Precise grinding and polishing machine for large-diameter silicon wafers

Abstract

The utility model belongs to the technical field of large-diameter silicon wafer grinding and polishing, and discloses a large-diameter silicon wafer precise grinding and polishing machine, which comprises a bottom box, a bearing structure and a polishing structure, and is characterized in that a bottom frame is arranged at the top of the bottom box, a pushing structure, a liquid conveying structure and a vacuumizing structure are arranged on the bottom frame, and a stand column is arranged on the bottom frame; the bearing structure is movably arranged between the bottom frames, the bearing structure is movably connected with the pushing structure, a backing ring is arranged on the bearing structure, and the polishing structure is arranged on the top plate. The first motor drives the transmission shafts and the transmission belt between the transmission shafts to rotate forwards or reversely, the transmission belt drives the push rod to move, the push rod pushes the bearing structure to move back and forth between the bottom frames, and the bearing structure drives large-diameter silicon wafers needing to be ground and polished to move. The large-diameter silicon wafers at different positions are polished by the polishing structure, and the polishing efficiency of the large-diameter silicon wafers is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of large-diameter silicon wafer polishing, in particular to a large-diameter silicon wafer precision grinding and polishing machine. Background Art

[0002] Single crystal silicon wafers, which are refined from ordinary silicon salad, are the most commonly used semiconductor material. They are divided into 4-inch, 5-inch, 6-inch, 8-inch and other specifications according to their diameters. Recently, 12-inch and even larger specifications have been developed. The larger the wafer, the more ICs can be produced on the same wafer, which can reduce costs.

[0003] Large diameter single crystal silicon wafers need to be polished after cutting. The polishing machine in the prior art has problems such as low stability of the silicon wafers, inability to polish multiple large diameter silicon wafers at the same time, and inability to recycle the grinding fluid during the polishing process of large diameter silicon wafers.

[0004] Based on this, we propose a large-diameter silicon wafer precision grinding and polishing machine. Utility Model Content

[0005] The utility model aims to provide a large-diameter silicon wafer precision grinding and polishing machine with a reasonable structural design, which has the advantages of low stability of large-diameter silicon wafers during the polishing process, ability to polish multiple large-diameter silicon wafers at the same time, and ability to recycle grinding fluid, in order to solve the problems of existing large-diameter silicon wafer precision grinding and polishing machines, such as low stability of large-diameter silicon wafers, inability to polish multiple large-diameter silicon wafers at the same time, and inability to recycle grinding fluid.

[0006] The technical solution adopted by the utility model to solve the technical problem is:

[0007] A large-diameter silicon wafer precision grinding and polishing machine comprises a bottom box, a bearing structure and a polishing structure. A bottom frame is arranged on the top of the bottom box, a pushing structure, an infusion structure and a vacuum structure are arranged on the bottom frame, columns are arranged on the bottom frame, and a top plate is arranged on the columns. The bearing structure is movably arranged between the bottom frames and the bearing structure is movably connected to the pushing structure. A gasket is arranged on the bearing structure and the bearing structure is connected to the vacuum structure. The polishing structure is arranged on the top plate.

[0008] Preferably, the pushing structure includes a motor 1, a transmission shaft, and a transmission belt. A bearing 1 and a fixing groove are provided on the base frame. The motor 1 is arranged on the base frame and is arranged as a servo motor. Both ends of the transmission shaft are inserted into bearing 1, and one end of the transmission shaft is connected to the output shaft of the motor 1. The transmission belt is arranged between the transmission shafts. A push rod is arranged on the transmission belt, and the push rod is movably connected to the bearing structure. The motor 1 drives the transmission shaft and the transmission belt between the transmission shaft and the transmission shaft to rotate forward or reversely, and the transmission belt drives the push rod to move, so that the push rod pushes the bearing structure to move back and forth between the base frame and the base frame, so that the bearing structure drives the large-diameter silicon wafers that need to be ground and polished to move, and the polishing structure polishes the large-diameter silicon wafers at different positions, which can improve the polishing efficiency of the large-diameter silicon wafers.

