High-reliability MEMS infrared light source

Abstract

The utility model relates to a high-reliability MEMS (Micro Electro Mechanical System) infrared light source, which comprises a base, a packaging gasket, an infrared light source chip, a light condensing cup and an infrared window, the packaging gasket is arranged on the base; the infrared light source chip is supported and mounted through a packaging gasket, and a gap is formed between the infrared light source chip and the surface of the base; the light condensing cup is mounted on the base and used for collimating and focusing infrared light radiated by the infrared light source chip; the infrared window is mounted in the clamping groove of the light condensing cup; according to the MEMS infrared light source, through a method of adding gasket packaging, the loss of heat transmitted from the infrared light source chip to the base is reduced, the power consumption of the MEMS infrared light source is reduced, air below a radiation area of the infrared light source is communicated with the outside through gasket packaging, the vibration amplitude of the supporting film when the MEMS infrared light source works is greatly reduced, and the reliability of the MEMS infrared light source is improved. Therefore, the long-term reliability of the MEMS infrared light source is improved.

Description

Technical Field

[0001] The utility model relates to the field of infrared gas sensors, in particular to a high-reliability MEMS infrared light source. Background Art

[0002] Infrared gas sensors based on the principle of infrared absorption of gas are widely used in medical, environmental protection, industrial safety and other fields due to their advantages of anti-poisoning, excellent long-term stability, wide temperature range and low maintenance cost. Infrared light source is an indispensable component of infrared gas sensor, and the long-term reliability of infrared gas sensor mainly depends on the infrared light source. MEMS infrared light source based on MEMS processing technology has the advantages of low power consumption, small size, low cost, high radiation energy and excellent electrical modulation performance, and has gradually replaced small infrared bulbs to become the mainstream of market application.

[0003] Due to the performance requirements of infrared gas sensors, the MEMS infrared light source needs to work in a flashing state. When the power is on, the light source heats up and lights up, and when the power is off, the light source cools down and goes out. Usually, the temperature difference between when the light source is on and when it is off exceeds 400°C. The thermal stress generated and the thermal expansion and contraction of the air under the radiation area of ​​the light source cause the supporting film of the MEMS infrared light source to be in a vibrating state when the MEMS infrared light source is working. This makes the supporting film of the MEMS infrared light source very easy to crack and make the light source fail. In addition, the MEMS infrared light source is a thermal radiation light source based on the principle of Joule heat. When it is heated, its center temperature exceeds 500°C. The power consumption also limits the practical application of MEMS infrared light sources in low power consumption requirements. Utility Model Content

[0004] The purpose of the utility model is to overcome the deficiencies of the prior art and provide a high-reliability MEMS infrared light source, which can not only reduce the power consumption of the MEMS infrared light source, but also reduce the vibration amplitude of the supporting film when the MEMS infrared light source is working, reduce the risk of the supporting film breaking when the MEMS infrared light source works for a long time, and improve the reliability of the MEMS infrared light source.

[0005] To achieve the above-mentioned purpose, the technical solution adopted by the utility model is: a high-reliability MEMS infrared light source, comprising a base, a packaging gasket, an infrared light source chip, a focusing cup and an infrared window;

[0006] The packaging gasket is placed on the base;

[0007] The infrared light source chip is supported and installed by a packaging gasket, and a gap is provided between the infrared light source chip and the surface of the base;

[0008] The focusing cup is installed on the base to collimate and focus the infrared light radiated by the infrared light source chip;

[0009] The infrared window is installed in the card slot of the focusing cup.

[0010] Preferably, the packaging gasket supports the infrared light source chip at four corners, four center sides or two opposite sides.

[0011] Preferably, the base is one of a TO metal tube base and a ceramic tube base.

[0012] Preferably, the packaging gasket is a silicon wafer or a glass wafer, and has a thickness of 0.3 to 0.5 mm.

[0013] Preferably, the infrared light source chip is a MEMS infrared light source, and its structure includes a substrate, a support film, a heating layer, a passivation layer, and a radiation layer.

[0014] Preferably, the focusing cup is made of stainless steel, aluminum, etc., and includes at least one optical curved surface for collimating and focusing the infrared light radiated by the infrared light source chip.

[0015] Preferably, the infrared window is made of one of silicon, germanium, sapphire, barium fluoride and zinc sulfide, and has a thickness of 0.3 to 1 mm.

[0016] Due to the application of the above technical solution, the utility model has the following advantages compared with the prior art:

[0017] The utility model increases the gasket packaging method, which not only reduces the heat loss transmitted from the infrared light source chip to the base and reduces the power consumption of the MEMS infrared light source, but also the gasket packaging allows the air below the infrared light source radiation area to be connected to the outside world, greatly reducing the vibration amplitude of the supporting film when the MEMS infrared light source is working, thereby improving the long-term reliability of the MEMS infrared light source. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The technical solution of the utility model is further described below in conjunction with the accompanying drawings:

[0019] Attached Figure 1 This is a structural diagram of the high-reliability MEMS infrared light source described in the utility model;

[0020] Attached Figure 2 This is a gasket packaging diagram of the high-reliability MEMS infrared light source described in the utility model;

[0021] Attached Figure 3 This is a production flow chart of the high-reliability MEMS infrared light source described in the utility model.

