Heat transport device

Abstract

The embodiment of the utility model provides a heat conveying device which can prevent a working fluid in an evaporation part from being dried up even under the use condition that a heating body with high heat productivity is thermally connected and under the use condition that the air volume of cooling air is increased. A heat transfer device is provided with: a first heat transfer unit having an evaporation unit thermally connected to a heating element; and a second heat transport unit connected to the condensing unit of the first heat transport unit and having a heat transport direction different from that of the first heat transport unit. The first heat transport unit has an integrated internal space in which a working fluid is sealed and which communicates from the evaporation unit to a connection part between the first heat transport unit and the second heat transport unit, and the internal space of the first heat transport unit communicates with the internal space of the second heat transport unit. The heat transport device is provided with: a first capillary structure which is provided in the internal space of the first heat transport unit and which extends from the evaporation unit to the condensation unit; a second capillary structure which is provided on the inner surface of the second heat transport unit and extends in the heat transport direction of the second heat transport unit; and a backflow promoting body that is provided to the second capillary structure, extends in the heat transport direction of the second heat transport unit, and has a capillary force, the capillary force of the first capillary structure being greater than the capillary force of the backflow promoting body. The capillary force of the backflow promoting body is greater than the capillary force of the second capillary structure, or the capillary force of the backflow promoting body is the same as the capillary force of the second capillary structure.

Description

Technical Field

[0001] The present invention relates to a heat transfer device for cooling heat generating bodies such as electrical / electronic components mounted on substrates such as electronic circuit boards, and more particularly to a heat transfer device capable of preventing the working fluid in an evaporation portion from drying up even when the device is used in thermal connection with a heat generating body having a high heat output or when the cooling air volume is increased. Background Art

[0002] As electronic devices become more advanced in performance, many of the components inside electronic devices, including heat generating bodies such as electronic components, are mounted on substrates such as electronic circuit boards. In addition, as electronic devices become more advanced in performance, the amount of heat generated by heat generating bodies such as electronic components is increasing. As a means of cooling heat generating bodies such as electronic components, heat transport components such as steam chambers, heat pipes, and radiators are sometimes used.

[0003] However, when the heat generation of a heat generating body such as an electronic component increases, the flow rate of the gas phase working fluid flowing from the evaporation portion of the heat transfer member to the condensation portion increases, and therefore, sometimes the reflux of the liquid phase working fluid in a convection relationship with the gas phase working fluid is hindered. In particular, when the capillary force of the capillary structure is relatively small, etc., there is a tendency to easily hinder the reflux of the liquid phase working fluid. When the reflux of the liquid phase working fluid is hindered, the liquid phase working fluid will accumulate in the condensation portion of the heat transfer member, and then, sometimes the reflux amount of the liquid phase working fluid from the condensation portion to the evaporation portion is insufficient, and the heat transfer member will dry up.

[0004] Therefore, as a heat transfer component for cooling heat-generating bodies such as electronic components, a steam chamber is proposed, which contains a capillary structure with relatively large capillary force such as a sintered body of metal powder and a working fluid, and the steam chamber comprises: a first section; a second section extending from one end of the first section in a direction away from the first section; a fourth section extending from the second section in the left-right direction; a third section extending from one end of the first section in a direction away from the first section; and a fifth section extending from the third section in the left-right direction, and the capillary structure extends throughout the first section to the fifth section (Patent Document 1).

[0005] In Patent Document 1, the heat of the heating element thermally connected to the first section is transferred from the first section as an evaporation section to the fourth section and the fifth section as a condensation section via the second section and the third section to cool the heating element. In addition, the liquid working fluid is refluxed from the fourth section and the fifth section to the first section through a capillary structure having a relatively large capillary force such as a sintered body of metal powder.

[0006] However, in Patent Document 1, since the same capillary structure extends throughout the first to fifth sections, the capillary structures in the fourth and fifth sections tend to retain the liquid-phase working fluid. Therefore, in the vapor chamber of Patent Document 1, the liquid-phase working fluid will still accumulate in the condensation section, and sometimes the reflux amount of the liquid-phase working fluid from the condensation section to the evaporation section is insufficient, which may cause drying up.

[0007] In addition, in order to smoothly cool the high-heat-generating heating element, the air volume of the cooling air supplied to the heat transport member is sometimes increased. However, when the air volume of the cooling air is increased, the phase change of the working fluid from the gas phase to the liquid phase is promoted in the condensation section. Therefore, in the steam chamber of Patent Document 1, there is still a situation where the liquid phase working fluid accumulates in the condensation section and dries up.

[0008] Prior art literature

[0009] Patent Literature

[0010] Patent Document 1: U.S. Patent Application Publication No. 2020 / 0018555 Utility Model Content

[0011] Problems to be solved by utility models

[0012] In view of the above, the purpose of the present embodiment is to provide a heat transfer device that can prevent the working fluid in the evaporation section from drying up even when it is used in thermal connection with a high-heat-generating heating element or when the cooling air volume is increased.

[0013] Means used to solve problems

[0014] The gist of the structure of the novel radiator of this embodiment is as follows.

[0015] [1] comprising: a first heat transport section having an evaporation section thermally connected to a heat generating body; and

[0016] a second heat transport section connected to the condensation section of the first heat transport section and having a heat transport direction different from that of the first heat transport section,

[0017] The first heat transport section has an integral internal space that is connected from the evaporation section to the connection portion between the first heat transport section and the second heat transport section and is sealed with a working fluid, and the internal space of the first heat transport section is connected to the internal space of the second heat transport section.

[0018] The heat transport device comprises:

[0019] A first capillary structure is disposed in the inner space of the first heat transport portion and extends from the evaporation portion to the condensation portion;

[0020] A second capillary structure is disposed on the inner surface of the second heat transport portion and extends along a heat transport direction of the second heat transport portion; and

[0021] The reflux promoter is disposed on the second capillary structure and extends along the heat transport direction of the second heat transport portion and has a capillary force.

[0022] The capillary force of the first capillary structure is greater than the capillary force of the reflux promoter, the capillary force of the reflux promoter is greater than the capillary force of the second capillary structure, or the capillary force of the reflux promoter is the same as the capillary force of the second capillary structure.

[0023] [2] The heat transport device according to [1], wherein the first capillary structure and the reflow promoting body are connected via a connecting member having a capillary force.

[0024] [3] A heat transfer device according to [2], wherein the capillary force of the first capillary structure is greater than the capillary force of the connecting member, the capillary force of the connecting member is greater than the capillary force of the reflux promoter, or the capillary force of the connecting member is the same as the capillary force of the reflux promoter.

[0025] [4] The heat transport device according to [2] or [3], wherein the connecting member is located at a connecting portion between the first heat transport section and the second heat transport section.

[0026] [5] The heat transport device according to any one of [1] to [4], wherein the reflow promoter covers an area of ​​5% or more of the circumference of the cross section in a direction perpendicular to the heat transport direction of the second heat transport section.

