Circuit board capable of preventing copper wrinkles

Abstract

The utility model discloses a circuit board capable of preventing copper wrinkles, comprising a board body, the top of the board body is fixedly connected with a dynamic pressure balance layer, the top of the dynamic pressure balance layer is provided with a copper foil, the top of the dynamic pressure balance layer is fixedly connected with an interface adhesion layer, and the interface adhesion layer is provided with a copper wire. The interior of the dynamic pressure balance layer comprises a first pressure distribution grid layer and an elastic substrate layer, and the first pressure distribution grid layer is located on the top of the elastic substrate layer. According to the circuit board capable of preventing copper wrinkling, the dynamic pressure balance layer is introduced, so that the problem of copper foil wrinkling caused by non-uniform pressure distribution in the processing and using processes of the circuit board is effectively solved, the dynamic pressure balance layer can automatically adjust internal pressure distribution according to the change of external stress, the stress on the copper foil is uniformly distributed, and the service life of the circuit board is prolonged. Therefore, the wrinkling phenomenon of the copper foil caused by uneven stress is avoided, and the processing stability and the service life of the circuit board are remarkably improved and prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit boards, in particular to a circuit board capable of preventing copper wrinkles. Background Art

[0002] With the continuous development of science and technology, circuit board processing technology is also constantly improving. The number of layers in circuit boards has also increased with the continuous improvement of demand. Multi-layer circuit boards have become the main type of circuit board processing. During the multi-layer board processing, multiple inner layer boards need to be stacked together through a lamination process.

[0003] However, in actual application, the copper foil on the circuit board is prone to wrinkling, which seriously affects the quality and service life of the circuit board. The main reason for the wrinkling of the copper foil is that the pressure on the circuit board is unevenly distributed during processing and use. During the processing stage, the circuit board needs to undergo multiple pressing, etching and other processes. These processes may cause the copper foil to be subjected to uneven stress, thereby causing wrinkling. During use, the circuit board may be affected by external factors such as vibration and temperature changes, further exacerbating the risk of copper foil wrinkling. Utility Model Content

[0004] The purpose of the present utility model is to provide a circuit board that prevents copper wrinkling, so as to solve the problem raised in the above background technology that the circuit board is subjected to uneven pressure distribution during processing and use. During the processing stage, the circuit board needs to undergo multiple processes such as pressing and etching. These processes may cause the copper foil to be subjected to uneven stress, thereby causing wrinkling. During use, the circuit board may be affected by external factors such as vibration and temperature changes, further exacerbating the risk of copper foil wrinkling.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: A circuit board for preventing copper wrinkles, comprising a board body, a dynamic pressure balancing layer fixedly connected to the top of the board body, a copper foil provided on the top of the dynamic pressure balancing layer, an interface adhesion layer fixedly connected to the top of the dynamic pressure balancing layer, the interior of the dynamic pressure balancing layer comprising a pressure distribution grid layer 1 and an elastic base layer, the pressure distribution grid layer 1 being located on the top of the elastic base layer, the top of the pressure distribution grid layer 1 being fixedly connected to a bottom layer, the top of the bottom layer being fixedly connected to a pressure distribution grid layer 2, and the top of the pressure distribution grid layer 2 being fixedly connected to a top layer.

[0006] Compared with the prior art, the beneficial effects of the present invention are:

[0007] The circuit board for preventing copper wrinkles effectively solves the problem of copper foil wrinkling caused by uneven pressure distribution during the processing and use of the circuit board by introducing a dynamic pressure balancing layer. The dynamic pressure balancing layer can automatically adjust the internal pressure distribution according to the changes in external stress, so that the stress on the copper foil is evenly distributed, thereby avoiding the wrinkling of the copper foil caused by uneven force. This design significantly improves the processing stability and service life of the circuit board. By optimizing the internal structure of the dynamic pressure balancing layer, its effect of preventing copper wrinkles is further enhanced. The setting of the pressure distribution grid layer 1 and the pressure distribution grid layer 2 enables the dynamic pressure balancing layer to form a more stable structure when subjected to pressure. The uniform pressure distribution field is added, which effectively disperses the stress on the copper foil. At the same time, the combination of the elastic base layer and the silicone rubber filler not only increases the elasticity and toughness of the dynamic pressure balance layer, but also makes the circuit board have better buffering performance when facing external forces, further reducing the risk of copper foil wrinkling. The design of the interface adhesion layer effectively enhances the connection strength between the copper foil and other parts of the circuit board. The interface adhesion layer fits tightly to the bottom of the copper foil, ensuring that the copper foil will not fall off or shift during processing and use, thereby avoiding the copper wrinkling phenomenon caused by copper foil problems. This design not only improves the electrical performance of the circuit board, but also enhances its structural stability. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 This is a schematic diagram of the structure of the utility model;

[0009] Figure 2 This is a cross-sectional view of the structure of the utility model;

[0010] Figure 3 This is a structural cross-sectional view of the dynamic pressure balance layer of the utility model;

[0011] Figure 4 For this utility model Figure 3 A partial enlarged schematic diagram of the middle A.

[0012] In the figure: 1. Plate body; 2. Dynamic pressure balance layer; 3. Copper foil; 4. Bottom plate; 5. Side plate; 6. Fixing bar; 7. Fixing rod; 8. Insulation plate; 9. Buffer ball; 10. Mounting block; 11. Pressure distribution grid layer 1; 12. Elastic base layer; 13. Silicone rubber filler; 14. Top layer; 15. Interface adhesion layer; 16. Pressure distribution grid layer 2; 17. Bottom layer. DETAILED DESCRIPTION

[0013] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0014] See also Figure 1-4 The utility model provides a technical solution: a circuit board for preventing copper wrinkles, comprising a board body 1, with a dynamic pressure balancing layer 2 fixedly connected to the top of the board body 1 (the core design concept of the dynamic pressure balancing layer 2 is that it can sense and respond to the pressure applied by the outside in real time. This sense and response ability mainly comes from its internal multi-layer structure and special material selection. In terms of materials, the pressure distribution grid layer 11 and the pressure distribution grid layer 2 16 are made of materials with excellent elasticity and pressure distribution capabilities, such as high-elasticity polymers or metal grids. These grid layers can deform when subjected to pressure, and evenly distribute the pressure to the entire layer to avoid local pressure concentration. At the same time, the silicone rubber filler 13 of the elastic base layer 12 not only increases the elasticity and toughness of the base, but also enables the entire dynamic pressure balancing layer 2 to produce a certain deformation when facing external pressure, thereby absorbing and dispersing the pressure. The excellent elasticity and recovery properties of silicone rubber ensure that the dynamic pressure balance is restored after the pressure disappears. The dynamic pressure balancing layer 2 can quickly return to its original state, preparing for the next pressure balance. In addition, the "dynamic" characteristics of the dynamic pressure balancing layer 2 are also reflected in its real-time response to changes in external pressure. When the external pressure changes, the pressure distribution grid layer and the elastic base layer 12 can quickly adjust their deformation state to adapt to the new pressure distribution. This real-time response capability enables the dynamic pressure balancing layer 2 to maintain a stable pressure balancing effect in different working environments. The top of the dynamic pressure balancing layer 2 is provided with a copper foil 3, and the top of the dynamic pressure balancing layer 2 is fixedly connected to the interface adhesion layer 15. The interior of the dynamic pressure balancing layer 2 includes a pressure distribution grid layer 11 and an elastic base layer 12. The pressure distribution grid layer 11 is located on the top of the elastic base layer 12. The top of the pressure distribution grid layer 11 is fixedly connected to the bottom layer 17. The top of the bottom layer 17 is fixedly connected to the pressure distribution grid layer 2 16. The top of the pressure distribution grid layer 2 16 is fixedly connected to the top 14.

