FPC stamping die

Abstract

The utility model relates to an FPC stamping die, and relates to the technical field of flexible circuit board processing equipment, the FPC stamping die comprises a stamping die base and a support, the support is arranged on the base, the base is provided with a lower die, the support is provided with an upper die, the upper die is located right above the lower die, and the upper die is provided with a stamping driving part for driving the upper die to move in the vertical direction; a mounting groove for mounting the flexible circuit board is formed in the lower die, a lower die plate is inserted into the mounting groove, the lower die plate is in sliding connection with the inner wall of the mounting groove in the vertical direction, and a discharging driving part for driving the lower die plate to move in the vertical direction is arranged on the lower die plate. Through the arrangement of the lower die plate and the discharging driving piece, automatic discharging after FPC stamping machining can be achieved, and therefore the stamping machining efficiency is improved.

Description

Technical Field

[0001] The present application relates to the technical field of flexible circuit board processing equipment, and in particular to an FPC stamping die. Background Art

[0002] FPC is called "flexible printed circuit board" or "flexible board" in Chinese. It is a new type of circuit material made of polyimide or polyester film as the base material, with the characteristics of high wiring density, light weight, thin thickness and good bendability.

[0003] With the development of electronic equipment towards miniaturization, the demand for flexible circuit boards in society is increasing. In the process of making flexible circuit boards, it is necessary to stamp the flexible circuit boards so that the processed flexible circuit boards meet the required shape, which is convenient for subsequent operations. Stamping dies are often used for stamping flexible circuit boards. Stamping dies mainly include upper dies and lower dies. The flexible circuit board is often placed on the lower die, and then the upper die is stamped on the lower die to achieve the stamping of the flexible circuit board.

[0004] In order to improve the installation accuracy of the flexible circuit board on the lower die, a mounting groove is often opened on the lower die, and then the flexible circuit board is installed in the mounting groove to improve the installation accuracy of the flexible circuit board. However, after the stamping process of the flexible circuit board is completed, since the inner side wall of the mounting groove is generally in contact with the corresponding side wall of the flexible circuit board, it is difficult to remove the flexible circuit board from the mounting groove, which will prolong the material removal time of the flexible circuit board and reduce the efficiency of the stamping process. Utility Model Content

[0005] The present application provides an FPC stamping die, the purpose of which is to automatically cut the processed FPC under the premise of meeting the FPC stamping process, thereby improving the efficiency of the stamping process.

[0006] The FPC stamping die provided in this application adopts the following technical solution:

[0007] An FPC stamping die, comprising: a base and a bracket, wherein the bracket is arranged on the base, and a lower die is arranged on the base, an upper die is arranged on the bracket, the upper die is located directly above the lower die, and a stamping driving member for driving the upper die to move in a vertical direction is arranged on the upper die;

[0008] The lower mold is provided with an installation groove for installing a flexible circuit board, and a lower mold plate is inserted into the installation groove. The lower mold plate is slidably connected to the inner wall of the installation groove along the vertical direction, and a material discharge driving member is provided on the lower mold plate for driving the lower mold plate to move along the vertical direction.

[0009] By adopting the above technical solution, firstly, the coordinated arrangement of the base and the bracket can enable installation of other devices.

[0010] Secondly, the upper mold, the lower mold and the stamping drive cooperate. After the flexible circuit board is installed on the lower mold, the upper mold will be stamped onto the lower mold under the drive of the stamping drive, thereby stamping the flexible circuit board on the lower mold to realize the stamping process of the flexible circuit board.

[0011] The lower mold is provided with an installation groove for installing the flexible circuit board, which can improve the installation accuracy of the flexible circuit board. The lower mold plate and the material unloading driving member are arranged in the installation groove. The structure of the lower mold plate is selected according to the flexible circuit board to be processed, ensuring that the structure of the lower mold plate can meet the stamping processing requirements of the flexible circuit board.

[0012] Under the drive of the material unloading drive, the lower template can move in the vertical direction, so after the stamping process is completed, the lower template will push out the flexible circuit board through the drive of the material unloading drive, realizing the automatic unloading of the flexible circuit board. And because the lower template can fit the flexible circuit board, the flexible circuit board will not be deformed when it is ejected, thereby reducing the impact of automatic unloading on the flexible circuit board.

