Display device

Abstract

The embodiment of the utility model belongs to the display technology, and provides display equipment and a manufacturing method thereof. The display device includes a substrate, a first terminal, a second terminal, and a conductive component. The substrate has a first surface, a second surface, and a side surface. The side surface is disposed between the first surface and the second surface. Grooves are formed in the side faces. The first terminal is arranged in the first binding area of the first surface. The second terminal is arranged in the second binding area of the second surface. The conductive assembly comprises a connecting piece and a conductive piece which are sequentially arranged in a stacked mode. At least part of the connecting piece is arranged on the side face. The first end of the connecting piece extends towards the first surface and is electrically connected with the first terminal; the second end of the connecting piece extends towards the second surface and is electrically connected with the second terminal. According to the display device, the groove is formed in the side face of the substrate, and at least part of the connecting piece extends into the groove, so that the connecting strength of the connecting piece and the side face of the substrate is improved, the conductive assembly located on the side face of the substrate is prevented from being peeled off, and the use performance of the display device is improved.

Description

Technical Field

[0001] The embodiments of the present application relate to display technology, and more specifically, to a display device. Background Art

[0002] Mini-LED display devices and Micro-LED display devices are widely used due to their advantages such as high brightness, high contrast and long life.

[0003] In the prior art, glass-based Mini-LED and Micro-LED are mainly used in large-size display devices by splicing. Back-binding technology is often used to reduce the splicing width. At present, glass-based Micro-LED and MiniLED borderless splicing screens mainly use the method of arranging conductive wires on the side to connect the binding terminals on the front of the glass substrate with the connecting terminals on the back of the glass substrate. The method of arranging conductive wires on the side includes copper plating on the side of the substrate to form conductive wires and pad printing to form conductive wires.

[0004] However, the existing method of arranging conductive wires on the side of the glass substrate has the problem that the conductive wires are easy to peel off. Utility Model Content

[0005] The embodiment of the present application provides a display device, which increases the connection strength between the connector and the side of the substrate, avoids the peeling of the connector located on the side of the substrate, and improves the performance of the display device.

[0006] The embodiment of the present application provides a display device. The display device includes a substrate, a first terminal, a second terminal and a conductive component. The substrate has a first surface, a second surface and a side surface. The first surface and the second surface are arranged opposite to each other. The side surface is arranged between the first surface and the second surface. The side surface is provided with a groove. The first surface has a first binding area. The second surface has a second binding area.

[0007] The first terminal is disposed in the first binding area, and the second terminal is disposed in the second binding area.

[0008] The conductive component includes a connecting member and a conductive member stacked in sequence. At least a portion of the connecting member is arranged on the side surface. At least a portion of the connecting member extends into the groove. The first end of the connecting member extends toward the first surface and is electrically connected to the first terminal; the second end of the connecting member extends toward the second surface and is electrically connected to the second terminal.

[0009] Beneficial effects of the present application: The display device provided by the present application increases the connection area between the connector and the side of the substrate, increases the connection strength between the connector and the side of the substrate, and further increases the connection stability between the conductive component and the side of the substrate by setting a groove on the side of the substrate and extending at least part of the connector into the groove. The display device provided by the present application increases the connection strength between the conductive component and the side of the substrate by setting the conductive component as a connector and a conductive component stacked in sequence. The conductive component realizes the electrical connection between the first terminal on the first side of the substrate and the second terminal on the second side of the substrate, thereby ensuring the effective electrical connection of the display device.

[0010] In an achievable manner, the connecting member includes at least two connecting layers. Along a direction away from the substrate, portions of the at least two connecting layers located at the side are stacked in sequence.

[0011] In one achievable manner, the connector includes a first connecting layer and a second connecting layer. The first connecting layer includes a first connecting segment and a second connecting segment connected to each other. The first connecting segment is disposed on the first surface and is electrically connected to the first terminal. The second connecting segment is disposed on the side surface and is connected to the substrate. At least a portion of the second connecting segment extends into the groove.

[0012] The second connection layer includes a third connection segment and a fourth connection segment connected to each other. The third connection segment is arranged on the second surface and is electrically connected to the second terminal. The fourth connection segment is arranged on the side surface.

[0013] The second connecting section and the fourth connecting section are stacked in sequence.

[0014] In an achievable manner, the conductive component further comprises a protective layer. The conductive member comprises a conductive layer.

[0015] Along a thickness direction intersecting the substrate, the second connecting section, the fourth connecting section, the conductive layer and the protective layer are stacked in sequence.

[0016] In an achievable manner, the side surface includes a first side surface, a vertical surface, and a second side surface connected in sequence, wherein the first side surface is connected to the first surface, and the second side surface is connected to the second surface.

[0017] Along the thickness direction of the substrate, the vertical surface is convex in a direction away from the substrate relative to the first side surface and the second side surface at two ends of the side surface.

[0018] The vertical surface extends along the thickness direction of the substrate. The extension direction of the first side surface intersects with the thickness direction of the substrate. The extension direction of the second side surface intersects with the thickness direction of the substrate.

[0019] In one achievable manner, a groove is provided on the vertical surface. The notch of the groove faces away from the substrate. There are multiple grooves. The multiple grooves are arranged in sequence at intervals along the thickness direction of the substrate. And / or, the multiple grooves are arranged in sequence at intervals along the thickness direction intersecting the substrate.