[0015] The top of the interface adhesion layer 15 is in close contact with the bottom of the copper foil 3, and the interface adhesion layer 15 is tightly attached to the bottom of the copper foil 3, which effectively enhances the connection strength between the copper foil 3 and other parts of the circuit board, preventing the copper foil 3 from falling off or shifting during processing and use, thereby avoiding the copper wrinkle phenomenon caused by problems with the copper foil 3.

[0016] The interior of the elastic base layer 12 is fixedly connected with a silicone rubber filler 13 , which increases the elasticity and toughness of the elastic base layer 12 , so that the circuit board has better buffering performance when facing external forces.

[0017] The top of the top layer 14 is fixedly connected to the bottom of the interface adhesion layer 15 .

[0018] The center of the bottom of the board body 1 is fixedly connected to the bottom plate 4, the center of the bottom of the bottom plate 4 is fixedly connected to the insulating plate 8, and the bottom of the insulating plate 8 is fixedly connected to a number of buffer balls 9, which enhance the insulation performance of the circuit board and improve its safety performance.

[0019] The four sides of the bottom of the base plate 4 are fixedly connected with mounting blocks 10, which can be conveniently connected and fixed with other devices or structures, thereby improving the installation convenience of the circuit board.

[0020] Side panels 5 are fixedly connected to both sides of the board body 1, and the top and bottom of the opposite sides of the two side panels 5 are fixedly connected to fixing bars 6, and the opposite sides of the two fixing bars 6 arranged above and below are fixedly connected to fixing rods 7, and the opposite sides of the two fixing rods 7 pass through the interior of the board body 1 and are fixedly connected to the board body 1, thereby enhancing the overall structural stability of the circuit board.

[0021] Working principle: The core part of the circuit board is the dynamic pressure balancing layer 2, which is located on the top of the board body 1. Its main function is to dynamically balance and disperse the pressure applied to the copper foil 3. The dynamic pressure balancing layer 2 is composed of a multi-layer structure, including a pressure distribution grid layer 11, an elastic base layer 12, a bottom layer 17, a pressure distribution grid layer 2 16 and a top layer 14. These hierarchical structures are designed to evenly disperse any pressure applied to the copper foil 3 to prevent pressure concentration from causing wrinkling of the copper foil 3. The silicone rubber filler 13 in the elastic base layer 12 increases the elasticity and toughness of the base, provides better buffering performance for the circuit board, and reduces the impact of external shocks on the copper foil 3. The interface adhesion layer 15 fits tightly to the bottom of the copper foil 3, significantly enhancing the connection strength between the copper foil 3 and other parts of the circuit board (especially the dynamic pressure balancing layer 2). This tight fit not only prevents the copper foil 3 falls off or shifts during processing and use, and effectively avoids copper wrinkles caused by displacement or instability of copper foil 3. The bottom center of the board body 1 is connected to the bottom plate 4, the insulating plate 8 and the buffer ball 9, which not only enhances the insulation performance of the circuit board, but also improves its buffering ability when facing external impact. The insulating plate 8 enhances the safety performance of the circuit board, ensuring that it can be used safely even in complex environments. The buffer ball 9 further enhances the seismic resistance of the circuit board and reduces the potential damage to the copper foil 3 caused by vibration or impact. The mounting block 10 at the bottom of the bottom plate 4 enables the circuit board to be easily connected and fixed to other equipment or structures, greatly improving the installation efficiency. The combined structure of the side panels 5, the fixing bars 6 and the fixing rods 7 on both sides of the board body 1 significantly enhances the overall structural stability of the circuit board, ensuring that the circuit board can remain stable in various application scenarios.

