Chip rack dismounting clamp
By designing the chip holder to remove the clamp, using the combination of the fixture main body, the disassembly part and the urge to apply, the time-consuming and laborious problem of chip holder disassembly in the prior art is solved, a fast and convenient disassembly process is achieved, and efficiency and reusability are improved.
Patent Information
- Application Number
- CN202420650403.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Priority Date
- 2023-07-25
- Filing Date
- 2024-03-29
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2034-03-29
AI Technical Summary
In the prior art, chip holder disassembly has the problem of time-consuming and laborious.
A chip holder removal fixture is provided, including a fixture main body, a disassembly part and a force urging part. The fixture is positioned on the chip holder or the housing through the positioning part. The force urging part applies a force to the disassembly part so that the chip holder is removed from the housing under the driving of the disassembly part.
It realizes the rapid and convenient disassembly of the chip holder, shortens the disassembly time, improves the disassembly efficiency, saves time and effort, and reduces the manufacturing difficulty and manufacturing cost.
Smart Images

Figure CN222553441U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of printing equipment, in particular to a chip frame disassembly fixture. Background Art
[0002] In the prior art, a processing box is provided, which can be detachably installed in an electronic photographic imaging device with an electrical contact, and includes: a chip, which can store relevant parameter information of the processing box, such as model, number of printed pages, etc., and can be electrically contacted with the electrical contact to establish a communication connection with the electronic photographic imaging device; a chip frame, which is used to install the chip. Specifically, in the processing box, the chip is adhered to the chip frame by epoxy resin glue. After the epoxy resin glue is cured, the chip and the chip frame are very firmly adhered. Then, the chip frame is welded to the processing box by welding, or the chip frame and the processing box are integrally injection molded, so as to fix the chip on the processing box. When the chip frame needs to be removed and the chip is reused, the chip frame is manually disassembled.
[0003] However, chip rack disassembly is time-consuming and labor-intensive. Utility Model Content
[0004] The embodiment of the utility model provides a chip frame disassembly fixture to solve the problem that the chip frame disassembly is time-consuming and labor-intensive.
[0005] The embodiment of the utility model provides a chip rack disassembly fixture, which is used to disassemble a chip rack on a processing box for supporting a chip, wherein the processing box comprises a housing rotatably supporting a photosensitive drum and a developing roller and a chip rack arranged on the housing, and the chip rack disassembly fixture comprises a fixture body, a disassembly portion and a force application portion;
[0006] The fixture body is provided with a positioning portion, and the positioning portion is configured to position the chip rack removal fixture on the chip rack or the housing;
[0007] The disassembly part and the force-applying part are respectively connected to the clamp body, and the force-applying part is constructed to apply force to the disassembly part when the chip rack disassembly clamp is positioned on the chip rack or the shell, so that the chip rack is removed from the shell under the drive of the disassembly part.
[0008] In a possible implementation manner, the positioning portion includes an opening, and when the positioning portion is positioned on the chip frame, the chip frame is at least partially exposed to the opening.
[0009] In a possible implementation manner, an inner side wall of the opening has a distance from the chip frame in the length direction of the chip frame removal fixture;
[0010] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
[0011] In a possible implementation manner, the chip rack is provided with a receiving portion, the opening is sleeved outside the receiving portion, the inner wall of the opening abuts against the side wall of the receiving portion, and the opening and the receiving portion are interference fit to clamp the chip rack;
[0012] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
[0013] In a possible implementation, the chip rack includes a rack body and a receiving portion, the receiving portion is disposed on the rack body, the opening is sleeved on the rack body, and an inner wall of the opening abuts against a side wall of the rack body to position the chip rack disassembly fixture;
[0014] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
[0015] In a possible implementation, a snap-fit structure is provided on the positioning portion, and the snap-fit structure is snap-fitted on the housing.
[0016] In a possible implementation manner, the positioning portion includes a groove, and the groove can be snapped onto a guide rib of the chip rack to position the chip rack removal fixture;
[0017] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box; or, the chip rack is located above the shell at the driving end of the processing box and in the height direction of the processing box.
[0018] In a possible implementation manner, the positioning portion includes a positioning surface and an avoidance groove, the avoidance groove is provided on the positioning surface, the housing is provided with a positioning protrusion, the positioning surface abuts against the housing, and the positioning protrusion is stuck in the avoidance groove to position the chip rack disassembly fixture;
[0019] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
[0020] In a possible implementation manner, the disassembly portion is fixed on the fixture body, the chip frame is provided with a first engaging protrusion, and the disassembly portion is engaged with the first engaging protrusion to disassemble the chip frame.
[0021] In a possible embodiment, the disassembly part can be detachably fixed on the clamp body, the disassembly part includes a disassembly protrusion and abutment surface, the chip frame is provided with a second locking protrusion, the disassembly protrusion is locked on the second locking protrusion, and the abutment surface abuts against the side wall of the chip frame to disassemble the chip frame.
[0022] In a possible implementation manner, the abutting surface is a plane or a serrated surface;
[0023] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
[0024] In a possible implementation manner, the disassembly portion is movably disposed on the fixture body, and the disassembly portion includes a cutter head for disassembling the chip rack and a cutter body receiving the driving force of the force-applying portion, and the cutter head is connected to the cutter body;
[0025] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box; or, the chip rack is located above the shell at the driving end of the processing box and in the height direction of the processing box.
[0026] In a possible implementation manner, a slide groove is provided on the clamp body, and the disassembly portion is provided in the slide groove and can slide along the slide groove.
[0027] In a possible implementation, a sliding hole is further provided on the clamp body, the sliding hole is connected to the positioning portion, the sliding groove is connected to the sliding hole, and the tool head of the disassembly portion can extend into the positioning portion through the sliding hole.
[0028] In a possible implementation manner, a pushed plate is provided on the blade body, the force-applying portion abuts against the pushed plate, and the force-applying portion pushes the disassembly portion to move through the pushed plate, so that the blade head extends between the chip frame and the housing.
[0029] In a possible implementation, the disassembly portion includes a first disassembly member and a second disassembly member, wherein the first disassembly member can disassemble the chip rack under the push of the force-applying portion, and the second disassembly member can disassemble the chip in the chip rack under the push of the first disassembly member.
[0030] In a possible implementation manner, the disassembly portion is movably disposed on the fixture body, and the disassembly portion includes a cutter head for disassembling the chip rack and a cutter body receiving the driving force of the force-applying portion, and the cutter head is connected to the cutter body;
[0031] The clamp body is provided with a slide groove, the disassembling part is arranged in the slide groove and can slide along the slide groove, the clamp body is also provided with a slide hole, the slide hole is connected with the positioning part, the slide groove is connected with the slide hole, and the cutter head of the disassembling part can extend into the positioning part through the slide hole;
[0032] A limiting portion is provided on the slide groove, and when the disassembling portion moves in the slide groove, the pushed plate on the blade is limited by the limiting portion;
[0033] Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
[0034] In a possible implementation manner, the disassembly portion has a disassembly protrusion, the disassembly protrusion is inserted between the chip frame and the shell, and the disassembly protrusion abuts against the chip frame to disassemble the chip frame.
[0035] In a possible implementation manner, the force-applying portion is fixedly connected to the clamp body or the disassembly portion; or, the force-applying portion is movably connected to the clamp body.
[0036] In a possible embodiment, the force-applying part includes a handle and a driving member, the driving member is mounted on the clamp body and abuts against the disassembly part, the driving member is connected to the handle, and the handle can drive the driving member to move on the clamp body so that the driving member pushes the disassembly part to move and disassemble the chip rack.
[0037] The embodiment of the utility model provides a chip rack disassembly fixture, including a fixture body, a disassembly part and a force-applying part; the fixture body is provided with a positioning part, and the positioning part is configured to position the chip rack disassembly fixture on the chip rack or the housing; the disassembly part and the force-applying part are respectively connected to the fixture body, and the force-applying part is configured to apply a force to the disassembly part when the chip rack disassembly fixture is positioned on the chip rack or the housing, so that the chip rack is disassembled from the housing under the drive of the disassembly part. When the chip rack disassembly fixture is positioned on the chip rack or the housing, the disassembly part can receive the force of the force-applying part, so that the chip rack is disassembled from the housing. The chip rack disassembly fixture has a simple structure and is easy to operate, which shortens the disassembly time, improves the disassembly efficiency, saves time and labor, and the chip rack disassembly fixture has a relatively simple structure, and the manufacturing difficulty and manufacturing cost are also low. BRIEF DESCRIPTION OF THE DRAWINGS
[0038] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.
[0039] Figure 1 A three-dimensional diagram of a processing box in the first embodiment of the utility model;
[0040] Figure 2 for Figure 1 A partial enlarged view of the D position in the middle;
[0041] Figure 3 for Figure 1 A three-dimensional diagram of a chip rack in FIG.