[0020] In one achievable manner, the first connection layer includes at least one of a titanium layer and a molybdenum layer.

[0021] In one achievable manner, the second connection layer includes at least one of a titanium layer and a molybdenum layer.

[0022] In one achievable manner, the conductive layer includes at least one of an aluminum layer, a copper layer, and a silver layer.

[0023] In one achievable manner, the protection layer includes an indium tin oxide layer or an indium zinc oxide layer.

[0024] In an achievable manner, a first protrusion is provided on the first terminal, and the first protrusion is located on a surface of the first terminal facing away from the substrate.

[0025] In an achievable manner, a second protrusion is provided on the second terminal, and the second protrusion is located on a surface of the second terminal facing away from the substrate.

[0026] In one achievable manner, the display device further includes a circuit, a chip, a COF film and a circuit board. The circuit and the chip are both arranged on the first surface. The circuit is connected to the first surface. The chip is electrically connected to the circuit.

[0027] The chip-on-film and the circuit board are arranged on one side of the substrate close to the second surface. The first end of the chip-on-film is electrically connected to the second terminal through the conductive component, and the second end of the chip-on-film is electrically connected to the circuit board.

[0028] And / or, the display device further comprises a packaging film layer. The packaging film layer is arranged on the first surface. The packaging film layer covers at least part of the circuit, the chip and the conductive component.

[0029] The embodiment of the present application provides a display device. The display device includes a substrate, a first terminal, a second terminal and a conductive component. The substrate has a first surface, a second surface and a side surface. The first surface and the second surface are arranged opposite to each other. The side surface is used to connect the first surface and the second surface. The first terminal is used to connect a first binding area of ​​the first surface. The second terminal is used to connect a second binding area of ​​the second surface.

[0030] The conductive assembly includes a connector and a conductive member stacked in sequence. At least a portion of the connector is used to connect to the side surface. At least a portion of the connector is used to extend into the groove of the side surface. The first end of the connector is used to extend toward the first surface and be electrically connected to the first terminal. The second end of the connector is used to extend toward the second surface and be electrically connected to the second terminal.

[0031] A display device is provided in an embodiment of the present application. The display device includes a substrate, a first terminal, a second terminal and a conductive component. The substrate has a first surface, a second surface and a side surface. The side surface is arranged between the first surface and the second surface. A groove is arranged on the side surface. The first terminal is arranged in a first binding area of ​​the first surface. The second terminal is arranged in a second binding area of ​​the second surface. The conductive component includes a connector and a conductive component stacked in sequence. At least part of the connector is arranged on the side surface. The first end of the connector extends toward the first surface and is electrically connected to the first terminal; the second end of the connector extends toward the second surface and is electrically connected to the second terminal. By arranging a groove on the side surface of the substrate and extending at least part of the connector into the groove, the display device provided by the present application increases the connection strength between the connector and the side surface of the substrate, avoids the peeling of the conductive component located on the side surface of the substrate, and improves the use performance of the display device. The display device provided by the present application improves the connection stability between the conductive component and the substrate, avoids the problem of peeling of the conductive component, improves the quality of the wiring on the side of the substrate, and improves the display effect of the display device. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0033] Figure 1 A schematic diagram of the structure of a display device provided in an embodiment of the present application;

[0034] Figure 2 A schematic structural diagram of a substrate, a first terminal, and a second terminal of a display device provided in an embodiment of the present application;

[0035] Figure 3 A schematic diagram of a structure in which a first end of a substrate of a display device provided in an embodiment of the present application has a chamfer;

[0036] Figure 4 A schematic diagram of a structure in which a groove is provided on the side of a substrate of a display device provided in an embodiment of the present application Figure 1 ;

[0037] Figure 5 A schematic diagram of a structure in which a groove is provided on the side of a substrate of a display device provided in an embodiment of the present application Figure 2 ;

[0038] Figure 6 A schematic diagram of a structure in which a groove is provided on the side of a substrate of a display device provided in an embodiment of the present application Figure 3 ;

[0039] Figure 7A schematic diagram of a structure in which a first connection layer is formed on the side of a substrate of a display device provided in an embodiment of the present application;

[0040] Figure 8 A schematic diagram of a structure in which a second connection layer is formed on the side of a substrate of a display device provided in an embodiment of the present application;

[0041] Fig. 9 A schematic diagram of a structure in which a conductive layer is formed on the side of a substrate of a display device provided in an embodiment of the present application;

[0042] Fig.10 A schematic diagram of a structure in which a protective layer is formed on the side of a substrate of a display device provided in an embodiment of the present application;

[0043] Fig.11 A schematic diagram of the structure of a display device provided in an embodiment of the present application.

[0044] Reference numerals:

[0045] 100: substrate; 110: first surface; 120: second surface; 130: side surface; 131: first side surface; 132: second side surface; 133: vertical surface; 134: groove;

[0046] 200: first terminal; 210: first protrusion;

[0047] 300: second terminal; 310: second protrusion;

[0048] 400: conductive components;

[0049] 410: connecting member; 411: first connecting layer; 411a: first connecting section; 411b: second connecting section; 412: second connecting layer; 412a: third connecting section; 412b: fourth connecting section;

[0050] 420: conductive parts;

[0051] 430: protective layer;

[0052] 500: circuit; 600: chip; 700: flip chip film; 800: circuit board; 900: packaging film layer. DETAILED DESCRIPTION

[0053] Mini-LED display devices and Micro-LED display devices are widely used due to their advantages such as high brightness, high contrast and long life.

