Technical Field

[0001] The utility model relates to the technical field of LED preparation, in particular to a heat dissipation layer preparation device. Background Art

[0002] LED is a solid-state semiconductor device, including a bracket, chip and packaging glue. It can convert electrical energy into light energy, but only about 20-30% of the electrical energy can be converted into light energy, and the rest is converted into heat energy at the chip. If the converted heat energy cannot be dissipated to the surrounding environment in time, it will affect the life and performance of the LED. Therefore, LED heat dissipation is a very important issue.

[0003] Graphene has an extremely high thermal conductivity of 5300W / (m·K) in the horizontal direction and only 15W / (m·K) in the vertical direction. It has a high planar thermal conductivity effect, which can prevent the longitudinal diffusion of heat. It also has high light transmittance, with an absorption rate of about 2.3% in a wide wavelength range. It is almost completely transparent, so it is often used to make heat dissipation coatings for LEDs.

[0004] In the prior art, heat dissipation is achieved by setting a graphene layer in the packaging glue of the LED. This method divides the packaging glue into two layers, the lower packaging glue layer covers the LED chip, and then graphene liquid is dripped on the surface of the lower packaging glue layer. After it is cooled and formed, a graphene layer is formed on the surface of the lower packaging glue, and then an upper packaging glue layer is covered on the graphene layer. The graphene heat dissipation layer made by this method has a small area, which affects the heat dissipation effect of the LED chip. Utility Model Content

[0005] In view of the deficiencies of the prior art, the purpose of the utility model is to provide a heat dissipation layer preparation device, which is intended to coat the heat dissipation layer on the LED bracket to solve the problem of the small area of ​​the graphene heat dissipation layer of the LED in the prior art.

[0006] In order to achieve the above purpose, the utility model is implemented through the following technical solutions:

[0007] A heat dissipation layer preparation device is used to coat a heat dissipation layer on an LED bracket, the LED bracket comprising a substrate and a side plate arranged around the outer edge of the substrate, the substrate and the side plate enclose a receiving cavity, the heat dissipation layer preparation device comprises a base, a lifting mechanism and a core, the LED bracket and the lifting mechanism are arranged on the base, the lifting mechanism is connected to the core at one end facing away from the base, so that the core can enter or leave the receiving cavity vertically, an injection hole is provided on a side of the core facing away from the base, the injection hole passes through the core, when the core enters the receiving cavity, a side of the core facing the base abuts against a side of the substrate facing away from the base, a spacing space is formed between the outer side wall of the core and the inner side wall of the side plate, the injection hole is connected to the spacing space, so as to form the heat dissipation layer in the spacing space.

[0008] Compared with the prior art, the utility model has the following beneficial effects: driven by the lifting mechanism, the core enters the accommodating cavity vertically, a side of the core facing the base abuts against a side of the substrate facing away from the base, an outer wall of the core and an inner wall of the side plate form a spacing space, an appropriate amount of liquid heat dissipation material is injected into the injection hole, the liquid heat dissipation material enters the spacing space through the injection hole, and when the liquid heat dissipation material is cooled and formed, a heat dissipation layer with the same shape as the spacing space is formed on the inner wall of the side plate, and then driven by the lifting mechanism, the core is separated from the accommodating cavity. Compared with setting the heat dissipation layer in the packaging glue, the area of ​​the heat dissipation layer set on the inner wall of the side plate is larger, and the side plate surrounds the outer edge of the substrate, which can dissipate heat laterally with the outside world.

[0009] Furthermore, the inner side wall of the side plate forms a first inclined surface, and the outer side wall of the core forms a second inclined surface parallel to the first inclined surface.

[0010] Furthermore, the lifting mechanism includes two lifting units arranged on the base, the two lifting units are located on two opposite sides of the base, and the LED bracket and the core are arranged between the two lifting units.

[0011] Furthermore, the lifting unit includes a hydraulic cylinder and a connecting block arranged from bottom to top on the base, the hydraulic cylinder includes a cylinder body and a piston rod, the piston rod faces the side of the cylinder body facing away from the base, the connecting block is fixedly connected to the piston rod, and the connecting block is connected to the core.

[0012] Furthermore, a flange is provided between the cylinder body and the base.

[0013] Furthermore, a groove is provided on a side of the base facing the LED bracket, and the groove corresponds to the position of the LED bracket.

[0014] Furthermore, the heat dissipation layer is a graphene heat dissipation layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A cross-sectional view of the equipment for preparing the embodiment of the utility model;

[0016] Among them: 1. LED bracket; 11. Side panel 2. Base; 31. Cylinder body; 32. Piston rod; 4. Core; 5. Injection hole; 6. Flange; 7. Spacing space; 8. Connecting block.

[0017] The following specific implementation manner will further illustrate the present utility model in conjunction with the above-mentioned drawings. DETAILED DESCRIPTION

[0018] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. Several embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0019] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art in the technical field of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0021] See also Figure 1 The heat dissipation layer preparation device in the embodiment of the utility model is used to coat the heat dissipation layer on the LED bracket 1. The LED bracket 1 includes a substrate and a side panel 11 arranged around the outer edge of the substrate. The substrate and the side panel 11 enclose a receiving cavity. The LED bracket 1 is an EMC bracket with good heat dissipation performance. The side panel plays a role in protecting the components located in the receiving cavity.

