Electronic atomization device
By adopting a double-layer circuit board structure and connection hole design in the electronic atomization device, the wiring connection is avoided, and the problem of the traditional device's structure is not compact, achieving a smaller product size and a more stable welding structure.
Patent Information
- Application Number
- CN202421105501.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-20
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-05-20
AI Technical Summary
In traditional electronic atomization devices, power supply components, air flow sensing components and electrical connectors are welded on the circuit board through wiring lines, resulting in a not compact structure and a large space, which makes the product size larger.
A double-layer circuit board structure is adopted, wherein the first circuit board is provided with a connecting hole, the electrodes of the power supply assembly pass through the connecting hole and are soldered to the first circuit board, the air flow sensing assembly and the electrical connector are soldered to the second circuit board, and electrically connected to the first circuit board through the second circuit board, avoiding wiring connection.
The compact connection of the internal structure of the electronic atomization device is realized, reducing product size and improving the stability of the welded structure.
Smart Images
Figure CN222548590U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electronic atomization devices, and in particular to an electronic atomization device. Background Art
[0002] Electronic atomization devices are commonly used in the field of electronic atomization, and are used to make an atomization matrix generate atomized gas for users to inhale. In the electronic atomization device, the power supply component, the airflow sensing component and the electrical connector are all electrically connected to the circuit board, and the power supply component is usually used to supply power to the atomization component. The airflow sensing component is usually used to detect the airflow in the electronic atomization device, and the electrical connector is used to electrically connect the atomization component to the power supply component. In traditional electronic atomization devices, the power supply component, the airflow sensing component and the electrical connector are all welded on the circuit board through wiring, which results in the structure of the entire circuit connection part being not compact enough and occupying a large space, further resulting in the increase in the product size of the electronic atomization device. Utility Model Content
[0003] In view of this, the purpose of the present application is to overcome the deficiencies in the prior art and to provide an electronic atomization device that can have a smaller product size.
[0004] To achieve the above objectives, the technical solutions adopted in this application are as follows:
[0005] According to the electronic atomization device of the embodiment of the present application, it includes: a circuit board assembly, the circuit board assembly includes a first circuit board and a second circuit board welded to the first circuit board, the first circuit board is provided with a first connection hole spaced apart from the second circuit board; a power supply assembly, the power supply assembly includes a power supply component and an electrode electrically connected to the power supply component, the electrode is passed through the first connection hole and welded to the first circuit board; an airflow sensing assembly, the airflow sensing assembly is welded to the second circuit board; and an electrical connector, the electrical connector is welded to the second circuit board and spaced apart from the airflow sensing assembly.
[0006] The electronic atomization device of the present application has the following advantages:
[0007] The atomizing component of the electronic atomizing device can be powered by the power supply component of the power supply component, so that the atomizing component can be powered on to generate heat to atomize the atomizing matrix. At the same time, in this process, the electrical connector is used to electrically connect to the atomizing component, so that the power supply component can power the atomizing component. The airflow sensing component is used to detect the gas entering the above-mentioned electronic atomizing device. Since the first circuit board is welded to the second circuit board, and the airflow sensing component and the electrical connector are welded to the second circuit board, the airflow sensing component can be electrically connected to the first circuit board through the second circuit board, and at the same time, the electrical connector can be electrically connected to the first circuit board through the second circuit board, without the need for wiring. To connect the airflow sensing component and the electrical connector to the first circuit board, the connection relationship between the airflow sensing component and the electrical connector and the first circuit board can be made more compact. Furthermore, since the electrode of the power supply component is passed through the first connecting hole and welded to the first circuit board, the power supply component can be directly welded to the first circuit board, and there is no need to connect the power supply component to the first circuit board through a wiring harness, so the connection relationship between the power supply component and the first circuit board can be made more compact. In this way, the connection between the internal structures of the above-mentioned electronic atomization device can be made more compact, so that the above-mentioned electronic atomization device has a smaller product size.
[0008] According to the electronic atomization device of an embodiment of the present application, the first circuit board is also provided with a second connection hole, the second connection hole and the first connection hole are spaced apart along a preset direction, the second circuit board is at least partially passed through the second connection hole and is welded to the first circuit board.
[0009] According to the electronic atomization device of an embodiment of the present application, the second circuit board includes a circuit board body and a connecting portion, the connecting portion protrudes from the circuit board body, the first circuit board has a first soldering pad at the edge near the second connecting hole, the connecting portion is passed through the second connecting hole, and is welded to the first circuit board through the first soldering pad.