[0054] In the prior art, in order to realize the large-screen display device, Mini-LED and Micro-LED are mainly used in large-screen display devices through splicing technology. At the same time, in order to achieve seamless splicing during the splicing process, back-binding technology is often used to reduce the splicing width. The back-binding technology connects the binding terminals on the front of the substrate with the connecting terminals on the back of the substrate by arranging conductive wires on the side of the substrate. The splicing technology is based on the conductive wires on the side of the substrate transmitting the signal from the front of the substrate to the back of the substrate, and splicing individual substrates to form a large-screen display device. The methods of arranging conductive wires on the side include silver paste transfer, exposure, development, etching and laser engraving.

[0055] However, the conductive wires arranged on the substrate need to extend along the side of the substrate, and the two ends of the conductive wires need to be connected to the binding terminals on the front of the substrate and the connection terminals on the back of the substrate respectively. Since there are corners between the side of the substrate and the front and back of the substrate, the adhesion between the conductive wires and the substrate prepared by the silver paste transfer method at this stage is weak, and the force is uneven at the corners of the substrate, which makes it easy for the conductive wires to peel off, causing short circuits or open circuits in the conductive wires, affecting the display performance of the display device. Therefore, the existing method of arranging conductive wires on the side of the glass substrate has the problem of easy peeling of the conductive wires.

[0056] In view of this, an embodiment of the present application provides a display device. The display device includes a substrate, a first terminal, a second terminal and a conductive component. The substrate has a first surface, a second surface and a side surface. The first surface and the second surface are arranged opposite to each other. The side surface is arranged between the first surface and the second surface. A groove is arranged on the side surface. The first surface has a first binding area. The second surface has a second binding area. The first terminal is arranged in the first binding area. The second terminal is arranged in the second binding area. The conductive component includes a connector and a conductive member stacked in sequence. At least a portion of the connector is arranged on the side surface. At least a portion of the connector extends into the groove. The first end of the connector extends toward the first surface and is electrically connected to the first terminal; the second end of the connector extends toward the second surface and is electrically connected to the second terminal.

[0057] The display device provided in the embodiment of the present application increases the connection area between the connector and the side of the substrate, increases the connection strength between the connector and the side of the substrate, and further increases the connection stability between the conductive component and the side of the substrate, avoids the problem of conductive component peeling, improves the quality of the wiring on the side of the substrate, and improves the display effect of the display device.

[0058] The display device provided in the embodiment of the present application arranges the conductive component as a connector and a conductive component which are sequentially stacked, wherein the connector increases the connection strength between the conductive component and the substrate, and the conductive component realizes the electrical connection between the first terminal on the first surface of the substrate and the second terminal on the second surface of the substrate, thereby ensuring the effective electrical connection of the display device.

[0059] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0060] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0061] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components expressly listed but may include other components not expressly listed or inherent to such products or devices.

[0062] Figure 1 The structural diagram of the display device provided in the embodiment of the present application is schematically shown.

[0063] The embodiment of the present application provides a display device. The display device provided in the present application can have various implementation forms, for example, it can be a television, a smart television, a laser projection device, a monitor, an electronic whiteboard, an electronic table, etc.

[0064] The present application provides a display device. Figure 1 As shown, the display device includes a substrate 100, a first terminal 200, a second terminal 300 and a conductive component 400. The substrate 100 has a first surface 110, a second surface 120 and a side surface 130. The first surface 110 and the second surface 120 are arranged opposite to each other. The side surface 130 is arranged between the first surface 110 and the second surface 120. Both ends of the side surface 130 are connected to the first surface 110 and the second surface 120 respectively. The side surface 130 is provided with a groove 134. The first surface 110 has a first binding area. The second surface 120 has a second binding area. The first terminal 200 is arranged in the first binding area. The second terminal 300 is arranged in the second binding area.

[0065] The conductive assembly 400 includes a connector 410 and a conductive member 420 which are stacked in sequence. At least a portion of the connector 410 is disposed on the side surface 130. At least a portion of the connector 410 extends into the groove 134. A first end of the connector 410 extends toward the first surface 110 and is electrically connected to the first terminal 200; a second end of the connector 410 extends toward the second surface 120 and is electrically connected to the second terminal 300.

[0066] Exemplarily, the first surface 110 of the substrate 100 is the top surface of the substrate 100 . The second surface 120 of the substrate 100 is the bottom surface of the substrate 100 .

[0067] For example, refer to Figure 1 As shown, the first binding area of ​​the first surface 110 of the substrate 100 is provided with a first terminal 200. The second binding area of ​​the second surface 120 of the substrate 100 is provided with a second terminal 300. At least part of the connector 410 is located on the side surface 130 of the substrate 100. The connector 410 connects the first terminal 200 and the second terminal 300 to achieve electrical connection and signal transmission of the display device.