[0009] Preferably, the bearing structure includes a bearing plate, a gasket is arranged on the top of the bearing plate, a baffle and a drain pipe are arranged on the bottom of the bearing plate, and the baffle is movably connected to the push rod. Connecting rods are arranged on the outer walls on opposite sides of the bearing plate, the connecting rods are extended into the fixed groove, and auxiliary wheels are arranged on the connecting rods. The bearing plate moves back and forth under the action of the pushing structure, and the auxiliary wheels on the connecting rods move back and forth in the fixed groove, which can reduce the resistance encountered by the connecting rod during the movement and improve the stability of the bearing plate during the back and forth movement.

[0010] Preferably, the gasket ring is made of polymer rubber material, and an exhaust pipe, an inner cavity and a drainage groove are provided in the supporting plate. One end of the exhaust pipe passes through the supporting plate and connects to the vacuum structure. A branch pipe is provided on the exhaust pipe, and the top of the branch pipe extends out from the supporting plate in the gasket ring. The inner cavity is connected with the drainage groove and the drainage pipe, and the bottom of the inner cavity is set to an arc structure. The large-diameter silicon wafer to be polished is placed on the gasket ring, and the vacuum structure performs vacuum treatment on the gasket ring to firmly fix the large-diameter silicon wafer on the gasket ring, thereby improving the stability of the large-diameter silicon wafer on the gasket ring and during the polishing process, and enhancing the polishing quality of the large-diameter silicon wafer.

[0011] Preferably, the vacuum pumping structure comprises a vacuum pump, which is arranged on a base frame, and a vacuum pipe is arranged on the vacuum pump, a ventilation pipe is arranged on the vacuum pipe, and the ventilation pipe is connected to the exhaust pipe, and a valve is arranged on the exhaust pipe. During the polishing process of the large-diameter silicon wafer by the polishing structure, the vacuum pump draws out the air between the gasket and the large-diameter silicon wafer through the vacuum pipe, the ventilation pipe, the exhaust pipe and the branch pipe, so that the large-diameter silicon wafer is firmly fixed on the gasket, thereby improving the stability of the large-diameter silicon wafer during the polishing process. After the polishing of the large-diameter silicon wafer is completed, the valve on the corresponding exhaust pipe is closed, so as to facilitate the removal of the polished large-diameter silicon wafer and improve the unloading efficiency.

[0012] Preferably, the infusion structure includes an infusion pump, which is arranged on a base frame. A connecting pipe and a spray pipe are arranged on the infusion pump. The connecting pipe is connected to the bottom box, the spray pipe is movably connected to the polishing structure, and a nozzle is arranged on the spray pipe. The infusion pump draws out the polishing liquid in the bottom box through the connecting pipe, and sprays it onto the surface of the large-diameter silicon wafer through the spray pipe and the nozzle, which can reduce the polishing difficulty of the large-diameter silicon wafer and enhance the polishing quality of the large-diameter silicon wafer.

[0013] Preferably, the polishing structure comprises a hydraulic cylinder, a fixed box, a second motor, a rotating shaft, and a polishing disc. The hydraulic cylinder is arranged on a top plate, and a piston rod is arranged on the hydraulic cylinder. The fixed box is connected to the piston rod. A second bearing is arranged on the inner wall of the fixed box, and a third bearing is arranged on the bottom of the fixed box. The second motor is arranged on the outer wall of the fixed box. A driving shaft is arranged on the second motor, and the driving shaft is extended into the second bearing. A first cone wheel is arranged on the driving shaft. The rotating shaft vertically passes through the third bearing. A second cone wheel meshingly connected to the first cone wheel is arranged at the top end of the rotating shaft. A mounting ring is arranged on the polishing disc, and the mounting ring is connected to the rotating shaft. The fixed box moves vertically under the action of the hydraulic cylinder, so that the polishing disc moves downward to polish the large-diameter silicon wafer and the polishing disc rises after the large-diameter silicon wafer is polished. The second drive shaft and the cone wheel one on the drive shaft rotate, the cone wheel one drives the cone wheel two and the rotating shaft to rotate, the rotating shaft drives the polishing disk to rotate, so that the polishing disk polishes the large-diameter silicon wafer fixed on the gasket ring, and can polish multiple large-diameter silicon wafers at the same time, thereby improving the polishing efficiency of large-diameter silicon wafers. The grinding liquid sprayed by the nozzle falls on the surface of the large-diameter silicon wafer, which is convenient for grinding and polishing the large-diameter silicon wafer. The grinding liquid flowing from the surface of the large-diameter silicon wafer falls on the surface of the supporting plate, and flows into the inner cavity from the drainage groove on the supporting plate. The bottom of the inner cavity is set to an arc structure, so that the grinding liquid entering the inner cavity quickly flows into the drainage pipe and flows back into the bottom box from the drainage pipe, thereby realizing the recycling of the grinding liquid. In order to improve the purity of the grinding liquid, a filtering device can be set in the bottom box to filter the grinding liquid.