[0042] Figure 4 A three-dimensional diagram of the chip rack disassembly fixture in the first embodiment of the utility model observed from the top;
[0043] Figure 5 A three-dimensional diagram of the chip rack disassembly fixture in the first embodiment of the utility model observed from the bottom;
[0044] Figure 6 This is a schematic diagram of the structure of the chip rack disassembly fixture installed on the processing box in the first embodiment of the utility model;
[0045] Figure 7 It is a partial cross-sectional view of the chip rack disassembly fixture installed on the processing box in the first embodiment of the utility model;
[0046] Figure 8 A three-dimensional diagram of the chip rack disassembly fixture in the second embodiment of the present utility model observed from the top;
[0047] Fig. 9 A three-dimensional diagram of the chip rack disassembly fixture in the second embodiment of the present utility model observed from the bottom;
[0048] Fig.10 This is a schematic diagram of the structure of the chip rack disassembly fixture installed on the processing box in the second implementation example of the utility model;
[0049] Fig.11 A three-dimensional diagram of a chip rack disassembly fixture in the third implementation example of the present utility model;
[0050] Fig.12 This is an exploded view of the chip rack disassembly fixture in the third implementation example of the present utility model;
[0051] Fig.13This is a partial structural schematic diagram of the chip rack disassembly fixture installed on the processing box in the third implementation example of the utility model;
[0052] Fig.14 It is a partial cross-sectional view of the chip rack disassembly fixture installed on the processing box in the third implementation example of the utility model;
[0053] Fig.15 A three-dimensional diagram of a chip rack disassembly fixture in a fourth embodiment of the present utility model;
[0054] Fig.16 This is a schematic diagram of the exploded structure of the chip rack disassembly fixture in the fourth implementation example of the present utility model;
[0055] Fig.17 A three-dimensional diagram of the chip rack fixture body in the fourth embodiment of the present utility model observed from the top;
[0056] Fig.18 A three-dimensional diagram of the chip rack fixture body observed from the bottom in the fourth embodiment of the present utility model;
[0057] Fig.19 A three-dimensional diagram of the disassembly portion of the fourth embodiment of the present utility model;
[0058] Fig. 20 A three-dimensional diagram of the force-applying portion of the fourth embodiment of the present utility model;
[0059] Fig.21 This is a schematic diagram of the structure of the chip rack disassembly fixture in the fourth embodiment of the utility model installed on the processing box;
[0060] Fig. 22 It is a partial cross-sectional view of the chip rack disassembly fixture in the fourth embodiment of the utility model installed on the processing box;
[0061] Fig.23 A three-dimensional view of the chip rack disassembly fixture in the fifth embodiment of the present utility model observed from the top;
[0062] Fig.24 A three-dimensional view of the chip rack disassembly fixture in the fifth embodiment of the present utility model observed from the top and bottom;
[0063] Fig.25 This is a schematic diagram of the structure of the chip rack disassembly fixture in the fifth embodiment of the present utility model installed on the processing box;
[0064] Fig.26 It is a partial cross-sectional view of the chip rack disassembly fixture in the fifth embodiment of the utility model installed in the processing box;
[0065] Fig. 27 A three-dimensional diagram of a chip rack disassembly fixture in Example 6 of the present utility model;
[0066] Fig.28 It is a schematic diagram of the exploded structure of the chip rack disassembly fixture in the sixth embodiment of the present utility model;
[0067] Fig.29 This is a schematic diagram of the structure of the chip rack disassembly fixture in the sixth embodiment of the present utility model installed on the processing box;
[0068] Fig.30 It is a three-dimensional diagram of the processing box in the seventh embodiment of the utility model;
[0069] Fig.31 for Fig.30 A partial enlarged view of the E position in the middle;
[0070] Fig.32 A three-dimensional diagram of the protective cover in the seventh embodiment of the present utility model;
[0071] Fig.33 A three-dimensional diagram of a chip rack disassembly fixture in the seventh implementation example of the present utility model;
[0072] Fig.34 This is a schematic diagram of the exploded structure of the chip rack disassembly fixture in the seventh implementation example of the utility model;
[0073] Fig.35 This is a three-dimensional diagram of the clamp body in the seventh embodiment of the present utility model observed from the top;
[0074] Fig.36 This is a three-dimensional diagram of the clamp body in the seventh embodiment of the utility model observed from the bottom;
[0075] Fig.37 It is a three-dimensional diagram of the disassembly part in the seventh implementation example of the utility model;
[0076] Fig.38 It is a three-dimensional diagram of the power unit in the seventh implementation example of the utility model;
[0077] Fig.39 A three-dimensional diagram of the chip rack disassembly fixture installed in the processing box in the seventh embodiment of the utility model;
[0078] Fig.40 It is a partial cross-sectional view of the chip rack disassembly fixture installed in the processing box in the seventh embodiment of the utility model;
[0079] Fig.41 A three-dimensional diagram of the chip rack in the seventh embodiment of the present utility model observed from the bottom;
[0080] Fig.42 A three-dimensional diagram of a new processing box in the seventh implementation example of the present utility model;
[0081] Fig.43A three-dimensional diagram of the new protective cover in the seventh implementation example of the utility model;
[0082] Fig.44 A three-dimensional diagram of a chip removal fixture in the eighth implementation example of the present utility model;
[0083] Fig.45 This is a three-dimensional diagram of the clamp body in the eighth embodiment of the present utility model observed from the bottom;
[0084] Fig.46 This is a three-dimensional view of the chip rack in the eighth embodiment of the present utility model observed from the bottom after being installed in the chip removal fixture;
[0085] Fig.47 for Fig.46 A schematic diagram of the enlarged structure of position B in the middle;
[0086] Fig.48 This is a cross-sectional view of the chip removal fixture used to remove the chip frame in the eighth implementation example of the utility model;
[0087] Fig.49 It is a structural schematic diagram of a processing box in a ninth embodiment of the present utility model;
[0088] Fig.50 It is a schematic diagram of one end of the processing box chip located in the ninth embodiment of the present utility model;
[0089] Fig.51 A schematic diagram of a chip rack disassembly fixture from a certain angle on the front side of the ninth embodiment of the present utility model;
[0090] Fig.52 A schematic diagram of a chip rack disassembly fixture at a certain angle on the back side of the ninth embodiment of the present utility model;
[0091] Fig.53 It is a schematic diagram of a chip rack disassembly fixture of the ninth embodiment of the present utility model after being disassembled at a certain angle;
[0092] Fig.54 It is a structural schematic diagram of the first disassembly member in the ninth embodiment of the utility model;
[0093] Fig.55 It is a structural schematic diagram of the second disassembly member in the ninth embodiment of the present utility model;
[0094] Fig.56 It is a structural schematic diagram of the force-applying part of the ninth embodiment of the present utility model;
[0095] Fig.57 It is a schematic diagram of a chip rack disassembly fixture installed on a processing box at a certain angle in the ninth embodiment of the present utility model;
[0096] Fig.58It is a schematic diagram of another angle when the chip holder clamp of the ninth embodiment of the present utility model is installed on the processing box;
[0097] Fig.59 It is a schematic diagram of another angle when the chip holder clamp of the ninth embodiment of the present utility model is installed on the processing box;
[0098] Fig.60 A cross-sectional view of a chip holder fixture of a ninth embodiment of the present utility model when installed on a processing box;
[0099] Fig.61 It is a cross-sectional view at a certain angle of the chip rack fixture in the ninth embodiment of the present utility model.
[0100] Description of reference numerals:
[0101] 1-processing box; 1a-new processing box; 100-chip holder disassembly fixture; 10-chip; 20-chip holder; 21-accommodation part; 22-guide rib; 30-drum box; 31-photosensitive housing; 32-photosensitive drum; 40-developing box; 41-developing housing; 410-convex part; 23-first engaging protrusion; 24-second engaging protrusion; 110-clamp body; 1101-protrusion; 1102-through groove; 111-slide groove; 111a-limiting part; 112-slide hole; 120-positioning part; 12a-lower surface; 1211-groove; 121-opening; 121a-inner wall; 123-avoidance groove ;124-mounting hole;130-disassembly part;1301-through hole;131-disassembly protrusion;132-abutment surface;133-cutter head;134-cutter body;135-pushed plate;136-acting protrusion;140-force-applying part;141-driving member;142-handle;150-fastener;151-screw;152-steel sheet;160-screw hole;50-protective cover;50a-new protective cover;501-upper end surface;502-protective cover protrusion;25-protrusion block;180-chip mounting part;181-slot;1221-first snap-fit structure;1222-second snap-fit structure;1411-thread. DETAILED DESCRIPTION
[0102] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0103] It should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0104] In the present invention, unless otherwise clearly specified and limited, the terms "installation", "connection", "fixation" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or communication with each other; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.
[0105] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0106] In the above description, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.
[0107] As described in the background art, the chip rack disassembly is time-consuming and labor-intensive. The inventor of the utility model has found that the reason for this problem is that the chip rack is disassembled manually without the aid of a disassembly fixture, which is time-consuming and labor-intensive.
[0108] In order to solve the above problems, the embodiment of the utility model provides a chip rack disassembly fixture, including a fixture body, a disassembly part and a force-applying part; the fixture body is provided with a positioning part, and the positioning part is configured to position the chip rack disassembly fixture on the chip rack or the housing; the disassembly part and the force-applying part are respectively connected to the fixture body, and the disassembly part is configured to receive the force of the force-applying part when the chip rack disassembly fixture is positioned on the chip rack or the housing, so that the chip rack can be disassembled from the housing. When the chip rack disassembly fixture is positioned on the chip rack or the housing, the disassembly part can receive the force of the force-applying part, so that the chip rack can be disassembled from the housing. The chip rack disassembly fixture has a simple structure and is easy to operate, which shortens the disassembly time, improves the disassembly efficiency, saves time and labor, and the chip rack disassembly fixture has a relatively simple structure, and the manufacturing difficulty and manufacturing cost are also low.
[0109] The chip rack disassembly fixture provided by the embodiment of the utility model is described in detail below in conjunction with specific embodiments.
[0110] Embodiment 1
[0111] In order to make the solution easier to understand, a brief introduction to the processing box 1 of the prior art is first given. Figure 1 As shown, the length direction of the processing box 1 is defined as the left-right direction, wherein the left side is the driving end and the right side is the non-driving end, and the chip 10 is located on the left side of the processing box 1 in the left-right direction, that is, the chip 10 is located at the driving end of the processing box; the width direction of the processing box 1 is the front-to-back direction, and the drum box 30 is located on the rear side of the developing box 40 in the front-to-back direction; the height direction of the processing box 1 is the up-and-down direction, and the chip 10 is located on the lower side of the processing box 1 in the height direction; the left-right direction is perpendicular to the front-to-back direction and the up-and-down direction.
[0112] The processing box 1 is generally used to be detachably installed in an image forming device (such as a printer), and the processing box 1 stores consumables for development, such as developer. When the image forming device is recording, the consumables in the processing box 1 will be displayed on the recording medium (such as paper, or other printing medium that can carry the consumables).
[0113] refer to Figure 1 and Figure 2 The processing box 1 includes a housing that rotatably supports a photosensitive drum 32 and a developing roller, and a chip rack 20 disposed on the housing for supporting a chip 10. The chip rack 20 is located below the housing in the height direction of the processing box 1, away from the photosensitive drum 32 and the developing roller. Specifically, the processing box 1 includes a drum box 30 and a developing box 40 that are combined with each other. Optionally, the drum box 30 is formed integrally with the developing box 40, or the drum box 30 is detachably connected to the developing box 40, or the drum box 30 is integrated in the image forming device (printer).
[0114] Further, the developing box 40 includes a developing housing 41 that can accommodate the developer and a developing roller rotatably mounted on the developing housing 41, and the drum box 30 includes a photosensitive housing 31 and a photosensitive drum 32 rotatably mounted on the photosensitive housing 31. The developing roller and the photosensitive drum 32 are arranged opposite to each other. When the developing roller and the photosensitive drum 32 are close to each other, the developing roller supplies the developer to the surface of the photosensitive drum 32 to develop the electrostatic latent image on the surface of the photosensitive drum 32. After the processing box 1 is finished working, the waste developer remaining on the surface of the photosensitive drum 32 will be cleaned, and the photosensitive housing 31 can be used to accommodate the cleaned waste developer. The housing of the processing box 1 includes the photosensitive housing 31 and the developing housing 41.
[0115] Next, the photosensitive housing 31 is provided with a chip 10 storing the processing box information and a chip frame 20 for supporting the chip 10 , and the chip frame 20 is mounted on the photosensitive housing 31 by welding.
[0116] The chip rack 20 includes a receiving portion 21 for receiving the chip and guide ribs 22 respectively disposed on the left and right sides of the chip 10 , that is, guide ribs 22 respectively disposed on both sides of the chip 10 in the height direction of the process box.
[0117] The chip 10 can be used to record information such as the developer amount of the processing box 1 and the number of times the processing box 1 is used. When the processing box 1 is installed in the image forming device, the chip 10 can be electrically connected to the image forming device to transmit the information on the chip 10 to the image forming device. In order to avoid waste of resources, the chip 10 on the processing box 1 can be removed and installed on a new processing box for reuse. The chip rack disassembly fixture 100 of the utility model is used for disassembling the chip rack 20.
