Calibration jig and semiconductor processing equipment

Abstract

The utility model discloses a calibration jig and semiconductor processing equipment. The calibration jig is used for achieving position calibration between a wafer bearing table and a mechanical arm, the mechanical arm is used for conveying a wafer to the wafer bearing table, the calibration jig comprises a first calibration piece, the first calibration piece comprises a bearing plate and a connecting part located on the first side of the bearing plate, and the connecting part is used for connecting the bearing plate to the mechanical arm; the bearing plate is provided with a notch part and a first clamping part, the connecting part is used for being detachably connected to the wafer bearing table, and the notch part corresponds to a first groove in the wafer bearing table in position; and the second calibration piece comprises a second clamping part and a third clamping part, the second clamping part is used for being detachably clamped to the first clamping part, and the third clamping part is used for being detachably clamped to the mechanical arm. According to the calibration jig and the semiconductor processing equipment, position calibration between the wafer bearing table and the mechanical arm can be conveniently achieved.

Description

Technical Field

[0001] The present application relates to the technical field of calibration equipment, and in particular to a calibration fixture and semiconductor processing equipment. Background Art

[0002] For semiconductor processing equipment such as wafer flaw detection equipment, the wafer carrier is usually located inside the machine, and the robot arm is usually outside the machine, used to transfer the wafer to the wafer carrier and make the center of the wafer correspond to the center position of the wafer carrier.

[0003] Currently, the position calibration between the wafer carrier and the robot arm is usually achieved through visual observation and rotation testing, which is inconvenient and difficult to achieve accurate calibration.

[0004] Therefore, improvements are needed to at least partially solve the above problems. Utility Model Content

[0005] A series of simplified concepts are introduced in the utility model content section, which will be further described in detail in the detailed implementation section. The utility model content section of the utility model does not mean to attempt to define the key features and essential technical features of the technical solution claimed for protection, nor does it mean to attempt to determine the scope of protection of the technical solution claimed for protection.

[0006] In order to at least partially solve the above problems, according to a first aspect of the present invention, a calibration fixture is provided, the calibration fixture is used to realize the position calibration between a wafer carrier and a robot arm, the robot arm is used to transfer the wafer to the wafer carrier, the calibration fixture comprises:

[0007] A first calibration piece, the first calibration piece comprises a carrier plate and a connecting portion located on a first side of the carrier plate, the carrier plate is provided with a notch portion and a first clamping portion, wherein the connecting portion is used to be detachably connected to the wafer carrier, and the notch portion corresponds to a position of a first groove on the wafer carrier;

[0008] The second calibration piece includes a second clamping portion and a third clamping portion, the second clamping portion is used to be detachably clamped to the first clamping portion, and the third clamping portion is used to be detachably clamped to the robotic arm.

[0009] Exemplarily, the connecting portion is a first arc-shaped wall, and the first arc-shaped wall is used to be detachably snap-fitted to a circumferential edge of the wafer supporting platform.

[0010] Exemplarily, the second calibration member includes a first connecting block and a second connecting block, the first connecting block is connected to the second connecting block, and the first connecting block and the second connecting block are stepped as a whole, the second clamping portion is located on the first connecting block, and the third clamping portion is located on the second connecting block;

[0011] When the second clamping portion is clamped to the first clamping portion, the first connecting block is located at the second side of the carrying plate, and the second connecting block is partially located in the notch.

[0012] Exemplarily, the second clamping portion is a plug hole or a slot, and the first clamping portion is a plug-in column, and the plug-in column matches the shape of the plug hole or the slot.

[0013] Exemplarily, the third clamping portion is a boss, and the robotic arm has a second groove matching the shape of the boss.

[0014] Exemplarily, the first calibration member further includes a second arc-shaped wall located on a second side of the carrier plate, and the second arc-shaped wall matches the outer contour shape of the wafer;

[0015] Wherein, the center of the wafer located in the second arc-shaped wall corresponds to the center position of the wafer supporting platform.

[0016] Exemplarily, the edge of the second arc-shaped wall is provided with a rounded corner.

[0017] Exemplarily, the notch portion is strip-shaped, having a first edge and a second edge parallel to each other;

[0018] The first calibration member further includes a first straight wall and a second straight wall parallel to each other, wherein the first straight wall and the second straight wall are both located on the first side of the supporting plate, the first straight wall is connected to the first edge, and the second straight wall is connected to the second edge.