[0014] Preferably, the polishing disc is configured as a replaceable structure on the rotating shaft through a mounting ring, and the mounting ring on the polishing disc is mounted on the rotating shaft through a thread, thereby improving the installation efficiency of the polishing disc on the rotating shaft and the stability of the polishing disc on the rotating shaft. On the other hand, according to the different polishing requirements of large-diameter silicon wafers, the corresponding polishing disc is selected to improve the versatility of the precision grinding and polishing machine and expand the scope of application of the precision grinding and polishing machine.

[0015] Preferably, a fixed block is provided at the bottom of the fixed box, and the spray pipe is provided on the fixed block, and the spray pipe is fixed on the fixed block to improve the stability of the spray pipe. The fixed box moves vertically under the action of the hydraulic cylinder, so that the fixed box drives the spray pipe and the nozzle on the spray pipe to rise or fall, so that the grinding liquid can be evenly sprayed onto the surface of the large-diameter silicon wafer, which is convenient for fully grinding and polishing the large-diameter silicon wafer and improving the polishing efficiency and polishing quality of the large-diameter silicon wafer.

[0016] Beneficial effects:

[0017] 1. The motor drives the transmission shaft and the transmission belt between the transmission shafts to rotate forward or reversely, and the transmission belt drives the push rod to move, so that the push rod pushes the bearing structure to move back and forth between the base frame and the base frame, so that the bearing structure drives the large-diameter silicon wafers that need to be ground and polished to move, and the polishing structure polishes the large-diameter silicon wafers at different positions, which can improve the polishing efficiency of the large-diameter silicon wafers;

[0018] 2. Place the large-diameter silicon wafer to be polished on the gasket, and use the vacuum structure to vacuum the inside of the gasket, so that the large-diameter silicon wafer is firmly fixed on the gasket, improving the stability of the large-diameter silicon wafer on the gasket and during the polishing process, and enhancing the polishing quality of the large-diameter silicon wafer;

[0019] 3. The fixed box moves vertically under the action of the hydraulic cylinder, so that the polishing disc moves downward to polish the large-diameter silicon wafer and the polishing disc rises after the large-diameter silicon wafer is polished. Motor 2 drives the driving shaft and the cone wheel 1 on the driving shaft to rotate, and the cone wheel 1 drives the cone wheel 2 and the rotating shaft to rotate. The rotating shaft drives the polishing disc to rotate, so that the polishing disc polishes the large-diameter silicon wafer fixed on the gasket. Multiple large-diameter silicon wafers can be polished at the same time, thereby improving the polishing efficiency of large-diameter silicon wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a structural schematic diagram of the utility model.

[0021] Figure 2 It is a left view of the utility model.

[0022] Figure 3 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the moving frame and the liquid leakage hole.

[0023] Figure 4 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the moving frame and the carrying plate.

[0024] Figure 5 It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the rotating shaft and the moving ring.

[0025] Figure 6It is a partial structural schematic diagram of the utility model, illustrating the connection structure between the moving ring and the positioning plate.

[0026] Figure 7 It is another schematic diagram of the implementation structure of the utility model.

