Double-sided synchronous polishing device for semiconductor silicon wafer
By designing a semiconductor silicon wafer double-sided synchronous polishing device, clamping with a U-shaped frame and a clamping assembly, and double-sided polishing is achieved through synchronous rotation of the upper and lower polishing pads, the problem of low single-sided polishing efficiency in the prior art is solved, and the polishing efficiency and output are improved.
Patent Information
- Application Number
- CN202420435543.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-07
- Publication Date
- 2025-03-07
- Estimated Expiration
- 2034-03-07
AI Technical Summary
The existing polishing devices can only grind the semiconductor silicon wafer alone, and cannot perform double-sided polishing simultaneously, resulting in low polishing efficiency, reduced output and inconvenient use.
A semiconductor silicon wafer double-sided synchronous polishing device is designed, which uses a U-shaped frame and a clamping assembly for clamping, and the polishing assembly is rotated by two upper and lower polishing pads for synchronous polishing operation.
The two-sided double-side polishing of semiconductor silicon wafers is achieved, which improves polishing efficiency, shortens processing time, increases output, and simplifies the operation process.
Smart Images
Figure CN222570322U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor silicon wafer polishing tools, in particular to a semiconductor silicon wafer double-sided synchronous polishing device. Background Art
[0002] Semiconductor silicon wafers are the most core basic material for manufacturing chips. During the production, processing and preparation of semiconductor silicon wafers, since the surface of the newly prepared semiconductor silicon wafers is not smooth enough, in order to make the prepared semiconductor silicon wafers meet the subsequent processing requirements, polishing and grinding operations are usually required after the initial preparation of the semiconductor silicon wafers is completed. Polishing can make the surface of the semiconductor silicon wafer smoother. When performing polishing operations, corresponding polishing devices are usually required. There are many types of polishing devices on the market. Most polishing devices use motors to drive the corresponding polishing pads to rotate to achieve grinding operations. At present, for the polishing of semiconductor silicon wafers, microcrystalline glass high temperature resistant and hydrolysis resistant polishing pads are usually used. Microcrystalline glass high temperature resistant and hydrolysis resistant polishing pads have the advantages of extending service life and not being easily damaged.
[0003] However, when a conventional polishing device is used, it can only perform a polishing operation on one side of a semiconductor silicon wafer at a time, and cannot perform polishing on both sides simultaneously. Polishing only one side at a time will delay the polishing progress, which is not conducive to improving the polishing efficiency, affecting the output, and bringing inconvenience to the user. In view of this, we propose a semiconductor silicon wafer double-sided synchronous polishing device. Utility Model Content
[0004] The utility model aims to provide a semiconductor silicon wafer double-sided synchronous polishing device to solve the defects mentioned in the above background technology.
[0005] In order to achieve the above purpose, the utility model provides the following technical solutions:
[0006] A semiconductor silicon wafer double-sided synchronous polishing device comprises a U-shaped frame, wherein the left and right side plates of the U-shaped frame are both provided with clamping components for clamping semiconductor silicon wafers, a top support frame is fixedly installed on the top surface of the rear side plate of the U-shaped frame, and a polishing component is arranged on the top support frame, and the polishing component comprises a driving motor fixedly installed on the top plate of the top support frame, a guide rail is arranged on the output shaft of the driving motor, a second servo motor is fixedly installed at the end of the guide rail, a horizontal lead screw is fixedly installed at the end of the output shaft of the second servo motor, a second slider is threadedly connected to the horizontal lead screw, the second slider is slidably connected to the guide rail, a support seat is fixedly installed on the bottom end of the second slider, a cylinder is fixedly installed on the upper and lower side plates of the support seat, a high-speed motor is arranged on the telescopic shaft of the cylinder, and a polishing pad is arranged on the output shaft of the high-speed motor.
[0007] Preferably, the two polishing pads are located between the two high-speed motors and are used to perform synchronous polishing operations on both sides of the semiconductor silicon wafer.