[0022] In summary, the circuit board for preventing copper wrinkles effectively solves the problem of wrinkling of the copper foil 3 caused by uneven pressure distribution during the processing and use of the circuit board by introducing the dynamic pressure balancing layer 2. The dynamic pressure balancing layer 2 can automatically adjust the internal pressure distribution according to the changes in external stress, so that the stress on the copper foil 3 is evenly distributed, thereby avoiding the wrinkling of the copper foil 3 due to uneven force. This design significantly improves the processing stability and service life of the circuit board. By optimizing the internal structure of the dynamic pressure balancing layer 2, its effect of preventing copper wrinkles is further enhanced. The arrangement of the pressure distribution grid layer 11 and the pressure distribution grid layer 2 16 enables the dynamic pressure balancing layer 2 to form a more stable structure when subjected to pressure. The uniform pressure distribution field is added, which effectively disperses the stress on the copper foil 3. At the same time, the combination of the elastic base layer 12 and the silicone rubber filler 13 not only increases the elasticity and toughness of the dynamic pressure balance layer 2, but also makes the circuit board have better buffering performance when facing external forces, further reducing the risk of wrinkling of the copper foil 3. The design of the interface adhesion layer 15 effectively enhances the connection strength between the copper foil 3 and other parts of the circuit board. The interface adhesion layer 15 fits tightly to the bottom of the copper foil 3, ensuring that the copper foil 3 will not fall off or shift during processing and use, thereby avoiding the copper wrinkling phenomenon caused by problems with the copper foil 3. This design not only improves the electrical performance of the circuit board, but also enhances its structural stability.

[0023] It should be noted that, in this document, relational terms such as first and second, etc., are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "comprises," "comprising," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that includes a list of elements includes not only those elements but also other elements not explicitly listed, or elements inherent to such process, method, article, or apparatus.

[0024] Although the embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and variations may be made to these embodiments without departing from the principles and spirit of the present invention, and the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A circuit board for preventing copper wrinkles, comprising a board body (1), characterized in that: The top of the plate body (1) is fixedly connected to a dynamic pressure balancing layer (2), the top of the dynamic pressure balancing layer (2) is provided with a copper foil (3), the top of the dynamic pressure balancing layer (2) is fixedly connected to an interface adhesion layer (15), the interior of the dynamic pressure balancing layer (2) comprises a pressure distribution grid layer 1 (11) and an elastic base layer (12), the pressure distribution grid layer 1 (11) is located on the top of the elastic base layer (12), the top of the pressure distribution grid layer 1 (11) is fixedly connected to a bottom layer (17), the top of the bottom layer (17) is fixedly connected to a pressure distribution grid layer 2 (16), and the top of the pressure distribution grid layer 2 (16) is fixedly connected to a top layer (14).

2. A circuit board for preventing copper wrinkles according to claim 1, characterized in that: The top of the interface adhesion layer (15) is in close contact with the bottom of the copper foil (3).

3. A circuit board for preventing copper wrinkles according to claim 1, characterized in that: A silicone rubber filling body (13) is fixedly connected to the interior of the elastic base layer (12).

4. A circuit board for preventing copper wrinkles according to claim 1, characterized in that: The top of the top layer (14) is fixedly connected to the bottom of the interface adhesion layer (15).

5. A circuit board for preventing copper wrinkles according to claim 1, characterized in that: The center of the bottom of the plate body (1) is fixedly connected to a bottom plate (4), the center of the bottom of the bottom of the bottom plate (4) is fixedly connected to an insulating plate (8), and the bottom of the insulating plate (8) is fixedly connected to a plurality of buffer balls (9).

6. A circuit board for preventing copper wrinkles according to claim 5, characterized in that: The four sides of the bottom of the base plate (4) are all fixedly connected with mounting blocks (10).

7. A circuit board for preventing copper wrinkles according to claim 1, characterized in that: The plate body (1) is fixedly connected to side panels (5) on both sides, and the tops and bottoms of opposite sides of the two side panels (5) are fixedly connected to fixing strips (6), and the opposite sides of the two fixing strips (6) arranged above and below are fixedly connected to fixing rods (7), and the opposite sides of the two fixing rods (7) penetrate into the interior of the plate body (1) and are fixedly connected to the plate body (1).

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