[0068] For example, along Figure 1 In the direction indicated by X, the first end of the substrate 100 is sequentially provided with a connector 410 and a conductive member 420. At least a portion of the connector 410 is connected to the side surface 130 of the substrate 100. The first end of the connector 410 extends toward the first surface 110 and is connected to the first terminal 200; the second end of the connector 410 extends toward the second surface 120 and is connected to the second terminal 300. The conductive member 420 covers the connector 410. By configuring the conductive component 400 as the connector 410 and the conductive member 420 stacked in sequence, the connector 410 increases the connection strength between the conductive component 400 and the substrate 100, and the conductive member 420 realizes the electrical connection between the first terminal 200 of the first surface 110 of the substrate 100 and the second terminal 300 of the second surface 120 of the substrate 100, thereby ensuring the effective electrical connection of the display device.

[0069] Exemplarily, the side 130 of the substrate 100 is provided with a groove 134. At least part of the connector 410 extends into the groove 134. The connection method of extending the connector 410 into the groove 134 to connect the substrate 100 increases the connection area between the connector 410 and the side 130 of the substrate 100, increases the connection strength between the connector 410 and the side 130 of the substrate 100, and thus increases the connection stability between the conductive component 400 and the side 130 of the substrate 100, avoids the peeling problem of the connector 410 located on the side 130 of the substrate 100, avoids the possible circuit breakage and disconnection problems of the conductive component 400, and improves the use performance of the display device. The display device provided by the embodiment of the present application improves the connection stability between the conductive component 400 and the substrate 100, avoids the problem of the conductive component 400 peeling off, improves the quality of the wiring on the side of the substrate 100, and improves the display effect of the display device.

[0070] Exemplarily, the substrate 100 may be a glass substrate 100 .

[0071] Figure 2 The schematic diagram schematically shows the structure of the substrate 100, the first terminal 200 and the second terminal 300 of the display device provided in the embodiment of the present application.

[0072] In some possible implementations, reference Figure 2 As shown, a first protrusion 210 is disposed on the first terminal 200 . The first protrusion 210 is located on the surface of the first terminal 200 facing away from the substrate 100 .

[0073] In some achievable embodiments, a second protrusion 310 is disposed on the second terminal 300 . The second protrusion 310 is located on a surface of the second terminal 300 that is away from the substrate 100 .

[0074] For example, the first terminal 200 and the second terminal 300 can be respectively prepared on the first side 110 of the substrate 100 and the second side 120 of the substrate 100 by a photolithography mask method. The photolithography mask method is a method for transferring a fine pattern to the substrate 100 by using a photoresist and a mask plate to realize the manufacture of a microstructure.

[0075] Further, a first protrusion 210 can be provided on the first terminal 200 by a photolithography mask method, and a second protrusion 310 can be provided on the second terminal 300. The provision of the first protrusion 210 and the second protrusion 310 can increase the contact area between the first terminal 200 and the connector 410, the second terminal 300 and the connector 410, ensure the stability and reliability of the electrical connection between the first terminal 200 and the connector 410, the second terminal 300 and the connector 410, and reduce the contact resistance. At the same time, the provision of the first protrusion 210 and the second protrusion 310 structure can enhance the mechanical connection strength of the connection between the first terminal 200 and the connector 410, the second terminal 300 and the connector 410, and reduce the connection failure caused by mechanical stress.

[0076] Figure 3 The schematic diagram schematically shows a structure in which the first end of the substrate 100 of the display device provided by the embodiment of the present application has a chamfer.

[0077] In some possible implementations, reference Figure 3 As shown, the side surface 130 includes a first side surface 131, a vertical surface 133, and a second side surface 132 connected in sequence. The first side surface 131 is located between the first surface 110 and the vertical surface 133, and the first side surface 131 is connected to the first surface 110. The second side surface 132 is located between the second surface 120 and the vertical surface 133, and the second side surface 132 is connected to the second surface 120. The vertical surface 133 is perpendicular to the first surface 110. Along the thickness direction of the substrate 100, the vertical surface 133 is convex in a direction away from the substrate 100 relative to the first side surface 131 and the second side surface 132 at both ends of the side surface 130. The vertical surface 133 extends along the thickness direction of the substrate 100. The extension direction of the first side surface 131 intersects with the thickness direction of the substrate 100. The extension direction of the second side surface 132 intersects with the thickness direction of the substrate 100.

[0078] Exemplarily, the connector 410 includes a first section, a second section, and a third section, wherein the first section is located on the first surface 110, the second section is located on the second surface 120, and the third section is located on the side surface 130. The third section connects the first section and the second section. At least a portion of the third section is located on the first side surface 131. At least a portion of the third section is located on the second side surface 132.

[0079] By setting the side surface 130 as the first side surface 131, the vertical surface 133 and the second side surface 132 connected in sequence, and setting the first section on the first surface 110, and setting at least part of the third section on the first side surface 131, the angle between the first section and the third section in the extending direction is reduced, so that the connection between the first section and the third section is smoothly transitioned between the first surface 110 and the first side surface 131, which is conducive to improving the adhesion of the connector 410 to the substrate 100 and preventing the connector 410 from peeling off from the substrate 100. By setting the second section on the second surface 120, and setting at least part of the third section on the second side surface 132, the angle between the second section and the third section in the extending direction is reduced, so that the connection between the second section and the third section is smoothly transitioned between the second surface 120 and the second side surface 132, which is conducive to improving the adhesion of the connector 410 to the substrate 100 and preventing the connector 410 from peeling off from the substrate 100.

