Wafer coating jig and coating equipment

Abstract

The utility model provides a wafer coating jig and coating equipment, and relates to the technical field of semiconductor equipment. The wafer coating jig comprises a first coating disc and a second coating disc. A first liquid injection hole and a first spraying hole communicated with the first liquid injection hole are formed in the first coating disc; a second liquid injection hole and a second spraying hole communicated with the second liquid injection hole are formed in the second coating disc; the first liquid injection hole is communicated with the second liquid injection hole; the first coating disc and the second coating disc are coaxially connected and can rotate relatively; and the diameter of the first coating disc is smaller than that of the second coating disc. According to the wafer coating jig, partitioned coating can be achieved, deposition of colloid on the edge of the wafer is reduced, the edge washing process can be omitted, and the gluing quality is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor equipment, in particular to a wafer coating jig and coating equipment. Background Art

[0002] With the rapid development of the semiconductor industry, fan-out or fan-in wafer-level packaging structures are widely used in the semiconductor industry. At present, when the wafer is coated with photoresist, a photoresist layer is formed on the surface of the wafer by a machine rotation spraying method to meet the subsequent exposure and development process. After the pattern layer is formed on the photoresist layer, the circuit layer is formed on the pattern layer by electroplating.

[0003] In the prior art, in the process of applying photoresist, most of the coating jigs use a single coating plate with spray holes designed on the coating plate. The coating liquid applied to the wafer is in the middle area of ​​the wafer, and the coating liquid covers the surface of the wafer to form a glue layer by rotating the wafer. This method has linear glue layer marks and uneven glue layer coating during the spin coating process. More colloid will be deposited on the edge of the wafer due to centrifugal force, resulting in poor coplanarity of the coated glue layer. Utility Model Content

[0004] The utility model aims to provide a wafer coating jig and coating equipment, which can improve the uniformity of glue coating and the quality of glue coating.

[0005] The embodiment of the utility model is achieved as follows:

[0006] In a first aspect, the utility model provides a wafer coating jig, comprising:

[0007] A first coating plate; the first coating plate is provided with a first liquid injection hole and a first spray hole connected to the first liquid injection hole;

[0008] A second coating plate; the second coating plate is provided with a second liquid injection hole and a second spray hole connected to the second liquid injection hole;

[0009] The first liquid injection hole is connected to the second liquid injection hole; the first coating disc and the second coating disc are coaxially connected and can rotate relatively; the diameter of the first coating disc is smaller than the diameter of the second coating disc.

[0010] In an optional embodiment, one of the first coating disc and the second coating disc is provided with a first rotating boss, and the other is provided with a first rotating hole, and the first rotating boss is rotatably disposed in the first rotating hole.

[0011] In an optional embodiment, the first rotating hole, the first rotating boss, the first liquid injection hole and the second liquid injection hole are located on the same axis.

[0012] In an optional embodiment, a first flow channel for connecting the first liquid injection hole and the first spray hole is provided on the first coating disk; and a control valve is provided on the first flow channel or the first spray hole.

[0013] In an optional embodiment, a second flow channel for connecting the second liquid injection hole and the second spray hole is provided on the second coating disk; and a control valve is provided on the second flow channel or the second spray hole.

[0014] In an optional embodiment, it further comprises a third coating disk, wherein the third coating disk is provided with a third liquid injection hole and a third spray hole connected to the third liquid injection hole;

[0015] The third coating disc is rotatably connected to the second coating disc, and the third coating disc and the second coating disc are coaxially arranged.

[0016] In an optional embodiment, one of the third coating disk and the second coating disk is provided with a second rotating boss, and the other is provided with a second rotating hole, and the second rotating boss is rotatably disposed in the second rotating hole.

[0017] In an optional embodiment, the second rotating boss is provided with a second center hole, and two ends of the second center hole are respectively connected to the second injection hole and the third injection hole.