[0013] Optionally, the side wall of the installation groove is provided with a plurality of guide posts, and the guide posts are axially arranged along the vertical direction;

[0014] The upper side wall of the lower template is provided with a plurality of guide grooves, and the guide grooves penetrate the lower template in the vertical direction;

[0015] The guide grooves and the guide posts are arranged in one-to-one correspondence, and the guide posts are plug-fitted with the corresponding guide grooves. The guide posts are slidably connected with the inner side walls of the guide grooves along their own axial directions.

[0016] By adopting the above technical solution, the cooperation between the guide column and the guide groove can provide positioning for the lower template when installing the lower template, thereby improving the installation accuracy of the lower template; and during automatic unloading, the cooperation between the guide column and the guide groove can also guide and limit the movement of the lower template.

[0017] Optionally, a plurality of first holes are formed through the bottom of the installation groove, and a plurality of second holes are formed on the base, the first holes are arranged in one-to-one correspondence with the second holes, and the first holes are coaxially arranged and connected with the corresponding second holes;

[0018] The material unloading driving member includes a plurality of driving columns, each of which is arranged in a one-to-one correspondence with the first hole, one end of each driving column is plugged into the first hole, and the other end is plugged into the second hole, and each driving column is slidably connected to the inner wall of the first hole and the inner wall of the second hole along its own axial direction;

[0019] The support is provided with a pneumatic control device for providing gas, and the pneumatic control device is communicated with an end of the second hole away from the first hole.

[0020] By adopting the above technical solution, a first hole is opened at the bottom of the installation groove, and a second hole is opened on the base. The first hole is connected to the second hole. The driving column is arranged in the first hole and the second hole, and the driving column is slidingly connected to the inner wall of the first hole and the inner wall of the second hole along its own axial direction. A pneumatic control device is connected to the end of the second hole away from the first hole.

[0021] When the pneumatic control device injects gas into the second hole, the gas will push the driving column, causing the driving column to move along its own axial direction toward the lower template. Then, when the driving column hits the lower template, the hitting column can drive the lower template to move vertically upward, thereby realizing automatic unloading of the flexible circuit board.

[0022] Optionally, the driving column includes a sliding plate, an intermediate column and a top plate, one end of the intermediate column is coaxially connected to the sliding plate, and the other end is coaxially connected to the top plate, the sliding plate is plug-fitted with the corresponding second hole, and the sliding plate is slidably connected to the inner wall of the second hole along its own axis, the top plate is plug-fitted with the first hole, and the top plate is slidably connected to the inner wall of the first hole along its own axis;

[0023] A sealing ring is sleeved on the outer side wall of the sliding plate.

[0024] By adopting the above technical solution, the driving column includes a sliding plate, an intermediate column and a top plate. Since the sliding plate is located in the second hole and a sealing ring is provided on the outside of the sliding plate, the sealing ring can increase the sealing between the side wall of the sliding plate and the inner wall of the second hole, thereby ensuring that the gas injected into the second hole by the pneumatic control device can push the sliding plate to move, thereby enabling the sliding plate to drive the intermediate column and the top plate to move upward, thereby realizing the driving of the lower template.

[0025] Optionally, a negative pressure through hole is opened at one end of the driving column, and the negative pressure through hole runs through the driving column;

[0026] One-way exhaust valves are provided at both ends of the driving column, and the one-way exhaust valves are plugged into the negative pressure through holes;

[0027] The lower template is provided with a first negative pressure hole, the first negative pressure hole is arranged in one-to-one correspondence with the first hole, and the first negative pressure hole is communicated with the first hole.

[0028] By adopting the above technical solution, since the driving column is penetrated by a negative pressure through hole and both ends of the driving column are provided with one-way exhaust valves, the airflow in the negative pressure through hole can only flow from top to bottom, and cannot flow from bottom to top.

[0029] A first negative pressure hole is provided on the lower template, and the first negative pressure hole is communicated with the first hole.

[0030] Therefore, when the gas discharged from the pneumatic control device enters the second hole, the one-way exhaust valve cannot be turned on, so that the gas can only drive the column to move upward.

[0031] When the pneumatic control device absorbs the gas in the second hole, the one-way exhaust valve is turned on at this time, so that the gas on the upper side of the driving column will enter the pneumatic control device through the negative pressure through hole. Based on this principle, when the flexible circuit board is placed on the lower template, the pneumatic control device absorbs air, which can form negative pressure at the first negative pressure hole, thereby sucking the flexible circuit board and increasing the stability of the flexible circuit board fixation.