[0027] [6] The heat transport device according to any one of [1] to [5], wherein the reflux promoting body is composed of a plurality of reflux promoting portions, and the capillary forces of the plurality of reflux promoting portions are different from each other.

[0028] [7] The heat transport device according to any one of [1] to [6], wherein the container of the first heat transport section is a flat container.

[0029] [8] The heat transport device according to any one of [1] to [7], wherein the container of the second heat transport unit is a flat type having an integral internal space.

[0030] [9] The heat transport device according to any one of [1] to [7], wherein the second heat transport unit is a plurality of tubes.

[0031]

[10] The heat transport device according to any one of [1] to [9], wherein a plurality of second heat transport parts are provided and extend from the first heat transport part in multiple directions.

[0032]

[11] The heat transport device according to [9], wherein the plurality of tubes extend downward in the direction of gravity.

[0033]

[12] The heat transport device according to any one of [1] to

[11] , wherein the heat transport device is a heat sink in which a plurality of heat sinks are thermally connected to the second heat transport section.

[0034] In the embodiment of the present invention, the internal space of the heat transport member having the evaporation part (i.e., the heat receiving part) is different from the internal space of the heat pipe group in which the plurality of heat pipes are arranged in parallel, and the whole is connected to form a whole. In the embodiment of the present invention, the part of the first heat transport part that is thermally connected to the heat generating body as the cooling object functions as the evaporation part (i.e., the heat receiving part), and the part connected to the second heat transport part functions as the condensation part (i.e., the heat dissipation part) of the first heat transport part. In the evaporation part of the first heat transport part, the working fluid is heated from the heat generating body and changes from the liquid phase to the gas phase, and in the condensation part of the first heat transport part, a part of the gas phase working fluid releases latent heat and changes from the gas phase to the liquid phase. In the embodiment of the present invention, the heat of the heat generating body is transported from the evaporation part of the first heat transport part to the condensation part of the first heat transport part through the first heat transport part, and further, from the condensation part of the first heat transport part to the second heat transport part. In addition, the working fluid that changes from the heat generating body to the gas phase through the first heat transport part flows from the first heat transport part to the second heat transport part. By allowing the gaseous working fluid to flow from the first heat transport part to the second heat transport part, the second heat transport part receives heat from the first heat transport part, and the heat of the heat generating element diffuses from the first heat transport part to the second heat transport part. By thermally connecting a heat exchange unit such as a heat sink to the second heat transport part, the second heat transport part further transfers the heat received from the first heat transport part to the heat exchange unit, and the heat is released from the heat exchange unit to the external environment. When the second heat transport part transfers the heat received from the first heat transport part to the heat exchange unit, the gaseous working fluid flowing from the first heat transport part to the second heat transport part changes phase to a liquid phase.

[0035] In the above aspect, since the heat transport direction of the first heat transport section is different from the heat transport direction of the second heat transport section, the extending direction of the first heat transport section is different from the extending direction of the second heat transport section.

[0036] In an embodiment in which the container of the first heat transport section is a flat type and the container of the second heat transport section is a flat type having an integral internal space, the heat transport device is a steam chamber.

[0037] Effect of utility model

[0038] In the embodiment of the novel heat transport device, the capillary force of the first capillary structure extending from the evaporation part to the condensation part provided in the internal space of the first heat transport part is greater than the capillary force of the reflux promoter provided on the second capillary structure formed on the inner surface of the second heat transport part, and the capillary force of the reflux promoter is greater than or equal to the capillary force of the second capillary structure. Therefore, the second capillary structure and the reflux promoter are provided on the inner surface of the second heat transport part, and the capillary force of the first capillary structure provided in the first heat transport part having the evaporation part is relatively large. Therefore, according to the embodiment of the novel heat transport device, even under the use condition of thermally connecting a heat generating body with high heat generation and under the use condition of increasing the air volume of the cooling air, the liquid phase working fluid refluxes from the top end of the second heat transport part to the connection part connected to the first heat transport part and refluxes from the condensation part of the first heat transport part to the evaporation part. In addition, according to the embodiment of the present invention, the capillary forces of the second capillary structure and the reflux promoter provided on the inner surface of the second heat transport section are relatively small, so that the liquid working fluid can be prevented from being retained and accumulated in the second heat transport section. In addition, according to the embodiment of the present invention, the liquid working fluid that refluxes from the top end of the second heat transport section to the connection section connected to the first heat transport section in the second capillary structure is protected by the reflux promoter from being affected by the flow of the gaseous working fluid as convection, and the reflux promoter also helps the liquid working fluid to reflux from the top end of the second heat transport section to the connection section connected to the first heat transport section. As described above, according to the embodiment of the present invention, even under the use conditions of a heat generating body with high heat output being thermally connected and under the use conditions of an increased cooling air volume, the drying of the working fluid in the evaporation section can be prevented.

[0039] According to the embodiment of the novel heat transport device, the first capillary structure and the reflux promoter are connected via the connection member having capillary force, thereby refluxing the liquid working fluid from the second heat transport section to the first heat transport section more smoothly.

[0040] According to the embodiment of the novel heat transport device, the capillary force of the first capillary structure is greater than the capillary force of the connecting member, and the capillary force of the connecting member is greater than or equal to the capillary force of the reflux promoter. As a result, as the liquid working fluid flows from the second heat transport section to the first heat transport section, the capillary force increases. Therefore, even under the conditions of use of a heat generating body with high heat output thermally connected or the conditions of use of an increased cooling air volume, the working fluid in the evaporation section can be more reliably prevented from drying up.

[0041] According to the embodiment of the new heat transport device, the reflux promoter covers an area of ​​more than 5% of the circumference of the cross section in the direction orthogonal to the heat transport direction of the second heat transport part, thereby further promoting the reflux of the liquid working fluid from the top end of the second heat transport part to the connection part connected to the first heat transport part.

[0042] According to the embodiment of the novel heat transport device, the reflux promoter is composed of a plurality of reflux promotion parts, and the capillary forces of the plurality of reflux promotion parts are different from each other. Thus, the capillary force of the reflux promoter can be increased from the top end of the second heat transport part toward the connection part connected to the first heat transport part. Therefore, the reflux of the liquid working fluid from the top end of the second heat transport part toward the connection part connected to the first heat transport part becomes smoother.

[0043] According to the embodiment of the novel heat transport device, a plurality of second heat transport portions are provided, extending from the first heat transport portion in a plurality of directions. Thus, the heat transported from the first heat transport portion to the second heat transport portion is transported in a plurality of directions different from the extension direction (heat transport direction) of the first heat transport portion. Therefore, an increase in the size of the heat transport device can be prevented, and as a result, space saving can be achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] Figure 1 This is a plan cross-sectional view schematically illustrating the interior of the heat transport device according to the first embodiment of the present novel embodiment.