[0027] In the figure: 1. bottom box, 2. bearing plate, 3. fixed box, 4. bottom frame, 5. column, 6. bearing 1, 7. fixed groove, 8. top plate, 9. motor 1, 10. transmission belt, 11. transmission shaft, 12. push rod, 13. infusion pump, 14. connecting pipe, 15. spray pipe, 16. nozzle, 17. vacuum pump, 18. vacuum pipe, 19. ventilation pipe, 20. gasket, 21. baffle, 22. exhaust Liquid pipe, 23. Connecting rod, 24. Auxiliary wheel, 25. Exhaust pipe, 26. Valve, 27. Branch pipe, 28. Drain trough, 29. Inner cavity, 30. Hydraulic cylinder, 31. Motor 2, 32. Rotating shaft, 33. Polishing disc, 34. Piston rod, 35. Bearing 2, 36. Bearing 3, 37. Fixed block, 38. Driving shaft, 39. Cone wheel 1, 40. Cone wheel 2, 41. Mounting ring, 42. Anti-skid pad. DETAILED DESCRIPTION

[0028] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0029] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0030] Embodiment 1:

[0031] As attached Figure 1-6 As shown, a large-diameter silicon wafer precision grinding and polishing machine includes a bottom box 1, a bearing structure, and a polishing structure. A bottom frame 4 is arranged on the top of the bottom box 1, and a pushing structure, an infusion structure, and a vacuum structure are arranged on the bottom frame 4. A column 5 is arranged on the bottom frame 4, and a top plate 8 is arranged on the column 5. The bearing structure is movably arranged between the bottom frames 4 and the bottom frames 4, and the bearing structure is movably connected to the pushing structure. A gasket 20 is arranged on the bearing structure, and the bearing structure is connected to the vacuum structure. The polishing structure is arranged on the top plate 8.

[0032] Among them, the driving structure includes a motor 9, a transmission shaft 11, and a transmission belt 10. A bearing 6 and a fixing groove 7 are provided on the base frame 4. The motor 9 is arranged on the base frame 4, and the motor 9 is arranged as a servo motor. Both ends of the transmission shaft 11 are inserted into the bearing 6, and one end of the transmission shaft 11 is connected to the output shaft of the motor 9. The transmission belt 10 is arranged between the transmission shafts 11 and the transmission shafts 11. A push rod 12 is arranged on the transmission belt 10, and the push rod 12 is movably connected to the bearing structure.

[0033] Among them, the bearing structure includes a bearing plate 2, a gasket 20 is arranged on the top of the bearing plate 2, a baffle 21 and a drain pipe 22 are arranged at the bottom of the bearing plate 2, and the baffle 21 is movably connected to the push rod 12, and connecting rods 23 are arranged on the outer walls of the bearing plate 2 on both sides, the connecting rods 23 are extended into the fixed groove 7, and an auxiliary wheel 24 is arranged on the connecting rod 23, the gasket 20 is made of polymer rubber material, and an exhaust pipe 25, an inner cavity 29, and a drain groove 28 are arranged in the bearing plate 2. One end of the exhaust pipe 25 passes through the bearing plate 2 and is connected to the vacuum pumping structure. A branch pipe 27 is arranged on the exhaust pipe 25, and the top end of the branch pipe 27 is extended from the bearing plate 2 in the gasket 20. The inner cavity 29 is connected with the drain groove 28 and the drain pipe 22, and the bottom of the inner cavity 29 is set as an arc structure.

[0034] Among them, the vacuum pumping structure includes a vacuum pump 17, which is arranged on the base frame 4, and a vacuum pipe 18 is arranged on the vacuum pump 17, a ventilation pipe 19 is arranged on the vacuum pipe 18, and the ventilation pipe 19 is connected to the exhaust pipe 25, and a valve 26 is arranged on the exhaust pipe 25.

[0035] Among them, the infusion structure includes an infusion pump 13, which is arranged on the base frame 4. A connecting pipe 14 and a spray pipe 15 are arranged on the infusion pump 13. The connecting pipe 14 is connected to the bottom box 1, and the spray pipe 15 is movably connected to the polishing structure, and a nozzle 16 is arranged on the spray pipe 15.