[0008] Preferably, a fixing plate is fixedly mounted on the end of the output shaft of the driving motor, and the guide rail is fixedly mounted on the bottom surface of the fixing plate by a plurality of fastening bolts, so as to facilitate the fixing and mounting operation of the guide rail.
[0009] Preferably, an end plate is fixedly mounted on the end of the telescopic shaft of the cylinder, and the high-speed motor is fixedly mounted on the end plate, so as to facilitate assembly operation of the high-speed motor.
[0010] Preferably, the clamping assembly includes a slide rail fixedly mounted on the U-shaped frame in a vertical shape, a first servo motor is fixedly mounted on the end of the slide rail, a forward screw rod is fixedly mounted on the end of the output shaft of the first servo motor, a reverse screw rod is fixedly mounted on the end of the forward screw rod, a first slider is threadedly connected to the forward screw rod and the reverse screw rod, and a clamping plate is fixedly mounted on the end of the first slider to facilitate clamping operation.
[0011] Preferably, the clamping plates are arranged horizontally, and the upper and lower clamping plates are used to clamp the semiconductor silicon wafer.
[0012] Preferably, the size of the first slider is matched with the size of the slide rail, and the size of the second slider is matched with the size of the guide rail, so that the first slider and the second slider can slide more smoothly.
[0013] Preferably, the outer spirals on the surfaces of the forward screw and the reverse screw have opposite rotation directions, so as to drive the two first sliding blocks to move in opposite directions.
[0014] Compared with the prior art, the beneficial effects of the utility model are:
[0015] 1. The utility model can realize the clamping operation of semiconductor silicon wafers through the provided clamping assembly, and can realize the polishing operation by rotating the upper and lower polishing pads through the provided polishing assembly. In addition, the two clamping assemblies are operated separately and in coordination, so that the polishing position will not be blocked, which is conducive to comprehensive polishing operation and achieves the effect of being able to perform double-sided synchronous polishing.
[0016] 2. The utility model can drive the polishing pad to rotate in a circle by means of a driving motor, and can adjust the left and right position of the polishing pad by means of components such as a guide rail, a second servo motor and a horizontal screw rod, so as to facilitate a comprehensive polishing operation. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1It is a schematic diagram of the overall structure of the utility model;
[0018] Figure 2 It is a structural schematic diagram of the polishing assembly of the utility model;
[0019] Figure 3 This is one of the exploded structural schematic diagrams of the polishing assembly of the utility model;
[0020] Figure 4 This is the second exploded structural schematic diagram of the polishing assembly of the utility model;
[0021] Figure 5 It is a schematic diagram of the exploded structure of the clamping assembly of the utility model.
[0022] The meaning of each number in the figure is:
[0023] 1. U-shaped frame; 10. Top support frame;
[0024] 2. Clamping assembly; 20. Slide rail; 21. First servo motor; 22. Forward screw rod; 23. Reverse screw rod; 24. First slider; 25. Clamping plate;
[0025] 3. Polishing assembly; 30. Drive motor; 31. Fixed plate; 32. Guide rail; 33. Second servo motor; 34. Horizontal screw rod; 35. Second slider; 36. Support seat; 37. Cylinder; 371. End plate; 38. High-speed motor; 39. Polishing pad. DETAILED DESCRIPTION
[0026] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0027] See also Figure 1-Figure 5The utility model provides a technical solution: a semiconductor silicon wafer double-sided synchronous polishing device, comprising a U-shaped frame 1, and a clamping assembly 2 for clamping the semiconductor silicon wafer is arranged on the left and right side plates of the U-shaped frame 1. The clamping assembly 2 comprises a slide rail 20 fixedly installed on the U-shaped frame 1 in a vertical shape, and a first servo motor 21 is fixedly installed at the end of the slide rail 20. A forward screw rod 22 is fixedly installed at the end of the output shaft of the first servo motor 21, and a reverse screw rod 23 is fixedly installed at the end of the forward screw rod 22. A first slider 24 is threadedly connected to the forward screw rod 22 and the reverse screw rod 23. The first slider 24 is slidably connected to the slide rail 20, and a clamping plate 25 is fixedly installed at the end of the first slider 24 to facilitate the clamping operation, so as to achieve the effect of clamping and fixing the semiconductor silicon wafer;