[0045] Figure 2 This is a front cross-sectional view schematically illustrating the interior of the second heat transport unit of the heat transport device according to the first embodiment of the present invention.

[0046] Figure 3 This is a side cross-sectional view schematically illustrating the interior of the second heat transport unit of the heat transport device according to the first embodiment of the present invention.

[0047] Figure 4 These are explanatory diagrams for explaining the flow of the working fluid in the second heat transport section of the heat transport device according to the first embodiment of the present novel embodiment.

[0048] Figure 5 This is a plan cross-sectional view schematically illustrating the interior of a heat transport device according to a second embodiment of the present novel embodiment.

[0049] Figure 6 This is a front cross-sectional view schematically illustrating the interior of a second heat transport unit of a heat transport device according to a second embodiment of the present invention.

[0050] Figure 7 This is a side cross-sectional view schematically illustrating the interior of a second heat transport unit of a heat transport device according to a second embodiment of the present invention.

[0051] Figure 8 It is a side view of a heat transport device according to a third embodiment of the present novel embodiment.

[0052] Fig. 9 This is a front cross-sectional view schematically illustrating the interior of the second heat transport unit of the heat transport device according to the fourth embodiment of the present invention. DETAILED DESCRIPTION

[0053] Hereinafter, the heat transport device according to the embodiment of the present invention will be described using the accompanying drawings. First, the heat transport device according to the first embodiment of the present invention will be described. Figure 1 This is a plan cross-sectional view schematically illustrating the interior of the heat transport device according to the first embodiment of the present novel embodiment. Figure 2 This is a front cross-sectional view schematically illustrating the interior of the second heat transport unit of the heat transport device according to the first embodiment of the present invention. Figure 3 This is a side cross-sectional view schematically illustrating the interior of the second heat transport unit of the heat transport device according to the first embodiment of the present invention. Figure 4 These are explanatory diagrams for explaining the flow of the working fluid in the second heat transport section of the heat transport device according to the first embodiment of the present novel embodiment.

[0054] like Figure 1 As shown, the heat transport device 1 involved in the first embodiment of the present invention comprises: a first heat transport section 10 having an evaporation section 11 thermally connected to a heat generating body 100; and a second heat transport section 20 connected to the condensation section 12 of the first heat transport section 10 and having heat transport directions D2 and D3 different from the heat transport direction D1 of the first heat transport section 10. The second heat transport section 20 is connected to the first heat transport section 10 through the condensation section 12 of the first heat transport section 10, thereby forming a connection section 30 between the first heat transport section 10 and the second heat transport section 20. In addition, the internal space of the first heat transport section 10 is connected to the internal space of the second heat transport section 20. In the heat transport device 1, the first heat transport section 10 has an integrated internal space that is connected from the evaporation section 11 to the connection section 30 connected to the second heat transport section 20 and is sealed with a working fluid.

[0055] The first heat transport unit 10 includes: a container 19 having a hollow cavity 13; and a working fluid (in Figure 1The container 19 is formed by a plate-like body 40 located on the installation surface side of the heat transport device 1 and another plate-like body (in the Figure 1 (not shown in the figure) overlap to form.

[0056] One plate body 40 is a plate-shaped body having a side wall erected from the plane portion at the edge of the plane portion. The other plate-shaped body 40 is a plate-shaped body having a side wall erected from the plane portion at the edge of the plane portion. Therefore, both the one plate-shaped body 40 and the other plate-shaped body are concave. By overlapping the one plate-shaped body 40 and the other plate-shaped body with the concave shapes facing each other, the cavity portion 13 of the container 19 is formed. Therefore, in the heat transport device 1, the shape of the container 19 of the first heat transport portion 10 is a flat type. The cavity portion 13 of the container 19 is an internal space that is sealed relative to the external environment and is depressurized by degassing.

[0057] The portion of the outer surface of the container 19 that is thermally connected to the heat generating element 100 to be cooled functions as the evaporation portion 11. The heat generating element 100 is thermally connected to the container 19 of the first heat transport unit 10, whereby the heat generating element 100 is cooled. In the first heat transport unit 10, the heat generating element 100 is thermally connected to one end of the heat transport direction D1, i.e., the extension direction of the first heat transport unit 10. Therefore, the evaporation portion 11 is formed at one end of the first heat transport unit 10 in the extension direction.

[0058] The first heat transport section 10 extends in a predetermined direction from the position of the heating element 100, and the second heat transport section 20 is connected to the other end of the first heat transport section 10 that faces one end in the extending direction. The other end of the first heat transport section 10 connected to the second heat transport section 20 functions as the condensation section 12 of the first heat transport section 10.

[0059] In the first heat transport section 10, the middle portion between the evaporation section 11 located at one end of the container 19 and the condensation section 12 located at the other end of the container 19 functions as a heat insulating section 15. The heat transferred from the heating element 100 to the evaporation section 11 is transported from the evaporation section 11 to the condensation section 12 via the heat insulating section 15.

[0060] like Figure 1 As shown, a first capillary structure 14 having a capillary force is accommodated in the cavity 13 of the first heat transport section 10. The first capillary structure 14 is arranged in the internal space of the first heat transport section 10, and extends from the evaporation section 11 to the condensation section 12. The first capillary structure 14 extends from the evaporation section 11 of the container 19 to the condensation section 12 over substantially the entire surface in the width direction of the first heat transport section 10.

[0061] The first capillary structure 14 is not particularly limited, and for example, a sintered body of metal powder such as copper powder, a metal mesh composed of metal wire, a nonwoven fabric, a metal fiber, etc. can be cited. In the first heat transport section 10, a sintered body of metal powder is used as the first capillary structure 14. In addition, in the first heat transport section 10, a groove (a plurality of fine grooves, not shown) may be further provided on the inner surface of the container 19. The portion of the cavity 13 where the first capillary structure 14 is not provided functions as a steam flow path 16 for the circulation of the working fluid of the gas phase. The steam flow path 16 extends from the evaporation section 11 of the container 19 to the condensation section 12, corresponding to the first capillary structure 14 extending from the evaporation section 11 of the container 19 to the condensation section 12. The first heat transport section 10 transports the heat of the heating element 100 received by the evaporation section 11 from the evaporation section 11 to the condensation section 12 through the heat transport characteristics based on the action of the working fluid.

[0062] like Figure 1 As shown, a second heat transport section 20 having an internal space connected to the cavity 13 of the container 19 of the first heat transport section 10 is provided on the side of the condensation section 12 of the first heat transport section 10. The second heat transport section 20 includes a container 29 having a hollow cavity 23. The cavity 23 of the second heat transport section 20 is connected to the cavity 13 of the first heat transport section 10 through a connection section 30.

