Improved frame

Abstract

The utility model relates to an improved frame which comprises a frame body and an overflow separation groove formed in the frame body, the overflow separation groove comprises a lower groove part and an upper groove part located on the upper side of the lower groove part, a pressing piece area used for abutting against an ejector rod is formed in the upper portion, close to the upper groove part, of the lower groove part, and the pressing piece area is located outside the lower groove part. According to the TO-247PLUS frame structure, the technical problem that a plastic package material enters the overflow isolation groove and is solidified at the positioning groove and is difficult to remove when the plastic package operation is carried out on the existing TO-247PLUS frame structure can be solved.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor packaging, in particular to an improved frame. Background Art

[0002] The lead frame is the chip carrier of the integrated circuit and serves as a bridge to connect with external wires. When the package is encapsulated by injection molding, the frame is placed in the mold cavity, and the top rod is used to push the end of the frame to fix the frame, and then the plastic encapsulation material is poured to form a plastic encapsulation structure; after the package is formed, the top rod abuts to form a positioning groove.

[0003] A circle of overflow isolation grooves is arranged circumferentially at the end of the conventional TO-247PLUS frame. During the process of plastic encapsulation of the frame to form an improved packaging structure, the ejector pin abuts against the top of the overflow isolation groove, so that after the plastic encapsulation is formed, the plastic encapsulation material enters the overflow isolation groove and solidifies at the positioning groove, which is difficult to remove, affecting the use effect of the improved packaging plastic encapsulation structure. Utility Model Content

[0004] The utility model provides an improved frame to solve the technical problem that during the plastic sealing operation of the existing TO-247PLUS frame structure, the plastic sealing material enters the overflow isolation groove and solidifies at the positioning groove, which is difficult to remove.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] An improved frame includes a frame body and an overflow isolation groove opened on the frame body, the overflow isolation groove includes a lower groove portion and an upper groove portion located on the upper side of the lower groove portion, the lower groove portion is formed with a pressing plate area for abutting a top rod at the upper portion close to the upper groove portion, and the pressing plate area is located outside the lower groove portion.

[0007] The beneficial effect of the utility model is that when injection molding forms a plastic package, the mold push rod abuts against the tablet pressing area to fix the frame body. During the injection molding process, since the tablet pressing area is isolated from the overflow isolation groove, the plastic encapsulation material will not enter the tablet pressing area, but enter between the push rod and the tablet pressing area, thereby reducing the technical problem that the plastic encapsulation material will enter the overflow isolation groove and solidify at the positioning groove, making it difficult to remove.

[0008] On the basis of the above technical solution, the present invention can also be improved as follows.

[0009] Furthermore, the lower groove portion includes two inner groove sections that are arranged opposite to each other, and the two inner groove sections are respectively located at the inner sides of the two tablet pressing areas.

[0010] The beneficial effect of adopting the above further scheme is that the other end of the inner groove section is located on the inner side of the tablet pressing area, which can form a partition for the plastic encapsulation material flowing from the tablet pressing area to the two inner groove sections, reducing the problem of the plastic encapsulation material penetrating inward, and the inner groove section improves the bonding strength with the plastic encapsulation material to form a package.

[0011] Furthermore, the lower groove portion also includes an outer groove section, which is closer to the edge of the frame body relative to the inner groove section, and the lower ends of the two inner groove sections are bent outward and respectively connected to the two ends of the outer groove section.

[0012] The beneficial effect of adopting the above further solution is that the outer groove section is closer to the edge of the frame body than the inner groove section, which can improve the bonding strength of the entire frame body and the package at the edge.

[0013] Furthermore, the upper end of the inner groove section extends to be close to the upper groove portion and forms a partition between the inner groove portion and the upper groove portion.

[0014] The beneficial effect of adopting the above further solution is that the partition separates the upper trough portion from the lower trough portion to reduce the overflow isolation trough area and ensure that the overflow isolation trough is completely filled.

[0015] Furthermore, the width of the overflow isolation groove gradually increases from the groove bottom to the groove mouth.

[0016] The beneficial effects of adopting the above further solution are: it is easy to process and form the overflow isolation groove, and it can ensure that the plastic sealing material enters the overflow isolation groove smoothly.

[0017] Furthermore, at least two recesses are formed at the bottom of the overflow isolation groove.

[0018] The beneficial effect of adopting the above further solution is that the bonding strength between the package formed after the plastic packaging material solidifies and the frame body is improved by using a plurality of recesses.