[0018] In an optional embodiment, the third coating disc is provided with a third flow channel for connecting the third liquid injection hole and the third spray hole; the third flow channel or the third spray hole is provided with a control valve.

[0019] In a second aspect, the utility model provides a coating device, comprising a carrier and a wafer coating jig as described in any one of the aforementioned embodiments, wherein the carrier is used to place a wafer, and the wafer coating jig is rotatably disposed above the carrier.

[0020] The wafer coating jig and coating equipment provided by the embodiments of the present invention have the following beneficial effects:

[0021] The wafer coating jig provided by the utility model adopts at least two coating disks, which can be used to coat the wafer with glue in different areas. During the coating process, the coating disk can rotate while the wafer is fixed, which can effectively alleviate the problem of excessive deposition on the edge of the wafer due to centrifugal force, improve the coating quality, and facilitate the elimination of the edge washing process, thereby improving the process efficiency.

[0022] The coating equipment provided by the utility model includes the above-mentioned wafer coating fixture, which can effectively alleviate the problem of excessive colloid deposition on the edge of the wafer due to centrifugal force, improve the quality of glue coating, improve the coplanarity of the coated colloid, and improve the process efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0024] Figure 1 A schematic diagram of the first structure of a wafer coating jig provided by an embodiment of the utility model;

[0025] Figure 2 A schematic diagram of the disassembly of a first structure of a wafer coating jig provided by an embodiment of the utility model;

[0026] Figure 3 A structural schematic diagram of a first coating plate of a wafer coating jig provided by an embodiment of the utility model from one viewing angle;

[0027] Figure 4 A structural schematic diagram of a second coating plate of a wafer coating fixture provided by an embodiment of the utility model from one viewing angle;

[0028] Figure 5 A second structural schematic diagram of a wafer coating jig provided by an embodiment of the utility model;

[0029] Figure 6 A schematic diagram of the disassembly of the second structure of the wafer coating jig provided by an embodiment of the utility model;

[0030] Figure 7 A schematic structural diagram of a third coating plate of a wafer coating fixture provided in an embodiment of the utility model from one perspective.

[0031] Icons: 100-wafer coating jig; 110-first coating plate; 111-first spray hole; 112-boss; 113-first rotating boss; 114-first center hole; 115-second surface; 120-second coating plate; 121-second spray hole; 123-first rotating hole; 125-second rotating boss; 126-second center hole; 130-third coating plate; 131-third spray hole; 133-second rotating hole; 135-third injection hole. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0033] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0035] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, or the positions or positional relationships in which the utility model product is usually placed when in use, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific position, be constructed and operated in a specific position, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0036] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0037] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] Please refer to Figures 1 to 4 The present embodiment provides a wafer coating jig 100, comprising at least two coating discs, namely a first coating disc 110 and a second coating disc 120. The first coating disc 110 is provided with a first liquid injection hole and a first spray hole 111 connected to the first liquid injection hole; the second coating disc 120 is provided with a second liquid injection hole and a second spray hole 121 connected to the second liquid injection hole; the first liquid injection hole and the second liquid injection hole are connected; the first coating disc 110 and the second coating disc 120 are coaxially connected and can rotate relative to each other; the diameter of the first coating disc 110 is smaller than the diameter of the second coating disc 120. The wafer coating jig 100 can realize zoned coating, reduce the deposition of colloid on the edge of the wafer, save the edge washing process, and improve the coating quality.

[0039] One of the first coating disc 110 and the second coating disc 120 is provided with a first rotating boss 113, and the other is provided with a first rotating hole 123, and the first rotating boss 113 is rotatably arranged in the first rotating hole 123. The first coating disc 110 and the second coating disc 120 are arranged in a stacked manner. In the present embodiment, the first coating disc 110 is provided with a first rotating boss 113 at the center, and the second coating disc 120 is provided with a first rotating hole 123 at the center, and the first rotating boss 113 is inserted into the first rotating hole 123, and the first coating disc 110 and the second coating disc 120 can rotate relative to each other. Of course, in some embodiments, the first rotating hole 123 may also be provided on the first coating disc 110, and the first rotating boss 113 may be provided on the second coating disc 120. No specific limitation is made here.