[0063] The container 29 is formed by placing a plate-like body 41 on the installation surface side of the heat transport device 1 and another plate-like body (at Figure 1 The plate-like body 41 is formed by overlapping two plate-like bodies (not shown in the figure). One plate-like body 41 is a plate-like body having a side wall erected from the plane portion at the edge portion of the plane portion. The other plate-like body is also a plate-like body having a side wall erected from the plane portion at the edge portion of the plane portion. Therefore, both the one plate-like body 41 and the other plate-like body are concave. By overlapping the one plate-like body 41 and the other plate-like body with the concave shapes facing each other, the cavity portion 23 of the container 29 is formed. Therefore, in the heat transport device 1, the shape of the container 29 of the second heat transport portion 20 is a planar type.

[0064] The cavity 23 of the container 29 is an internal space that is sealed from the external environment of the heat transport device 1 and is depressurized by degassing. The working fluid can flow between the cavity 13 of the container 19 of the first heat transport section 10 and the cavity 23 of the container 29 of the second heat transport section 20. As described above, the working fluid flowing in the cavity 13 of the first heat transport section 10 is sealed in the space from the cavity 13 of the first heat transport section 10 to the cavity 23 of the second heat transport section 20.

[0065] The shape of second heat transport section 20 is not particularly limited, and in heat transport device 1 , container 29 of second heat transport section 20 is a flat shape having an integral internal space.

[0066] The second heat transport section 20 extends along the plane direction of the condensation section 12 of the first heat transport section 10 in a direction substantially orthogonal to the heat transport direction of the first heat transport section 10. Therefore, the second heat transport section 20 is sometimes provided in a direction orthogonal to the gravity direction. In the heat transport device 1, since the extension direction of the second heat transport section 20 is not parallel to the extension direction (heat transport direction) of the first heat transport section 10, the heat transported from the first heat transport section 10 is transported to a direction different from the extension direction of the first heat transport section 10 through the second heat transport section 20. Therefore, the size of the heat transport device 1 in the heat transport direction of the first heat transport section 10 can be prevented from increasing, and thus, the space saving of the heat transport device 1 can be achieved.

[0067] There are multiple second heat transport parts 20, and they extend from the first heat transport part 10 in multiple directions. In the heat transport device 1, two second heat transport parts 20 are provided, and the second heat transport parts 20 extend in two directions to the left and right with the first heat transport part 10 as the center. Since the multiple second heat transport parts 20 extend from the first heat transport part 10 in multiple directions (two directions in the heat transport device 1), the heat transported from the first heat transport part 10 to the second heat transport part 20 is branched and transported in multiple directions (two directions in the heat transport device 1) different from the extension direction of the first heat transport part 10. Therefore, it is possible to more reliably prevent the size of the heat transport device 1 from increasing in the extension direction of the first heat transport part 10.

[0068] like Figures 1 to 3 As shown, a second capillary structure 24 extending along the heat transport direction of the second heat transport part 20 is provided on the inner surface of the second heat transport part 20. The second capillary structure 24 has a function of causing the liquid working fluid to flow back from the top end 33 of the second heat transport part 20 toward the connection part 30 connected to the first heat transport part 10.

[0069] The second capillary structure 24 is a capillary structure having a capillary force and having a different structure from the first capillary structure 14 housed in the container 19. In the heat transport device 1, as the second capillary structure 24, a groove (a plurality of fine grooves) is formed on the inner surface of the second heat transport part 20. As described above, in the heat transport device 1, the second capillary structure 24 is a capillary structure of a different type from the first capillary structure 14. The groove as the second capillary structure 24 extends along the heat transport direction of the second heat transport part 20. In the heat transport device 1, the second capillary structure 24 extends from the top end 33 of the second heat transport part 20 to the connection part 30 connected to the first heat transport part 10.

[0070] In addition, in the second heat transport section 20, a reflux promoting body 34 having a capillary force and extending along the heat transport direction of the second heat transport section 20 is provided on the second capillary structure 24. The reflux promoting body 34 has a function of promoting the reflux of the liquid-phase working fluid from the top end 33 of the second heat transport section 20 toward the connection section 30 connected to the first heat transport section 10. The reflux promoting body 34 is provided in contact with the second capillary structure 24. In the heat transport device 1, the reflux promoting body 34 extends from the top end 33 of the second heat transport section 20 to the vicinity of the connection section 30 connected to the first heat transport section 10.

[0071] The reflux promoter 34 is a capillary member having a capillary force and having a different structure from the first capillary structure 14 contained in the container 19 and the second capillary structure 24 contained in the container 29. The reflux promoter 34 is not particularly limited, and for example, a sintered body of a metal powder such as copper powder, a metal mesh composed of metal wires, a nonwoven fabric, a metal fiber, etc. can be cited. In the heat transport device 1, the reflux promoter 34 is formed by the same member as a whole, and the reflux promoter 34 has substantially the same capillary force as a whole. In the heat transport device 1, a sheet-shaped metal mesh is used as the reflux promoter 34. As described above, in the heat transport device 1, the reflux promoter 34 is a capillary member of a different type from the first capillary structure 14 and the second capillary structure 24. The portion of the cavity portion 23 of the second heat transport portion 20 where the reflux promoter 34 and the second capillary structure 24 are not provided functions as a steam flow path 26 for the working fluid of the gas phase to flow. Steam flow path 26 extends from connection portion 30 connected to first heat transport section 10 to top end portion 33 of container 29 of second heat transport section 20. Second heat transport section 20 transports the heat of heat generating element 100 received from first heat transport section 10 from connection portion 30 connected to first heat transport section 10 to top end portion 33 of second heat transport section 20 by heat transport characteristics based on the action of the working fluid.

[0072] The location of the reflux promoter 34 is not particularly limited as long as it is the inner surface of the container 29 of the second heat transport section 20. However, from the perspective of being able to further promote the reflux of the liquid-phase working fluid from the top end 33 of the second heat transport section 20 toward the connection section 30 connected to the first heat transport section 10, thereby allowing the liquid-phase working fluid to reflux more smoothly from the top end 33 of the second heat transport section 20 toward the connection section 30 connected to the first heat transport section 10, the reflux promoter 34 preferably covers an area of ​​more than 5% of the circumference of the cross section in a direction orthogonal to the heat transport direction of the second heat transport section 20. In addition, when the second heat transport section 20 is provided so that the extension direction of the second heat transport section 20 is substantially perpendicular to the gravity direction, the reflux promoting body 34 preferably covers an area of ​​25% or more and 50% or less of the circumference of the cross section from the viewpoint of further promoting the reflux of the liquid-phase working fluid from the tip 33 of the second heat transport section 20 toward the connection section 30 connected to the first heat transport section 10 while reliably securing the steam flow path 26. In addition, when the second heat transport section 20 is provided so that the tip 33 of the second heat transport section 20 is located below the connection section 30 connected to the first heat transport section 10 in the gravity direction, the reflux promoting body 34 preferably covers an area of ​​50% or more and 100% or less of the circumference of the cross section from the viewpoint of reliably promoting the reflux of the liquid-phase working fluid from the tip 33 of the second heat transport section 20 toward the connection section 30.