[0010] According to the electronic atomization device of the embodiment of the present application, the shape of the second connecting hole is the same as the shape of the connecting part.
[0011] According to the electronic atomization device of the embodiment of the present application, the second circuit board is arranged at an angle with the first circuit board to form a accommodating space, the power supply is arranged in the accommodating space, and among the two adjacent side surfaces of the power supply, one side surface of the power supply is arranged parallel to the first circuit board, and the other side surface of the circuit board is arranged parallel to the second circuit board.
[0012] According to the electronic atomization device of the embodiment of the present application, the second circuit board and the power supply are spaced apart in the preset direction, and the second circuit board is located at one end of the power supply away from the electrode, and the airflow sensing component includes an airflow sensor, and the airflow sensor and the electrical connector are welded to a side of the second circuit board away from the power supply along the preset direction.
[0013] According to the electronic atomization device of the embodiment of the present application, the airflow sensor has a first connection surface, the first connection surface is arranged parallel to the second circuit board, and the first connection surface is welded to the second circuit board.
[0014] According to the electronic atomization device of the embodiment of the present application, the electrical connector has a second connecting surface, the second connecting surface is arranged parallel to the second circuit board, and the second connecting surface is welded to a side of the second circuit board away from the power supply component along a preset direction.
[0015] According to the electronic atomization device of the embodiment of the present application, the first circuit board has a second soldering pad at the edge close to the first connecting hole, the electrode is passed through the first connecting hole, and is welded to the first circuit board through the second soldering pad.
[0016] According to the electronic atomization device of the embodiment of the present application, the shape of the first connecting hole is the same as the shape of the electrode. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 A schematic diagram showing the structure of the electronic materialization device in the present application is shown;
[0019] Figure 2 A schematic diagram of the exploded structure of the electronic materialization device in the present application is shown;
[0020] Figure 3 A schematic diagram showing the structure of the circuit board assembly in the present application is shown;
[0021] Figure 4 A schematic diagram of the structure of the first circuit board in the present application is shown;
[0022] Figure 5 A schematic diagram of the structure of the second circuit board in the present application is shown;
[0023] Figure 6 The schematic diagram of the structure of the airflow sensor in the present application is shown;
[0024] Figure 7 A schematic structural diagram of the electrical connector in the present application is shown.
[0025] Description of main component symbols:
[0026] 100-circuit board assembly; 110-first circuit board; 111-first connection hole; 112-second connection hole; 113-first solder pad; 114-second solder pad; 120-second circuit board; 121-circuit board body; 122-connecting portion; 130-accommodating space;
[0027] 200-power supply assembly; 210-power supply member; 220-electrode;
[0028] 300-airflow sensing component; 310-airflow sensor; 311-first connecting surface;
[0029] 400 - electrical connector; 410 - second connection surface. DETAILED DESCRIPTION
[0030] The embodiments of the present application are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and cannot be understood as limiting the present application.
[0031] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.
[0032] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.
[0033] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.
[0034] In the present application, unless otherwise clearly specified and limited, a first feature being “above” or “below” a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being “above”, “above”, and “above” a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being “below”, “below”, and “below” a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0035] Reference Figure 1 as well as Figure 2 As shown, the electronic atomization device involved in the embodiment of the present application includes: a circuit board assembly 100, a power supply assembly 200, an airflow sensing assembly 300 and an electrical connector 400.
[0036] Specifically, the circuit board assembly 100 includes a first circuit board 110 and a second circuit board 120 welded to the first circuit board 110, and a first connection hole 111 is opened on the first circuit board 110 and is spaced apart from the second circuit board 120; the power supply assembly 200 includes a power supply component 210 and an electrode 220 electrically connected to the power supply component 210, the electrode 220 is passed through the first connection hole 111 and is welded to the first circuit board 110; the airflow sensing component 300 is welded to the second circuit board 120; and the electrical connector 400 is welded to the second circuit board 120 and is spaced apart from the airflow sensing component 300.
[0037] Specifically, in the above-mentioned embodiment, the power supply 210 is a battery.