[0019] Furthermore, an arc transition surface is formed between the notch of the overflow isolation groove and the surface of the frame body.

[0020] The beneficial effect of adopting the above further solution is: the arc surface is used to form an arc transition between the overflow isolation groove and the frame body, so as to ensure that the plastic packaging material smoothly enters the overflow isolation groove.

[0021] Furthermore, a side groove located outside the tablet pressing area is formed on the edge of the frame body.

[0022] The beneficial effect of adopting the above further solution is that the plastic sealing material solidifies at the edge groove, which can improve the bonding strength between the plastic sealing at this location and the frame body.

[0023] Furthermore, the frame body includes a wafer carrier area and a pin area connected to the wafer carrier area, and the overflow isolation groove is opened in the wafer carrier area.

[0024] The beneficial effect of adopting the above further solution is that during processing, the ejector pin is fixed to the wafer carrier area, packaged and formed and wrapped in the wafer carrier area.

[0025] Furthermore, the pin area includes at least three pins, one end of which is connected to the wafer carrier area.

[0026] The beneficial effect of adopting the above further solution is: the driving and control of the MOSFET can be realized by utilizing the pins, and the necessary protection function can be provided. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a structural diagram of the improved frame of the utility model;

[0028] Figure 2 for Figure 1 Enlarged view of part A in the middle;

[0029] Figure 3 It is a partial cross-sectional view of the improved frame of the utility model, mainly used to show the overflow isolation groove;

[0030] Figure 4 The structure diagram of the TO-247PLUS frame of the related art.

[0031] In the accompanying drawings, the components represented by the reference numerals are listed as follows:

[0032] 1. Frame body; 11. Chip loading area; 12. Pin area;

[0033] 2. overflow isolation groove; 21. lower groove portion; 211. outer groove section; 212. inner groove section; 22. upper groove portion; 23. concave portion;

[0034] 3. Tablet pressing area;

[0035] 4. Partition;

[0036] 5. Side groove. DETAILED DESCRIPTION

[0037] The principles and features of the present invention are described below in conjunction with the accompanying drawings. The examples given are only used to explain the present invention and are not used to limit the scope of the present invention.

[0038] First, the conventional TO-247PLUS frame is explained, such as Figure 4As shown, a circle of overflow isolation grooves 2 is circumferentially arranged at the end of the frame body 1; during the plastic encapsulation molding process, the ejector pin abuts against the top of the overflow isolation groove 2, that is, there is an overflow isolation groove 2 passing through the bottom of the ejector pin, so that after the plastic encapsulation molding, the plastic encapsulation material enters the overflow isolation groove 2 and solidifies at the positioning groove, which is difficult to remove. The positioning groove is a groove body formed by the abutment position of the ejector pin. After demolding, the metal frame at the positioning groove is exposed, forming a certain heat dissipation effect, but the difficult-to-remove plastic encapsulation material will affect the appearance and heat dissipation effect.

[0039] The following is a detailed description of an improved frame of the present invention to solve the above problems.

[0040] Example 1

[0041] like Figure 1 and Figure 2 An improved frame includes a frame body 1 and an overflow isolation groove 2 opened on the frame body 1, the overflow isolation groove 2 includes a lower groove portion 21 and an upper groove portion 22 located on the upper side of the lower groove portion 21, and a pressing area 3 for abutting against a top rod is formed at the upper part of the lower groove portion 21 near the upper groove portion 22, and the pressing area 3 is located outside the lower groove portion 21.

[0042] The beneficial effects of this embodiment are as follows: when the plastic package is formed by injection molding, the mold push rod abuts against the tablet pressing area 3 to fix the frame body 1. During the injection molding process, since the tablet pressing area 3 is isolated from the overflow isolation groove 2, the plastic encapsulation material will not enter the tablet pressing area 3 and enter between the push rod and the tablet pressing area 3, thereby reducing the technical problem that the plastic encapsulation material will enter the overflow isolation groove and solidify at the positioning groove, making it difficult to remove.

[0043] Among them, after the packaging is formed and demolded, the pressing area 3 forms the bottom of the positioning groove and is an exposed plane, which is relatively more beautiful and does not need to be removed from the plastic packaging material. The frame body 1 is partially exposed, so that the metal frame body 1 is directly in contact with the air, forming a certain heat dissipation effect.

[0044] As a specific solution of the above embodiment, the lower groove portion 21 is located below the upper groove portion 22, and the lower groove portion 21 and the upper groove portion 22 are both "U"-shaped structures that are open toward each other, the lower groove portion 21 is upwardly open toward the upper groove portion 22, and the upper groove portion 22 is downwardly open toward the lower groove portion 21. Both ends of the upper groove portion 22 are bent downward to form a "V"-shaped downwardly open structure.