[0118] like Figure 3 As shown, the length direction of the chip rack 20 is defined as the first direction A, the width direction of the chip rack 20 is defined as the second direction B, and the height direction of the chip rack 20 is defined as the third direction C. The first direction A, the second direction B, and the third direction C are perpendicular to each other. It should be noted that the length direction of the chip rack 20 is the same as the width direction of the process box 1, the width direction of the chip rack 20 is the same as the height direction of the process box 1, and the height direction of the chip rack 20 is the same as the length direction of the process box 1.
[0119] like Figures 4 to 7 As shown, the embodiment of the utility model provides a chip rack disassembly fixture 100, including a fixture body 110, a disassembly portion 130 and a force application portion 140; the fixture body 110 is provided with a positioning portion 120, and the positioning portion 120 is constructed to position the chip rack disassembly fixture 100 on the chip rack 20.
[0120] The disassembly portion 130 and the force applying portion 140 are respectively connected to the fixture body 110 . The force applying portion 140 is configured to apply force to the disassembly portion 130 when the chip rack disassembly fixture 100 is positioned on the chip rack 20 , so that the chip rack 20 is removed from the housing under the drive of the disassembly portion 130 .
[0121] Among them, the length direction of the chip frame disassembly fixture 100 is the X-axis direction, the width direction of the chip frame disassembly fixture 100 is the Y-axis direction, and the height direction of the chip frame disassembly fixture 100 is the Z-axis direction. The X-axis, Y-axis and Z-axis are perpendicular to each other.
[0122] The positioning portion 120 , the disassembling portion 130 and the force applying portion 140 are disposed on the clamp body 110 and are integrally formed with the clamp body 110 .
[0123] The fixture body 110 can be fixed on the chip rack 20 of the processing box 1 through the positioning part 120, and the positioning part 120 corresponds to the position of the chip rack 20 and the chip 10 on the photosensitive housing 31, and is used to position the chip rack removal fixture 100 on the chip rack 20.
[0124] When the positioning portion 120 is positioned on the chip frame 20 , the detaching portion 130 can be snapped onto the chip frame 20 .
[0125] The force applying portion 140 is disposed on a side of the clamp body 110 away from the positioning portion 120 , and is used to receive an external force so that the disassembly portion 130 applies a force to the chip frame 20 to disassemble the chip frame 20 .
[0126] The chip rack disassembly fixture 100 provided by the embodiment of the utility model has a simple structure and is easy to operate, which shortens the disassembly time, improves the disassembly efficiency, saves time and labor, and greatly improves the reusability of the chip 10. Moreover, the chip rack disassembly fixture 100 has a relatively simple structure, and the manufacturing difficulty and manufacturing cost are also low.
[0127] refer to Figures 4 to 7 As shown, the positioning portion 120 is arranged in the +X axis direction of the fixture body 110, and an opening 121 is provided on the positioning portion 120. When the positioning portion 120 is positioned on the chip frame 20, the chip frame 20 is at least partially exposed to the opening 121. In this way, when the positioning portion 120 is positioned on the chip frame 20, it is convenient to observe the chip frame 20.
[0128] like Figure 6 and Figure 7As shown, when the positioning portion 120 is positioned on the chip frame 20, the opening 121 can be aligned with the receiving portion 21 of the chip frame 20. Specifically, the opening 121 penetrates the positioning portion 120 of the fixture body 110 along the Z-axis direction. When the positioning portion 120 is installed on the chip frame 20, the opening 121 can be sleeved on the receiving portion 21 of the chip frame 20, so that the positioning portion 120 is positioned on the chip frame 20, and the inner side wall 121a of the opening 121 has a spacing with the chip frame 20 in the X-axis direction, that is, the inner side wall 121a of the opening 121 has a certain distance from the chip frame 20 in the X-axis direction, so that when the fixture body 110 is installed on the chip frame 20, appropriate adjustments are made to accurately install the fixture body 110 on the chip frame 20.
[0129] like Figure 4 As shown, the positioning part 120 is further provided with a groove 1211. When the positioning part 120 is installed on the chip frame 20, the groove 1211 can cooperate with the guide rib 22 to position the positioning part 120 on the chip frame 20. Specifically, the positioning part 120 is provided with a groove 1211 in the -X axis direction, and the chip frame 20 is provided with guide ribs 22 on the left and right sides. When the positioning part 120 is installed on the chip frame 20, the groove 1211 on the positioning part 120 can be snapped on the guide rib 22 of the chip frame 20, so that the positioning part 120 is positioned on the chip frame 20 and the positioning part 120 is fixed on the chip frame 20.
[0130] like Figure 5 and Figure 7 As shown, the disassembly portion 130 is provided on the fixture body 110, and is used to disassemble the chip frame 20. Specifically, in this embodiment, the disassembly portion 130 protrudes from the fixture body 110 toward the -Z axis direction, and is roughly an "L"-shaped structure, and is integrally formed with the fixture body 110. The chip frame 20 is provided with a first engaging protrusion 23. When the fixture body 110 is fixed to the chip frame 20 through the positioning portion 120, the disassembly portion 130 can be engaged with the first engaging protrusion 23 of the chip frame 20, so that the chip frame 20 can be disassembled.
[0131] like Figure 4 and Figure 7 As shown, the clamp body 110 is further provided with a force applying portion 140, which is fixedly connected to the clamp body 110 and is located in the -X axis direction of the clamp body 110. Specifically, the force applying portion 140 is integrally formed with the clamp body 110. When the clamp body 110 is positioned on the chip rack 20 through the positioning portion 120, the force applying portion 140 is at a certain distance from the chip rack 20 in the Z axis direction, that is, the force applying portion 140 is far away from the housing of the processing box 1, forming an operating space for user convenience.
[0132] refer to Figures 4 to 7In this embodiment, when the processing box chip rack disassembly fixture 100 is used:
[0133] First, the clamp body 110 is sleeved on the outside of the accommodating portion 21 of the chip frame 20 through the opening 121 on the positioning portion 120, so that the guide rib 22 on the chip frame 20 and the groove 1211 cooperate. Then, the force-applying portion 140 is grasped and the clamp body 110 is pulled to move in the -X axis direction, and the angle is adjusted so that the disassembly portion 130 is engaged with the first engaging protrusion 23 of the chip frame 20. Then, the clamp body 110 is pushed in the +X axis direction so that the disassembly portion 130 is clamped with the first engaging protrusion 23 of the chip frame 20, and the groove 1211 on the positioning portion 120 is also clamped with the guide rib 22 on the chip frame 20, so that the clamp body 110 is installed on the chip frame 20 of the processing box 1. Next, hold the force-applying portion 140 and lift the clamp body 110 upwards, so that the disassembly portion 130 can exert a force on the chip frame 20 to move away from the photosensitive housing 31, so that the chip frame 20 is separated from the photosensitive housing 31, thereby disassembling the chip frame 20 and installing it on a new processing box.
[0134] Implementation case 2:
[0135] like Figures 8 to 10 As shown, another chip rack disassembly fixture 100 is provided in this embodiment. The difference between this embodiment and the first embodiment is that: in this embodiment, the disassembly portion 130 is not provided on the fixture body 110, and the length of the opening 121 in the X-axis direction is smaller than the length of the accommodating portion 21 of the chip rack 20 in the first direction A, and the width of the opening 121 in the Y-axis direction is smaller than the width of the accommodating portion 21 of the chip rack 20 in the second direction B.
[0136] The opening 121 is sleeved on the outside of the accommodating portion 21, the inner wall of the opening 121 abuts against the side wall of the accommodating portion 21, and the opening 121 and the accommodating portion 21 are interference fit to clamp the chip frame 20. Specifically, in this embodiment, on the clamp body 110, the length of the opening 121 in the X-axis direction is smaller than the length of the accommodating portion 21 of the chip frame 20 in the first direction A, the width of the opening 121 in the Y-axis direction is smaller than the width of the accommodating portion 21 of the chip frame 20 in the second direction, and the opening 121 is provided with two grooves 1211 in the Y-axis direction, the guide rib 22 on the chip frame 20 is limited by the grooves 1211, and an interference fit is formed between the opening 121 and the accommodating portion 21, and between the grooves 1211 and the guide rib 22, so that the clamp body 110 clamps the chip frame 20 through the positioning portion 120.
[0137] In this embodiment, when the chip rack disassembly fixture 100 is used:
[0138] First, put the clamp body 110 on the accommodating portion 21 and the guide rib 22 on the chip frame 20 through the opening 121 and the groove 1211 on the positioning portion 120, clamp the chip frame 20, grasp the force-applying portion 140 of the clamp body 110, and lift the clamp body 110 upward. The opening 121 is interfered with the accommodating portion 21 to give the chip frame 20 a force away from the photosensitive shell 31, so that the chip frame 20 can be removed and installed on the new processing box.
[0139] In this implementation case, the force applying part 140 is consistent with that in the first implementation case and will not be described again here.
[0140] Implementation case three:
[0141] like Figures 11 to 14 As shown, another chip rack disassembly fixture 100 is provided in this embodiment case. The difference between this embodiment case and the second embodiment case is that: in this embodiment case, a disassembly portion 130 is provided on the fixture body 110, and the disassembly portion 130 is installed on the fixture body 110 to disassemble the chip rack 20.
[0142] Specifically, Fig.12 As shown, in this embodiment, the clamp body 110 is provided with a cylindrical protrusion 1101 in the -X axis direction, and the disassembly part 130 is provided with a through hole 1301 adapted to the cylindrical protrusion 1101, and the through hole 1301 of the disassembly part 130 is sleeved on the cylindrical protrusion 1101, so that the disassembly part 130 is installed to the clamp body 110.
[0143] Further, such as Fig.12 As shown, in order to more firmly install the disassembly part 130 on the fixture body 110, the chip rack disassembly fixture 100 of this embodiment is also provided with a fastener 150, which is composed of a screw 151 and a steel sheet 152. The screw 151 and the steel sheet 152 can be integrally formed to form the fastener 150, or they can be split and assembled together to form the fastener 150, which is not limited here. Specifically, in this embodiment, the cylindrical protrusion 1101 on the fixture body 110 is provided with a circular hole 1101a, and the circular hole 1101a is formed inside the cylindrical protrusion 1101. The screw 151 of the fastener 150 is screwed into the circular hole 1101a of the cylindrical protrusion 1101, and the steel sheet 152 is blocked on the disassembly part 130, thereby further fixing the disassembly part 130 on the fixture body 110.
[0144] Further, such as Fig.12 , Fig.13 and Fig.14As shown, the disassembly portion 130 is provided with a disassembly protrusion 131 and abutting surface 132, which are used to disassemble the chip frame 20. Specifically, in this embodiment, the fixture body 110 is also provided with a through slot 1102, and the through slot 1102 is communicated with the positioning portion 120. When the disassembly portion 130 is installed on the fixture body 110, and the fixture body 110 is positioned on the chip frame 20 through the positioning portion 120, the disassembly portion 130 is provided with a disassembly protrusion 131 and an end of the abutting surface 132 extends through the through slot 1102 to a side close to the chip frame 20. At this time, the disassembly protrusion 131 can be engaged with the second engaging protrusion 24 on the chip frame 20, and the abutting surface 132 abuts against the side wall of the chip frame 20, forming a certain friction force, so that the chip frame 20 can be disassembled.