[0073] like Figure 2 , 3 As shown, in the heat transport device 1, in the inner surface of the container 29 formed by overlapping a plate-like body 41 and another plate-like body 43 facing the one plate-like body 41, the reflux promoter 34 is arranged on the plate-like body located below the direction of gravity, that is, one plate-like body 41, and not on the other plate-like body 43.

[0074] In the heat transport device 1, the capillary force of the first capillary structure 14 is greater than the capillary force of the reflow promoting body 34. The capillary force of the reflow promoting body 34 is greater than or equal to the capillary force of the second capillary structure 24.

[0075] like Figure 1 , 2 As shown, first capillary structure 14 provided in first heat transport section 10 and reflow promoter 34 provided in second heat transport section 20 may also be connected via connection member 35 having capillary force. Connection member 35 is located at connection section 30 between first heat transport section 10 and second heat transport section 20 and its vicinity.

[0076] The connecting member 35 is a capillary member having a capillary force and having a different structure from the first capillary structure 14 housed in the container 19, the second capillary structure 24 housed in the container 29, and the reflux promoter 34. Examples of the connecting member 35 include a metal mesh, a braided body of metal wires, and metal fibers. In the heat transport device 1, the connecting member 35 may be a capillary member of a different type from the first capillary structure 14, the second capillary structure 24, and the reflux promoter 34.

[0077] In the heat transport device 1 , the capillary force of the first capillary structure 14 is greater than the capillary force of the connecting member 35 . The capillary force of the connecting member 35 is greater than or substantially equal to the capillary force of the reflux promoting body 34 .

[0078] The working fluid that changes from the gas phase to the liquid phase in the second heat transport section 20 flows back from the top end 33 of the second heat transport section 20 toward the connection section 30 in the second capillary structure 24 and the reflux promoter 34 due to the capillary force of the second capillary structure 24 and the capillary force of the reflux promoter 34. The liquid-phase working fluid that flows back to the vicinity of the connection section 30 flows from the second capillary structure 24 and the reflux promoter 34 to one end of the connection member 35. The liquid-phase working fluid that flows to one end of the connection section 35 flows from one end to the other end of the connection member 35, and flows back from the other end of the connection section 35 to the first capillary structure 14 of the first heat transport section 10.

[0079] Therefore, by providing the connecting member 35, the return flow of the liquid phase working fluid from the second heat transport part 20 to the first heat transport part 10 is smoother. As described above, the connection member 35 improves the flow performance of the liquid phase working fluid between the second heat transport part 20 and the first heat transport part 10, thereby improving the heat transport characteristics of the heat transport device 1.

[0080] In addition, when the connecting member 35 is not provided, from the viewpoint of improving the flow performance of the liquid working fluid between the second heat transport section 2 and the first heat transport section 10 , it is preferable to adopt a structure in which the reflux promoter 34 is in contact with the first capillary structure 14 near the connecting section 30 .

[0081] Examples of the material of the container 19 and the container 29 include copper, copper alloys, aluminum, aluminum alloys, nickel, nickel alloys, stainless steel, titanium, titanium alloys, etc. The working fluid sealed in the heat transport device 1 can be appropriately selected according to the compatibility with the materials of the container 19 and the container 29, and examples thereof include water, fluorocarbons, hydrofluoroether (HFE), cyclopentane, ethylene glycol, and mixtures thereof.

[0082] The thickness of the container 19 and the container 29 can be appropriately selected according to mechanical strength, weight, etc., and can be, for example, 0.5 to 3 mm. The width of the container 19 and the container 29 can be appropriately selected according to the use conditions of the heat transport device 1, etc., and can be, for example, 4 to 20 mm.

[0083] Next, use Figures 1 to 3 The mechanism of the heat transport function of the heat transport device 1 is explained. First, the heat generating body 100 as the cooled body is thermally connected to one end of the container 19 of the first heat transport unit 10, so that the one end of the container 19 functions as the evaporation unit 11. When one end of the container 19 is heated from the heat generating body 100, heat is transferred to the liquid phase working fluid of the cavity 13 at one end of the container 19, and the liquid phase working fluid changes phase to the gas phase working fluid in the cavity 13 at one end of the container 19. The gas phase working fluid flows from one end of the container 19 to the other end as the condensation unit 12 in the steam flow path 16. By causing the gas phase working fluid to flow from one end of the container 19 to the other end, the first heat transport unit 10 transports heat from the one end to the other end. When a heat exchange unit (not shown) is thermally connected to the other end of the container 19, due to the heat exchange effect of the heat exchange unit, a part of the gas phase working fluid flowing to the other end of the container 19 releases latent heat, thereby changing phase to a liquid phase working fluid, and the released latent heat is transferred to the heat exchange unit. The heat transferred to the heat exchange unit is released to the external environment of the heat transport device 1 through the heat exchange unit. The working fluid that changes into a liquid phase at the other end of the container 19 flows back from the other end to the one end of the container 19 by the capillary force of the first capillary structure 14.

[0084] In addition, since the cavity 13 of the first heat transport section 10 is connected to the cavity 23 of the second heat transport section 20, the working fluid that has changed from the liquid phase to the gas phase in the evaporation section 11 of the first heat transport section 10 and the working fluid that has not changed from the liquid phase in the condensation section 12 of the first heat transport section 10 flows from the cavity 13 of the first heat transport section 10 to the cavity 23 of the second heat transport section 20 via the connection section 30. The gas-phase working fluid that has flowed from the cavity 13 of the first heat transport section 10 to the cavity 23 of the second heat transport section 20 flows in the steam flow path 26 in the direction from the connection section 30 to the top end 33 of the second heat transport section 20. The gas-phase working fluid flows in the steam flow path 26 in the direction from the connection section 30 to the top end 33 of the second heat transport section 20, so that the second heat transport section 20 transports heat from the connection section 30 to the top end 33 thereof. When the heat exchange unit (not shown) is thermally connected to the container 29 of the second heat transport part 20, the gas phase working fluid flowing into the cavity 23 of the second heat transport part 20 releases latent heat inside the second heat transport part 20 due to the heat exchange effect of the heat exchange unit, thereby changing into a liquid phase working fluid. The latent heat released inside the second heat transport part 20 is transferred to the heat exchange unit thermally connected to the second heat transport part 20. The heat transferred to the heat exchange unit is discharged to the external environment of the heat transport device 1 via the heat exchange unit. The working fluid that changes from the gas phase to the liquid phase inside the second heat transport part 20 flows back from the top end 33 of the second heat transport part 20 to the connection part 30 direction through the capillary force of the second capillary structure 24 and the reflux promoter 34 provided on the inner surface of the second heat transport part 20. The liquid phase working fluid that flows back from the top end 33 of the second heat transport part 20 to the vicinity of the connection part 30 flows back to the first capillary structure 14 at the other end (condensation part 12) of the container 19 through the connecting member 35. The liquid-phase working fluid that flows back from the first capillary structure 14 flows back from the other end (condensation section 12 ) of the container 19 to one end (evaporation section 11 ) of the container 19 due to the capillary force of the first capillary structure 14 .