[0040] It can be understood that the first coating disk 110 includes a first surface and a second surface 115 that are arranged opposite to each other, a first liquid injection hole is provided on the first surface, and a plurality of first spray holes 111 are provided on the second surface 115, and a first flow channel (not shown) is provided between the first surface and the second surface 115, and the first flow channel can be provided along the radial direction of the first coating disk 110 to connect the first liquid injection hole and the first spray hole 111. The plurality of first spray holes 111 can be evenly distributed along an annular array, or distributed in a rectangular array, or distributed along any other shape. During coating, the first coating disk 110 is provided with a side of the first spray hole 111 facing the wafer. The coating liquid, such as the photoresist liquid, enters from the first liquid injection hole, enters the first spray hole 111 through the first flow channel, and is thus coated on the surface of the wafer. In this embodiment, the wafer is fixed on the table and does not move, and the first coating disk 110 rotates to spin-coat the coating liquid onto the wafer.

[0041] Optionally, the second surface 115 of the first coating plate 110 is provided with a plurality of bosses 112, and each boss 112 is provided with a first spray hole 111. This can provide a better flow guide for the coating liquid, which is beneficial to improving the coating quality.

[0042] The first injection hole can be provided on the first coating disk 110, and is spaced apart from the first rotating boss 113. In the present embodiment, the first rotating boss 113 is provided on the first surface. In order to make the structure more compact and the coating liquid can flow into each first spray hole 111 more evenly, the first injection hole is also provided at the center of the first coating disk 110. The first injection hole, the first rotating boss 113, the first rotating hole 123 and the second injection hole are located on the same axis. A first center hole 114 is axially opened on the first rotating boss 113 as the first injection hole. It can be understood that the hole wall of the first center hole 114 is provided with an opening for communicating with the first flow channel.

[0043] The first rotating hole 123 and the second spray hole 121 are arranged on the same surface of the second coating disc 120. Optionally, the first rotating hole 123 is a through hole that passes through the second coating disc 120. In this way, the first rotating hole 123 can be used to install the first rotating boss 113 and can also be used as the second liquid injection hole, the structure is more compact, and the structural strength of the first coating disc 110 and the second coating disc 120 is greater. The second coating disc 120 is provided with a second flow channel, and the second flow channel is used to connect the second liquid injection hole and the second spray hole 121.

[0044] In this way, during actual coating, the coating liquid enters from the second injection hole, enters the second spray hole 121 through the second flow channel, and can also enter the first spray hole 111 from the first center hole 114 through the first flow channel to achieve spraying on the wafer. It can be understood that the size of the first coating plate 110 is smaller, which can achieve spraying on the center area of ​​the wafer, and the size of the second coating plate 120 is larger, which can achieve spraying on the area relatively close to the edge of the wafer. In this way, the first coating plate 110 and the second coating plate 120 rotate relative to the wafer in different areas to achieve spraying, which can solve the problem of excessive colloid deposition on the edge of the wafer caused by the centrifugal force generated by the rotation of the wafer in the prior art, improve the uniformity of colloid coating, improve the coating quality, and solve the problem of poor coplanarity after colloid coating.

[0045] Optionally, the first flow channel or the first spray hole 111 is provided with a control valve (not shown). The control valve can control the opening and closing of the first spray hole 111. According to the actual coating situation, the first spray hole 111 in a specific area can be selectively controlled to be opened or closed to adjust the coating area. Similarly, the second coating plate 120 is provided with a second flow channel for connecting the second injection hole and the second spray hole 121; the second flow channel or the second spray hole 121 is provided with a control valve. The control valve can control the opening and closing of the second spray hole 121. According to the actual coating situation, the second spray hole 121 in a specific area can be selectively controlled to be opened or closed to adjust the coating area.