[0080] Exemplarily, the first side surface 131 and the second side surface 132 may be arc surfaces, so that the end of the substrate 100 provided with the side surface 130 has a chamfered structure, which helps to increase the contact area between the connector 410 and the substrate 100, improves the adhesion of the connector 410 to the substrate 100, and prevents the connector 410 from peeling off from the substrate 100.

[0081] Exemplarily, the first side surface 131 and the second side surface 132 may also be planes. A first preset angle is formed between the first side surface 131 and the first surface 110. A second preset angle is formed between the second side surface 132 and the second surface 120. The first preset angle and the second preset angle are both obtuse angles, so that the first surface 110 and the first side surface 131, and the second side surface 132 and the second surface 120 are smoothly transitioned, so as to avoid the disconnection problem of the connector 410 on the first side surface 131 and the second side surface 132, and improve the connection stability of the connector 410.

[0082] Figure 4 The structure schematic diagram of the side surface 130 of the substrate 100 of the display device provided in the embodiment of the present application having the groove 134 is shown schematically. Figure 1 .

[0083] In some possible implementations, reference Figure 4 As shown, a groove 134 is provided on the vertical surface 133. The notch of the groove 134 faces away from the substrate 100. There are multiple grooves 134. Along the thickness direction of the substrate 100, the multiple grooves 134 are arranged in sequence at intervals. And / or, along the thickness direction intersecting the substrate 100, the multiple grooves 134 are arranged in sequence at intervals.

[0084] In some embodiments, a groove 134 is disposed on the vertical surface 133. The notch of the groove 134 faces away from the substrate 100. Along the thickness direction of the substrate 100, a plurality of grooves 134 are arranged at intervals. Figure 4 By providing a plurality of grooves 134 and extending at least a portion of the connector 410 into the grooves 134, the connection area between the connector 410 and the side surface 130 of the substrate 100 is increased, the connection strength between the connector 410 and the side surface 130 of the substrate 100 is increased, and the connection stability between the conductive component 400 and the side surface 130 of the substrate 100 is increased, thereby reducing the peeling problem of the conductive component 400 located on the side surface 130 of the substrate 100.

[0085] In some other embodiments, a groove 134 is provided on the vertical surface 133. The notch of the groove 134 faces away from the substrate 100. Figure 4 In the plane direction formed by X and Z, a plurality of grooves 134 are arranged at intervals. By providing a plurality of grooves 134 and extending at least a portion of the connector 410 into the grooves 134, the connection area between the connector 410 and the side surface 130 of the substrate 100 is increased, the connection strength between the connector 410 and the side surface 130 of the substrate 100 is increased, and the connection stability between the conductive component 400 and the side surface 130 of the substrate 100 is increased, and the peeling problem of the connector 410 located on the side surface 130 of the substrate 100 is reduced.

[0086] For example, the groove 134 may be formed on the side surface 130 of the substrate 100 by laser, etching or grinding.

[0087] Figure 5 The structure schematic diagram of the side surface 130 of the substrate 100 of the display device provided in the embodiment of the present application having the groove 134 is shown schematically. Figure 2 . Figure 6 The structure schematic diagram of the side surface 130 of the substrate 100 of the display device provided in the embodiment of the present application having the groove 134 is shown schematically. Figure 3 .

[0088] For example, refer to Figures 4 to 6 As shown, along the thickness direction intersecting the substrate 100 , the cross-sectional shape of the groove 134 includes, but is not limited to, a square, a rectangle, a semicircle, and a trapezoid. The present application does not limit the shape of the groove 134 .

[0089] In some achievable embodiments, the connector 410 includes at least two connecting layers. Along the direction away from the substrate 100, the at least two connecting layers are stacked in sequence at the side 130. By providing at least two connecting layers on the side 130 of the substrate 100, the connection strength between the connector 410 and the substrate 100 is increased, thereby increasing the connection stability between the conductive component 400 and the side 130 of the substrate 100, and preventing the conductive component 400 from peeling off from the side 130 of the substrate 100 as a whole.

[0090] Figure 7 The schematic diagram schematically shows the structure of forming a first connection layer 411 on the side surface 130 of the substrate 100 of the display device provided by the embodiment of the present application. Figure 8 The schematic diagram schematically shows the structure of forming a second connection layer 412 on the side surface 130 of the substrate 100 of the display device provided by the embodiment of the present application.

[0091] In some possible implementations, reference Figures 7 and 8 As shown, the connector 410 includes a first connection layer 411 and a second connection layer 412. The first connection layer 411 includes a first connection segment 411a and a second connection segment 411b connected to each other. The first connection segment 411a is disposed on the first surface 110 and is electrically connected to the first terminal 200 to achieve electrical connection between the first connection layer 411 and the first terminal 200. The second connection segment 411b is disposed on the side surface 130 and is connected to the substrate 100. At least a portion of the second connection segment 411b extends into the groove 134.

[0092] The second connection layer 412 includes a third connection segment 412a and a fourth connection segment 412b connected to each other. The third connection segment 412a is arranged on the second surface 120 and is electrically connected to the second terminal 300 to achieve electrical connection between the second connection layer 412 and the second terminal 300. The fourth connection segment 412b is arranged on the side surface 130. The second connection segment 411b and the fourth connection segment 412b are stacked in sequence.