[0019] Exemplarily, the edge of the notch portion is provided with rounded corners.

[0020] According to a second aspect of the present invention, there is provided a semiconductor processing device, which includes the calibration fixture as described above.

[0021] According to the calibration jig and semiconductor processing equipment of the utility model, when performing position calibration between the wafer carrier and the robot arm, the connecting portion of the first calibration piece can be first connected to the wafer carrier, so that the notch portion corresponds to the position of the first groove on the wafer carrier, and then the second clamping portion of the second calibration piece is clamped to the first clamping portion, and the position to be calibrated by the robot arm is located by the third clamping portion on the second calibration piece (the robot arm places the wafer at this position so that the center of the wafer corresponds to the center of the wafer carrier), and finally the robot arm is moved to this position and clamped with the third clamping portion to complete the position calibration. According to the calibration jig and semiconductor processing equipment of the utility model, accurate position calibration between the wafer carrier and the robot arm can be conveniently achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The following drawings of the present application are hereby used as part of the present application for understanding the present application. The drawings show the embodiments of the present application and their descriptions, and are used to explain the device and principle of the present application. In the drawings,

[0023] Figure 1 It is a structural schematic diagram of a wafer carrying platform according to an embodiment of the present application;

[0024] Figure 2 is a schematic structural diagram of a robotic arm according to an embodiment of the present application;

[0025] Figure 3 is a schematic structural diagram of a first calibration component according to an embodiment of the present application;

[0026] Figure 4 is a schematic structural diagram of a first calibration component according to an embodiment of the present application;

[0027] Figure 5 is a schematic structural diagram of a second calibration component according to an embodiment of the present application;

[0028] Figure 6 It is a schematic structural diagram of a second calibration component according to an embodiment of the present application;.

[0029] Figure 7 It is a schematic structural diagram of a first calibration component connected to a wafer carrier according to an embodiment of the present application.

[0030] Description of reference numerals:

[0031] 10-wafer carrying platform, 11-first groove;

[0032] 20-Robotic arm;

[0033] 100 - first calibration piece, 110 - carrying plate, 111 - first clamping portion, 112 - notch portion, 1121 - first edge, 1122 - second edge, 1123 - third edge, 120 - connecting portion, 130 - first straight wall, 140 - second straight wall, 150 - second curved wall;

[0034] 200 - second calibration piece, 210 - first connecting block, 211 - second clamping portion, 220 - second connecting block, 221 - third clamping portion. DETAILED DESCRIPTION

[0035] In the following description, a large number of specific details are provided to provide a more thorough understanding of the present application. However, it is apparent to those skilled in the art that the present application can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present application, some technical features well known in the art are not described.

[0036] It should be understood that the present application can be implemented in different forms and should not be construed as being limited to the embodiments presented herein. On the contrary, providing these embodiments will make the disclosure thorough and complete and fully convey the scope of the present application to those skilled in the art. In the accompanying drawings, the sizes and relative sizes of layers and regions may be exaggerated for clarity. The same reference numerals throughout represent the same elements.

[0037] It should be understood that although the terms first, second, third, etc. can be used to describe various elements, components, regions, layers and / or parts, these elements, components, regions, layers and / or parts should not be limited by these terms. These terms are only used to distinguish one element, component, region, layer or part from another element, component, region, layer or part. Therefore, without departing from the teachings of the present application, the first element, component, region, layer or part discussed below can be represented as a second element, component, region, layer or part.

[0038] Spatially relative terms such as "under", "beneath", "below", "under", "above", "above", etc., may be used herein for convenience of description to describe the relationship of one element or feature to other elements or features shown in the figures. It should be understood that the spatially relative terms are intended to encompass different orientations of the device in use and operation in addition to the orientation shown in the figures.

[0039] The purpose of the terms used herein is only to describe specific embodiments and is not intended to be limiting of the present application. When used herein, the singular forms "one", "an" and "said / the" are also intended to include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "consisting of" and / or "comprising", when used in this specification, determine the presence of the features, integers, steps, operations, elements and / or parts, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, parts and / or groups. When used herein, the term "and / or" includes any and all combinations of the relevant listed items.