[0145] The contact surface 132 of the disassembly portion 130 may be a serrated surface. It should also be noted that the contact surface 132 of the disassembly portion 130 may not be a serrated surface, as long as it can produce a large friction force with the side wall of the chip frame 20, such as a plane, which is not limited here.
[0146] In this embodiment, when the processing box chip rack disassembly fixture 100 is used:
[0147] First, the clamp body 110 is put on the accommodating portion 21 and the guide rib 22 of the chip frame 20 through the opening 121 and the groove 1211 on the positioning portion 120, and the chip frame 20 is clamped. At the same time, the disassembly protrusion 131 and the abutting surface 132 of the disassembly portion 130 extend into the opening 121 through the through groove 1102 on the clamp body 110, and the disassembly protrusion 131 is engaged with the second engaging protrusion 24 of the chip frame 20, and the abutting surface 132 abuts against the side wall of the chip frame 20 to generate friction. At this time, the clamp body 110 is grasped on the force applying portion 140 of the clamp body 110, and the clamp body 110 is lifted upward, and the disassembly protrusion 131 and the abutting surface 132 give the chip frame 20 a force away from the photosensitive housing 31, so that the chip frame 20 is disassembled from the processing box 1 and installed on the new processing box.
[0148] Implementation Case 4:
[0149] The processing box 1 in this embodiment is the same as the processing box 1 in the first embodiment.
[0150] like Figures 15 to 22 As shown, the embodiment of the utility model provides a chip rack disassembly fixture 100, including a fixture body 110, a disassembly portion 130 and a force application portion 140; the fixture body 110 is provided with a positioning portion 120, and the positioning portion 120 is constructed to position the chip rack disassembly fixture 100 on the chip rack 20.
[0151] The disassembly portion 130 and the force applying portion 140 are respectively connected to the fixture body 110 . The force applying portion 140 is configured to apply force to the disassembly portion 130 when the chip rack disassembly fixture 100 is positioned on the chip rack 20 , so that the chip rack 20 is removed from the housing under the drive of the disassembly portion 130 .
[0152] Among them, the length direction of the chip frame disassembly fixture 100 is the X-axis direction, the width direction of the chip frame disassembly fixture 100 is the Y-axis direction, and the height direction of the chip frame disassembly fixture 100 is the Z-axis direction. The X-axis, Y-axis and Z-axis are perpendicular to each other.
[0153] The fixture body 110 can be fixed on the chip rack 20 of the processing box 1 through the positioning part 120, and the positioning part 120 corresponds to the position of the chip rack 20 and the chip 10 on the photosensitive housing 31, and is used to position the chip rack removal fixture 100 on the chip rack 20.
[0154] The disassembly part 130 is installed on the fixture body 110 and can move on the fixture body 110. When the disassembly part 130 moves on the fixture body 110, the disassembly part 130 can extend into the positioning part 120 to disassemble the chip frame 20 that positions the positioning part 120, so that the chip 10 on the chip frame 20 is also removed together.
[0155] The force-applying part 140 is installed on the fixture body 110, abuts against the disassembly part 130, and can receive external force to drive the disassembly part 130, so that the disassembly part 130 moves on the fixture body 110 to disassemble the chip frame 20. The chip frame disassembly fixture 100 can disassemble the chip frame 20 and the chip 10 on the processing box 1 by driving the disassembly part 130 on the fixture body 110 through the force-applying part 140. The chip frame disassembly fixture 100 has a simple structure and is easy to operate. It solves the problem of difficult operation during the installation or disassembly of the chip 10 on the processing box 1 in the prior art, and greatly improves the reusability of the chip 10.
[0156] like Fig.15 and Fig.21As shown, the positioning part 120 is also provided with an opening 121. When the positioning part 120 is installed on the chip frame 20, the opening 121 provided on the positioning part 120 can be aligned with the receiving part 21 on the chip frame 20, so that the fixture body 110 is positioned on the chip frame 20, that is, the chip frame disassembly fixture 100 is positioned on the chip frame 20. Specifically, the opening 121 passes through the positioning part 120 of the fixture body 110 in the vertical direction, that is, the opening 121 passes through the positioning part 120 of the fixture body 110 in the Z-axis direction. In the X-axis direction, the length of the opening 121 is less than the length of the receiving part 21 on the chip frame 20, and in the Y-axis direction, the width of the opening 121 is less than the width of the receiving part 21 on the chip frame 20. The opening 121 is sleeved on the outside of the receiving part 21, and forms an interference fit with the receiving part 21, clamping the receiving part 21, so that the fixture body 110 can be fixed to the chip frame 20.
[0157] Furthermore, if Fig.18 As shown, the positioning part 120 is further provided with a groove 1211, and the chip frame 20 is provided with a guide rib 22. The groove 1211 can cooperate with the guide rib 22, so that when the positioning part 120 is fixed to the receiving part 21, it can be positioned on the chip frame 20. Specifically, the bottom surface of the positioning part 120 is provided with a groove 1211, and the two sides of the receiving part 21 are provided with guide ribs 22. When the positioning part 120 is installed on the chip frame 20, the groove 1211 on the bottom surface of the positioning part 120 can be sleeved on the guide ribs 22 on the two sides of the receiving part 21, so that the positioning part 120 is positioned on the chip frame 20, so that the chip frame removal fixture 100 can be positioned.
[0158] like Fig.15 , Fig.17 and Fig.19 As shown, the fixture body 110 is further provided with a slide groove 111, and the disassembly portion 130 is arranged in the slide groove 111 and can slide along the slide groove 111. Specifically, the disassembly portion 130 is a cutter, including a cutter head 133 and a blade body, and the blade body includes a blade body 134 and a pushed plate 135. Preferably, the cutter head 133, the blade body 134 and the pushed plate 135 can be an integrally formed structure, and the cutter head 133 and the pushed plate 135 are respectively located at both ends of the blade body 134. The cutter head 133 is a wedge-shaped structure, and the cutter head 133 is arranged on the horizontally arranged end of the blade body 134, and the pushed plate 135 is arranged on the vertically arranged part of the blade body 134, so that the disassembly portion 130 is a generally "L"-shaped structure as a whole. When the disassembly part 130 moves on the clamp body 110, one end of the cutter head 133 of the disassembly part 130 is close to the positioning part 120, and one end of the pushed plate 135 is close to the force-applying part 140. The pushed plate 135 abuts against the force-applying part 140 and can be driven by the force-applying part 140 to move the disassembly part 130 in the slide groove 111, so that the cutter head 133 can extend into the positioning part 120 to disassemble the chip rack 20. Specifically, the cutter head 133 extends between the chip rack 20 and the shell.
[0159] Furthermore, if Fig.17 As shown, a sliding hole 112 is also provided on the clamp body 110, and the sliding hole 112 is connected to the positioning part 120, and the sliding groove 111 is connected to the sliding hole 112. When the disassembly part 130 is installed in the sliding groove 111, the blade head 133 of the disassembly part 130 can extend into the positioning part 120 through the sliding hole 112, and the blade body 134 of the disassembly part 130 can be pushed by the force-applying part 140 to move in the sliding groove 111, so that the blade head 133 moves in the sliding hole 112 to disassemble the chip frame 20 positioned by the positioning part 120, so that the disassembly part 130 can be used to disassemble the chip frame 20 on the positioning part 120.
[0160] like Fig.15 , Fig.17 and Fig. 20 As shown, the force-applying part 140 includes a driving member 141 and a handle 142. The force-applying part 140 is installed on the clamp body 110 and can move, and abuts against the pushed plate 135 of the disassembly part 130 in the slide groove 111. The driving member 141 is connected to the handle 142. The handle 142 can receive external force to drive the driving member 141 to move on the clamp body 110, push the disassembly part 130 to move, and disassemble the chip rack 20. Specifically, a screw hole 160 is provided on the clamp body 110. In the X-axis direction, the screw hole 160 is located on the -X-axis side of the slide groove 111, and the screw hole 160 is connected to the slide groove 111. The outer circumferential surface of the driving member 141 has an external thread that matches the internal thread in the screw hole 160. The driving member 141 is installed on the screw hole 160 through the cooperation of the internal thread and the external thread, and can move on the screw hole 160. When in use, the handle 142 is rotated to move the driving member 141 toward the pushed plate 135 and push the pushed plate 135, thereby driving the cutter head 133 to move toward the chip frame 20 in the positioning portion 120. During the movement, the cutter head 133 enters the welding layer between the chip frame 20 and the photosensitive shell 31 from the end close to the chip frame 20 to disassemble the chip frame 20.
[0161] Further, such as Fig.16 and Fig.17As shown, a limiting portion 111a is provided on the slide groove 111. When the disassembly portion 130 moves in the slide groove 111 along the +X axis direction, the push plate 135 is limited by the limiting portion 111a, so that the moving distance of the disassembly portion 130 in the slide groove 111 is fixed, and the position of the blade 133 of the disassembly portion 130 inserted into the chip frame 20 is fixed. Specifically, the limiting portion 111a is two protrusions arranged on both sides of the slide groove 111, and the pushed plate 135 arranged on the disassembly portion 130 is shaped as a baffle with a roughly circular structure. The width of the baffle in the Y-axis direction is greater than the width of the two protrusions in the Y-axis direction. When the disassembly portion 130 moves to the position of the limiting portion 111a in the slide groove 111, the pushed plate 135 on the disassembly portion 130 is blocked by the limiting portion 111a, and the disassembly portion 130 can no longer move. The disassembly portion 130 cuts into the welding layer between the chip frame 20 and the photosensitive shell 31 at a position more than half of the length of the chip 10 in the Y-axis direction.
[0162] Refer to Figure 15 to Fig. 22 In this embodiment, when the chip rack disassembly fixture 100 is used:
[0163] First, make the length direction of the chip rack disassembly fixture 100 parallel to the length direction of the chip rack 20, that is, the X-axis direction of the chip rack disassembly fixture 100 is parallel to the first direction A of the chip rack 20, and the fixture body 110 is mounted on the outside of the accommodating portion 21 on the chip rack 20 through the opening 121 on the positioning portion 120, the accommodating portion 21 corresponds to the position of the opening 121 on the fixture body 110, and the groove 1211 on the bottom surface of the positioning portion 120 is clamped on the guide rib 22, so as to position the chip rack disassembly fixture 100 on the chip rack 20.
[0164] By turning the handle 142 of the force-applying part 140 , the rotating driving member 141 moves on the clamp body 110 , pushing the disassembly part 130 to move in the slide groove 111 and the slide hole 112 , so that the blade 133 of the disassembly part 130 extends to the welding layer between the chip frame 20 and the photosensitive shell 31 in a direction parallel to the chip 10 .