[0093] By setting the first connecting layer 411 and the second connecting layer 412, and electrically connecting the first connecting segment 411a of the first connecting layer 411 and the first terminal 200, and electrically connecting the third connecting segment 412a of the second connecting layer 412 and the second terminal 300, the two ends of the connector 410 are electrically connected to the first terminal 200 and the second terminal 300 respectively, thereby realizing the electrical signal transmission of the connector 410.

[0094] along Figure 8As shown in the X direction, the second connection segment 411b of the first connection layer 411 and the fourth connection segment 412b of the second connection layer 412 are sequentially spaced apart on the side 130 of the substrate 100, thereby increasing the connection strength between the connector 410 and the side 130 of the substrate 100, thereby increasing the connection stability between the conductive component 400 and the side 130 of the substrate 100, and reducing the peeling problem of the connector 410 located on the side 130 of the substrate 100.

[0095] The first connection layer 411 covers the first surface 110 and the side surface 130 of the substrate 100, and the second connection layer 412 covers the second surface 120 and the side surface 130 of the substrate 100, which is conducive to the molding of the first connection layer 411 and the second connection layer 412, and saves materials for preparing the first connection layer 411 and the second connection layer 412. In addition, the problem of the connector 410 located on the first surface 110 being too thick and the problem of the connector 410 located on the second surface 120 being too thick is avoided, and the connector 410 is avoided from occupying too much space, thereby avoiding the connector 410 being too thick to affect the compactness of the overall design of the display device.

[0096] Fig. 9 The schematic diagram schematically shows a structure in which a conductive layer is formed on the side surface 130 of the substrate 100 of the display device provided by an embodiment of the present application. Fig.10 The schematic diagram schematically shows the structure of forming a protective layer 430 on the side surface 130 of the substrate 100 of the display device provided by the embodiment of the present application.

[0097] In some possible implementations, reference Figures 9 and 10 As shown, the conductive component 400 further includes a protective layer 430. The conductive member 420 includes a conductive layer.

[0098] Along the thickness direction crossing the substrate 100, the side surface 130 of the substrate 100 is connected to the second connection section 411b of the first connection layer 411. Fig. 9The direction indicated by X in the figure. The second connecting section 411b, the fourth connecting section 412b, the conductive layer and the protective layer 430 are stacked in sequence. The arrangement of the second connecting section 411b and the fourth connecting section 412b can increase the connection strength between the connector 410 and the side 130 of the substrate 100, prevent the connector 410 from falling off in whole or in part from the side 130 of the substrate 100, and avoid the short circuit and open circuit problems caused thereby. The conductive layer is used to electrically connect the first terminal 200 and the second terminal 300, ensure that the current and signal can be smoothly transmitted in the circuit 500, and realize the transmission of electrical signals between the first surface 110 of the substrate 100 and the second surface 120 of the substrate 100. The protective layer 430 covers the conductive layer, which can prevent the conductive layer from being physically damaged by scratches, wear and tear during manufacturing, transportation and use. At the same time, the protective layer 430 can increase the mechanical strength of the conductive layer and reduce the risk of deformation and breakage under mechanical stress.

[0099] For example, the first connection layer 411 , the second connection layer 412 , the conductive layer and the protective layer 430 may be sequentially formed by physical vapor deposition, atomic layer deposition, magnetron sputtering deposition, or the like.

[0100] In some achievable embodiments, the first connection layer 411 includes at least one of a titanium layer and a molybdenum layer.

[0101] In some embodiments, the second connection layer 412 includes at least one of a titanium layer and a molybdenum layer.

[0102] For example, the titanium layer has good adhesion. A strong bonding force can be formed between the titanium atoms and the surface atoms of the glass substrate 100. By setting the first connecting layer 411 as a titanium layer, the connection strength between the first connecting layer 411 and the substrate 100 is improved, thereby improving the connection stability between the connector 410 and the substrate 100.

[0103] For example, the titanium layer can be deposited on the glass substrate 100 by physical vapor deposition, chemical vapor deposition, sputtering deposition, etc. Moreover, by performing surface treatment on the glass substrate 100, such as cleaning, plasma treatment or chemical treatment, the adhesion of the titanium layer can be significantly improved.

[0104] For example, the molybdenum layer also has good adhesion. In particular, under high temperature deposition conditions, molybdenum atoms can form a strong bonding force with the surface of the glass substrate 100. By setting the first connecting layer 411 as a molybdenum layer, the connection strength between the first connecting layer 411 and the substrate 100 is improved, thereby improving the connection stability between the connector 410 and the substrate 100.

[0105] For example, the molybdenum layer can be deposited on the glass substrate 100 by physical vapor deposition and sputtering deposition. The adhesion of the molybdenum layer can be optimized by controlling the deposition rate and temperature. The adhesion of the molybdenum layer can be significantly improved by surface treatment of the glass substrate 100, such as cleaning, plasma treatment or chemical treatment.

[0106] In some embodiments, the first connection layer 411 is a titanium layer, and the second connection layer 412 is a molybdenum layer.

[0107] In some other embodiments, the first connection layer 411 is a titanium layer, and the second connection layer 412 is a titanium layer.