[0085] In the heat transport device 1, since the capillary force of the first capillary structure 14 extending from the evaporation section 11 to the condensation section 12 and arranged in the cavity section 13 of the first heat transport section 10 is greater than the capillary force of the reflux promoting body 34 arranged on the second capillary structure 24 formed on the inner surface of the second heat transport section 20, the capillary force of the reflux promoting body 34 is greater than the capillary force of the second capillary structure 24, or the capillary force of the reflux promoting body 34 is approximately the same as the capillary force of the second capillary structure 24, it becomes an embodiment in which the second capillary structure 24 and the reflux promoting body 34 are arranged on the inner surface of the second heat transport section 20, and the capillary force of the first capillary structure 14 arranged in the first heat transport section 10 having the evaporation section 11 is relatively large. Therefore, in the heat transport device 1, even under the use condition of being thermally connected to the heat generating body 100 with high heat output and under the use condition of increasing the air volume of the cooling air, the liquid phase working fluid can smoothly reflux from the top end portion 33 of the second heat transport section 20 to the connection portion 30 connected to the first heat transport section 10 and reflux from the condensation portion 12 of the first heat transport section 10 to the evaporation portion 11. In addition, in the heat transport device 1, the capillary forces of the second capillary structure 24 and the reflux promoter 34 provided on the inner surface of the second heat transport section 20 are relatively small, so that the liquid phase working fluid can be prevented from being retained and accumulated in the second heat transport section 20.

[0086] In addition, if Figure 4 As shown, in the heat transport device 1, the liquid-phase working fluid F1 that flows back from the top end 33 of the second heat transport section 20 toward the connection section 30 connected to the first heat transport section 10 in the second capillary structure 24 is protected by the reflux promoting body 34 from being affected by the flow of the gas-phase working fluid G as convection, and the reflux promoting body 34 also helps the liquid-phase working fluid F2 to flow back from the top end 33 of the second heat transport section 20 toward the connection section 30 connected to the first heat transport section 10. In addition, the interface S between the second capillary structure 24 and the reflux promoting body 34 also helps the liquid-phase working fluid F3 to flow back from the top end 33 of the second heat transport section 20 toward the connection section 30 connected to the first heat transport section 10. As described above, in the heat transport device 1, even under the use condition of thermally connecting the heat generating body 100 with high heat generation or under the use condition of increasing the air volume of the cooling air, it is possible to prevent the working fluid in the evaporation section 11 from drying up.

[0087] In addition, in the heat transport device 1, since the capillary force of the first capillary structure 14 is greater than the capillary force of the connecting member 35, the capillary force of the connecting member 35 is greater than the capillary force of the reflux promoter 34, or the capillary force of the connecting member 35 is substantially the same as the capillary force of the reflux promoter 34, the capillary force increases as the liquid working fluid flows from the second heat transport section 20 to the first heat transport section 10. Therefore, even under the use conditions of thermally connecting a heat generating element 100 with high heat output or under the use conditions of increasing the air volume of the cooling air, it is possible to more reliably prevent the working fluid in the evaporation section 11 from drying up.

[0088] Next, the heat transport device according to the second embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the heat transport device according to the second embodiment is identical to the heat transport device according to the first embodiment in terms of its main components, and therefore the same components as those of the heat transport device according to the first embodiment will be described using the same reference numerals. Figure 5 This is a plan cross-sectional view schematically illustrating the interior of a heat transport device according to a second embodiment of the present novel embodiment. Figure 6 This is a front cross-sectional view schematically illustrating the interior of a second heat transport unit of a heat transport device according to a second embodiment of the present invention. Figure 7 It is a side cross-sectional view schematically illustrating the interior of a second heat transport section of a heat transport device according to a second embodiment of the present invention.

[0089] In the heat transport device 1 according to the first embodiment, the second heat transport unit 20 is a flat container having an integral internal space. Figure 5 As shown, in the heat transport device 2 according to the second embodiment, the second heat transport unit 20 is formed as a plurality of tubes 51 , 51 , 51 . . . instead of a flat container having an integral internal space.

[0090] Second heat transport section 20 includes a plurality of tubes 51 having hollow cavities 23. Multiple tubes 51, 51, 51, ... are arranged in parallel along the radial direction of tubes 51 to form one second heat transport section 20. The length direction of tubes 51 is the heat transport direction of tubes 51, and thus forms the heat transport direction of second heat transport section 20.

[0091] The end portion 32 of the tube body 51 on the first heat transport section 10 side (hereinafter, sometimes referred to as the "base portion") is open, and the end portion opposite to the base portion 32 (i.e., the top end portion 33) is closed. The cavity portion 23 of the tube body 51 forming the second heat transport section 20 is connected to the cavity portion 13 of the first heat transport section 10 via the connection portion 30. The cavity portion 23 of the tube body 51 is an internal space sealed from the external environment of the heat transport device 2, and is depressurized by degassing. The working fluid can flow between the cavity portion 13 of the first heat transport section 10 and the cavity portion 23 of the tube body 51.

[0092] A through hole (not shown) for attaching the tube body 51 to the container 19 is formed on the side surface of the container 19 of the first heat transport section 10. The shape and size of the through hole correspond to the shape and size of the tube body 51, and the tube body 51 is connected to the first heat transport section 10 by inserting the base 32 of the tube body 51 into the through hole of the container 19. Therefore, the tube body 51 and the container 19 of the first heat transport section 10 are composed of different members. There is no particular limitation on the method of fixing the tube body 51 to the container 19, but for example, welding, soldering, brazing, etc. can be cited. The tube body 51 extends in a direction substantially orthogonal to the heat transport direction of the first heat transport section 10 along the plane direction of the condensation section 12 of the first heat transport section 10. Therefore, in the heat transport device 2, the length direction of the tube body 51 is sometimes set to be along a direction orthogonal to the gravity direction.

[0093] like Figures 5 to 7 As shown, the inner surface of each tube body 51 is provided with a second capillary structure 24 extending along the heat transport direction of the tube body 51. The second capillary structure 24 has a function of causing the liquid-phase working fluid to flow back from the top end 33 of the tube body 51 to the connection part 30 connected to the first heat transport part 10. In the heat transport device 2, the second capillary structure 24 also extends from the top end 33 of the tube body 51 to the connection part 30 connected to the first heat transport part 10. In the heat transport device 2, as the second capillary structure 24, a groove (a plurality of fine grooves) is also formed on the inner surface of the tube body 51.

