Hot pressboard capable of efficiently preventing resonance of pins in frame

Abstract

The utility model relates to a hot pressboard capable of efficiently preventing resonance of pins in a frame, and relates to the technical field of chip bonding. The device comprises a heating block and a pressing plate, the pressing plate is positioned above the heating block; the heating block comprises at least two frame containing areas, and every two adjacent frame containing areas are attached to each other. The pressing plate is provided with an opening, and when the pressing plate makes contact with the heating block, the position of the opening corresponds to the at least two frame containing areas. The edge of the frame accommodating area has a dip angle; when the hot pressing plate for efficiently preventing the resonance of the pins in the frame is in a working state, the heating block is matched with the pressing plate, the frame accommodating area is used for accommodating a to-be-bonded chip, and the pins of the to-be-bonded chip are extruded by the inclination angles. In the bonding process, through the design of the inclination angle in the frame accommodating area in the heating block, an overpressure effect is generated on the pins of the to-be-bonded chip in the frame, and under the action of bonding ultrasonic waves, the pins in the frame are not easy to slightly shake due to resonance, so that lead crease and breakage abnormity caused by pin resonance are reduced.

Description

Technical Field

[0001] The utility model relates to the technical field of chip bonding, in particular to a hot pressing plate design for efficiently preventing pin resonance in a frame. Background Art

[0002] With the high reliability requirements of plastic-encapsulated devices, compared with the traditional wire bonding process, adding a solder ball to the second solder joint of the bonding wire can significantly increase the firmness of the wire and significantly improve the risk of the second solder joint falling off during reliability testing.

[0003] However, adding solder balls requires strong ultrasonic bonding. The inner pins of the plastic-encapsulated device will shake slightly after pressing. Under the action of ultrasonic waves during solder ball bonding, the leads will resonate with the slight shaking of the inner pins, causing creases or even breaks, which brings great quality risks to the process of adding solder balls to two solder joints. Summary of the invention

[0004] The utility model relates to a hot pressing plate for effectively preventing pin bonding resonance in a frame, which can prevent the pin bonding resonance from occurring during the bonding process and ensure the yield of the product. The hot pressing plate for effectively preventing pin bonding resonance in a frame comprises a heating block and a pressing plate;

[0005] The pressing plate is located above the heating block;

[0006] The heating block includes at least two frame accommodating areas, and two adjacent frame accommodating areas are in contact with each other;

[0007] The pressing plate has an opening, and when the pressing plate contacts the heating block, the position of the opening corresponds to at least two frame accommodating areas;

[0008] The edge of the frame receiving area has an inclination;

[0009] When the hot pressing plate that effectively prevents the pin resonance in the frame is in working state, the heating block and the pressing plate cooperate, the frame accommodating area is used to accommodate the chip to be bonded, and the pins of the chip to be bonded are squeezed at an angle.

[0010] In an optional embodiment, the two right-angled sides of the inclination respectively correspond to the bottom surface of the frame accommodating area and the edge of the frame accommodating area.

[0011] In an optional embodiment, the frame accommodating area is rectangular;

[0012] The inclination angles are distributed on the edges of each side of the frame accommodating area.

[0013] In an optional embodiment, the height of the inclination angle is 15 μm to 30 μm.

[0014] In an optional embodiment, at least two frame receiving areas are located in the center of the heating block.

[0015] In an optional embodiment, the number of the frame accommodating areas is 4.

[0016] In an optional embodiment, the heating block further comprises a gas channel;

[0017] The gas passage is located below the frame accommodating area, and the gas passage passes through the frame accommodating area;

[0018] When the hot pressing plate for effectively preventing the resonance of the pins in the frame is in working state, the gas channel is used to control the gas pressure in the frame accommodating area.

[0019] The beneficial effects brought by the technical solution provided by the utility model include at least:

[0020] During the bonding process, the inclination angle design in the frame accommodating area of ​​the heating block produces an overpressure effect on the pins of the chip to be bonded in the frame. Under the action of the bonding ultrasound, the pins in the frame are not prone to micro-shaking due to resonance, thereby reducing the lead creases and breakage abnormalities caused by pin resonance. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0022] Figure 1 A side view of a hot pressing plate for efficiently preventing pin resonance in a frame provided by the utility model is shown.

[0023] Figure 2 The utility model shows a structural schematic diagram of a heating block in a hot pressing plate for efficiently preventing resonance of pins in a frame.

[0024] Figure 3 The utility model shows a schematic structural diagram of a hot pressing plate in which a pressure plate is provided for effectively preventing the resonance of pins in a frame.

[0025] Figure 4 A schematic structural diagram of a frame accommodating area in a hot pressing plate provided by the utility model for efficiently preventing resonance of pins in a frame is shown.

[0026] Figure 5 A side view schematic diagram of an inclination angle provided by the utility model is shown.

[0027] The reference numerals in the accompanying drawings are as follows:

[0028] 1-heating block, 2-pressing plate, chip to be bonded;

[0029] 11-frame accommodating area, 12-gas channel;

[0030] 21-opening;

[0031] 111-Inclination. DETAILED DESCRIPTION

[0032] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0033] It should be noted that the hot pressing plate for preventing pin resonance involved in the present invention is used to prevent the pins of the chip to be bonded from resonating due to the unfixed position during the bonding process. The resonance phenomenon can easily lead to abnormal lead creases and breakages.