[0038] Specifically, in the above-mentioned embodiment, the above-mentioned electronic atomization device also includes a control component (not shown), the airflow sensing component 300 and the power supply component 200 are electrically connected to the control component, and the airflow sensing component 300 is used to detect the gas entering the above-mentioned electronic atomization device. When the airflow sensing component 300 is used to detect the gas entering the above-mentioned electronic atomization device, it will send a signal to the control component so that the control component can control the power supply component 200 to supply power to the atomization component.
[0039] Specifically, in the above-mentioned embodiment, the first circuit board 110 is the main board of the above-mentioned electronic atomization device, and the second circuit board 120 is the circuit board of the airflow sensing component 300 .
[0040] In the above-mentioned electronic atomization device, the atomization component (not shown) of the electronic atomization device can be powered by the power supply component 210 of the power supply component 200, so that the atomization component can be powered on to generate heat and atomize the atomization matrix. At the same time, in this process, the electrical connector 400 is used to electrically connect to the atomization component so that the power supply component 210 can power the atomization component. The airflow sensing component 300 is used to detect the gas entering the above-mentioned electronic atomization device. Since the first circuit board 110 is welded to the second circuit board 120, and the airflow sensing component 300 and the electrical connector 400 are welded to the second circuit board 120, the airflow sensing component 300 can be electrically connected to the first circuit board 110 through the second circuit board 120. At the same time, the electrical connector 400 is electrically connected to the first circuit board 110 through the second circuit board 120. Therefore, there is no need to connect the airflow sensing component 300 and the electrical connector 400 to the first circuit board 110 through wiring, so the connection relationship between the airflow sensing component 300 and the electrical connector 400 and the first circuit board 110 can be made more compact. Furthermore, since the electrode 220 of the power supply component 200 is passed through the first connection hole 111 and welded to the first circuit board 110, the power supply component 200 can be directly welded to the first circuit board 110, and there is no need to connect the power supply component 200 to the first circuit board 110 through wiring, so the connection relationship between the power supply component 200 and the first circuit board 110 can be made more compact. In this way, the connection between the internal structures of the above-mentioned electronic atomization device can be made more compact, so that the above-mentioned electronic atomization device has a smaller product size.
[0041] Reference Figure 3 as well as Figure 4 As shown, the first circuit board 110 is further provided with a second connection hole, which is spaced apart from the first connection hole 111 along a preset direction, and the second circuit board 120 is at least partially passed through the second connection hole and welded to the first circuit board 110 .
[0042] It should be noted that the preset direction is Figure 1 The direction that x points to.
[0043] Specifically, in the above embodiment, the distance between the second connection hole and the first connection hole 111 can satisfy that the second circuit board 120 and the power supply assembly 200 are spaced apart and arranged on the first circuit board 110 .
[0044] It can be understood that since the second circuit board 120 is at least partially inserted into the second connecting hole and welded to the first circuit board 110, the second circuit board 120 can be directly welded to the second connecting hole of the first circuit board 110. Since the first connecting hole 111 and the second connecting hole are spaced apart in a preset direction, interference between the second circuit board 120 and the power supply component 200 can be avoided, so that the second circuit board 120 and the power supply component 200 can be directly electrically connected to the first circuit board 110, thereby improving the compactness of the connection relationship between the second circuit board 120 and the power supply component 200 and the first circuit board 110.
[0045] Reference Figure 3 , Figure 4 as well as Figure 5 As shown, the second circuit board 120 includes a circuit board body 121 and a connecting portion 122, the connecting portion 122 protrudes from the circuit board body 121, the first circuit board 110 has a first solder pad 113 at the edge near the second connecting hole, the connecting portion 122 is passed through the second connecting hole, and is welded to the first circuit board 110 through the first solder pad 113.
[0046] It can be understood that since the connecting portion 122 is passed through the second connecting hole and is welded to the first circuit board 110 through the first soldering pad 113, the connecting portion 122 can be welded to the first circuit board 110 through the first soldering pad 113, thereby realizing the electrical connection between the circuit board body 121 and the first circuit board 110.
[0047] Reference Figure 4 as well as Figure 5 As shown, the shape of the second connection hole is the same as the shape of the connection portion 122 .
[0048] It can be understood that since the shape of the second connecting hole is the same as the shape of the connecting portion 122, when the connecting portion 122 is inserted into the second connecting hole, the displacement of the connecting portion 122 can be limited by the hole wall of the second connecting hole. In this way, when the connecting portion 122 is welded, the connecting portion 122 can be prevented from moving, so as to improve the stability of the welding structure and further improve the stability of the electrical connection structure between the circuit board main body 121 and the first circuit board 110.