[0046] The number of coating discs is not limited to two, but can be three, four, five or more. Multiple coating discs are stacked and each coating disc can be rotated independently. The diameters of the multiple coating discs gradually increase from the direction close to the wafer to the direction away from the wafer.

[0047] Combination Figures 5 to 7 Optionally, in some embodiments, the wafer coating jig 100 further includes a third coating plate 130, and the third coating plate 130 is provided with a third liquid injection hole 135 and a third spray hole 131 connected to the third liquid injection hole 135. The third coating plate 130 is provided with a third flow channel connected to the third liquid injection hole 135 and the third spray hole 131, and the third flow channel or the third spray hole 131 is provided with a control valve. The control valve can control the opening and closing of the third spray hole 131. The connection mode, rotation principle, coating liquid flow path, etc. of the third coating plate 130 and the second coating plate 120 are similar to the connection mode, rotation principle and coating liquid flow path of the second coating plate 120 and the first coating plate 110.

[0048] The third coating pan 130 is rotatably connected to a side of the second coating pan 120 away from the first coating pan 110, and the third coating pan 130 and the second coating pan 120 are coaxially arranged. Optionally, one of the third coating pan 130 and the second coating pan 120 is provided with a second rotating boss 125, and the other is provided with a second rotating hole 133, and the second rotating boss 125 is rotatably arranged in the second rotating hole 133.

[0049] In this embodiment, the second coating disc 120 is provided with a second rotating boss 125, and the third coating disc 130 is provided with a second rotating hole 133, and the second rotating hole 133 runs through the third coating disc 130. The second rotating hole 133 can not only install the second rotating boss 125 to realize the relative rotation of the second coating disc 120 and the third coating disc 130, but also serve as the third injection hole 135. Optionally, the second rotating boss 125 is provided with a second center hole 126, and the two ends of the second center hole 126 are respectively connected to the second injection hole and the third injection hole 135. In other words, the injection holes of multiple coating discs are all passed through and connected in the center. If three coating discs are used, the diameter of the third coating disc 130 is greater than the diameter of the second coating disc 120, and the diameter of the second coating disc 120 is greater than the diameter of the first coating disc 110. From top to bottom, there are: the third coating tray 130, the second coating tray 120 and the first coating tray 110, and the wafer is below the first coating tray 110. The coating liquid enters from the third liquid injection hole 135 of the third coating tray 130 and flows to the third spray hole 131, the second spray hole 121 and the first spray hole 111 respectively. The control valve can realize the opening and closing of each spray hole to achieve directional coating.

[0050] During actual coating, the first coating disk 110 can be rotated first, and the first coating disk 110 applies glue to the center area of ​​the wafer. Then stop the first coating disk 110, rotate the second coating disk 120, and apply glue to the relatively middle area. This can also eliminate the linear glue layer marks that exist after the first coating disk 110 is coated with glue, improve the coplanarity of the glue layer, and make the coating more uniform. Then stop the second coating disk 120, rotate the third coating disk 130, and apply glue to the relatively outer edge area. This can also eliminate the linear glue layer marks that exist after the first coating disk 110 and the second coating disk 120 are coated with glue, improve the coplanarity of the glue layer, and make the coating more uniform. Of course, the first coating disk 110, the second coating disk 120, and the third coating disk 130 can also be rotated at the same time to apply glue. Alternatively, according to actual needs, only the wafer areas corresponding to the first coating disk 110 and the second coating disk 120 are coated with glue, which is not specifically limited here.

[0051] Since there are multiple coating discs, each coating disc can rotate independently, and the spray holes on each coating disc can also be independently controlled to open and close, making the wafer coating more flexible. It is also possible to repair and repair the area with coating line marks to improve the coplanarity of the colloid. In addition, the spin coating method with the coating disc rotating and the wafer not moving can avoid the problem of excessive colloid deposition on the edge of the wafer due to centrifugal force, improve the coating uniformity and coating quality, and the coplanarity of the coating colloid is better, and even the edge washing process can be omitted, thereby improving the process efficiency.

