Surface mounting equipment for semiconductor device production

Abstract

The utility model discloses a mounting device for semiconductor device production, and relates to the technical field of welding. The mounting equipment for semiconductor device production comprises a mounting equipment base, and a semiconductor device conveying belt is fixedly mounted at the upper end of the mounting equipment base; the upper end of the mounting equipment base is fixedly connected with a heating box, the interior of the heating box is fixedly connected with a heating pipe, the upper end of the mounting equipment base is fixedly connected with a working frame, the surface of the working frame is provided with an adjusting assembly, and semiconductor devices are conveyed through a semiconductor device conveying belt. The semiconductor devices are subjected to hot melting and cooling through the heating pipe and the cooling fan respectively, the distance between the cooling fan and the semiconductor device conveying belt is changed, the position of the cooling fan can be conveniently adjusted according to the density of different semiconductor devices, the good cooling effect is achieved, the operation process is simple and convenient, and the production efficiency is improved. And the batch processing efficiency of the semiconductor devices is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of welding, in particular to a mounting device for producing semiconductor devices. Background Art

[0002] Semiconductor devices are electronic devices with conductivity between good conductors and insulators, which use the special electrical properties of semiconductor materials to complete specific functions. Semiconductor device mounting is a process flow in reflow soldering. The Chinese utility model patent, authorization announcement number "CN202633307U", discloses a low-cost semiconductor optical device surface mount packaging structure, at least one semiconductor optical device is arranged on the substrate, and the semiconductor optical device is connected to the transimpedance amplifier through a wire; the lower surface of the transimpedance amplifier is bonded to the upper surface of the lead flexible board, and the lower surface of the lead flexible board is bonded to the bottom plate; the lead flexible board is provided with inner pins and outer pins, and the inner pins are electrically connected to the transimpedance amplifier through wires; a right-angle prism is installed above the receiving surface of the semiconductor optical device to form an optical path window; the semiconductor optical device, the transimpedance amplifier, the wire and the inner pins of the lead flexible board are all covered with packaging materials.

[0003] The above technical solution adopts surface mounting technology and wire bonding technology, takes lead soft board as carrier, and connects semiconductor optical device and lead soft board with wire. It has high integration and low mounting cost, and is conducive to expansion, integration and large-scale production. However, the above technical solution still has certain defects. When the above device is in use, the solder paste needs to be melted and cooled after mounting and transferred to other equipment. The operation is cumbersome, which greatly affects the efficiency of batch processing of semiconductor devices and is difficult to meet people's use requirements. Therefore, the utility model proposes a new solution. Utility Model Content

[0004] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a mounting device for semiconductor device production, which can solve the problem that when in use, the solder paste needs to be melted and cooled after mounting and needs to be transferred to other equipment, which is cumbersome to operate, greatly affects the efficiency of batch processing of semiconductor devices, and is difficult to meet people's usage requirements.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a placement device for semiconductor device production, comprising a placement device base, a semiconductor device conveyor belt is fixedly installed on the upper end of the placement device base;

[0006] The upper end of the mounting equipment base is fixedly connected with a heating box;

[0007] Among them, a heating tube is fixedly connected to the inside of the heating box, a working frame is fixedly connected to the upper end of the mounting equipment base, and an adjustment component is arranged on the surface of the working frame.

[0008] Preferably, the adjustment assembly includes a fixing plate, and a driving motor is fixedly connected to the lower end of the fixing plate;

[0009] The output end of the driving motor rotates through the fixed plate and is fixedly connected with a threaded rod, a movable block is threadedly sleeved on the surface of the threaded rod, and a connecting block is fixedly connected to one end of the movable block close to the working frame;

[0010] Wherein, a slide groove is provided on the surface of the working frame, and the connecting block is slidably connected with the inner wall of the slide groove.

[0011] Preferably, there are two adjusting components, which are respectively arranged at the left and right ends of the working frame.

[0012] Preferably, a fixed bracket is fixedly connected to the upper end of the mounting equipment base, and a detachable solder paste can is fixedly installed on the upper end of the fixed bracket.

[0013] Preferably, a plurality of semiconductor device fixing blocks are placed on the surface of the semiconductor device conveyor belt;

[0014] Wherein, the upper surface of each semiconductor device fixing block is fixedly connected with a semiconductor device limiting block.

[0015] Preferably, a glue coating hose is fixedly connected to the lower end of the solder paste tank, and a solenoid valve is installed inside the glue coating hose.

[0016] Compared with the prior art, the beneficial effects of the utility model are:

[0017] (1) The semiconductor device production mounting equipment conveys semiconductor devices through a semiconductor device conveyor belt. Compared with the existing mounting packaging structure, the semiconductor devices are respectively melted and cooled through a heating tube and a heat dissipation fan, and the distance between the heat dissipation fan and the semiconductor device conveyor belt is changed, so that the position of the heat dissipation fan can be adjusted according to the density of different semiconductor devices to achieve a better cooling effect. The operation process is simple to meet people's usage requirements and improve the efficiency of batch processing of semiconductor devices.