[0032] Optionally, a support groove is provided on the lower template, the support groove is arranged in one-to-one correspondence with the first negative pressure hole, and the support groove is communicated with the corresponding first negative pressure hole;

[0033] A mesh plate is inserted into the support groove, and a plurality of through holes are formed through the mesh plate, and some of the through holes are connected to the first negative pressure hole.

[0034] By adopting the above technical solution, the arrangement of the mesh plate in the support groove can support the flexible circuit board at the first negative pressure hole, thereby preventing the flexible circuit board from being deformed due to the suction force of the first negative pressure hole.

[0035] Optionally, the diameter of the second hole is greater than the diameter of the first hole, and a return spring is sleeved on the outer side of the driving column, one end of the return spring is connected to the lower mold, and the other end is connected to the driving column.

[0036] By adopting the above technical solution and setting the reset spring, after the lower template moves upward to eject the flexible circuit board, the pneumatic control device stops supplying air. At this time, under the action of the reset spring, the drive column will automatically reset, so that it can automatically wait for the next stamping process.

[0037] Optionally, a second negative pressure hole is formed through the bottom of the installation groove, a reset hole is formed on the base, one end of the reset hole is connected to the second negative pressure hole, and the other end of the reset hole is connected to the pneumatic control device.

[0038] By adopting the above technical solution, a second negative pressure hole is opened at the bottom of the installation groove, and a reset hole is opened on the base. The second negative pressure hole is connected to the pneumatic control device through the reset hole. Therefore, after the lower template is lifted up, the pneumatic control device absorbs the gas in the reset hole, so that negative pressure is formed at the second negative pressure hole, which can suck the lower template down and reset the lower template.

[0039] In summary, the present application includes at least one of the following beneficial technical effects:

[0040] 1. This application can realize automatic unloading after FPC stamping through the setting of the lower template and the unloading drive member, thereby improving the efficiency of the stamping process

[0041] 2. The present application can reinforce the FPC during stamping processing and ensure the stability of the FPC after installation by coordinating the negative pressure through hole, the first negative pressure hole and the pneumatic control device.

[0042] 3. The present application can achieve the fixation of the lower template and the automatic resetting of the lower template through the cooperation of the second negative pressure hole and the pneumatic control device, thereby improving the continuity and speed of FPC processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] Figure 1 It is a schematic diagram of the overall structure of the stamping die of the present application.

[0044] Figure 2 It is a schematic diagram of the cross-sectional structure of the lower mold and the base of the present application.

[0045] Figure 3 yes Figure 2 Schematic diagram of the local enlarged structure of part A.

[0046] Figure 4 yes Figure 2 Schematic diagram of the local enlarged structure of part B.

[0047] Figure 5 yes Figure 2 Schematic diagram of the local enlarged structure of part C in the middle.

[0048] In the figure, 1, base; 11, second hole; 12, air supply hole; 13, air supply pipeline; 14, reset hole; 15, reset tube; 2, bracket; 3, upper mold; 4, stamping drive member; 5, lower mold; 51, mounting groove; 52, first hole; 53, second negative pressure hole; 54, guide column; 6, lower mold plate; 61, first negative pressure hole; 62, supporting groove; 63, mesh plate; 64, guide groove; 7, unloading drive member; 71, drive column; 711, sliding plate; 712, middle column; 713, top plate; 714, reset spring; 715, cushion; 716, sealing ring; 717, negative pressure through hole; 718, one-way exhaust valve; 72, pneumatic control device. DETAILED DESCRIPTION

[0049] The following is combined with Figure 1 -Attached Figure 5 , further details of this application are given.

[0050] A FPC stamping die, refer to Figure 1, including a base 1 and a bracket 2, the bracket 2 is fixed on the base 1, an upper die 3 is arranged on the bracket 2, a lower die 5 is arranged on the base 1, the upper die 3 and the lower die 5 are arranged opposite to each other in the vertical direction, and a stamping drive 4 is arranged between the upper die 3 and the bracket 2. In this embodiment, the stamping drive 4 adopts a hydraulic cylinder. A flexible circuit board is installed on the lower die 5, and then under the drive of the stamping drive 4, the upper die 3 will be stamped onto the lower die 5, so as to perform stamping processing on the flexible circuit board on the lower die 5.

[0051] Reference Figure 1 and Figure 2 A mounting groove 51 is provided on the upper side of the lower mold 5. The mounting groove 51 is used to load the flexible circuit board, so that the mounting accuracy of the flexible circuit board is higher.