[0022] The heat dissipation layer preparation device comprises a base 2, a lifting mechanism and a core 4. The base 2 is provided with the LED bracket 1 and the lifting mechanism. The end of the lifting mechanism facing away from the base 2 is connected to the core 4, so that the core 4 can enter or leave the accommodating cavity in the vertical direction under the drive of the lifting mechanism. A liquid injection hole 5 is provided on a side of the core 4 facing away from the base 2. The liquid injection hole 5 passes through the core 4. When the core 4 enters the accommodating cavity under the drive of the lifting mechanism, a side of the core 4 facing the base 2 abuts against a side of the substrate facing away from the base 2. A spacing space 7 is formed between the outer side wall of the core 4 and the inner side wall of the side plate 11. The inner side wall of the side plate 11 forms a first inclined surface, and the outer side wall of the core forms a second inclined surface parallel to the first inclined surface. The spacing space 7 is composed of the first inclined surface, the second inclined surface and the substrate. The liquid injection hole 5 is connected with the spacing space 7, so that when liquid heat dissipation material is injected into the liquid injection hole 5, the liquid heat dissipation material can enter the spacing space 7.

[0023] The lifting mechanism includes two lifting units arranged on the base 2, and the two lifting units are located on opposite sides of the base 2. The lifting units are arranged on opposite sides of the base 2, which is beneficial to the overall stability of the LED preparation device. The lifting unit includes a hydraulic cylinder and a connecting block 8 arranged from bottom to top on the base 2. The hydraulic cylinder provides power support for the preparation device. The hydraulic cylinder includes a cylinder body 31 and a piston rod 32. The piston rod 32 faces the side of the cylinder body 31 that is away from the base 2. The connecting block 8 is fixedly connected to the piston rod 32. The connecting block 8 is connected to the core 4. The connecting block 8 plays a role in making the connection between the connecting block 8 and the core 4 more stable. The piston rod 32 reciprocates up and down under the pressure of the cylinder body 31. The core 4 enters or leaves the accommodating cavity vertically with the up and down reciprocating movement of the piston rod 32. A flange 6 is arranged between the cylinder body 31 and the base 2, and the cylinder body 31 is fixed to the base 2 through the flange 6.

[0024] A groove is provided on a side of the base 2 facing the LED bracket 1, and the position of the groove corresponds to that of the LED bracket 1. The groove serves to fix and limit the LED bracket 1. When the core 4 moves vertically into or out of the accommodating cavity along with the piston rod 32, the side of the core 4 facing the base 2 abuts against or out of the side of the substrate facing away from the base 2.

[0025] When the core 4 enters the accommodating cavity vertically along with the piston rod 32, the side of the core 4 facing the base 2 abuts against the side of the substrate facing away from the base 2, and the outer wall of the core 4 and the inner wall of the side plate 11 form a spacing space. The side of the core facing away from the base is provided with a liquid injection hole 5, and the liquid injection hole 5 is located on both sides of the core 4 facing the lifting unit. A proper amount of the liquid heat dissipation material is injected into the liquid injection hole 5. The liquid heat dissipation material can be graphene or other liquid heat dissipation materials. The liquid heat dissipation material enters the spacing space through the liquid injection hole 5. When the liquid heat dissipation material is cooled and formed, a heat dissipation layer with the same shape as the spacing space 7 is formed on the inner wall of the side plate 11. Thereafter, the core 4 moves vertically along with the piston rod 32 to leave the accommodating cavity. Compared with setting the heat dissipation layer in the packaging glue, setting it on the inner wall of the side plate 11 has a larger area, and the side plate 11 surrounds the outer edge of the substrate, which can be horizontally dissipated with the outside world.

[0026] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0027] The above-mentioned embodiments only express several implementation methods of the utility model, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the utility model, and these all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A heat dissipation layer preparation device, used for coating a heat dissipation layer on an LED bracket, wherein the LED bracket comprises a substrate and a side plate arranged around the outer edge of the substrate, wherein the substrate and the side plate enclose a receiving cavity, characterized in that: The heat dissipation layer preparation device includes a base, a lifting mechanism and a core. The LED bracket and the lifting mechanism are arranged on the base. The end of the lifting mechanism facing away from the base is connected to the core so that the core can enter or leave the accommodating cavity vertically. An injection hole is provided on a side of the core facing away from the base. The injection hole passes through the core. When the core enters the accommodating cavity, a side of the core facing the base abuts against a side of the substrate facing away from the base. A spacing space is formed between the outer wall of the core and the inner wall of the side plate. The injection hole is connected to the spacing space to form the heat dissipation layer in the spacing space.

2. A heat dissipation layer preparation device according to claim 1, characterized in that: The inner side wall of the side plate forms a first inclined surface, and the outer side wall of the core forms a second inclined surface parallel to the first inclined surface.

3. A heat dissipation layer preparation device according to claim 1, characterized in that: The lifting mechanism comprises two lifting units arranged on the base, the two lifting units are located on two opposite sides of the base, and the LED bracket and the core are arranged between the two lifting units.

4. A heat dissipation layer preparation device according to claim 3, characterized in that: The lifting unit includes a hydraulic cylinder and a connecting block which are arranged from bottom to top on the base, the hydraulic cylinder includes a cylinder body and a piston rod, the cylinder body is arranged on the base, the side of the cylinder body facing away from the base is connected to the piston rod, the connecting block is fixedly connected to the piston rod, and the connecting block is connected to the core.

5. A heat dissipation layer preparation device according to claim 4, characterized in that: A flange is arranged between the cylinder body and the base.

6. The heat dissipation layer preparation device according to claim 1, characterized in that: A groove is arranged on a side of the base facing the LED bracket, and the groove corresponds to the position of the LED bracket.

7. The heat dissipation layer preparation device according to claim 1, characterized in that: The heat dissipation layer is a graphene heat dissipation layer.

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