[0040] See attached Figure 1-7 An exemplary description is given of a calibration jig according to an embodiment of the present application, where the calibration jig is used to achieve position calibration between the wafer carrier 10 and the robot arm 20 .

[0041] See attached Figure 1 , the wafer carrier 10 is used to carry the wafer. The wafer carrier 10 is approximately cylindrical, and its upper surface is used to carry the wafer. The wafer carrier 10 has a first groove 11. Exemplarily, the wafer carrier 10 can be a wafer carrier 10 in a wafer microwave flaw detection device, which can drive the wafer thereon to rotate for microwave flaw detection. When the center of the wafer on the wafer carrier 10 is greatly offset from the center of the wafer carrier 10, it will cause abnormal detection or wafer drop during rotation.

[0042] See attached Figure 2 , the robot arm 20 is used to transfer the wafer to the wafer carrier 10. The robot arm 20 is also called a wafer transfer robot arm 20, which may include a base and a plurality of arms that are rotatably connected in sequence, wherein the wafer may be fixed on the end arm by vacuum adsorption. The robot arm 20 may transfer the wafer to the wafer carrier 10 by its own movement, and after the robot arm 20 places the wafer on the wafer carrier 10, it may leave the wafer carrier 10 through the first groove 11.

[0043] In order to enable the robot arm 20 to accurately transfer the wafer to the wafer carrier 10, that is, to make the center of the wafer placed on the wafer carrier 10 correspond to the center position of the wafer carrier 10, that is, to make the central axis of the wafer placed on the wafer carrier 10 coincide with or basically coincide with the central axis of the wafer carrier 10, it is necessary to perform a position calibration between the wafer carrier 10 and the robot arm 20.

[0044] The calibration fixture of the embodiment of the present application is used to achieve position calibration between the wafer carrier 10 and the robot arm 20 , and includes a first calibration component 100 and a second calibration component 200 .

[0045] See attached Figure 3 ,4 The first calibration member 100 includes a carrier plate 110 and a connecting portion 120 located on a first side of the carrier plate 110, and a notch portion 112 and a first clamping portion 111 are provided on the carrier plate 110. The connecting portion 120 is used to be detachably connected to the wafer carrier 10, so that the first side of the carrier plate 110 is fitted with the upper surface of the wafer carrier 10. The notch portion 112 corresponds to the position of the first groove 11 on the wafer carrier 10, that is, after the connecting portion 120 is connected to the wafer carrier 10, the notch portion 112 and the first groove 11 are in a specific relative position, and at this position, the projection on the wafer carrier 10 at least partially overlaps with the first groove 11, that is, during the calibration process, the robot 20 can move to the first groove 11 through the notch portion 112.

[0046] The second calibration member 200 includes a second clamping portion 211 and a third clamping portion 221, wherein the second clamping portion 211 is used to be detachably clamped to the first clamping portion 111, and the third clamping portion 221 is used to be detachably clamped to the robot 20. It should be noted that when the connecting portion 120 is connected to the wafer carrier 10, the notch portion 112 corresponds to the position of the first groove 11 on the wafer carrier 10, and the second clamping portion 211 is clamped to the first clamping portion 111, the position of the third clamping portion 221 corresponds to the position to which the robot 20 needs to be calibrated, that is, the robot 20 places the wafer at this position, and the robot 20 places the wafer at this position so that the center of the wafer corresponds to the center position of the wafer carrier 10. Thus, when the connection portion 120 is connected to the wafer carrier 10, the notch portion 112 corresponds to the position of the first groove 11 on the wafer carrier 10, and the second clamping portion 211 is clamped to the first clamping portion 111, the robot 20 can be moved to be clamped with the third clamping portion 221 (the robot 20 has a clamping structure corresponding to the third clamping portion 221), and the position of the robot 20 when the two are clamped is recorded, and this position is the position that the robot 20 needs to be calibrated to. The robot 20 places the wafer at this position later, so that the center of the wafer can correspond to the center position of the wafer carrier 10.