[0028] Specifically, a top support frame 10 is fixedly installed on the top surface of the rear side plate of the U-shaped frame 1, and a polishing assembly 3 is arranged on the top support frame 10. The polishing assembly 3 includes a driving motor 30 fixedly installed on the top plate of the top support frame 10, and a horizontal guide rail 32 is arranged on the output shaft of the driving motor 30. A second servo motor 33 is fixedly installed at the end of the guide rail 32, and a horizontal screw rod 34 is fixedly installed at the end of the output shaft of the second servo motor 33. A second slider 35 is threadedly connected to the horizontal screw rod 34, and the second slider 35 is slidably connected to the guide rail 32. A support seat 36 is fixedly installed on the bottom end of the second slider 35, and a cylinder 37 is fixedly installed on the upper and lower side plates of the support seat 36. A high-speed motor 38 is arranged on the telescopic shaft of the cylinder 37, and a polishing pad 39 is arranged on the output shaft of the high-speed motor 38, so as to facilitate the use of the upper and lower polishing pads 39 to realize the double-sided synchronous polishing operation of the semiconductor silicon wafer.
[0029] In this embodiment, two polishing pads 39 are located between two high-speed motors 38 and are used to perform synchronous polishing operations on both sides of a semiconductor silicon wafer.
[0030] Specifically, a fixing plate 31 is fixedly mounted on the end of the output shaft of the driving motor 30 , and the guide rail 32 is fixedly mounted on the bottom surface of the fixing plate 31 by a plurality of fastening bolts, so that the fixing and mounting operation of the guide rail 32 is convenient.
[0031] Furthermore, an end plate 371 is fixedly mounted on the end of the telescopic shaft of the cylinder 37 , and the high-speed motor 38 is fixedly mounted on the end plate 371 by a plurality of fastening bolts, so that the assembly operation of the high-speed motor 38 is convenient.
[0032] In addition, the clamping plate 25 is arranged horizontally, and the upper and lower clamping plates 25 are used to clamp the semiconductor silicon wafer.
[0033] It is worth noting that the size of the first slider 24 matches the size of the slide rail 20 , and the size of the second slider 35 matches the size of the guide rail 32 , so that the first slider 24 and the second slider 35 can slide more smoothly.
[0034] It is worth noting that the outer spirals on the surfaces of the forward screw rod 22 and the reverse screw rod 23 have opposite rotation directions, so as to drive the two first sliding blocks 24 to move in opposite directions.
[0035] When the semiconductor silicon wafer double-sided synchronous polishing device of the utility model is used, the semiconductor silicon wafer is placed between the upper and lower clamping plates 25, and then one of the first servo motors 21 is started and made to work. When the first servo motor 21 works, the output shaft on it rotates to drive the forward screw rod 22 and the reverse screw rod 23 to rotate, and further drives the two clamping plates 25 to move, so as to realize the clamping operation of the semiconductor silicon wafer by using the two clamping plates 25 on one side;
[0036] Then, the cylinder 37 is started and made to work. When the cylinder 37 works, the telescopic shaft thereon extends to drive the polishing pad 39 to move and abut against the semiconductor silicon wafer. Then, the high-speed motor 38 is connected to an external power supply and made to work. When the high-speed motor 38 works, the output shaft thereon rotates to drive the polishing pad 39 to rotate for polishing. In addition, the second servo motor 33 is connected to an external power supply and made to work. When the second servo motor 33 works, the output shaft thereon rotates to drive the horizontal screw rod 34 to rotate. The rotation of the horizontal screw rod 34 drives the second slider 35 and the polishing pad 39 to move left and right, so as to adjust the position for polishing. In addition, the drive motor 30 is connected to an external power supply and made to work. When the drive motor 30 works, the output shaft thereon rotates to drive the guide rail 32 and the polishing pad 39 to rotate in a circular manner, so as to polish the circular part on the semiconductor silicon wafer.