[0045] In the above embodiment, two tablet pressing areas 3 are provided and are arranged opposite to each other at the left and right ends of the upper end of the frame body 1 .

[0046] Example 2

[0047] like Figure 1 and Figure 2On the basis of Example 1, the lower groove portion 21 includes two inner groove sections 212 arranged opposite to each other, and the two inner groove sections 212 are respectively located on the inner sides of the two tablet pressing areas 3.

[0048] The beneficial effect of adopting the preferred scheme in the above embodiment is that the other end of the inner groove section 212 is located on the inner side of the pressing area 3, which can form a partition for the plastic encapsulation material flowing from the pressing area 3 to the two inner groove sections 212, thereby reducing the problem of the plastic encapsulation material penetrating inward, and the inner groove section 212 improves the bonding strength with the plastic encapsulation material to form a package.

[0049] Example 3

[0050] like Figure 1 and Figure 2 On the basis of embodiments 1 and 2, the lower groove portion 21 also includes an outer groove section 211, which is closer to the edge of the frame body 1 relative to the inner groove section 212, and the lower ends of the two inner groove sections 212 are bent outward and respectively connected to the two ends of the outer groove section 211.

[0051] The beneficial effect of adopting the preferred solution in the above embodiment is that the outer groove section 211 is closer to the edge of the frame body 1 than the inner groove section 212, which can improve the bonding strength between the entire frame body 1 and the package and the edge.

[0052] On the basis of the above-mentioned embodiment, as a whole, the spacing between the open ends of the lower groove portion 21 is smaller than the spacing between the closed ends thereof.

[0053] The inner groove section 212 is in an “L” shape as a whole, and the angles between its two ends can be 90°, 120°, 135°, etc.

[0054] Example 4

[0055] like Figure 1 and Figure 2 On the basis of embodiments 1-3, the upper end of the inner groove section 212 extends to be close to the upper groove portion 22 and forms a partition 4 between the upper groove portion 22.

[0056] The beneficial effect of adopting the preferred solution in the above embodiment is that the partition 4 separates the upper groove portion 22 and the lower groove portion 21 to reduce the area of ​​the overflow isolation groove 2 and ensure that the overflow isolation groove 2 is completely filled.

[0057] Example 5

[0058] like Figure 2 and Figure 3 On the basis of Examples 1-4, the width of the overflow isolation groove 2 gradually increases from the bottom of the groove to the groove mouth.

[0059] The beneficial effect of adopting the preferred solution in the above embodiment is that it is easy to process and form the overflow isolation groove 2, and can ensure that the plastic sealing material enters the overflow isolation groove 2 smoothly.

[0060] As a solution of the above embodiment, the lower groove portion 21 and the upper groove portion 22 are both "V"-shaped grooves opening upward.

[0061] Example 6

[0062] like Figure 2 and Figure 3 On the basis of embodiments 1-5, at least two recesses 23 are formed at the bottom of the overflow isolation groove 2.

[0063] The beneficial effect of adopting the preferred solution in the above embodiment is that the plurality of recesses 23 are used to improve the bonding strength between the package formed after the plastic packaging material solidifies and the frame body 1 .

[0064] As a specific solution of the above embodiment, the recess 23 is an arc-shaped groove, which is convenient for cleaning the plastic sealing material later. The number of the recesses 23 can be two, three, four, etc.

[0065] Example 7

[0066] like Figure 1 and Figure 2 On the basis of Embodiments 1-6, an arc transition surface is formed between the notch of the overflow isolation groove 2 and the surface of the frame body 1.

[0067] The beneficial effect of adopting the preferred solution in the above embodiment is that an arc transition is formed between the overflow isolation groove 2 and the frame body 1 by using an arc surface, so as to ensure that the plastic packaging material smoothly enters into the overflow isolation groove 2.

[0068] Example 8

[0069] like Figure 2 and Figure 3 On the basis of embodiments 1-7, a side groove 5 located outside the tablet pressing area 3 is opened on the edge of the frame body 1.

[0070] The beneficial effect of adopting the preferred solution in the above embodiment is that the plastic sealing material solidifies at the edge groove 5, which can improve the bonding strength between the plastic sealing at this location and the frame body 1.

[0071] On the basis of the above-mentioned embodiment, a circular arc transition connection is formed between the groove edge of the edge groove 5 and the tablet pressing area 3 to ensure the beautiful packaging molding.