[0036] Among them, the polishing structure includes a hydraulic cylinder 30, a fixed box 3, a second motor 31, a rotating shaft 32, and a polishing disc 33. The hydraulic cylinder 30 is arranged on the top plate 8, and a piston rod 34 is arranged on the hydraulic cylinder 30. The fixed box 3 is connected to the piston rod 34. A second bearing 35 is arranged on the inner wall of the fixed box 3, and a third bearing 36 is arranged at the bottom of the fixed box 3. The second motor 31 is arranged on the outer wall of the fixed box 3. A drive shaft 38 is arranged on the second motor 31, and the drive shaft 38 is extended into the second bearing 35. A cone wheel 1 39 is arranged on the drive shaft 38. The rotating shaft 32 vertically passes through the third bearing 36. A cone wheel 2 40 meshingly connected to the cone wheel 1 39 is arranged at the top of the rotating shaft 32. A mounting ring 41 is arranged on the polishing disc 33, and the mounting ring 41 is connected to the rotating shaft 32. The polishing disc 33 is arranged as a structure that can be replaced on the rotating shaft 32 through the mounting ring 41. A fixed block 37 is arranged at the bottom of the fixed box 3, and the spray pipe 15 is arranged on the fixed block 37.

[0037] Embodiment 2:

[0038] This embodiment is further described on the basis of the first embodiment. Figure 7 As shown: an anti-skid pad 42 is provided on the gasket ring 20, and the anti-skid pad 42 further improves the stability of the large-diameter silicon wafer on the gasket ring 20, enhances the stability of the large-diameter silicon wafer during the grinding and polishing process, and improves the grinding and polishing quality of the large-diameter silicon wafer.

[0039] Working principle: Pour the grinding liquid for grinding and polishing large-diameter silicon wafers into the bottom box 1, select the corresponding polishing disc 33 according to the different polishing requirements of the large-diameter silicon wafers, install the mounting ring 41 on the polishing disc 33 on the rotating shaft 32 through threads, place the large-diameter silicon wafer to be polished on the gasket ring 20, and the vacuum pump 17 extracts the air between the gasket ring 20 and the large-diameter silicon wafer through the vacuum pipe 18, the ventilation pipe 19, the exhaust pipe 25, and the branch pipe 27, so that the large-diameter silicon wafer is firmly fixed on the gasket ring 20, and the fixed box 3 moves vertically under the action of the hydraulic cylinder 30, so that the polishing disc 33 moves downward to polish the large-diameter silicon wafer and the polishing disc 33 after the large-diameter silicon wafer is polished rises, and the motor 2 31 drives the driving shaft 38 and the cone wheel 1 39 on the driving shaft 38 to rotate, and the cone wheel 1 39 drives the cone wheel 2 40 and the rotating shaft 32 to rotate. The rotating shaft 32 drives the polishing disk 33 to rotate, so that the polishing disk 33 polishes the large-diameter silicon wafer fixed on the gasket 20. After the large-diameter silicon wafers in the same row are ground and polished, the motor 9 is started. The motor 9 drives the transmission shaft 11 and the transmission belt 10 between the transmission shaft 11 and the transmission shaft 11 to rotate forward or reversely. The transmission belt 10 drives the push rod 12 to move, so that the push rod 12 pushes the baffle 21 at the bottom of the supporting plate 2 to move, so that the supporting plate 2 can move back and forth between the base frame 4 and the base frame 4, so that the supporting plate 2 drives the large-diameter silicon wafer that needs to be ground and polished to move, and the large-diameter silicon wafer that has not been ground and polished is moved to the bottom of the polishing disk 33 for grinding and polishing. The valve 26 on the corresponding exhaust pipe 25 is closed, and the polished large-diameter silicon wafer is removed. The large-diameter silicon wafer to be polished can be placed on the gasket 20 for further grinding and polishing.

[0040] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

[0041] The parts not involved in the present invention are the same as the prior art or can be implemented by using the prior art.