[0094] In addition, in each tube body 51, a reflux promoter 34 having a capillary force is provided on the second capillary structure 24 and extends along the heat transport direction of the second heat transport part 20. In the heat transport device 2, the reflux promoter 34 extends from the central portion 36 in the longitudinal direction of the tube body 51 to the vicinity of the connection portion 30 connected to the first heat transport part 10 (i.e., the vicinity of the base 32). As described above, in the heat transport device 2, the reflux promoter 34 is not provided in the region from the top end portion 33 to the central portion 36 of the tube body 51, and the second capillary structure 24 is exposed. In the inner surface of the tube body 51, the reflux promoter 34 is provided in a portion below the gravity direction, and is not provided in a portion above the gravity direction. In addition, in the heat transport device 2, the reflux promoter 34 is also formed of the same member as a whole, and the reflux promoter 34 has substantially the same capillary force as a whole.

[0095] In heat transport device 2 , first capillary structure 14 provided in first heat transport section 10 and reflow promoter 34 provided in tube 51 may be connected via connecting member 35 having capillary force.

[0096] The shape of the tube body 51 is not particularly limited. In the heat transport device 2, the shape in the longitudinal direction is a straight line, and the shape in the direction perpendicular to the longitudinal direction (radial direction) is an elliptical shape. In addition, the shape and size of all the tube bodies 51 are substantially the same. The material of the tube body 51 constituting the second heat transport unit 20 is the same as the material of the container 29 of the second heat transport unit 20, for example, copper, copper alloy, aluminum, aluminum alloy, nickel, nickel alloy, stainless steel, titanium, titanium alloy, etc. can be cited.

[0097] like Figures 5 to 7 As shown, in the heat transport device 2, a plurality of first heat sinks 61, 61, 61, ... as heat exchange units are thermally connected to the tube body 51. The plurality of first heat sinks 61, 61, 61, ... are arranged in parallel along the length direction of the tube body 51. The first heat sink 61 is installed and fixed to the position of the tube body 51 by inserting the tube body 51 into the plurality of through holes formed on the first heat sink 61, and the first heat sink 61 is thermally connected to the plurality of tube bodies 51, 51, 51, ... As described above, the heat transport device 2 is a radiator in which the plurality of first heat sinks 61, 61, 61, ... are thermally connected to the second heat transport unit 20.

[0098] In addition, if Figure 6 As shown, a plurality of second heat sinks 62, 62, 62, ... as heat exchange units are thermally connected to the condensation portion 12 of the first heat transport portion 10 (at Figure 5(not shown in the figure for convenience of explanation). A plurality of second heat sinks 62, 62, 62 ... are arranged in parallel along the width direction of the first heat transport unit 10. The second heat sink 62 is installed and fixed at the position of the first heat transport unit 10 and is thermally connected to the first heat transport unit 10. The first heat sink 61 and the second heat sink 62 are both thin flat plate-shaped members.

[0099] In the heat transport device 2, since the capillary force of the first capillary structure 14 extending from the evaporation section 11 to the condensation section 12 and arranged in the cavity section 13 of the first heat transport section 10 is greater than the capillary force of the reflux promoter 34 arranged on the second capillary structure 24 formed on the inner surface of the tube body 51 serving as the second heat transport section 20, the capillary force of the reflux promoter 34 is greater than the capillary force of the second capillary structure 24, or the capillary force of the reflux promoter 34 is substantially the same as the capillary force of the second capillary structure 24, the second capillary structure 24 and the reflux promoter 34 are arranged on the inner surface of the tube body 51, and the capillary force of the first capillary structure 14 arranged in the first heat transport section 10 having the evaporation section 11 is relatively large. Therefore, in the heat transport device 2, even under the use condition of being thermally connected to the heat generating element 100 with high heat output and under the use condition of increasing the air volume of the cooling air, the liquid phase working fluid can smoothly reflux from the top end portion 33 of the tube body 51 to the connection portion 30 connected to the first heat transport portion 10 and the liquid phase working fluid can smoothly reflux from the condensation portion 12 of the first heat transport portion 10 to the evaporation portion 11. In addition, in the heat transport device 2, the capillary forces of the second capillary structure 24 and the reflux promoter 34 provided on the inner surface of the tube body 51 are relatively small, so that the liquid phase working fluid can be prevented from being retained and accumulated in the tube body 51.

[0100] In the heat transport device 2, the liquid-phase working fluid that refluxes from the top end 33 of the tube 51 toward the connection portion 30 connected to the first heat transport portion 10 in the second capillary structure 24 is also protected by the reflux promoting body 34 from being affected by the flow of the gas-phase working fluid as convection, and the reflux promoting body 34 also promotes the reflux of the liquid-phase working fluid from the top end 33 of the tube 51 toward the connection portion 30 connected to the first heat transport portion 10. In addition, the interface between the second capillary structure 24 and the reflux promoting body 34 also promotes the reflux of the liquid-phase working fluid from the top end 33 of the tube 51 toward the connection portion 30 connected to the first heat transport portion 10. As described above, in the heat transport device 2, even under the use condition of thermally connecting the heat generating element 100 with high heat generation or under the use condition of increasing the air volume of the cooling air, it is possible to prevent the working fluid in the evaporation portion 11 from drying up.

[0101] Next, the heat transport device according to the third embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the heat transport device according to the third embodiment is identical to the heat transport devices according to the first and second embodiments in terms of the main parts, and therefore the same components as those of the heat transport devices according to the first and second embodiments are described using the same reference numerals. Figure 8 It is a side view of a heat transport device according to a third embodiment of the present novel embodiment.

[0102] In the heat transport devices 1 and 2 of the first and second embodiments, the second heat transport section 20 extends along the plane direction of the condensation section 12 of the first heat transport section 10 in a direction substantially orthogonal to the heat transport direction of the first heat transport section 10. Figure 8 As shown, in the heat transport device 3 involved in the third embodiment, relative to the planar direction of the condensation section 12 of the first heat transport section 10, the second heat transport section 20 extends in a vertical direction and in a direction approximately orthogonal to the heat transport direction of the first heat transport section 10.

[0103] In the heat transport device 3, the second heat transport section 20 is composed of a plurality of tubes 51, 51, 51 ..., and the plurality of tubes 51, 51, 51 ... forming the second heat transport section 20 extend downward in the gravity direction. In the heat transport device 3, one second heat transport section 20 is provided. Since the top end portion 33 of the second heat transport section 20 is provided at a position further below the gravity direction than the evaporation section 11 of the first heat transport section 10, from the viewpoint of reliably promoting the reflux of the liquid-phase working fluid from the top end portion 33 of the second heat transport section 20 to the first heat transport section 10, it is preferred that the reflux promoting body covers an area of ​​not less than 50% and not more than 100% of the circumference of the cross section of the tube 51 in the direction perpendicular to the heat transport direction.