[0052] Reference Figure 1 and Figure 2 The bottom of the mounting groove 51 is provided with a lower template 6. The structure of the lower template 6 is selected according to the flexible circuit board that needs to be processed, ensuring that the structure of the lower template 6 can meet the stamping processing requirements of the flexible circuit board.

[0053] Reference Figure 1 and Figure 2 The lower template 6 is slidably connected with the inner wall of the mounting groove 51 along the vertical direction, and a material unloading driving member 7 is arranged between the lower template 6 and the base 1, and the driving direction of the material unloading driving member 7 is arranged along the vertical direction. Driven by the material unloading driving member 7, the lower template 6 can move in the vertical direction, so that after the stamping process of the flexible circuit board is completed, the material unloading driving member 7 can drive the lower template 6 to push the flexible circuit board out of the mounting groove 51, thereby realizing automatic unloading.

[0054] Reference Figure 2 and Figure 3 The material unloading driving member 7 includes a plurality of driving columns 71, and the driving columns 71 are axially arranged in the vertical direction. A plurality of first holes 52 are provided through the bottom of the mounting groove 51, and a plurality of second holes 11 are provided on the base 1. The first holes 52 are provided in a one-to-one correspondence with the second holes 11, and the first holes 52 and the corresponding second holes 11 are coaxially arranged in the vertical direction and are connected to each other. The driving columns 71 are provided in a one-to-one correspondence with the first holes 52, and the upper ends of the driving columns 71 are plugged in with the corresponding first holes 52, and the lower ends are plugged in with the corresponding second holes 11. The driving columns 71 are slidably connected with the corresponding inner walls of the first holes 52 and the corresponding inner walls of the second holes 11 along their own axial directions.

[0055] Reference Figure 1 and Figure 2The base 1 is also provided with a plurality of air supply holes 12, which are arranged one-to-one with the second holes 11, and one end of the air supply hole 12 is connected with the lower end of the corresponding second hole 11. The base 1 is also provided with a pneumatic control device 72 and a plurality of air supply pipes 13, which are arranged one-to-one with the air supply holes 12, and one end of the air supply pipe 13 is connected with the corresponding air supply hole 12, and the other end is connected with the pneumatic control device 72.

[0056] Gas can be introduced into the corresponding air supply pipe 13 through the pneumatic control device 72, so that the driving column 71 can move vertically upward, and then the lower template 6 can be driven to move vertically upward, thereby realizing automatic unloading of the flexible circuit board.

[0057] In this embodiment, the pneumatic control device 72 adopts an air supply system that can supply air into the second hole 11 and extract the air in the second hole 11.

[0058] Reference Figure 3 The driving column 71 includes a sliding plate 711, an intermediate column 712 and a top plate 713. The intermediate column 712 is axially arranged in the vertical direction. The lower end of the intermediate column 712 is coaxially arranged with the sliding plate 711, and the upper end of the intermediate column 712 is coaxially arranged with the top plate 713. The top plate 713 is plugged and matched with the corresponding first hole 52, and the top plate 713 is slidably connected with the inner wall of the corresponding first hole 52 along its own axial direction. A soft pad 715 is arranged on the upper end of the top plate 713, and the soft pad 715 can reduce the impact force between the top plate 713 and the lower template 6. The sliding plate 711 is plugged and matched with the corresponding second hole 11, and the sliding plate 711 is slidably connected with the inner wall of the corresponding second hole 11 along its own axial direction. A sealing ring 716 is arranged on the outer wall of the sliding plate 711, and the sealing ring 716 can increase the sealing between the side wall of the sliding plate 711 and the inner wall of the second hole 11.

[0059] When gas is injected into the second hole 11, due to the cooperation between the sliding plate 711 and the sealing ring 716, the gas can only push the sliding plate 711 to move upward, thereby driving the middle column 712 and the top plate 713 to move upward, so that the soft pad 715 on the top plate 713 can resist the lower template 6, thereby realizing the driving of the lower template 6 in the vertical direction.

[0060] Reference Figure 3 The diameter of the second hole 11 is larger than the diameter of the first hole 52, and a return spring 714 is sleeved on the outer side of the intermediate column 712, the lower end of the return spring 714 is connected to the sliding plate 711, and the upper end of the return spring 714 is connected to the lower side wall of the lower mold 5. The return spring 714 is arranged so that after the driving column 71 moves upward to lift the lower mold plate 6, the return spring 714 can return the driving column 71 to its original position.