[0049] Reference Figure 1 as well as Figure 3 As shown, the second circuit board 120 is arranged at an angle with the first circuit board 110 to form a receiving space 130, and the power supply 210 is arranged in the receiving space 130. Among the two adjacent side surfaces of the power supply 210, one side surface of the power supply 210 is arranged parallel to the first circuit board 110, and the other side surface of the circuit board is arranged parallel to the second circuit board 120.
[0050] Specifically, in the above-mentioned embodiment, the second circuit board 120 is arranged perpendicular to the first circuit board 110 .
[0051] It can be understood that since the second circuit board 120 and the first circuit board 110 are arranged at an angle to form the accommodating space 130, the power supply 210 is arranged in the accommodating space 130. In this way, the structural compactness between the power supply component 200, the first circuit board 110 and the second circuit board 120 can be further improved. Furthermore, among the two adjacent side surfaces of the power supply component 210, since one side surface of the power supply component 210 is arranged parallel to the first circuit board 110 and the other side surface of the circuit board is arranged parallel to the second circuit board 120, one side surface of the power supply component 210 can be fitted with the first circuit board 110, and at the same time, the gap between the other side surface of the power supply component 210 and the second circuit board 120 is reduced, thereby further improving the structural compactness between the power supply component 200, the first circuit board 110 and the second circuit board 120.
[0052] Reference Figure 1 as well as Figure 2 As shown, the second circuit board 120 and the power supply 210 are spaced apart in a preset direction, and the second circuit board 120 is located at one end of the power supply 210 away from the electrode 220, and the airflow sensing component 300 includes an airflow sensor 310, and the airflow sensor 310 and the electrical connector 400 are both welded to one side of the second circuit board 120 away from the power supply 210 along the preset direction.
[0053] It can be understood that the second circuit board 120 and the power supply 210 are spaced apart in a preset direction, and the second circuit board 120 is located at one end of the power supply 210 away from the electrode 220. In this way, the power supply 210 and the second circuit board 120 can be spaced apart on the first circuit board 110 along the preset direction. At the same time, since the airflow sensor 310 and the electrical connector 400 are welded to the side of the second circuit board 120 away from the power supply 210 along the preset direction, the airflow sensor 310 and the electrical connector 400 can be electrically connected to the first circuit board 110 through the second circuit board 120, and interference between the airflow sensor 310 and the electrical connector 400 and the power supply component 200 can be avoided.
[0054] Reference Figure 6 As shown, the airflow sensor 310 has a first connection surface 311 . The first connection surface 311 is arranged parallel to the second circuit board 120 , and the first connection surface 311 is soldered to the second circuit board 120 .
[0055] Specifically, in the above embodiment, the airflow sensor 310 is a microphone sensor, the first connection surface 311 is one of the end surfaces of the microphone sensor, and the first connection surface 311 of the microphone sensor is soldered to the second circuit board 120 by a chip mounter.
[0056] It can be understood that since the first connecting surface 311 is welded to the second circuit board 120, the airflow sensor 310 can be electrically connected to the second circuit board 120 by welding between the second connecting surface 410 and the second circuit board 120. At the same time, in this process, since the first connecting surface 311 and the second circuit board 120 are arranged in parallel, the stability of the welding relationship between the first connecting surface 311 and the second circuit board 120 can be improved, thereby improving the stability of the electrical connection relationship between the airflow sensor 310 and the second circuit board 120.
[0057] Reference Figure 7 As shown, the electrical connector 400 has a second connecting surface 410 , which is arranged parallel to the second circuit board 120 , and the second connecting surface 410 is welded to a side of the second circuit board 120 away from the power supply 210 along a preset direction.
[0058] Specifically, in the above-mentioned embodiment, the electrical connector 400 is a POGOPIN connector, one end of which has an elastic contact, and the elastic contact is abutted against the contact of the atomizer assembly to achieve electrical connection between the POGOPIN connector and the atomizer assembly. The second connecting surface 410 is the end surface of the POGOPIN connector away from the elastic contact.