[0165] Finally, the handle 142 of the force-applying part 140 is rotated until the pushed plate 135 contacts the limiting part 111a, and the disassembly part 130 cuts into the solder layer at a position more than half the length of the chip 10 in the Y-axis direction. At this time, the disassembly part 130 is limited by the limiting part 111a set on the slide 111, and has reached the maximum cutting depth. At this time, the clamp body 110 is lifted on the processing box 1 in the direction away from the chip 10, and the contact point between the end of the cutter head 133 away from the cutter body 134 in the Z-axis direction and the photosensitive housing 31 is used as a support point, and the chip frame 20 is pried out and installed on the new processing box using the principle of leverage.
[0166] Implementation Case 5:
[0167] like Figure 23 to Figure 26As shown, another chip rack disassembly fixture 100 is provided in this embodiment. The difference between this embodiment and the fourth embodiment is that: in this embodiment, the length of the opening 121 on the positioning portion 120 is greater than the length of the receiving portion 21 on the chip rack 20, and the width of the opening 121 is greater than the width of the receiving portion 21 on the chip rack 20, and the opening 121 can be nested on the chip rack 20. Specifically, the chip rack 20 includes a frame body and a receiving portion 21, the receiving portion 21 is arranged on the frame body, the length of the frame body is greater than the length of the receiving portion 21, the width of the frame body is greater than the width of the receiving portion 21, the opening 121 is sleeved on the outside of the frame body, and the inner wall of the opening 121 abuts against the side wall of the frame body to position the chip rack disassembly fixture 100.
[0168] A snap structure 122 is provided on the positioning portion 120. When the chip frame disassembly fixture 100 is installed on the chip frame 20, the snap structure 122 can be snapped onto the photosensitive shell 31, further firmly fixing the chip frame disassembly fixture 100 on the processing box 1 to prevent position displacement during disassembly; and no limiting portion is provided on the slide groove 111 of the chip frame disassembly fixture 100. When the chip frame disassembly fixture 100 is used, the force-applying portion 140 pushes the disassembly portion 130 to cut into the welding layer between the chip frame 20 and the photosensitive shell 31, thereby destroying the welding point between the chip frame 20 and the photosensitive shell 31 until the chip frame 20 is disassembled.
[0169] Implementation Case 6:
[0170] The processing box 1 in this embodiment is the same as the processing box 1 in the first embodiment.
[0171] like Figure 27 to Figure 29 As shown, the embodiment of the utility model provides a chip rack disassembly fixture 100, including a fixture body 110, a disassembly portion 130 and a force application portion 140; the fixture body 110 is provided with a positioning portion 120, and the positioning portion 120 is constructed to position the chip rack disassembly fixture 100 on the housing.
[0172] The disassembly portion 130 and the force applying portion 140 are respectively connected to the fixture body 110 . The force applying portion 140 is configured to apply force to the disassembly portion 130 when the chip rack disassembly fixture 100 is positioned on the chip rack 20 , so that the chip rack 20 is removed from the housing under the drive of the disassembly portion 130 .
[0173] Among them, the length direction of the chip frame disassembly fixture 100 is the X-axis direction, the width direction of the chip frame disassembly fixture 100 is the Y-axis direction, and the height direction of the chip frame disassembly fixture 100 is the Z-axis direction. The X-axis, Y-axis and Z-axis are perpendicular to each other.
[0174] The disassembly portion 130 is rotatably disposed on the jig body 110. When the chip holder disassembly jig 100 is positioned on the developing housing 41 by the positioning portion 120, the disassembly portion 130 can abut against the chip holder 20 to disassemble the chip holder 20. Specifically, a positioning surface 1201 is provided on the positioning portion 120. When the chip rack disassembly fixture 100 is installed on the developing housing 41, the positioning surface 1201 of the positioning portion 120 abuts against the developing housing 41. Furthermore, a convex portion 410 is provided on the developing housing 41. An avoidance groove 123 is provided on the positioning portion 120. The avoidance groove 123 is arranged on the positioning surface 1201. When the positioning surface 1201 of the positioning portion 120 abuts against the developing housing 41, the avoidance groove 123 on the positioning portion 120 can avoid the convex portion 410 on the developing housing 41, thereby preventing the positioning portion 120 from interfering with the convex portion 410 on the developing housing 41, and making it impossible to stably install the chip rack disassembly fixture 100 on the processing box 1 to disassemble the chip rack 20. In this embodiment, the protrusion 410 can be a positioning protrusion, the avoidance groove 123 can be an avoidance groove, the positioning surface abuts against the developer housing 41, and the positioning protrusion is stuck in the avoidance groove 123, so that the chip rack disassembly fixture 100 can be positioned on the developer housing 41.
[0175] The disassembly portion 130 and the force applying portion 140 are fixedly connected. Specifically, the disassembly portion 130 and the force applying portion 140 are formed in one piece.
[0176] Continue, such as Fig.28 As shown, the fixture body 110 is further provided with a mounting hole 124, and the disassembly portion 130 is mounted on the fixture body 110 and can rotate relative to the positioning portion 120. Specifically, the disassembly portion 130 is provided with a rotating shaft 137, and the rotating shaft 137 is inserted into the mounting hole 124 on the positioning portion 120, so that the disassembly portion 130 is rotatably mounted on the positioning portion 120 and can rotate relative to the positioning portion 120.
[0177] Furthermore, if Fig.28 As shown, the disassembly portion 130 is provided with an action protrusion 136, which can abut against the chip frame 20 to disassemble the chip frame 20. Specifically, when the chip frame 20 is welded to the photosensitive housing 31, the first engaging protrusion 23 of the chip frame 20 (see the first embodiment) Figure 2 The chip holder disassembly jig 100 is shown as protruding from the photosensitive housing 31, and its lower surface is at a certain distance from the developing housing 41 in the third direction C, leaving a certain space. When the chip holder disassembly jig 100 is installed on the developing housing 41, the action protrusion 136 of the disassembly portion 130 is inserted into the space below the first engaging protrusion 23, and the upper surface 136a of the action protrusion 136 abuts against the lower surface of the first engaging protrusion 23 to form a supporting point.
[0178] The end of the disassembly portion 130 away from the action protrusion 136 is the force-applying portion 140. A downward force in the -Z direction is applied to the force-applying portion 140. The contact point between the action protrusion 136 and the chip frame 20 is used as a support point. The chip frame 20 can be pried out and installed on a new processing box using the lever principle.
[0179] The chip rack disassembly fixture 100 of the processing box of the utility model positions the chip rack disassembly fixture 100 on the shell, and applies force to the chip rack 20 through the force-applying part 140, so that the chip rack 20 is separated from the welding layer on the shell. It has a simple structure and is easy to operate, which solves the problem of difficult operation during the disassembly of the chip rack on the processing box in the prior art, shortens the disassembly time, improves the disassembly efficiency, saves time and labor, and the chip rack disassembly fixture 100 has a relatively simple structure, and the manufacturing difficulty and manufacturing cost are relatively low.
[0180] Implementation Case 7:
[0181] like Figures 30 to 48 As shown, a chip frame disassembly fixture 100 can be used to disassemble the chip frame 20 and the chip 10 on the process box 1. The process box structure of this embodiment is different from that of the above-mentioned embodiment, and the process box structure of this embodiment is first briefly introduced below.
[0182] To better illustrate the various components of the processing box 1, as shown in FIG. Fig.30 As shown, the length direction of the processing box 1 is defined as the left-right direction, wherein the left side is the non-driving end and the right side is the driving end, and the chip 10 is located on the left side of the processing box 1 in the left-right direction; the width direction of the processing box 1 is the front-to-back direction, and the drum box 30 is located at the front end of the developing box 40 in the front-to-back direction, that is, the chip 10 is located at the non-driving end of the processing box; the height direction of the processing box 1 is the up-down direction, and the chip 10 is located on the upper side of the processing box 1 in the height direction; the left-right direction is perpendicular to the front-to-back direction and the up-down direction.
[0183] refer to Fig.30 , Fig.31 and Fig.32The processing box 1 is a recycling processing box. The processing box 1 includes a housing that rotatably supports a photosensitive drum and a developing roller, and a chip frame 20 arranged on the housing for supporting a chip 10. Specifically, the processing box 1 includes a developing box 40, a drum box 30, and protective covers 50 arranged at both ends of the developing box 40 and the drum box 30 in the length direction. The developing box 40 includes a developing housing that can accommodate developer and support a developing roller. The drum box 30 includes a photosensitive housing that can accommodate residual waste developer after development and support a photosensitive drum. The developing housing and the photosensitive housing are arranged side by side in the width direction of the processing box 1. The developing housing is arranged on one side of the photosensitive housing, that is, the developing housing is arranged at the rear end of the photosensitive housing in the width direction of the processing box, and the protective cover 50 connects the developing housing and the photosensitive housing to each other. The housing of the processing box includes a developing housing, a photosensitive housing, and a protective cover 50.
[0184] A chip 10 storing information about the process cartridge 1 and a chip rack 20 for mounting the chip 10 are provided on the upper end surface 501 of the protective cover 50. The chip rack 20 and the protective cover 50 are integrally formed. The chip 10 is mounted on the chip rack 20 by gluing. The chip 10 can be used to record information such as the developer amount of the process cartridge 1 and the number of times the process cartridge 1 is used. When the process cartridge 1 is mounted on the image forming device, the chip 10 can transmit information on the chip 10 to the image forming device by being electrically connected to the image forming device. In order to avoid wasting resources, the chip 10 on the process cartridge 1 can be removed and mounted on a new process cartridge 1a (see Fig.42 The chip frame disassembly fixture 100 of the present invention is used for disassembling the chip frame 20. The structure of the processing box 1 is prior art and will not be described here.
[0185] The chip rack 20 is provided with guide ribs 22 on the front and rear sides of the chip 10, which can guide the guided part set in the image forming device when the processing box 1 is installed in the image forming device, so as to guide the electrical contacts set in the image forming device to electrically contact with the chip 10 in the processing box 1.
[0186] like Figure 33 to Figure 36 As shown, the embodiment of the utility model provides a chip rack disassembly fixture 100, including a fixture body 110, a disassembly portion 130 and a force application portion 140; the fixture body 110 is provided with a positioning portion 120, and the positioning portion 120 is constructed to position the chip rack disassembly fixture 100 on the chip rack 20.
[0187] The disassembly portion 130 and the force applying portion 140 are respectively connected to the fixture body 110 . The force applying portion 140 is configured to apply force to the disassembly portion 130 when the chip rack disassembly fixture 100 is positioned on the chip rack 20 , so that the chip rack 20 is removed from the housing under the drive of the disassembly portion 130 .
[0188] Among them, the length direction of the chip frame disassembly fixture 100 is the X-axis direction, the width direction of the chip frame disassembly fixture 100 is the Y-axis direction, and the height direction of the chip frame disassembly fixture 100 is the Z-axis direction. The X-axis, Y-axis and Z-axis are perpendicular to each other.
[0189] The fixture body 110 can be fixed on the protective cover 50 of the processing box 1 through the positioning portion 120, and the positioning portion 120 corresponds to the position of the chip frame 20 and the chip 10 on the protective cover 50, and is used to position the chip frame removal fixture 100 on the chip frame 20.