[0022] Among them: 1. Base; 2. Packaging gasket; 3. Infrared light source chip; 4. Focusing cup; 5. Focusing cup optical surface; 6. Infrared window. DETAILED DESCRIPTION

[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0024] Attached Figure 1 The high-reliability MEMS infrared light source described in the utility model comprises a base 1, a packaging gasket 2, a MEMS infrared light source chip 3, a focusing cup 4, and an infrared window 6;

[0025] The packaging gasket 2 is placed on the base 1, the infrared light source chip 3 is supported and installed by the packaging gasket, with a certain gap from the surface of the base, the infrared light source chip 3 faces upward, the focusing cup 4 is installed on the base, the focusing cup optical surface 5 collimates and focuses the infrared light radiated by the infrared light source chip, and the infrared window 6 is installed in the focusing cup slot.

[0026] like Figure 2 As shown, this embodiment adopts a four-corner support method to support the MEMS infrared light source chip 3 through the packaging gasket 2, which avoids direct contact between the infrared light source chip 3 and the base 1, reduces heat loss caused by heat conduction, and thus reduces the power consumption of the infrared light source. Secondly, the air under the radiation area of ​​the infrared light source chip is connected to the outside world, thereby avoiding the vibration of the supporting film caused by thermal expansion and contraction of the air under the radiation area when the light source flickers, thereby improving the long-term reliability of the MEMS infrared light source.

[0027] In addition, the embodiment of the utility model also provides a method for manufacturing a high-reliability MEMS infrared light source, which specifically includes the following steps:

[0028] Step S01, providing a packaging base, the base being a TO metal tube base;

[0029] Step S02, dispensing glue on the base, the dispensing shape is four points, corresponding to the four corners of the MEMS infrared light source chip, placing a packaging gasket at the dispensing position, and curing the patch glue;

[0030] Step S03, dispensing glue on the packaging gasket, attaching the infrared light source chip, and curing the patch glue;

[0031] Step S04, installing a focusing cup on the base, with the infrared light source chip located at the center of the focusing cup.

[0032] Step S05, installing an infrared window on the focusing cup slot on the base.

[0033] In this example, the light source chip is supported by adding a gasket package, which not only reduces the power consumption of the MEMS infrared light source, but also improves the long-term reliability of the MEMS infrared light source.

[0034] In this example, an optical surface is provided in the focusing cup, and its function is to collimate and focus the infrared light radiated by the MEMS infrared light source chip. The shape of the optical surface is flexibly designed according to the optical path of the back-end application.

[0035] In this example, the infrared window is a circular window with a diameter of 2 to 10 mm and a thickness of 0.3 to 1 mm. The material of the infrared window is selected according to the infrared band, cost, size and other requirements required by the application.

[0036] In this embodiment, the target application is low-cost carbon dioxide gas detection, and silicon is selected as the infrared window.

[0037] The above are only specific application examples of the utility model, and do not constitute any limitation on the protection scope of the utility model. Any technical solution formed by equivalent transformation or equivalent replacement falls within the protection scope of the utility model.

Claims

1. A high reliability MEMS infrared light source, characterized in that: It includes a base, a packaging gasket, an infrared light source chip, a focusing cup and an infrared window; The packaging gasket is placed on the base; The infrared light source chip is supported and installed by a packaging gasket, and a gap is provided between the infrared light source chip and the surface of the base; The focusing cup is installed on the base to collimate and focus the infrared light radiated by the infrared light source chip; The infrared window is installed in the card slot of the focusing cup.

2. The high reliability MEMS infrared light source according to claim 1, characterized in that: The base is one of a TO metal tube base and a ceramic tube base.

3. The high reliability MEMS infrared light source according to claim 1, characterized in that: The packaging gasket is a silicon wafer or a glass wafer, and its thickness is 0.3-0.5 mm.

4. The high reliability MEMS infrared light source according to claim 1, characterized in that: The infrared light source chip is a MEMS infrared light source, and its structure includes a substrate, a support film, a heating layer, a passivation layer, and a radiation layer.

5. The high reliability MEMS infrared light source according to claim 1, characterized in that: The focusing cup is made of stainless steel or aluminum and includes at least one optical curved surface for collimating and focusing the infrared light radiated by the infrared light source chip.

6. The high reliability MEMS infrared light source according to claim 1, characterized in that: The infrared window is made of one of silicon, germanium, sapphire, barium fluoride and zinc sulfide, and has a thickness of 0.3-1 mm.

7. The high-reliability MEMS infrared light source according to any one of claims 1 to 6, characterized in that: The packaging gasket supports the four corner positions, the center positions of four sides or the two opposite sides of the infrared light source chip.

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