[0061] Reference Figure 2 and Figure 3, a plurality of first negative pressure holes 61 are formed through the lower template 6, and the first negative pressure holes are arranged one by one corresponding to the first holes 52, and the first negative pressure holes 61 are connected to the corresponding first holes 52. A negative pressure through hole 717 is formed at the upper end of the driving column 71, and the negative pressure through hole 717 passes through the soft pad 715, the top plate 713, the middle column 712 and the sliding plate 711 in the vertical direction, and a one-way exhaust valve 718 is provided on both the top plate 713 and the sliding plate 711, and the one-way exhaust valve 718 is inserted into the negative pressure through hole 717.

[0062] Reference Figure 2 and Figure 3 Due to the setting of the one-way exhaust valve 718, the airflow passing through the negative pressure through hole 717 can only pass through the soft cushion 715, the top plate 713, the middle column 712 and the sliding plate 711 from top to bottom and finally enter the pneumatic control device 72, while the airflow with the opposite flow direction cannot enter the negative pressure through hole 717.

[0063] When the gas discharged by the pneumatic control device 72 enters the second hole 11, the one-way exhaust valve 718 cannot be turned on, so the gas can only push the sliding plate 711 to move upward. When the pneumatic control device 72 absorbs the gas in the second hole 11, the one-way exhaust valve 718 is turned on at this time, so that the gas on the upper side of the top plate 713 will enter the pneumatic control device 72 through the negative pressure through hole 717. With such a setting, when the flexible circuit board is placed on the lower template 6, the pneumatic control device 72 absorbs air, which can form a negative pressure at the first negative pressure hole 61, thereby sucking the flexible circuit board and increasing the stability of the flexible circuit board fixation.

[0064] Reference Figure 2 and Figure 4 , the lower template 6 is also provided with a support groove 62, which is arranged one-to-one with the first negative pressure hole 61, and the support groove 62 is coaxially arranged with the corresponding first negative pressure hole 61 and is connected to each other. A mesh plate 63 is inserted into the support groove 62, and a plurality of through holes are arranged on the mesh plate 63, and a through hole is connected to the first negative pressure hole 61. The mesh plate 63 can support the flexible circuit board at the first negative pressure hole 61 to prevent the flexible circuit board from being deformed due to the suction force of the first negative pressure hole 61. Specifically, the shape, size and number of the first hole 52 and the support groove 62 are set according to actual conditions.

[0065] Reference Figure 1 and Figure 2 A second negative pressure hole 53 is formed through the bottom of the mounting groove 51, a reset hole 14 is formed on the upper side of the base 1, a reset tube 15 is arranged on the base 1, one end of the reset tube 15 is connected to the pneumatic control device 72, and the other end is connected to the reset hole 14, and the end of the reset hole 14 away from the reset tube 15 is connected to the second negative pressure hole 53.

[0066] After the lower mold plate 6 is lifted up, the pneumatic control device 72 absorbs the gas in the reset hole 14, so that negative pressure is formed at the second negative pressure hole 53, which can absorb the lower mold plate 6 to descend and reset the lower mold plate 6.

[0067] Reference Figure 2 and Figure 5 , a plurality of guide posts 54 are arranged on the inner side wall of the installation groove 51, and a plurality of guide grooves 64 are opened on the side wall of the lower template 6, the guide posts 54 and the guide grooves 64 are arranged one by one, the guide posts 54 are arranged axially in the vertical direction, the guide grooves 64 penetrate the lower template 6 in the vertical direction, the guide posts 54 and the corresponding guide grooves 64 are plug-fitted, and the guide posts 54 are slidably connected with the inner wall of the corresponding guide grooves 64 along their own axial direction. The cooperation between the guide posts 54 and the guide grooves 64 has a positioning and guiding effect on the lower template 6.

[0068] The implementation principle of the embodiment of the present application is: after the flexible circuit board is loaded into the installation groove 51, the flexible circuit board is sucked by the first negative pressure hole 61, and then under the drive of the stamping drive member 4, the upper mold 3 and the lower mold 5 are closed to realize the stamping process of the flexible circuit board.

[0069] After the stamping process is completed, the upper die 3 is reset under the action of the stamping drive 4. At this time, the driving column 71 moves upward and lifts the lower die plate 6, and the lower die plate 6 moves upward to realize automatic unloading of the flexible circuit board. After unloading is completed, the driving column 71 is reset under the action of the reset spring 714, and the lower die plate 6 is quickly reset under the suction of the second negative pressure hole 53. Then wait for the next stamping process.