[0047] According to the calibration fixture of the utility model, when performing position calibration between the wafer carrier 10 and the robot 20, the connection portion 120 of the first calibration member 100 can be first connected to the wafer carrier 10 so that the notch portion 112 corresponds to the position of the first groove 11 on the wafer carrier 10. Then, the robot 20 is powered on, and the robot 20 (that is, the end arm of the robot 20) is moved to the notch portion 112 and the first groove 11, that is, moved to the vicinity of the position to be calibrated. It should be noted that after the robot 20 is powered on, its position recorder is still started, and the position of the robot 20 can be recorded. Afterwards, the second clamping portion 211 of the second calibration member 200 is clamped to the first clamping portion 111, and the position to be calibrated by the robot 20 is located through the third clamping portion 221 on the second calibration member 200 (the robot 20 places the wafer at this position so that the center of the wafer corresponds to the center position of the wafer carrier 10). Finally, the robot arm 20 is moved to this position, connected with the third clamping part 221, and the position of the robot arm 20 at this time is recorded, and the position calibration can be completed. Subsequently, the robot arm can place the wafer at this position so that the center of the wafer corresponds to the center position of the wafer carrier 10. According to the calibration fixture and semiconductor processing equipment of the utility model, the precise position calibration between the wafer carrier 10 and the robot arm 20 can be easily achieved.

[0048] See attached Figure 3 , 7 In the present embodiment, the connection portion 120 is a first arcuate wall, and the first arcuate wall matches the shape of the circumferential edge of the wafer carrier 10, and the first arcuate wall is used to be detachably connected to the circumferential edge of the wafer carrier 10. The first arcuate wall is perpendicular to the carrier plate 110. When the first arcuate wall is connected to the circumferential edge of the wafer carrier 10, the first arcuate wall is sleeved on the outer side of the circumferential edge of the circular carrier, and is slightly interference fit with the circumferential edge of the wafer carrier 10, thereby achieving a connection and fixation between the two. It should be noted that the connection portion 120 may also be other structural forms, as long as it can be detachably connected to the wafer carrier 10.

[0049] See attached Figure 5 , 6In this embodiment, the second calibration member 200 includes a first connection block 210 and a second connection block 220, the first connection block 210 is connected to the second connection block 220, and the first connection block 210 and the second connection block 220 are stepped as a whole, the second clamping portion 211 is located on the first connection block 210, and the third clamping portion 221 is located on the second connection block 220. The second clamping portion 211 and the third clamping portion 221 are located on the same side of the second calibration member 200. When the second clamping portion 211 is clamped to the first clamping portion 111, the first connection block 210 is located on the second side of the carrier plate 110 (that is, the side of the carrier plate 110 away from the wafer carrier 10), and the second connection block 220 is partially located in the notch 112. Since the supporting plate 110 has a certain thickness and the position to which the robot arm 20 needs to be calibrated needs to be slightly higher than the surface of the wafer supporting platform 10, the height of the robot arm 20 in a direction perpendicular to the wafer supporting platform 10 can be accurately positioned by configuring the first connecting block 210 and the second connecting block 220 into a step shape.

[0050] For example, the second clamping portion 211 may be a plug hole or a slot, wherein the plug hole passes through the carrier plate 110, and the slot does not pass through the carrier plate 110. The first clamping portion 111 may be a plug post, which matches the shape of the plug hole or the slot. Figure 5 In this embodiment, the first clamping portion 111 is three plug-in posts, each of which is cylindrical and arranged in a herringbone shape, and the second clamping portion 211 is three plug-in holes corresponding to the shapes and positions of the three plug-in posts. In some other embodiments, the first clamping portion 111 can be a plug-in post, and its cross-sectional shape can be rectangular or trapezoidal, etc., and the second clamping portion 211 is a corresponding plug-in hole or slot.

[0051] See attached Figure 5 In this embodiment, the third clamping portion 221 is a boss, and the robot arm 20 has a second groove matching the shape of the boss, and the boss is clamped in the second groove. The second groove can be a structure that the robot arm 20 has, so that the position calibration can be effectively achieved without changing the structure of the robot arm 20. In another embodiment, the third clamping portion 221 can be a groove, in which case, it is necessary to additionally configure a boss or plug-in column corresponding to it on the robot arm 20.