[0034] Figure 1 A side view of a hot pressing plate for efficiently preventing resonance of pins in a frame provided by an exemplary embodiment of the utility model is shown. Figure 2 A schematic structural diagram of a heating block in a hot pressing plate for efficiently preventing resonance of pins in a frame provided by an exemplary embodiment of the utility model is shown. Figure 3 A schematic structural diagram of a pressure plate in a hot pressing plate for efficiently preventing resonance of pins in a frame provided by an exemplary embodiment of the utility model is shown. Figure 4 The schematic diagram of the structure of the frame accommodation area in the hot pressing plate for effectively preventing the resonance of the pins in the frame provided by an exemplary embodiment of the utility model is shown. Please refer to Figures 1 to 4 The hot pressing plate for efficiently preventing the resonance of the pins in the frame includes a heating block and a pressing plate; the pressing plate is located above the heating block; the heating block includes at least two frame accommodating areas, and the two adjacent frame accommodating areas are fitted together; the pressing plate has an opening, and when the pressing plate contacts the heating block, the position of the opening corresponds to the at least two frame accommodating areas; the edge of the frame accommodating area has an inclination angle; when the hot pressing plate for efficiently preventing the resonance of the pins in the frame is in a working state, the heating block and the pressing plate cooperate, the frame accommodating area is used to accommodate the chip to be bonded, and the pins of the chip to be bonded are squeezed by the inclination angle.

[0035] The device shown in the utility model can be widely applicable to a Quad Flat No-leads Package (QFN) frame and a Dual Flat No-lead Package (DFN) frame.

[0036] It should be noted that, in the present invention, the inclination angle is a raised block structure that is triangular in side view.

[0037] It should be noted that in the embodiment of the utility model, the heating block and the pressure plate will be placed in the frame accommodation area during the actual working process. The heating block and the pressure plate are fixed by the workpiece through the bonding process, and they are in contact with each other to produce extrusion. At this time, since the pins of the chip to be bonded are located above the inclination angle, when the heating block and the pressure plate are squeezed, the inclination angle will come into contact with the chip to be bonded and squeeze the pins to prevent the occurrence of pin resonance.

[0038] To summarize, the hot pressing plate provided by the embodiment of the utility model is efficient in preventing resonance of pins in the frame. During the bonding process, an overpressure effect is generated on the pins of the chip to be bonded in the frame by designing the inclination angle in the frame accommodating area of ​​the heating block. Under the action of the bonding ultrasonic wave, the pins in the frame are not prone to micro-shaking due to resonance, thereby reducing abnormal lead creases and breakages caused by pin resonance.

[0039] Next, combine Figures 1 to 5 , the specific structural parameters of the inclination angle involved in the embodiment of the utility model and the specific structure of the hot pressing plate for effectively preventing the resonance of the pins in the frame are explained.

[0040] In an alternative embodiment, please refer to Figure 5 The inclination angle is realized as a triangular convex block structure in the side view. The two right-angle sides of the inclination angle correspond to the bottom surface of the frame accommodating area and the edge of the frame accommodating area respectively.

[0041] In this case, the frame accommodating area is rectangular, and the inclination angles are distributed at the edges of each side of the frame accommodating area. In an optional embodiment, the height of the inclination angle is 15 μm to 30 μm.

[0042] In an optional embodiment, at least two frame accommodating areas are located in the center of the heating block, and the number of frame accommodating areas is four.

[0043] In an alternative embodiment, please refer to Figure 2 The heating block further comprises a gas channel, the gas channel is located above the frame accommodating area, and the gas channel passes through the frame accommodating area. Correspondingly, an inlet hole of the gas channel is opened on the front side of the pressing plate.

[0044] When the hot pressing plate for effectively preventing the resonance of the pins in the frame is in working state, the gas channel is used to control the gas pressure in the frame accommodating area.

[0045] The above are only optional embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A hot pressing plate for effectively preventing the resonance of pins in a frame, characterized in that: The highly efficient heat pressing plate for preventing the resonance of pins in a frame comprises a heating block (1) and a pressing plate (2); The pressing plate (2) is located above the heating block (1); The heating block (1) comprises at least two frame accommodating areas (11), and two adjacent frame accommodating areas (11) are in close contact with each other; The pressing plate (2) has an opening (21), and when the pressing plate (2) is in contact with the heating block (1), the position of the opening (21) corresponds to the position of at least two of the frame accommodating areas (11); The edge of the frame accommodating area (11) has an inclination angle (111); When the hot pressing plate for efficiently preventing pin resonance in a frame is in operation, the heating block (1) and the pressing plate (2) cooperate, the frame accommodating area (11) is used to accommodate the chip to be bonded (3), and the pins of the chip to be bonded (3) are squeezed by the inclination angle (111).

2. The hot pressing plate for efficiently preventing the resonance of pins in the frame according to claim 1 is characterized in that: The two right-angled sides of the inclination (111) correspond to the bottom surface of the frame accommodating area (11) and the edge of the frame accommodating area (11) respectively.

3. The hot pressing plate for efficiently preventing the resonance of pins in the frame according to claim 2 is characterized in that: The frame accommodating area (11) is rectangular; The inclination angles (111) are distributed on the edges of each side of the frame accommodating area (11).

4. The hot pressing plate for efficiently preventing the resonance of pins in the frame according to claim 2 is characterized in that: The height of the inclination (111) is 15 μm to 30 μm.

5. The hot pressing plate for efficiently preventing the resonance of pins in the frame according to claim 1 is characterized in that: At least two of the frame accommodating areas (11) are located in the center of the heating block (1).

6. The hot pressing plate for efficiently preventing the resonance of pins in the frame according to claim 5 is characterized in that: The number of the frame accommodating areas (11) is 4.

7. The hot pressing plate for efficiently preventing the resonance of pins in the frame according to claim 1 is characterized in that: The heating block (1) further comprises a gas channel (12); The gas passage (12) is located below the frame accommodating area (11), and the gas passage (12) passes through the frame accommodating area; When the hot pressing plate for efficiently preventing resonance of pins in a frame is in a working state, the gas channel (12) is used to control the gas pressure in the frame accommodating area (11).

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