[0070] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An FPC stamping die, characterized in that: include: A base (1) and a bracket (2), wherein the bracket (2) is arranged on the base (1), and a lower die (5) is arranged on the base (1), an upper die (3) is arranged on the bracket (2), the upper die (3) is located directly above the lower die (5), and a stamping drive member (4) is arranged on the upper die (3) for driving the upper die (3) to move in a vertical direction; The lower mold (5) is provided with a mounting groove (51) for mounting a flexible circuit board, a lower mold plate (6) is inserted into the mounting groove (51), the lower mold plate (6) is slidably connected to the inner wall of the mounting groove (51) in a vertical direction, and a material discharge driving member (7) is provided on the lower mold plate (6) for driving the lower mold plate (6) to move in a vertical direction.

2. The FPC stamping die according to claim 1, characterized in that: A plurality of guide columns (54) are provided on the side wall of the installation groove (51), and the guide columns (54) are axially arranged along the vertical direction; The upper side wall of the lower template (6) is provided with a plurality of guide grooves (64), and the guide grooves (64) penetrate the lower template (6) in the vertical direction; The guide grooves (64) and the guide posts (54) are arranged in a one-to-one correspondence, and the guide posts (54) are plug-fitted into the corresponding guide grooves (64), and the guide posts (54) are slidably connected to the inner side walls of the guide grooves (64) along their own axial directions.

3. The FPC stamping die according to claim 1, characterized in that: A plurality of first holes (52) are formed through the bottom of the installation groove (51), and a plurality of second holes (11) are formed on the base (1), wherein the first holes (52) and the second holes (11) are arranged in a one-to-one correspondence, and the first holes (52) and the corresponding second holes (11) are coaxially arranged and communicated with each other; The material unloading driving member (7) comprises a plurality of driving columns (71), wherein the driving columns (71) are arranged in a one-to-one correspondence with the first holes (52), one end of the driving column (71) is plugged into the first hole (52), and the other end is plugged into the second hole (11), and the driving column (71) is slidably connected to the inner wall of the first hole (52) and the inner wall of the second hole (11) along its own axial direction; The support (2) is provided with a pneumatic control device (72) for providing gas, and the pneumatic control device (72) is connected to an end of the second hole (11) away from the first hole (52).

4. The FPC stamping die according to claim 3, characterized in that: The driving column (71) comprises a sliding plate (711), an intermediate column (712) and a top plate (713); one end of the intermediate column (712) is coaxially connected to the sliding plate (711), and the other end is coaxially connected to the top plate (713); the sliding plate (711) is plug-fitted with the corresponding second hole (11), and the sliding plate (711) is slidably connected to the inner wall of the second hole (11) along its own axis; the top plate (713) is plug-fitted with the first hole (52), and the top plate (713) is slidably connected to the inner wall of the first hole (52) along its own axis; A sealing ring (716) is sleeved on the outer side wall of the sliding plate (711).

5. The FPC stamping die according to claim 3, characterized in that: A negative pressure through hole (717) is formed at one end of the driving column (71), and the negative pressure through hole (717) passes through the driving column (71); One-way exhaust valves (718) are provided at both ends of the driving column (71), and the one-way exhaust valves (718) are inserted into the negative pressure through holes (717); The lower template (6) is provided with a first negative pressure hole (61), the first negative pressure hole (61) and the first hole (52) are arranged in a one-to-one correspondence, and the first negative pressure hole (61) is communicated with the first hole (52).

6. The FPC stamping die according to claim 5, characterized in that: The lower template (6) is provided with a support groove (62), the support groove (62) and the first negative pressure hole (61) are arranged in a one-to-one correspondence, and the support groove (62) is communicated with the corresponding first negative pressure hole (61); A mesh plate (63) is inserted into the support groove (62), and a plurality of through holes are formed through the mesh plate (63), and some of the through holes are connected to the first negative pressure hole (61).

7. The FPC stamping die according to claim 3, characterized in that: The diameter of the second hole (11) is greater than the diameter of the first hole (52); a return spring (714) is sleeved on the outside of the driving column (71); one end of the return spring (714) is connected to the lower mold (5), and the other end is connected to the driving column (71).

8. The FPC stamping die according to claim 3, characterized in that: A second negative pressure hole (53) is formed through the bottom of the mounting groove (51), and a reset hole (14) is formed on the base (1). One end of the reset hole (14) is connected to the second negative pressure hole (53), and the other end of the reset hole (14) is connected to the pneumatic control device (72).

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