[0059] It can be understood that since the second connecting surface 410 is welded to the second circuit board 120, the electrical connector 400 can be electrically connected to the second circuit board 120 through welding between the second connecting surface 410 and the second circuit board 120. At the same time, in this process, since the second connecting surface 410 and the second circuit board 120 are arranged in parallel, the stability of the welding relationship between the second connecting surface 410 and the second circuit board 120 can be improved, thereby improving the stability of the electrical connection relationship between the electrical connector 400 and the second circuit board 120.
[0060] Reference Figure 4 As shown, the first circuit board 110 has a second soldering pad 114 at an edge close to the first connection hole 111 , and the electrode 220 passes through the first connection hole 111 and is soldered to the first circuit board 110 through the second soldering pad 114 .
[0061] It can be understood that since the electrode 220 is passed through the first connecting hole 111 and is welded to the first circuit board 110 through the second soldering pad 114, the electrode 220 can be welded to the first circuit board 110 through the second soldering pad 114, thereby realizing the electrical connection between the power supply 210 and the first circuit board 110.
[0062] Continue to refer to Figure 1 As shown, the shape of the first connection hole 111 is the same as the shape of the electrode 220 .
[0063] It can be understood that since the shape of the first connecting hole 111 is the same as the shape of the electrode 220, when the electrode 220 is inserted into the first connecting hole 111, the displacement of the electrode 220 can be limited by the hole wall of the first connecting hole 111. In this way, when the electrode 220 is welded, the electrode 220 can be prevented from moving, so as to improve the stability of the welding structure and further improve the stability of the electrical connection structure between the power supply 210 and the first circuit board 110.
[0064] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0065] Although the embodiments of the present application have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations on the present application. Ordinary technicians in this field can change, modify, replace and modify the above embodiments within the scope of the present application.
Claims
1. An electronic atomization device, characterized in that: include: A circuit board assembly, the circuit board assembly comprising a first circuit board and a second circuit board welded to the first circuit board, the first circuit board being provided with a first connection hole spaced apart from the second circuit board; A power supply assembly, the power supply assembly comprising a power supply member and an electrode electrically connected to the power supply member, the electrode being inserted through the first connection hole and welded to the first circuit board; an airflow sensing component, wherein the airflow sensing component is welded on the second circuit board; and An electrical connector is welded on the second circuit board and spaced apart from the airflow sensing component.
2. The electronic atomization device according to claim 1, characterized in that: The first circuit board is further provided with a second connection hole, the second connection hole and the first connection hole are spaced apart along a preset direction, the second circuit board is at least partially passed through the second connection hole and is welded to the first circuit board.
3. The electronic atomization device according to claim 2, characterized in that: The second circuit board includes a circuit board body and a connecting portion, wherein the connecting portion protrudes from the circuit board body, and the first circuit board has a first soldering pad at an edge close to the second connecting hole, and the connecting portion is passed through the second connecting hole and is soldered to the first circuit board through the first soldering pad.
4. The electronic atomization device according to claim 3, characterized in that: The shape of the second connection hole is the same as that of the connection portion.
5. The electronic atomization device according to claim 3, characterized in that: The second circuit board is arranged at an angle with the first circuit board to form a accommodating space. The power supply is arranged in the accommodating space. Among the two adjacent side surfaces of the power supply, one side surface of the power supply is arranged parallel to the first circuit board, and the other side surface of the circuit board is arranged parallel to the second circuit board.
6. The electronic atomization device according to any one of claims 2 to 5, characterized in that: The second circuit board and the power supply are spaced apart in the preset direction, and the second circuit board is located at one end of the power supply away from the electrode. The airflow sensing component includes an airflow sensor. The airflow sensor and the electrical connector are welded to one side of the second circuit board away from the power supply along the preset direction.
7. The electronic atomization device according to claim 6, characterized in that: The airflow sensor has a first connection surface, the first connection surface is arranged parallel to the second circuit board, and the first connection surface is welded on the second circuit board.
8. The electronic atomization device according to claim 6, characterized in that: The electrical connector has a second connecting surface, the second connecting surface is arranged parallel to the second circuit board, and the second connecting surface is welded to a side of the second circuit board away from the power supply component along a preset direction.
9. The electronic atomization device according to any one of claims 1 to 5, characterized in that: The first circuit board has a second soldering pad at an edge close to the first connecting hole. The electrode passes through the first connecting hole and is soldered to the first circuit board through the second soldering pad.
10. The electronic atomization device according to any one of claims 1 to 5, characterized in that: The shape of the first connection hole is the same as that of the electrode.