[0190] The disassembly part 130 is installed on the fixture body 110 and can move on the fixture body 110. When the disassembly part 130 moves on the fixture body 110, the disassembly part 130 can extend into the positioning part 120 to disassemble the chip frame 20 that positions the positioning part 120, so that the chip 10 on the chip frame 20 is also removed together.
[0191] The force-applying part 140 is installed on the fixture body 110, abuts against the disassembly part 130, and can receive external force to drive the disassembly part 130, so that the disassembly part 130 moves on the fixture body 110 to disassemble the chip frame 20. The chip frame disassembly fixture 100 can disassemble the chip frame 20 and the chip 10 on the processing box 1 by driving the disassembly part 130 on the fixture body 110 through the force-applying part 140. The chip frame disassembly fixture 100 has a simple structure and is easy to operate. It solves the problem of difficult operation during the installation or disassembly of the chip 10 on the processing box 1 in the prior art, and greatly improves the reusability of the chip 10.
[0192] refer to Fig.31 , Fig.32 , Fig.36 As shown, the positioning portion 120 is arranged on one end of the clamp body 110, and the positioning portion 120 includes a first snap-fit structure 1221. The protective cover 50 is provided with a protective cover protrusion 502. The first snap-fit structure 1221 of the positioning portion 120 can be engaged with the protective cover protrusion 502, so that the positioning portion 120 of the clamp body 110 is fixed on the protective cover 50, positioning the chip frame 20 and the chip 10. Specifically, in the present embodiment, the shape of one end of the clamp body 110 where the positioning portion 120 is provided can be adapted to the protective cover 50 on the processing box 1, and the protective cover 50 of the processing box 1 is provided with protective cover protrusions 502 on two opposite sides, and two first snap structures 1221 are provided on the bottom surface of the positioning portion 120. When the clamp body 110 is installed on the protective cover 50 of the processing box 1 through the positioning portion 120, the two first snap structures 1221 on the positioning portion 120 are respectively engaged with the protective cover protrusions 502 on the opposite sides of the protective cover, so that the clamp body 110 is fixed to the protective cover 50.
[0193] like Fig.36As shown, a groove 1211 is further provided on the positioning portion 120. The groove 1211 is the same as the groove in the fourth embodiment, and the details can be referred to the fourth embodiment.
[0194] like Fig.35 , Fig.36 As shown, the positioning portion 120 is further provided with an opening 121. When the positioning portion 120 is installed on the protective cover 50, the opening 121 provided on the positioning portion 120 can be aligned with the chip frame 20 and the chip 10 installed on the protective cover 50, so that the chip frame 20 and the chip 10 on the protective cover 50 can be exposed through the opening 121, so that when the chip frame 20 is removed, the conditions of the chip frame 20 and the chip 10 can be clearly observed. Specifically, the opening 121 penetrates the positioning portion 120 of the clamp body 110 in the vertical direction, that is, the opening 121 penetrates the positioning portion 120 of the clamp body 110 in the Z-axis direction, and the area of the opening 121 is larger than the area of the chip frame 20, so that when the positioning portion 120 is positioned on the chip frame 20, the opening 121 can expose the chip frame 20 and the chip 10; and the groove 1211 is arranged on the side of the opening 121 and is connected to the opening 121. When the clamp body 110 is positioned on the chip frame 20 through the groove 1211 and the guide rib 22, the opening 121 corresponds to the position of the chip frame 20, and the chip frame 20 and the chip 10 on the chip frame 20 can be exposed through the opening 121.
[0195] The area of the opening 121 can be understood as the projection area of the opening 121 in the height direction of the processing box 1 ; the area of the chip rack 20 can be understood as the projection area of the opening 121 in the height direction of the processing box 1 .
[0196] like Fig.37 As shown, the disassembly portion 130 includes a cutter head 133 and a cutter body, and the cutter body includes a cutter body 134 and a pushed plate 135. The cutter head 133 is the same as the cutter body in the fourth embodiment, and the details can be referred to in the fourth embodiment; the cutter body 134 and the pushed plate 135 are the same as the cutter body and the pushed plate in the fourth embodiment, and the details can be referred to in the fourth embodiment.
[0197] like Fig.35 As shown, the fixture body 110 is further provided with a sliding hole 112 and a sliding groove 111. The sliding hole 112 and the sliding groove 111 are respectively the same as the sliding hole and the sliding groove in the fourth embodiment, and the details can be referred to the fourth embodiment.
[0198] like Fig.38 As shown, the force applying part 140 includes a handle 142 and a driving member 141, and the driving member 141 is integrally formed with the handle 142. In this embodiment, the handle 142 and the driving member 141 are respectively the same as the handle and the driving member in the fourth embodiment, and the details can be referred to the fourth embodiment. In some other embodiments, the driving member 141 can also be a prismatic structural member, which is not limited here.
[0199] like Fig.35 and Fig.38 As shown, the clamp body 110 is provided with a screw hole 160. In the length direction of the clamp body 110, the screw hole 160 is arranged on the other end of the clamp body 110 opposite to the positioning portion 120. On the clamp body 110, the sliding hole 112, the sliding groove 111 and the screw hole 160 are arranged in sequence in the length direction of the clamp body 110, and the sliding hole 112 and the screw hole 160 are both connected to the sliding groove 111; the driving member 141 is a cylindrical structural member, and the outer circumferential surface of the driving member 141 is provided with a thread 1411. The driving member 141 is installed in the screw hole 160 through the cooperation of the thread 1411 and the screw hole 160, and the driving member 141 can move and rotate in the screw hole 160 through the cooperation of the thread 1411 and the screw hole 160.
[0200] like Figure 41 to Figure 43 As shown, in this embodiment, the chip holder 20 is further provided with a protruding block 25. When in use, a notch 181 can be provided on the new processing box 1a, and the chip holder 20 can be installed on the new processing box 1a for use through the cooperation between the notch 181 and the protruding block 25. Specifically, the protruding block 25 is provided at the bottom of the chip holder 20, that is, at the connection surface where the chip holder 20 is connected to the protective cover 50. A chip mounting portion 180 is provided on the new protective cover 50a of the new processing box 1a. The structure of the chip mounting portion 180 is adapted to the structure of the chip holder 20. The notch 181 is provided on the chip mounting portion 180. After the chip holder 20 is removed from the recycling processing box, the chip holder 20 can be installed on the chip mounting portion 180, and the protruding block 25 of the chip holder 20 is embedded in the notch 181 of the chip mounting portion of the new processing box 1a, so that the protruding block 25 and the notch 181 are interference-fitted, so that the chip holder 20 can be installed on the new processing box 1a for use.
[0201] refer to Figure 39 to Figure 43 In this embodiment, when the chip rack disassembly fixture 100 is used:
[0202] First, the clamp body 110 is engaged with the protective cover protrusions 502 on both sides of the protective cover 50 through the first snap-fit structure 1221, and the guide ribs 22 and the grooves 1211 on the chip rack 20 are matched to install the positioning part 120 of the clamp body 110 on the protective cover 50 of the recycling processing box, and the chip rack 20 on the protective cover 50 is exposed through the opening 121 of the positioning part 120.
[0203] Rotate the handle 142 installed on the clamp body 110, rotate the driving member 141, and the driving member 141 moves on the clamp body 110, pushing the disassembly part 130 to move in the slide groove 111 and the slide hole 112, so that the blade 133 of the disassembly part 130 cross-cuts into the bottom of the chip frame 20, that is, the blade 133 cross-cuts into between the chip frame 20 and the protective cover 50, and continue to rotate the force-applying part 140 to push the disassembly part 130 to move until the disassembly part 130 pries out the chip frame 20.
[0204] Finally, the removed chip holder 20 and chip 10 can be installed in the chip mounting portion 180 of the new process box 1 a.
[0205] Implementation Case 8:
[0206] like Figures 44 to 48 As shown, a chip disassembly fixture is provided in this embodiment. The difference between this embodiment and embodiment nine is that: in this embodiment, a second snap-fit structure 1222 is also provided on the positioning portion 120, and the chip rack 20 can be fixed on the chip rack disassembly fixture 100 through the second snap-fit structure 1222. The chip disassembly fixture is not used to disassemble the chip rack 20 on the processing box 1, but is used to disassemble the chip 10 on the chip rack 20.
[0207] Specifically, in this embodiment, on the clamp body 110, the area of the opening 121 is smaller than the area of the chip frame 20 but larger than the area of the chip 10, and the second snap-fit structure 1222 is arranged below the opening 121. The chip frame 20 can be snapped into place below the opening 121 through the second snap-fit structure 1222, and the guide ribs 22 on the chip frame 20 are limited by the groove 1211, so that the chip frame 20 is fixed on the clamp body 110.
[0208] The area of the opening 121 can be understood as the projection area of the opening 121 in the height direction of the processing box 1; the area of the chip rack 20 can be understood as the projection area of the opening 121 in the height direction of the processing box 1; the area of the chip 10 can be understood as the projection area of the chip 10 in the height direction of the processing box 1.
[0209] Moreover, when the disassembly part 130 moves on the clamp body 110, the blade head 133 of the disassembly part 130 can cut into between the chip 10 and the chip frame 20, so that when the disassembly part 130 is pushed by the force-applying part 140, it can cut into between the chip 10 and the chip frame 20, so that the chip 10 can be removed from the chip frame 20.
[0210] In this embodiment, when the chip removal fixture is used:
[0211] First, the chip rack 20 removed from the processing box 1 is matched with the positioning part 120 in the groove 1211 through the guide ribs 22, and then engaged with the bottom of the chip rack 20 through the second snap structure 1222, so that the chip rack 20 is fixed at the bottom of the opening 121, and the chip 10 on the chip rack 20 is exposed through the opening 121 of the positioning part 120.
[0212] Rotate the handle 142 installed on the clamp body 110, rotate the driving member 141, and the driving member 141 moves on the clamp body 110, pushing the disassembly part 130 to move in the slide groove 111 and the slide hole 112, so that the cutter head 133 of the disassembly part 130 cuts into the bottom of the chip 10, that is, the cutter head 133 cuts into between the chip frame 20 and the chip 10, continue to rotate the force-applying part 140, push the disassembly part 130 to move, and the disassembly part 130 continues to cut into between the chip 10 and the chip frame 20 until the chip 10 is removed from the chip frame 20.
[0213] In this implementation case, the force applying portion 140, the clamp body 110 and the disassembly portion 130 are consistent with those in the seventh implementation case and will not be described again here.
[0214] Implementation Case 9:
[0215] In this embodiment, the chip rack disassembly fixture 100 can integrate the functions of the chip rack disassembly fixture in Example 7 and the chip disassembly fixture in Example 8, that is, the chip rack disassembly fixture 100 is not only used to disassemble the chip rack 20 on the processing box 1, but also used to disassemble the chip 10 on the chip rack 20.
[0216] like Fig.49 and Fig.50 As shown, the processing box 1 in this embodiment is the same as the processing box 1 in embodiment seven.
[0217] like Figure 51 to Figure 61 As shown, this embodiment provides a chip holder disassembly fixture 100 according to the above-mentioned processing box 1, which can disassemble the chip 10 set on the processing box 1 from the processing box 1.