[0108] In some other embodiments, the first connection layer 411 is an alloy layer formed of titanium and molybdenum, and the second connection layer 412 is a molybdenum layer.

[0109] In some other embodiments, the first connection layer 411 is an alloy layer formed of titanium and molybdenum, and the second connection layer 412 is an alloy layer formed of titanium and molybdenum.

[0110] In some achievable embodiments, the conductive layer includes at least one of an aluminum layer, a copper layer, and a silver layer.

[0111] Exemplarily, by setting the conductive layer to a silver layer, the silver layer has good conductivity, and its resistivity is about 1.59 μΩ·cm, thereby improving the conductive efficiency of the conductive member 420 .

[0112] For example, the aluminum layer has the advantages of good conductivity and low cost. By setting the conductive layer as the aluminum layer, the conductivity of the conductive member 420 is achieved, while the production cost is saved.

[0113] For example, the copper layer has electrical conductivity, and in addition, the copper layer has good mechanical strength and ductility, which facilitates processing and manufacturing of complex circuit 500 patterns. By setting the conductive layer as a copper layer, the conductivity of the conductive member 420 is achieved, and it is convenient for the staff to prepare the conductive member 420 into the desired circuit 500 pattern.

[0114] In some implementations, the protection layer 430 includes an indium tin oxide layer or an indium zinc oxide layer.

[0115] For example, the indium tin oxide layer has electrical conductivity, chemical stability, and corrosion resistance. At the same time, the indium tin oxide layer has mechanical strength and wear resistance.

[0116] Illustratively, the indium zinc oxide layer has electrical conductivity, flexibility and processability, chemical stability, and wear resistance.

[0117] By setting the protective layer 430 as an indium tin oxide layer or an indium zinc oxide layer with wear resistance, the wear resistance of the conductive component 400 is improved while ensuring that the conductive component 400 has the ability to conduct electricity, thereby avoiding damage to the conductive component 400 by external forces and increasing the service life of the conductive component 400.

[0118] Fig.11 The structural diagram of the display device provided in the embodiment of the present application is schematically shown.

[0119] In one achievable manner, referring to Fig.11 As shown, the display device further includes a circuit 500 , a chip 600 , a COF 700 and a circuit board 800 .

[0120] The circuit 500 and the chip 600 are both disposed on the first surface 110. The circuit 500 is connected to the first surface 110. The chip 600 is electrically connected to the circuit 500.

[0121] The COF 700 and the circuit board 800 are disposed on a side of the substrate 100 close to the second surface 120. The first end of the COF 700 is electrically connected to the second terminal 300 through the conductive component 400. The second end of the COF 700 is electrically connected to the circuit board 800.

[0122] In an implementable manner, the display device further includes a packaging film layer 900. The packaging film layer 900 is disposed on the first surface 110. The packaging film layer 900 covers at least part of the circuit 500, the chip 600 and the conductive component 400.

[0123] Exemplarily, the circuit 500 may be a driving circuit, the chip 600 may be an LED chip, the circuit 500 and the chip 600 are electrically connected, and the circuit 500 is used to drive the chip 600 to emit light.

[0124] Exemplarily, the chip 600 is a basic light-emitting unit for constructing a display screen of a display device. The LED chip can emit high-brightness light. There are multiple LED chips. Each chip 600 can control its brightness and color individually, thereby realizing a high dynamic range of the display device and a more refined image display.

[0125] Exemplarily, the circuit board 800 may be a flexible circuit board. The circuit board 800 is disposed on a side of the COF 700 away from the second terminal 300 , and the circuit board 800 is connected to the COF 700 .

[0126] Exemplarily, the encapsulation film layer 900 has protective properties. The encapsulation film layer 900 can effectively block moisture and water, prevent the chip 600 and the circuit 500 from getting damp, and extend their service life. The encapsulation film layer 900 can isolate oxygen, prevent the chip 600 and the metal wire from oxidation, and maintain the stability of their electrical properties. The encapsulation film layer 900 has good mechanical strength and can protect the chip 600 from external shocks and vibrations. The wear resistance of the encapsulation film layer 900 enables it to remain intact and not easily worn during long-term use.

[0127] The present application provides a display device. The display device includes a substrate 100, a first terminal 200, a second terminal 300 and a conductive component 400. The substrate 100 has a first surface 110, a second surface 120 and a side surface 130. The first surface 110 and the second surface 120 are arranged opposite to each other. The side surface 130 is used to connect the first surface 110 and the second surface 120. The first terminal 200 is used to connect the first binding area of ​​the first surface 110. The second terminal 300 is used to connect the second binding area of ​​the second surface 120.

[0128] The conductive assembly 400 includes a connector 410 and a conductive member 420 which are stacked in sequence. At least a portion of the connector 410 is used to be connected to the side surface 130. At least a portion of the connector 410 is used to extend into the groove 134 of the side surface 130. The first end of the connector 410 is used to extend toward the first surface 110 and be electrically connected to the first terminal 200. The second end of the connector 410 is used to extend toward the second surface 120 and be electrically connected to the second terminal 300.