[0052] In this embodiment, the first calibration member 100 also includes a second curved wall 150 located on the second side of the carrier plate 110, and the second curved wall 150 is located at the outer peripheral edge of the carrier plate 110. The second curved wall 150 matches the outer contour shape of the wafer, and the center of the wafer located in the second curved wall 150 corresponds to the center position of the wafer carrier 10. Therefore, in the calibration fixture according to the embodiment of the present application, after the position is completed, the second calibration member 200 can be removed, and the first calibration member 100 connected to the wafer carrier 10 is retained. Then, the robot 20 is controlled to transfer the wafer in the calibrated position. If the transferred wafer can be placed just in the second curved wall 150 (on the carrier plate 110 located in the second curved wall 150) without colliding with the second curved wall 150, it means that the position calibration is successful; if the wafer collides with the second curved wall 150 during the transfer process, it means that the calibration fails and needs to be recalibrated. It should be noted that after the calibration is successful and the robot 20 has been used normally for a period of time, the first calibration component 100 can also be connected to the wafer carrier 10 for inspection, that is, the first calibration component 100 is connected to the wafer carrier 10, and then the robot 20 is controlled to transfer the wafer. If the transferred wafer can be placed just in the second curved wall 150 without colliding with the second curved wall 150, it means that the robot 20 can accurately transfer the wafer and no recalibration is required; if the wafer collides with the second curved wall 150 during the transfer process, it means that the position of the wafer transferred by the robot 20 has deviated and needs to be recalibrated.

[0053] In this embodiment, the edge of the second arc-shaped wall 150 is provided with rounded corners, that is, the edge of the second arc-shaped wall 150 away from the wafer carrier 10 and the edges at both ends of the second arc-shaped wall 150 are provided with rounded corners. On the one hand, when testing whether the calibration is successful, the wafer can be placed to collide with the second arc-shaped wall 150 to cause damage. On the other hand, after the wafer contacts the rounded corner, it can slide along the rounded corner toward the middle of the second arc-shaped wall 150, so that it can be observed.

[0054] See attached Figure 3 , 4In this embodiment, the notch 112 is strip-shaped and has a first edge 1121 and a second edge 1122 that are parallel to each other. The first calibration member 100 further includes a first straight wall 130 and a second straight wall 140 that are parallel to each other. The first straight wall 130 and the second straight wall 140 are both located on the first side of the carrier plate 110. The first straight wall 130 is connected to the first edge 1121, and the second straight wall 140 is connected to the second edge 1122. The width between the first straight wall 130 and the second straight wall 140 can be slightly larger than the width of the second connection block 220, so that the second connection block 220 can be located therebetween. When the robot 20 (i.e., the arm at the end of the robot 20) is moved to the notch 112 and the first groove 11, the first straight wall 130 and the second straight wall 140 can guide the movement path of the robot 20 to the vicinity of the position to be calibrated. At the same time, the first straight wall 130 and the second straight wall 140 can also prevent the robot 20 from colliding with the wafer carrier 10 during the movement. In this embodiment, the notch 112 also has a third edge 1123 that is perpendicular to the first edge 1121 and the second edge 1122. When the notch 112 corresponds to the first groove 11 on the wafer carrier 10, the third edge 1123 can be flush or fit with one side edge of the first groove 11. Therefore, after the first calibration component 100 is connected to the wafer carrier 10, it can be judged whether the notch 112 corresponds to the first groove 11. In this embodiment, both ends of the first straight wall 130 and both ends of the second straight wall 140 are in contact with the first edge 1121 and the first arc-shaped wall respectively.

[0055] In this embodiment, the edges of the notch 112 are provided with rounded corners, that is, the first edge 1121, the second edge 1122 and the third edge 1123 are all provided with rounded corners, which can effectively prevent the robot arm 20 from colliding with it during movement and being damaged.

[0056] The present application also provides a semiconductor processing equipment, which has the calibration fixture as described above.

[0057] Although example embodiments have been described herein with reference to the accompanying drawings, it should be understood that the above example embodiments are merely exemplary and are not intended to limit the scope of the present application to this. Those of ordinary skill in the art may make various changes and modifications therein without departing from the scope and spirit of the present application. All these changes and modifications are intended to be included within the scope of the present application as required by the appended claims.