[0218] like Fig.51 , Fig.52 and Fig.53 As shown, the embodiment of the utility model provides a chip rack disassembly fixture 100, including a fixture body 110, a disassembly portion 130 and a force application portion 140; the fixture body 110 is provided with a positioning portion 120, and the positioning portion 120 is constructed to position the chip rack disassembly fixture 100 on the chip rack 20.
[0219] The disassembly portion 130 and the force applying portion 140 are respectively connected to the fixture body 110 . The force applying portion 140 is configured to apply force to the disassembly portion 130 when the chip rack disassembly fixture 100 is positioned on the chip rack 20 , so that the chip rack 20 is removed from the housing under the drive of the disassembly portion 130 .
[0220] Among them, the length direction of the chip frame disassembly fixture 100 is the X-axis direction, the width direction of the chip frame disassembly fixture 100 is the Y-axis direction, and the height direction of the chip frame disassembly fixture 100 is the Z-axis direction. The X-axis, Y-axis and Z-axis are perpendicular to each other.
[0221] The fixture body 110 can be fixed on the protective cover 50 of the processing box 1 through the positioning portion 120, and the positioning portion 120 corresponds to the position of the chip frame 20 and the chip 10 on the protective cover 50, and is used to position the chip frame removal fixture 100 on the chip frame 20.
[0222] The disassembly portion 130 is installed on the fixture body 110, and includes a first disassembly component 130a and a second disassembly component 130b. The disassembly portion 130 can move on the fixture body 110. When the first disassembly component 130a moves on the fixture body 110, the first disassembly component 130a can extend into the positioning portion 120 to disassemble the chip rack 20 positioned by the positioning portion 120, so that the chip 10 on the chip rack 20 is also removed together. Thereafter, the chip rack disassembly fixture 100 is removed from the processing box 1, and the force applying portion 140 is continuously rotated, so that the first disassembly component 130a moves on the fixture body 110 to drive the second disassembly component 130b to disassemble the chip 10 accommodated in the chip rack 20.
[0223] The force-applying part 140 is installed on the fixture body 110, abuts against the first disassembly part 130a, and can receive external force to drive the first disassembly part 130a, so that the first disassembly part 130a moves on the fixture body 110 to disassemble the chip frame 20, and indirectly pushes the second disassembly part 130b to disassemble the chip 10 accommodated in the chip frame 20. The chip frame disassembly fixture 100 can disassemble the chip frame 20 and the chip 10 on the processing box by driving the first disassembly part 130a to move on the fixture body through the force-applying part 140, and has a simple structure and convenient operation, which solves the problem of difficulty in disassembling the chip 10 on the processing box 1 in the prior art and greatly improves the reusability of the chip 10.
[0224] refer to Fig.51 , Fig.52 , Fig.58 and Fig.59The positioning portion 120 is arranged on one end of the clamp body 110, and the clamp body 110 is provided with a first positioning portion 120a facing the processing box 1. The first positioning portion 120a protrudes outward from the clamp body 110 and can abut against the front end surface of the protective cover 50 to limit the movement of the positioning portion 120 in the front and rear direction of the processing box.
[0225] The first positioning portion 120 a may be a first positioning wall, and the first positioning wall abuts against the front end surface of the protective cover 50 .
[0226] Furthermore, the clamp body 110 is also provided with opposing second positioning portions 120b spaced apart on the clamp body 110. The second positioning portions 120b are formed to protrude outward from the clamp body 110 and can abut against the rear end surface of the protective cover 50, so that the first positioning portion 120a and the second positioning portion 120b abut against the front and rear end surfaces of the protective cover 50 respectively to prevent the positioning portion 120 from moving in the front and rear directions.
[0227] The second positioning portion 120 b may be a second positioning wall, and the second positioning wall abuts against the rear end surface of the protective cover 50 .
[0228] Next, the clamp body 110 is further provided with a third positioning portion 120 c , which is formed by protruding outward from the clamp body 110 and can abut against the right end surface of the protective cover 50 to limit the movement of the positioning portion 120 in the left-right direction.
[0229] The third positioning portion 120 c may be a third positioning wall, and the third positioning wall abuts against the right end surface of the protective cover 50 .
[0230] Furthermore, the clamp body 110 is also provided with a fourth positioning portion 120d opposite to the third positioning portion 120c. The fourth positioning portion 120d is formed to protrude outward on the clamp body 110 and can abut against the left end surface of the protective cover 50, so that the fourth positioning portion 120d and the third positioning portion 120c abut against the left and right end surfaces of the protective cover 50 respectively to prevent the positioning portion 120 from moving in the left and right directions.
[0231] The fourth positioning portion 120 d may be a fourth positioning wall, and the fourth positioning wall abuts against the left end surface of the protective cover 50 .
[0232] In addition, in order to prevent the fixture body 110 from detaching from the processing box 1 in the opposite direction (i.e., upward direction, i.e., +Z axis direction) from the protective cover 50 installed on the processing box 1 when the chip rack disassembly fixture 100 is used to disassemble the chip rack 20, and thus prevent a disassembly accident from occurring, a plurality of elastic buckle structures are provided on the positioning portion 120, which can buckle the fixture body 110 to the protective cover 50 of the processing box 1, which can not only stably prevent detachment, but also facilitate disassembly. Specifically, if Fig.52As shown, the snap-on structure includes a first snap-on structure 1221 and a second snap-on structure 1222, and the second snap-on structure 1222 is arranged at a position closer to the disassembly portion 130 relative to the first snap-on structure 1221, and the first snap-on structure 1221 is arranged at a position farther away from the disassembly portion 130 relative to the second snap-on structure 1222, so that the first snap-on structure 1221 and the second snap-on structure 1222 are more evenly arranged on the clamp body 110, and when snapped, the positioning portion 120 is subjected to a more uniform and balanced force. During the process of installing the clamp body 110 on the protective cover 50, the first snap-on structure 1221 can be snapped on the right end surface of the protective cover 50, and the second snap-on structure 1222 can be snapped on the left end surface of the protective cover 50. By setting the first snap-on structure 1221 and the second snap-on structure 1222, the clamp body 110 can be upper-limited in the up and down directions to prevent the clamp body 110 from detaching from the processing box during disassembly.
[0233] like Fig.52 , Fig.53 As shown, the positioning portion 120 is further provided with an opening 121, and the opening 121 passes through the positioning portion 120. When the positioning portion 120 is installed on the protective cover 50, the opening 121 on the positioning portion 120 can be adapted to the chip rack 20 arranged on the protective cover 50, and the clamp body 110 is further positioned on the processing box 1, and a groove 1211 is provided at the bottom of the clamp body 110 for avoiding the guide ribs 22 arranged on both sides of the chip rack 20 to prevent the clamp body 110 from interfering with the guide ribs 22. There are two grooves 1211, which are respectively located on both sides of the opening 121. When the chip rack disassembly fixture 100 is installed on the protective cover 50, there is a distance between the groove 1211 and the guide rib 22.
[0234] like Figure 53 to Figure 56As shown, the fixture body 110 is also provided with a slide groove 111, and the disassembly portion 130 is arranged in the slide groove 111 and can slide along the slide groove 111. Specifically, the disassembly portion 130 includes a first disassembly member 130a and a second disassembly member 130b. The first disassembly member 130a is provided with a first blade head 133a at one end close to the opening 121, and the other end of the first disassembly member 130a is a first blade body, and the second disassembly member 130b is provided with a second blade head 133b at one end close to the opening 121, and the other end of the second disassembly member 130b is a second blade body, a first pushed plate 135a is provided on the first blade body, and a second pushed plate 135b is provided on the second blade body. The first disassembly member 130a can disassemble the chip frame 20 through the first blade head 133a. The second disassembly member 130b can disassemble the chip 10 through the second cutting head 133b. The first disassembly member 130a and the second disassembly member 130b are roughly "L"-shaped structures. The first cutting head 133a and the second cutting head 133b are wedge-shaped structures. When the first disassembly member 130a moves on the fixture body 110, the first disassembly member 130a is provided with one end of the first cutting head 133a close to the positioning portion 120, and one end of the first pushed plate 135a is provided close to the force-applying portion 140. The first pushed plate 135a abuts against the force-applying portion 140 and can be driven by the force-applying portion 140 to move the first disassembly member 130a in the slide groove 111, so that the first cutting head 133a can extend into the positioning portion 120 to disassemble the chip frame 20.
[0235] Further, such as Fig.53 As shown, the fixture body 110 is provided with a first sliding hole 112a and a second sliding hole 112b. The first sliding hole 112a is aligned with the upper end surface 501 of the protective cover 50 (see Fig.50 The first disassembly member 130a is installed on the first slide hole 112a, and the second disassembly member 130b is installed on the second slide hole 112b. The second disassembly member 130b is located above the first disassembly member 130a, and the first disassembly member 130a is closer to the force-applying member 140 than the second disassembly member 130b. The first blade 133a of the first disassembly member 130a can extend to the upper end surface 501 of the protective cover 50, and the second blade 133b of the second disassembly member 130b can extend to the opening 121 of the positioning portion 120. The first disassembly member 130a can be pushed by the force-applying portion 140 to move in the first sliding hole 112a to disassemble the chip frame 20 positioned by the positioning portion 120; the second disassembly member 130b can be pushed by the first disassembly member 130a to disassemble the chip 10 accommodated in the chip frame 20.
[0236] In addition, if Fig.53As shown, an indicator mark 110e is also provided on the outer surface of the clamp body 110, and the indicator mark 110e can indicate that when the first disassembly member 130a moves to a certain position of the slide groove 111 under the push of the force-applying part 140, the chip rack 20 can be disassembled from the protective cover 50, which can not only remind the operator of the progress of the first disassembly member 130a being pushed by the force-applying part 140 to improve the disassembly efficiency, but also prevent the first disassembly member 130a from excessively cutting in and causing damage to the processing box 1. In this embodiment, the indicator mark 110e is a protrusion on the outer surface of the clamp body 110, but in other embodiments, the indicator mark 110e can also be an arrow, text or other pattern, etc., as long as it can play a prompting role.
[0237] like Fig.53 , Fig.56 and Fig.57 As shown, the force-applying part 140 includes a handle 142 and a driving member 141, and the driving member 141 and the handle 142 are integrally formed. The driving member 141 is installed on one end of the clamp body 110 and abuts against the first disassembly member 130a. The other end of the driving member 141 is located outside the clamp body 110 and connected to the handle 142. The handle 142 can receive external force to drive the driving member 141 to rotate on the clamp body 110, and the driving member 141 can drive the disassembly part 130 to move to disassemble the chip frame 20 and the chip 10. In this embodiment, the handle 142 and the driving member 141 are respectively the same as the handle and the driving member in the fourth embodiment, and the details can refer to the fourth embodiment.