[0072] Example 9

[0073] like Figure 1 and Figure 2 On the basis of Examples 1-8, the frame body 1 includes a wafer carrier area 11 and a pin area 12 connected to the wafer carrier area 11, and the overflow isolation groove 2 is opened in the wafer carrier area 11.

[0074] The beneficial effect of adopting the preferred solution in the above embodiment is that during processing, the ejector pin is fixed to the wafer carrier area 11 , packaged and formed, and wrapped in the wafer carrier area 11 .

[0075] The chip loading area 11 is used for pasting the chip, specifically pasting the chip on the inner side of the overflow isolation groove 2.

[0076] Example 10

[0077] like Figure 1 and Figure 2 Based on Examples 1-9, the pin area 12 includes at least three pins connected to the carrier area 11 at one end.

[0078] The beneficial effect of adopting the preferred solution in the above embodiment is that the driving and control of the MOSFET can be realized by using the pins, and the necessary protection function can be provided.

[0079] In the figure, the number of pins is shown as three, but it can also be four, five, six, etc.

[0080] Among them, MOSFET (Metal-Oxide-Semiconductor Field-Effect Transistor), that is, metal oxide semiconductor field effect transistor, also known as metal-oxide-semiconductor field effect transistor, is a semiconductor device that can be widely used in analog circuits and digital circuits.

[0081] The pins are divided into positive power supply pin, negative power supply pin, gate pin and other pins, such as line voltage detection (L) pin and external current limit (X) pin. Among them, the positive power supply pin is responsible for providing the current and voltage channel; the negative power supply pin is connected to the load or other circuit parts; the gate pin is the input pin of the error amplifier and feedback current, which is used to control the flow of current.

[0082] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0083] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In the description of the present utility model, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0084] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0085] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Moreover, a first feature being "above", "above" or "above" a second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. A first feature being "below", "below" or "below" a second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0086] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art may combine and combine the different embodiments or examples described in this specification and the features of the different embodiments or examples, without contradiction.

[0087] Although the embodiments of the present invention have been shown and described above, it can be understood that the above embodiments are exemplary and cannot be understood as limitations of the present invention. Ordinary technicians in the field can change, modify, replace and modify the above embodiments within the scope of the present invention.

Claims

1. An improved frame, comprising a frame body (1) and an overflow isolation groove (2) provided on the frame body (1), characterized in that: The overflow isolation groove (2) comprises a lower groove portion (21) and an upper groove portion (22) located on the upper side of the lower groove portion (21); a pressing plate area (3) for abutting against a push rod is formed on the upper portion of the lower groove portion (21) close to the upper portion of the upper groove portion (22); and the pressing plate area (3) is located outside the lower groove portion (21).

2. An improved frame according to claim 1, characterized in that: The lower groove portion (21) comprises two inner groove sections (212) arranged opposite to each other, and the two inner groove sections (212) are respectively located on the inner sides of the two tablet pressing areas (3).

3. An improved frame according to claim 2, characterized in that: The lower groove portion (21) further comprises an outer groove section (211), the outer groove section (211) being closer to the edge of the frame body (1) relative to the inner groove section (212), and the lower ends of the two inner groove sections (212) are both bent outwards and respectively connected to the two ends of the outer groove section (211).

4. An improved frame according to claim 2, characterized in that: The upper end of the inner groove section (212) extends to be close to the upper groove portion (22), and forms a partition (4) between the inner groove section (212) and the upper groove portion (22).

5. An improved frame according to any one of claims 1 to 4, characterized in that: The width of the overflow isolation groove (2) gradually increases from the groove bottom to the groove mouth.

6. An improved frame according to claim 5, characterized in that: At least two recessed portions (23) are formed at the bottom of the overflow isolation groove (2).

7. An improved frame according to claim 5, characterized in that: An arc transition surface is formed between the notch of the overflow isolation groove (2) and the surface of the frame body (1).

8. An improved frame according to any one of claims 1 to 4, characterized in that: The edge of the frame body (1) is provided with a side groove (5) located outside the tablet pressing area (3).

9. An improved frame according to any one of claims 1 to 4, characterized in that: The frame body (1) comprises a wafer carrier area (11) and a pin area (12) connected to the wafer carrier area (11), and the overflow isolation groove (2) is opened in the wafer carrier area (11).

10. An improved frame according to claim 9, characterized in that: The pin area (12) includes at least three pins, one end of which is connected to the wafer carrier area (11).

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