[0058] In the description provided herein, a large number of specific details are described. However, it is understood that the embodiments of the present application can be practiced without these specific details. In some instances, well-known methods, structures and techniques are not shown in detail so as not to obscure the understanding of this description.

[0059] Similarly, it should be understood that in order to streamline the present application and help understand one or more of the various utility model aspects, in the description of the exemplary embodiments of the present application, the various features of the present application are sometimes grouped together into a single embodiment, figure, or description thereof. However, the method of the present application should not be interpreted as reflecting the following intention: the claimed application requires more features than the features explicitly stated in each claim. More specifically, as reflected in the corresponding claims, the inventive point is that the corresponding technical problem can be solved with features that are less than all the features of a single disclosed embodiment. Therefore, the claims following the specific embodiment are hereby explicitly incorporated into the specific embodiment, wherein each claim itself serves as a separate embodiment of the present application.

[0060] It will be understood by those skilled in the art that, except for mutually exclusive features, all features disclosed in this specification (including the accompanying claims, abstracts and drawings) and all processes or units of any method or device disclosed in this specification may be combined in any combination. Unless otherwise expressly stated, each feature disclosed in this specification (including the accompanying claims, abstracts and drawings) may be replaced by an alternative feature that provides the same, equivalent or similar purpose.

[0061] In addition, those skilled in the art will appreciate that, although some embodiments described herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims, any one of the claimed embodiments can be used in any combination.

[0062] It should be noted that the above-mentioned embodiments illustrate rather than limit the invention and that those skilled in the art will be able to design alternative embodiments without departing from the scope of the appended claims.

Claims

1. A calibration fixture, characterized in that: The calibration fixture is used to realize the position calibration between the wafer carrier and the robot arm, and the robot arm is used to transfer the wafer to the wafer carrier. The calibration fixture includes: A first calibration piece, the first calibration piece comprises a carrier plate and a connecting portion located on a first side of the carrier plate, the carrier plate is provided with a notch portion and a first clamping portion, wherein the connecting portion is used to be detachably connected to the wafer carrier, and the notch portion corresponds to a position of a first groove on the wafer carrier; The second calibration part includes a second clamping portion and a third clamping portion, the second clamping portion is used to be detachably clamped to the first clamping portion, and the third clamping portion is used to be detachably clamped to the robotic arm.

2. The calibration jig according to claim 1, characterized in that: The connecting portion is a first arc-shaped wall, and the first arc-shaped wall is used to be detachably clamped to the circumferential edge of the wafer supporting platform.

3. The calibration jig according to claim 1, characterized in that: The second calibration member comprises a first connecting block and a second connecting block, the first connecting block is connected to the second connecting block, and the first connecting block and the second connecting block are stepped as a whole, the second clamping portion is located on the first connecting block, and the third clamping portion is located on the second connecting block; When the second clamping portion is clamped to the first clamping portion, the first connecting block is located at the second side of the carrying plate, and the second connecting block is partially located in the notch.

4. The calibration jig according to claim 1 or 3, characterized in that: The second clamping portion is a plug hole or a slot, and the first clamping portion is a plug-in column, and the plug-in column matches the shape of the plug hole or the slot.

5. The calibration jig according to claim 1 or 3, characterized in that: The third clamping portion is a boss, and the mechanical arm has a second groove matching the shape of the boss.

6. The calibration jig according to claim 1, characterized in that: The first calibration member further comprises a second arc-shaped wall located on a second side of the carrier plate, the second arc-shaped wall matching the outer contour shape of the wafer; Wherein, the center of the wafer located in the second arc-shaped wall corresponds to the center position of the wafer supporting platform.

7. The calibration jig according to claim 6, characterized in that: The edge of the second arc-shaped wall is provided with a rounded corner.

8. The calibration jig according to claim 1, characterized in that: The notch portion is in a strip shape, and has a first edge and a second edge that are parallel to each other; The first calibration member further includes a first straight wall and a second straight wall parallel to each other, wherein the first straight wall and the second straight wall are both located on the first side of the supporting plate, the first straight wall is connected to the first edge, and the second straight wall is connected to the second edge.

9. The calibration jig according to claim 1 or 8, characterized in that: The edge of the notch is provided with a rounded corner.

10. A semiconductor processing equipment, characterized in that: Comprising a calibration fixture as described in any one of claims 1-9.

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