[0018] (2) The placement equipment for semiconductor device production places semiconductor devices on a semiconductor device fixing block and limits the semiconductor devices by a semiconductor device limiting block, thereby facilitating improving the stability of semiconductor devices during transportation, ensuring that the semiconductor devices maintain a stable position during transportation and avoid being impacted by external forces, thereby reducing the failure rate of semiconductor devices during transportation and improving the stability and efficiency of the production line. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The utility model is further described below in conjunction with the accompanying drawings and embodiments:

[0020] Figure 1This is a schematic diagram of the structure of a placement device for producing semiconductor devices according to the utility model;

[0021] Figure 2 This is a schematic diagram of the solder paste tank of the utility model;

[0022] Figure 3 This is a schematic diagram of a semiconductor device fixing block of the utility model;

[0023] Figure 4 This is a schematic diagram of the heating tube of the utility model;

[0024] Figure 5 This is a schematic diagram of a heat dissipation fan of the utility model.

[0025] Figure numerals: 1. Mounting equipment base; 2. Semiconductor device conveyor belt; 3. Fixed bracket; 4. Heating box; 5. Work rack; 6. Semiconductor device fixing block; 7. Solder paste tank; 8. Glue coating hose; 9. Solenoid valve; 10. Semiconductor device limit block; 11. Heating tube; 12. Fixed plate; 13. Driving motor; 14. Movable block; 15. Threaded rod; 16. Slide groove; 17. Connecting block; 18. Fan fixing frame; 19. Cooling fan. DETAILED DESCRIPTION

[0026] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0027] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0028] In the description of the present utility model, "greater than", "less than", "exceed" etc. are understood as not including the number itself, and "above", "below", "within" etc. are understood as including the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0029] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0030] See also Figure 1-5 The utility model provides a technical solution: a placement device for semiconductor device production, including a placement device base 1, a semiconductor device conveyor belt 2 is fixedly installed on the upper end of the placement device base 1, a heating box 4 is fixedly connected to the upper end of the placement device base 1, a heating tube 11 is fixedly connected to the interior of the heating box 4, a work frame 5 is fixedly connected to the upper end of the placement device base 1, and an adjustment component is arranged on the surface of the work frame 5.

[0031] The adjustment component includes a fixed plate 12, the lower end of which is fixedly connected to a driving motor 13, the output end of the driving motor 13 rotates through the fixed plate 12 and is fixedly connected to a threaded rod 15, a movable block 14 is threadedly sleeved on the surface of the threaded rod 15, and one end of the movable block 14 close to the working frame 5 is fixedly connected to a connecting block 17, a sliding groove 16 is provided on the surface of the working frame 5, and the connecting block 17 is slidably connected to the inner wall of the sliding groove 16.

[0032] There are two adjustment components, which are respectively arranged at the left and right ends of the work frame 5. A fixed bracket 3 is fixedly connected to the upper end of the mounting equipment base 1, and a detachable solder paste can 7 is fixedly installed on the upper end of the fixed bracket 3. A plurality of semiconductor device fixing blocks 6 are placed on the surface of the semiconductor device conveyor belt 2, and a semiconductor device limit block 10 is fixedly connected to the upper surface of each semiconductor device fixing block 6.

[0033] A glue coating hose 8 is fixedly connected to the lower end of the solder paste tank 7 , and a solenoid valve 9 is installed inside the glue coating hose 8 .

[0034] When using the device, first place the semiconductor device on the semiconductor device fixing block 6 and limit it through the semiconductor device limiting block 10 to improve the stability of the semiconductor device during transportation and ensure that the semiconductor device maintains a stable position during transportation. Then place the semiconductor device fixing block 6 on the semiconductor device conveyor belt 2 and start the semiconductor device conveyor belt 2 to convey the semiconductor device.

[0035] When passing the fixed bracket 3, the solenoid valve 9 is opened to apply the solder paste inside the solder paste tank 7 from the glue coating hose 8 to the surface of the semiconductor device, and the assembled components are placed on the solder paste. After the semiconductor device is mounted, it is hot-melted through the heating tube 11 inside the heating box 4, and then condensed through the cooling fan 19.

[0036] Start the drive motor 13 to drive the threaded rod 15 to rotate, the threaded rod 15 drives the movable block 14 to move up and down, the movable block 14 drives the corresponding connecting block 17 to slide on the inner wall of the slide groove 16, the connecting block 17 drives the fan fixing frame 18 to move up and down, and the fan fixing frame 18 drives the cooling fan 19 to move up and down. When the threaded rod 15 drives the movable block 14 to move up and down, it will be blocked by the connecting block 17, so that the movable block 14 can only move up and down but not rotate. By changing the distance between the cooling fan 19 and the semiconductor device conveyor belt 2, it is convenient to adjust the distance according to the density of semiconductor device placement, which is convenient for semiconductor device heat dissipation and solder paste condensation.