[0037] When the polishing of other parts is completed, the semiconductor silicon wafer is clamped by the upper and lower clamping plates 25 on the polished side, and the two clamping plates 25 at the previous clamping position are loosened. At this time, the polishing pad 39 is used to continue polishing the previously clamped position to complete the comprehensive polishing operation.
[0038] The above shows and describes the basic principle, main features and advantages of the utility model. Those skilled in the art should understand that the utility model is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the utility model and are not used to limit the utility model. Without departing from the spirit and scope of the utility model, the utility model may have various changes and improvements, which fall within the scope of the utility model to be protected. The scope of protection of the utility model is defined by the attached claims and their equivalents.
Claims
1. A semiconductor silicon wafer double-sided synchronous polishing device, comprising a U-shaped frame (1), characterized in that: The left and right side plates of the U-shaped frame (1) are both provided with clamping assemblies (2) for clamping semiconductor silicon wafers; a top support frame (10) is fixedly mounted on the top surface of the rear side plate of the U-shaped frame (1); a polishing assembly (3) is arranged on the top support frame (10); the polishing assembly (3) comprises a driving motor (30) fixedly mounted on the top plate of the top support frame (10); a guide rail (32) is arranged on the output shaft of the driving motor (30); a second servo motor (33) is fixedly mounted at the end of the guide rail (32) A horizontal screw rod (34) is fixedly mounted on the end of the output shaft of the second servo motor (33), a second slider (35) is threadedly connected to the horizontal screw rod (34), the second slider (35) is slidably connected to the guide rail (32), a support seat (36) is fixedly mounted on the bottom end of the second slider (35), a cylinder (37) is fixedly mounted on the upper and lower side plates of the support seat (36), a high-speed motor (38) is arranged on the telescopic shaft of the cylinder (37), and a polishing pad (39) is arranged on the output shaft of the high-speed motor (38).
2. The semiconductor silicon wafer double-sided synchronous polishing device according to claim 1, characterized in that: The two polishing pads (39) are located between the two high-speed motors (38) and are used to perform synchronous polishing operations on both sides of a semiconductor silicon wafer.
3. The semiconductor silicon wafer double-sided synchronous polishing device according to claim 1, characterized in that: A fixing plate (31) is fixedly mounted on the end of the output shaft of the driving motor (30), and the guide rail (32) is fixedly mounted on the bottom surface of the fixing plate (31) by means of a plurality of fastening bolts.
4. The semiconductor silicon wafer double-sided synchronous polishing device according to claim 1, characterized in that: An end plate (371) is fixedly mounted on the end of the telescopic shaft of the cylinder (37), and the high-speed motor (38) is fixedly mounted on the end plate (371).
5. The semiconductor silicon wafer double-sided synchronous polishing device according to claim 1, characterized in that: The clamping assembly (2) comprises a slide rail (20) fixedly mounted on the U-shaped frame (1) in a vertical shape, a first servo motor (21) being fixedly mounted on the end of the slide rail (20), a forward screw rod (22) being fixedly mounted on the end of the output shaft of the first servo motor (21), a reverse screw rod (23) being fixedly mounted on the end of the forward screw rod (22), a first slider (24) being threadedly connected to the forward screw rod (22) and the reverse screw rod (23), and a clamping plate (25) being fixedly mounted on the end of the first slider (24).
6. The semiconductor silicon wafer double-sided synchronous polishing device according to claim 5, characterized in that: The clamping plates (25) are arranged horizontally, and the upper and lower clamping plates (25) are used to clamp the semiconductor silicon wafer.
7. The semiconductor silicon wafer double-sided synchronous polishing device according to claim 5, characterized in that: The size of the first sliding block (24) is matched to the size of the slide rail (20), and the size of the second sliding block (35) is matched to the size of the guide rail (32).
8. The semiconductor silicon wafer double-sided synchronous polishing device according to claim 5, characterized in that: The outer spirals on the surfaces of the forward screw (22) and the reverse screw (23) have opposite rotation directions, and are used to drive the two first sliding blocks (24) to move in opposite directions.