[0052] The embodiment of the utility model also provides a coating device, including a carrier and a wafer coating jig 100 as in any of the above embodiments, the carrier is used to place the wafer, and the wafer coating jig 100 is rotatably arranged above the carrier. The first coating pan 110, the second coating pan 120, and the third coating pan 130 are provided with a spray hole on one side facing the wafer.

[0053] The wafer coating jig 100 and the coating device provided by the embodiment of the utility model have the following beneficial effects, including:

[0054] The wafer coating jig 100 provided in the embodiment of the utility model adopts at least two coating disks, which can be used to coat the wafer in different areas. During the coating process, the coating disk can rotate while the wafer is fixed. This can effectively alleviate the problem of excessive deposition on the edge of the wafer due to centrifugal force, improve the quality of coating, and facilitate the elimination of the edge washing process, thereby improving the process efficiency.

[0055] The coating equipment provided by the utility model includes the above-mentioned wafer coating fixture 100, which can effectively alleviate the problem of excessive colloid deposition on the edge of the wafer due to centrifugal force, improve the quality of glue coating, improve the coplanarity of the coated colloid, and improve the process efficiency.

[0056] The above description is only the preferred embodiment of the utility model, and is not intended to limit the utility model. For those skilled in the art, the utility model can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A wafer coating jig, characterized in that: include: A first coating plate; the first coating plate is provided with a first liquid injection hole and a first spray hole connected to the first liquid injection hole; a second coating pan; The second coating plate is provided with a second liquid injection hole and a second spray hole connected with the second liquid injection hole; The first liquid injection hole is connected to the second liquid injection hole; the first coating disc and the second coating disc are coaxially connected and can rotate relatively; the diameter of the first coating disc is smaller than the diameter of the second coating disc.

2. The wafer coating jig according to claim 1, characterized in that: One of the first coating disc and the second coating disc is provided with a first rotating boss, and the other is provided with a first rotating hole. The first rotating boss is rotatably disposed in the first rotating hole.

3. The wafer coating jig according to claim 2, characterized in that: The first rotating hole, the first rotating boss, the first liquid injection hole and the second liquid injection hole are located on the same axis.

4. The wafer coating jig according to claim 1, characterized in that: The first coating disc is provided with a first flow channel for connecting the first liquid injection hole and the first spray hole; the first flow channel or the first spray hole is provided with a control valve.

5. The wafer coating jig according to claim 1, characterized in that: The second coating disc is provided with a second flow channel for connecting the second liquid injection hole and the second spray hole; the second flow channel or the second spray hole is provided with a control valve.

6. The wafer coating jig according to any one of claims 1 to 5, characterized in that: It also includes a third coating plate, on which a third liquid injection hole and a third spray hole connected to the third liquid injection hole are provided; The third coating disc is rotatably connected to the second coating disc, and the third coating disc and the second coating disc are coaxially arranged.

7. The wafer coating jig according to claim 6, characterized in that: One of the third coating disk and the second coating disk is provided with a second rotating boss, and the other is provided with a second rotating hole. The second rotating boss is rotatably disposed in the second rotating hole.

8. The wafer coating jig according to claim 7, characterized in that: The second rotating boss is provided with a second center hole, and two ends of the second center hole are respectively connected with the second injection hole and the third injection hole.

9. The wafer coating jig according to claim 6, characterized in that: The third coating disc is provided with a third flow channel for connecting the third liquid injection hole and the third spray hole; the third flow channel or the third spray hole is provided with a control valve.

10. A coating device, characterized in that: It comprises a carrier and a wafer coating jig as claimed in any one of claims 1 to 9, wherein the carrier is used to place a wafer, and the wafer coating jig is rotatably disposed above the carrier.

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