[0129] Exemplarily, the side 130 of the substrate 100 is provided with a groove 134. At least part of the connector 410 extends into the groove 134. The connection method of extending the connector 410 into the groove 134 to connect the substrate 100 increases the connection area between the connector 410 and the side 130 of the substrate 100, increases the connection strength between the connector 410 and the side 130 of the substrate 100, and thus increases the connection stability between the conductive component 400 and the side 130 of the substrate 100, avoids the peeling problem of the connector 410 located on the side 130 of the substrate 100, avoids the possible circuit breakage and disconnection problems of the conductive component 400, and improves the use performance of the display device. The display device provided by the embodiment of the present application improves the connection stability between the conductive component 400 and the substrate 100, avoids the problem of the conductive component 400 peeling off, improves the quality of the wiring on the side of the substrate 100, and improves the display effect of the display device.

[0130] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0131] For ease of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are intended to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A display device, characterized in that: include: A substrate, wherein the substrate has a first surface, a second surface and a side surface, the first surface and the second surface are arranged opposite to each other, and the side surface is arranged between the first surface and the second surface; the side surface is provided with a groove; the first surface has a first binding area, and the second surface has a second binding area; A first terminal, disposed in the first binding area; A second terminal is arranged in the second binding area; A conductive component, comprising a connector and a conductive component stacked in sequence, wherein at least a portion of the connector is disposed on the side surface, and at least a portion of the connector extends into the groove; a first end of the connector extends toward the first surface and is electrically connected to the first terminal; and a second end of the connector extends toward the second surface and is electrically connected to the second terminal.

2. The display device according to claim 1, characterized in that The connecting member comprises at least two connecting layers, and along a direction away from the substrate, portions of at least two connecting layers located on the side surfaces are stacked in sequence.

3. The display device according to claim 2, characterized in that The connecting member comprises a first connecting layer and a second connecting layer; the first connecting layer comprises a first connecting segment and a second connecting segment connected to each other, the first connecting segment is arranged on the first surface and electrically connected to the first terminal; the second connecting segment is arranged on the side surface and connected to the substrate, and at least a portion of the second connecting segment extends into the groove; The second connection layer comprises a third connection segment and a fourth connection segment connected to each other, the third connection segment is arranged on the second surface and electrically connected to the second terminal; the fourth connection segment is arranged on the side surface; The second connecting section and the fourth connecting section are stacked in sequence.

4. The display device according to claim 3, characterized in that The conductive component further comprises a protective layer; the conductive member comprises a conductive layer; The second connecting section, the fourth connecting section, the conductive layer and the protective layer are stacked in sequence along a thickness direction intersecting the substrate.

5. The display device according to claim 2, characterized in that The side surface comprises a first side surface, a vertical surface, and a second side surface connected in sequence, the first side surface is connected to the first surface, and the second side surface is connected to the second surface; Along the thickness direction of the substrate, the vertical surface is convex relative to the first side surface and the second side surface at both ends of the side surface in a direction away from the substrate; The vertical surface extends along the thickness direction of the substrate, the extension direction of the first side surface intersects with the thickness direction of the substrate, and the extension direction of the second side surface intersects with the thickness direction of the substrate.

6. The display device according to claim 5, characterized in that The vertical surface is provided with the groove, and the notch of the groove faces away from the substrate; There are multiple grooves, and the multiple grooves are arranged in sequence and spaced apart along the thickness direction of the substrate; and / or the multiple grooves are arranged in sequence and spaced apart along the thickness direction intersecting the substrate.

7. The display device according to claim 4, characterized in that The first connection layer includes at least one of a titanium layer and a molybdenum layer; and / or, the second connection layer includes at least one of a titanium layer and a molybdenum layer; And / or, the conductive layer includes at least one of an aluminum layer, a copper layer and a silver layer; And / or, the protective layer includes an indium tin oxide layer or an indium zinc oxide layer.

8. The display device according to any one of claims 1 to 7, characterized in that: A first protrusion is provided on the first terminal, and the first protrusion is located on a surface of the first terminal away from the substrate; And / or, a second protrusion is disposed on the second terminal, and the second protrusion is located on a surface of the second terminal facing away from the substrate.

9. The display device according to any one of claims 1 to 7, characterized in that: It also includes circuits, chips, flip-chip films and circuit boards; The circuit and the chip are both arranged on the first surface, the circuit is connected to the first surface, and the chip is electrically connected to the circuit; The chip-on-film and the circuit board are arranged on a side of the substrate close to the second surface, the first end of the chip-on-film is electrically connected to the second terminal through the conductive component, and the second end of the chip-on-film is electrically connected to the circuit board; And / or, the display device further comprises a packaging film layer, wherein the packaging film layer is disposed on the first surface, and the packaging film layer covers at least part of the circuit, chip and conductive component.

10. A display device, characterized in that: It comprises a substrate, a first terminal, a second terminal and a conductive component; the substrate has a first surface, a second surface and a side surface, the first surface and the second surface are arranged opposite to each other, and the side surface is used to connect the first surface and the second surface; the first terminal is used to connect the first binding area of ​​the first surface; the second terminal is used to connect the second binding area of ​​the second surface; The conductive component includes a connector and a conductive member stacked in sequence, at least a portion of the connector is used to be connected to the side surface, and at least a portion of the connector is used to extend into the groove of the side surface; the first end of the connector is used to extend toward the first surface and be electrically connected to the first terminal; the second end of the connector is used to extend toward the second surface and be electrically connected to the second terminal.

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