[0037] Furthermore, the semiconductor devices are conveyed by the semiconductor device conveyor belt 2. Compared with the existing mounting packaging structure, the semiconductor devices are heat-melted and cooled respectively by the heating tube 11 and the heat dissipation fan 19, and the distance between the heat dissipation fan 19 and the semiconductor device conveyor belt 2 is changed, so that the position of the heat dissipation fan 19 can be adjusted according to the density of different semiconductor devices to achieve a better cooling effect. The operation process is simple to meet people's usage requirements and improve the efficiency of batch processing of semiconductor devices.

[0038] By placing the semiconductor device on the semiconductor device fixing block 6 and limiting the semiconductor device by the semiconductor device limiting block 10, the stability of the semiconductor device during transportation can be improved, and the semiconductor device can be ensured to maintain a stable position during transportation to avoid being impacted by external forces. The failure rate of the semiconductor device during transportation can be reduced, and the stability and efficiency of the production line can be improved.

[0039] Working principle: When using the equipment, first place the semiconductor device on the semiconductor device fixing block 6 and limit it through the semiconductor device limiting block 10 to improve the stability of the semiconductor device during transportation and ensure that the semiconductor device maintains a stable position during transportation. Then place the semiconductor device fixing block 6 on the semiconductor device conveyor belt 2 and start the semiconductor device conveyor belt 2 to convey the semiconductor device.

[0040] When passing the fixed bracket 3, the solenoid valve 9 is opened to apply the solder paste inside the solder paste tank 7 from the glue coating hose 8 to the surface of the semiconductor device, and the assembled components are placed on the solder paste. After the semiconductor device is mounted, it is hot-melted through the heating tube 11 inside the heating box 4, and then condensed through the cooling fan 19.

[0041] Start the drive motor 13 to drive the threaded rod 15 to rotate, the threaded rod 15 drives the movable block 14 to move up and down, the movable block 14 drives the corresponding connecting block 17 to slide on the inner wall of the slide groove 16, the connecting block 17 drives the fan fixing frame 18 to move up and down, and the fan fixing frame 18 drives the cooling fan 19 to move up and down. When the threaded rod 15 drives the movable block 14 to move up and down, it will be blocked by the connecting block 17, so that the movable block 14 can only move up and down but not rotate. By changing the distance between the cooling fan 19 and the semiconductor device conveyor belt 2, it is convenient to adjust the distance according to the density of semiconductor device placement, which is convenient for semiconductor device heat dissipation and solder paste condensation.

[0042] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments. Various changes can be made within the knowledge scope of ordinary technicians in the technical field without departing from the purpose of the present invention.

Claims

1. A placement device for semiconductor device production, comprising a placement device base (1), a semiconductor device conveyor belt (2) being fixedly mounted on the upper end of the placement device base (1), characterized in that: The upper end of the mounting equipment base (1) is fixedly connected to a heating box (4); The interior of the heating box (4) is fixedly connected with a heating tube (11), the upper end of the mounting device base (1) is fixedly connected with a working frame (5), and the surface of the working frame (5) is provided with an adjustment component; The adjustment component comprises a fixing plate (12), and a driving motor (13) is fixedly connected to the lower end of the fixing plate (12); The output end of the driving motor (13) rotates through the fixed plate (12) and is fixedly connected to a threaded rod (15); a movable block (14) is threadedly sleeved on the surface of the threaded rod (15); and a connecting block (17) is fixedly connected to one end of the movable block (14) close to the working frame (5); A sliding groove (16) is provided on the surface of the working frame (5), and the connecting block (17) is slidably connected to the inner wall of the sliding groove (16).

2. A placement device for semiconductor device production according to claim 1, characterized in that: There are two adjustment components, which are respectively arranged at the left and right ends of the working frame (5).

3. A semiconductor device production placement equipment according to claim 1, characterized in that: The upper end of the mounting equipment base (1) is fixedly connected to a fixed bracket (3), and the upper end of the fixed bracket (3) is fixedly mounted with a detachable solder paste tank (7).

4. A semiconductor device production placement equipment according to claim 1, characterized in that: A plurality of semiconductor device fixing blocks (6) are placed on the surface of the semiconductor device conveyor belt (2); Wherein, the upper surface of each semiconductor device fixing block (6) is fixedly connected with a semiconductor device limiting block (10).

5. A placement device for semiconductor device production according to claim 3, characterized in that: The lower end of the solder paste tank (7) is fixedly connected to a glue coating hose (8), and a solenoid valve (9) is installed inside the glue coating hose (8).

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