[0238] like Fig.51 , Fig.53 and Fig.60As shown, an elastic pressing member 170 is also provided on the clamp body 110. When the clamp body 110 is installed on the processing box 1, the elastic pressing member 170 abuts against the chip 10. At the same time, when the chip frame 20 is removed from the protective cover 50, the first disassembly member 130a can be used to clamp the chip frame 20 between the two, or when the chip 10 accommodated in the chip frame 20 is pried out, the second disassembly member 130b can be used to clamp the chip 10 between the two. Specifically, the positioning portion 120 is provided with an opening 121, and a stopper 118a is provided at the upper end of the opening 121. Preferably, the stopper 118a can fix the cover with a through hole on the positioning portion 120 by means of a screw 151; the elastic pressing member 170 includes an extrusion member 171, an elastic member 172 and a stopper 173 provided on the extrusion member 171, and the stopper 173 is approximately located at the middle position of the extrusion member 171; the extrusion member 171 is installed in the opening 121, and the elastic member 172 is provided in the opening 121, and one end of the elastic member 172 is in contact with the cover on the end of the opening 121 away from the chip 10. The first end of the chip holder 20 abuts against the stopper 118 a, and the other end abuts against the stop block 173. The extrusion member 171 can extend outward from the through hole of the cover. The extrusion member 171 will remain close to the chip 10 in the opening 121 under the elastic force of the elastic member 172. After the chip holder 20 is removed, the chip holder 20 is clamped between the extrusion member 171 and the first disassembly member 130 a, so that when the chip holder disassembly fixture 100 is removed from the processing box 1, the chip holder 20 will not fall off the chip holder disassembly fixture 100, which facilitates the second disassembly member 130 b to disassemble the chip 10 accommodated in the chip holder 20. In addition, after the chip 10 is pried out, the chip 10 will be clamped between the extrusion piece 171 and the second disassembly piece 130b. At this time, an adhesive surface can be set on the bottom wall of the chip rack on which the chip 10 is installed on the new processing box, and then the chip rack disassembly fixture 100 is installed on the new processing box. Then, the handle 142 is rotated in the opposite direction, and then the first disassembly piece 130a and the second disassembly piece 130b are manually moved in the direction of the force-applying part 140. The chip 10 can be pressed onto the chip rack of the new processing box under the action of the elastic pressing member 170. The disassembled chip 10 is successfully installed on the chip rack of the new processing box, which solves the problem of the chip being too small and inconvenient to install, thereby improving the user experience.
[0239] refer to Figure 57 to Figure 61 When the chip rack disassembly fixture 100 in this embodiment is used:
[0240] First, the operator can place the chip rack disassembly fixture 100 on the upper side of the chip 10 of the processing box 1 and install it from top to bottom. The fixture body 110 is engaged with the protective cover 50 through the first snap-fit structure 1221 and the second snap-fit structure 1222, and is upper-limited in the front-to-back direction and left-to-right direction of the protective cover 50 through the first positioning portion 120a, the second positioning portion 120b, the third positioning portion 120c and the fourth positioning portion 120d, thereby completing the installation of the chip rack disassembly fixture 100, and the chip rack 20 corresponds to the position of the opening 121 on the fixture body 110.
[0241] Then, the operator can hold and rotate the handle 142 of the force-applying part 140, and as the meshing amount of the thread 1411 of the driving member 141 and the screw hole 160 gradually increases, the first disassembly member 130a is pushed to move in the slide groove 111 and the first slide hole 112a, so that the first cutter head 133a of the first disassembly member 130a cuts into the space between the upper end surface 501 of the protective cover 50 and the chip frame 20 in a direction parallel to the chip frame 20, and the chip frame 20 is disassembled. When the first pushed plate 135a of the first disassembly member 130a reaches the position where the indicator mark 110e is provided on the outer surface of the clamp body 110, the chip frame 20 has been disassembled from the upper end surface 501 of the protective cover 50 by the first disassembly member 130a, and the chip frame 20 is clamped between the first disassembly member 130a and the elastic pressing member 170, and the operator can remove the chip disassembly clamp from the protective cover of the processing box 1.
[0242] Afterwards, the operator continues to rotate the handle 142 of the force-applying portion 140, so that the first disassembling member 130a pushes the second disassembling member 130b to move in the slide groove 111 and the second slide hole 112b, so that the second blade 133b of the second disassembling member 130b gradually cuts into the chip frame 20 to disassemble the chip 10 accommodated in the chip frame 20. As the second pushed plate 135b of the second disassembling member 130b abuts against the right end surface of the positioning portion 120, at this time, the chip 10 accommodated in the chip frame 20 is After being disassembled, the chip 10 is clamped between the second disassembly part 130b and the elastic pressing member 170. At this time, the operator can install the chip disassembly fixture on the new processing box, and then reversely rotate the handle 142, and then manually move the first disassembly part 130a and the second disassembly part 130b toward the direction of the force-applying part 140. The chip 10 can be pressed onto the chip frame of the new processing box under the action of the elastic pressing member 170, and the disassembled chip 10 is successfully installed on the chip frame of the new processing box.
[0243] The utility model solves the problem of difficult operation during chip installation or removal on the processing box in the prior art, shortens the time for removing the chip, improves the removal efficiency, saves time and labor, and the chip removal tool has a relatively simple structure, and the manufacturing difficulty and manufacturing cost are relatively low.
[0244] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.
Claims
1. A chip rack disassembly fixture, used for disassembling a chip rack for supporting a chip on a processing box, wherein the processing box comprises a housing rotatably supporting a photosensitive drum and a developing roller and a chip rack arranged on the housing, characterized in that: The chip rack disassembly fixture comprises a fixture body, a disassembly portion and a force application portion; The fixture body is provided with a positioning portion, and the positioning portion is configured to position the chip rack removal fixture on the chip rack or the housing; The disassembly part and the force-applying part are respectively connected to the clamp body, and the force-applying part is constructed to apply force to the disassembly part when the chip rack disassembly clamp is positioned on the chip rack or the shell, so that the chip rack is removed from the shell under the drive of the disassembly part.
2. The chip rack disassembly fixture according to claim 1, characterized in that: The positioning portion includes an opening, and when the positioning portion is positioned on the chip frame, the chip frame is at least partially exposed to the opening.
3. The chip rack disassembly fixture according to claim 2, characterized in that: The inner side wall of the opening has a distance from the chip frame in the length direction of the chip frame removal fixture; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
4. The chip rack disassembly fixture according to claim 2, characterized in that: The chip rack is provided with a receiving portion, the opening is sleeved on the outside of the receiving portion, the inner wall of the opening abuts against the side wall of the receiving portion, and the opening and the receiving portion are interference fit to clamp the chip rack; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
5. The chip rack disassembly fixture according to claim 2, characterized in that: The chip rack comprises a rack body and a receiving portion, wherein the receiving portion is arranged on the rack body, the opening is sleeved on the rack body, and the inner wall of the opening abuts against the side wall of the rack body to position the chip rack disassembly fixture; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
6. The chip rack disassembly fixture according to claim 5, characterized in that: The positioning portion is provided with a buckle structure, and the buckle structure is engaged with the housing.
7. The chip rack disassembly fixture according to claim 1, characterized in that: The positioning portion includes a groove, and the groove can be clamped on the guide rib of the chip frame to position the chip frame removal fixture; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box; or, the chip rack is located above the shell at the non-driving end of the processing box and in the height direction of the processing box.
8. The chip rack disassembly fixture according to claim 1, characterized in that: The positioning portion includes a positioning surface and an avoidance groove, the avoidance groove is arranged on the positioning surface, the housing is provided with a positioning protrusion, the positioning surface abuts against the housing, and the positioning protrusion is stuck in the avoidance groove to position the chip rack disassembly fixture; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
9. The chip rack disassembly fixture according to claim 3, characterized in that: The disassembly portion is fixed on the fixture body, the chip frame is provided with a first clamping protrusion, and the disassembly portion is clamped on the first clamping protrusion to disassemble the chip frame.
10. The chip rack disassembly fixture according to claim 2, characterized in that: The disassembly part can be detachably fixed on the clamp body, and the disassembly part includes a disassembly protrusion and a contact surface. The chip frame is provided with a second engaging protrusion, and the disassembly protrusion is engaged with the second engaging protrusion. The contact surface contacts the side wall of the chip frame to disassemble the chip frame.
11. The chip rack disassembly fixture according to claim 10, characterized in that: The abutting surface is a plane or a serrated surface; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
12. The chip rack disassembly fixture according to claim 2, characterized in that: The disassembly part is movably arranged on the fixture body, and the disassembly part includes a cutter head for disassembling the chip rack and a cutter body receiving the driving force of the force applying part, and the cutter head is connected to the cutter body; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box; or, the chip rack is located above the shell at the non-driving end of the processing box and in the height direction of the processing box.
13. The chip rack disassembly fixture according to claim 12, characterized in that: The clamp body is provided with a slide groove, and the disassembly portion is arranged in the slide groove and can slide along the slide groove.
14. The chip rack disassembly fixture according to claim 13, characterized in that: The clamp body is also provided with a sliding hole, the sliding hole is communicated with the positioning portion, the sliding groove is communicated with the sliding hole, and the cutter head of the disassembling portion can extend into the positioning portion through the sliding hole.
15. The chip rack disassembly fixture according to claim 13, characterized in that: The blade body is provided with a pushed plate, the force-applying portion abuts against the pushed plate, and the force-applying portion pushes the disassembly portion to move through the pushed plate, so that the blade head extends between the chip frame and the housing.
16. The chip rack disassembly fixture according to claim 15, characterized in that: The disassembly portion includes a first disassembly member and a second disassembly member. The first disassembly member can disassemble the chip frame under the push of the force-applying member, and the second disassembly member can disassemble the chip in the chip frame under the push of the first disassembly member.
17. The chip rack disassembly fixture according to claim 2, characterized in that: The disassembly part is movably arranged on the fixture body, and the disassembly part includes a cutter head for disassembling the chip rack and a cutter body receiving the driving force of the force applying part, and the cutter head is connected to the cutter body; The clamp body is provided with a slide groove, the disassembling part is arranged in the slide groove and can slide along the slide groove, the clamp body is also provided with a slide hole, the slide hole is connected with the positioning part, the slide groove is connected with the slide hole, and the cutter head of the disassembling part can extend into the positioning part through the slide hole; A limiting portion is provided on the slide groove, and when the disassembling portion moves in the slide groove, the pushed plate on the blade is limited by the limiting portion; Wherein, the chip rack is located below the shell at the driving end of the processing box and in the height direction of the processing box.
18. The chip frame disassembly fixture according to claim 11, characterized in that: The disassembly portion has a disassembly protrusion, the disassembly protrusion is inserted between the chip frame and the shell, and the disassembly protrusion abuts against the chip frame to disassemble the chip frame.
19. The chip rack disassembly fixture according to any one of claims 1 to 8, characterized in that: The force-applying portion is fixedly connected to the clamp body or the disassembly portion; or, the force-applying portion is movably connected to the clamp body.
20. The chip rack disassembly fixture according to claim 19, characterized in that: The force-applying part includes a handle and a driving member, wherein the driving member is mounted on the fixture body and abuts against the disassembly part, and the driving member is connected to the handle. The handle can drive the driving member to move on the fixture body so that the driving member pushes the disassembly part to move and disassemble the chip rack.