Claims

1. A large diameter silicon wafer precision grinding and polishing machine, comprising a bottom box, a bearing structure, and a polishing structure, characterized in that: A base frame is arranged on the top of the bottom box, a pushing structure, an infusion structure and a vacuum structure are arranged on the base frame, columns are arranged on the base frame, and a top plate is arranged on the columns, the bearing structure is movably arranged between the base frames, and the bearing structure is movably connected to the pushing structure, a gasket is arranged on the bearing structure, and the bearing structure is connected to the vacuum structure, and the polishing structure is arranged on the top plate.

2. The large diameter silicon wafer precision grinding and polishing machine according to claim 1, characterized in that: The pushing structure includes a motor 1, a transmission shaft, and a transmission belt. A bearing 1 and a fixing groove are provided on the base frame. The motor 1 is arranged on the base frame and is arranged as a servo motor. Both ends of the transmission shaft are inserted into bearing 1, and one end of the transmission shaft is connected to the output shaft of the motor 1. The transmission belt is arranged between the transmission shafts, a push rod is arranged on the transmission belt, and the push rod is movably connected to the bearing structure.

3. The large diameter silicon wafer precision grinding and polishing machine according to claim 2, characterized in that: The bearing structure includes a bearing plate, a gasket is arranged on the top of the bearing plate, a baffle and a drainage pipe are arranged on the bottom of the bearing plate, and the baffle is movably connected to the push rod. Connecting rods are arranged on the outer walls on both sides of the bearing plate, the connecting rods are extended into the fixed groove, and auxiliary wheels are arranged on the connecting rods.

4. The large diameter silicon wafer precision grinding and polishing machine according to claim 3, characterized in that: The gasket ring is made of polymer rubber material, and an exhaust pipe, an inner cavity, and a drainage groove are arranged inside the supporting plate. One end of the exhaust pipe passes through the supporting plate and connects to the vacuum structure. A branch pipe is arranged on the exhaust pipe, and the top end of the branch pipe extends out from the supporting plate inside the gasket ring. The inner cavity is connected with the drainage groove and the drainage pipe, and the bottom of the inner cavity is arranged as an arc structure.

5. The large diameter silicon wafer precision grinding and polishing machine according to claim 4, characterized in that: The vacuum pumping structure comprises a vacuum pump, which is arranged on a base frame, a vacuum pumping tube is arranged on the vacuum pump, a ventilation tube is arranged on the vacuum tube, the ventilation tube is connected to the exhaust tube, and a valve is arranged on the exhaust tube.

6. The large diameter silicon wafer precision grinding and polishing machine according to claim 1, characterized in that: The infusion structure includes an infusion pump, which is arranged on a base frame. A connecting pipe and a spray pipe are arranged on the infusion pump. The connecting pipe is connected to the base box, the spray pipe is movably connected to the polishing structure, and a nozzle is arranged on the spray pipe.

7. The large diameter silicon wafer precision grinding and polishing machine according to claim 6, characterized in that: The polishing structure includes a hydraulic cylinder, a fixed box, a second motor, a rotating shaft, and a polishing disc. The hydraulic cylinder is arranged on a top plate, and a piston rod is arranged on the hydraulic cylinder. The fixed box is connected to the piston rod. A second bearing is arranged on the inner wall of the fixed box, and a third bearing is arranged on the bottom of the fixed box. The second motor is arranged on the outer wall of the fixed box, and a driving shaft is arranged on the second motor. The driving shaft is extended into the second bearing, and a first cone wheel is arranged on the driving shaft. The rotating shaft vertically passes through the third bearing, and a second cone wheel meshingly connected to the first cone wheel is arranged at the top end of the rotating shaft. A mounting ring is arranged on the polishing disc, and the mounting ring is connected to the rotating shaft.

8. The large diameter silicon wafer precision grinding and polishing machine according to claim 7, characterized in that: The polishing disc is arranged as a replaceable structure on the rotating shaft through a mounting ring.

9. The large diameter silicon wafer precision grinding and polishing machine according to claim 7, characterized in that: A fixing block is arranged at the bottom of the fixing box, and the liquid spraying pipe is arranged on the fixing block.

Images