[0104] In the heat transport device 3, a second capillary structure and a reflux promoter are also provided on the inner surface of the tube body 51, and the capillary force of the first capillary structure provided in the first heat transport section 10 having the evaporation section 11 is relatively large. Therefore, even under the use conditions of thermally connecting a heating element 100 with high heat output and under the use conditions of increasing the air volume of the cooling air, the reflux of the liquid working fluid from the top end 33 of the tube body 51 toward the first heat transport section 10 and the reflux of the liquid working fluid from the condensation section 12 of the first heat transport section 10 to the evaporation section 11 are also smooth.

[0105] Next, the heat transport device according to the fourth embodiment of the present invention will be described with reference to the accompanying drawings. In addition, the heat transport device according to the fourth embodiment is identical to the heat transport devices according to the first to third embodiments in terms of the main parts, and therefore the same components as those of the heat transport devices according to the first to third embodiments are described using the same reference numerals. Fig. 9 This is a front cross-sectional view schematically illustrating the interior of the second heat transport unit of the heat transport device according to the fourth embodiment of the present invention.

[0106] In the heat transport devices 1, 2, and 3 according to the first to third embodiments, the reflux promoting body 34 is entirely formed of the same member, and the reflux promoting body 34 has substantially the same capillary force. Fig. 9 As shown, in the heat transport device 4 according to the fourth embodiment, the reflux promoter 34 is composed of a plurality of reflux promoters 34a, 34a, 34a, etc., and the plurality of reflux promoters 34a, 34a, 34a, etc. have different capillary forces. Fig. 9 In the figure, for convenience of explanation, the reflux promoting body 34 has three reflux promoting portions 34a, but the number of reflux promoting portions 34a provided is not particularly limited as long as it is plural.

[0107] In correspondence with the capillary force of the first capillary structure 14 being greater than the capillary force of the reflux promoting body 34, the capillary force of any reflux promoting part 34a is smaller than the capillary force of the first capillary structure 14. In addition, in correspondence with the capillary force of the reflux promoting body 34 being greater than the capillary force of the second capillary structure 24 or being substantially the same as the capillary force of the second capillary structure 24, the capillary force of any reflux promoting part 34a is greater than the capillary force of the second capillary structure 24 or being substantially the same as the capillary force of the second capillary structure 24.

[0108] The plurality of reflow promoting parts 34a, 34a, 34a ... are connected and arranged along the heat transport direction of the second heat transport part 20. In the heat transport device 4, the plurality of reflow promoting parts 34a, 34a, 34a ... are arranged in direct contact with each other. The magnitude of the capillary force of the plurality of reflow promoting parts 34a, 34a, 34a ... can be selected by adjusting the thickness of the metal mesh, for example, when the reflow promoting part 34a is a metal mesh, and can be selected by adjusting the porosity of the sintered body when the reflow promoting part 34a is a sintered body of metal powder.

[0109] By making the capillary forces of multiple reflux promotion sections 34a, 34a, 34a... different from each other, the capillary force of the reflux promoter 34 can be set to be larger as it moves from the top end 33 of the second heat transport section 20 toward the first heat transport section 10. Therefore, the reflux of the liquid working fluid from the top end 33 of the second heat transport section 20 toward the first heat transport section 10 becomes smoother.

[0110] Next, other embodiments of the heat transport device of the present novel embodiment will be described below. In the heat transport devices of the first and second embodiments described above, a plurality of second heat transport parts are provided, but instead, a single second heat transport part may be provided.

[0111] Industrial Applicability

[0112] The novel heat transfer device of this embodiment can prevent the working fluid in the evaporation section from drying up even under the operating conditions of high heat input and increased cooling air volume. Therefore, it has high utilization value in the field of cooling high-heat-generating electronic components mounted on circuit boards, such as central processing units and other electronic components.

[0113] Description of Reference Numerals

[0114] 1, 2, 3, 4 Heat transfer device

[0115] 10. First heat transport unit

[0116] 11 Evaporation section

[0117] 12 Condensation section

[0118] 14. First capillary structure

[0119] 20 Second heat transport unit

[0120] 24 Second capillary structure

[0121] 30 Connection

[0122] 34 Reflux promoter

[0123] 35 Connecting components

Claims

1. A heat transport device, wherein: have: A first heat transport portion having an evaporation portion thermally connected to the heat generating body; and a second heat transport section connected to the condensation section of the first heat transport section and having a heat transport direction different from that of the first heat transport section, The first heat transport section has an integral internal space that is connected from the evaporation section to the connection portion between the first heat transport section and the second heat transport section and is sealed with a working fluid, and the internal space of the first heat transport section is connected to the internal space of the second heat transport section. The heat transport device comprises: A first capillary structure is disposed in the inner space of the first heat transport portion and extends from the evaporation portion to the condensation portion; A second capillary structure is disposed on the inner surface of the second heat transport portion and extends along a heat transport direction of the second heat transport portion; as well as a reflux promoter, which is disposed on the second capillary structure and extends along the heat transport direction of the second heat transport portion and has a capillary force, The capillary force of the first capillary structure is greater than the capillary force of the reflux promoter, the capillary force of the reflux promoter is greater than the capillary force of the second capillary structure, or the capillary force of the reflux promoter is the same as the capillary force of the second capillary structure, The reflow promoter is provided on the lower side in the direction of gravity of the inner surface of the second heat transport section, but is not provided on the upper side in the direction of gravity of the inner surface of the second heat transport section.

2. A heat transport device, wherein: have: A first heat transport portion having an evaporation portion thermally connected to the heat generating body; and a second heat transport section connected to the condensation section of the first heat transport section and having a heat transport direction different from that of the first heat transport section, The first heat transport section has an integral internal space that is connected from the evaporation section to the connection portion between the first heat transport section and the second heat transport section and is sealed with a working fluid, and the internal space of the first heat transport section is connected to the internal space of the second heat transport section. The heat transport device comprises: A first capillary structure is disposed in the inner space of the first heat transport portion and extends from the evaporation portion to the condensation portion; A second capillary structure is disposed on the inner surface of the second heat transport portion and extends along a heat transport direction of the second heat transport portion; as well as a reflux promoter, which is disposed on the second capillary structure and extends along the heat transport direction of the second heat transport portion and has a capillary force, The capillary force of the first capillary structure is greater than the capillary force of the reflux promoter, the capillary force of the reflux promoter is greater than the capillary force of the second capillary structure, or the capillary force of the reflux promoter is the same as the capillary force of the second capillary structure, The reflow promoter covers a region that is not less than 5% and not more than 50% of a circumference of the cross section in a direction perpendicular to the heat transport direction of the second heat transport section.

3. The heat transport device according to claim 1 or 2, wherein: The second heat transport section is provided so that the extending direction of the second heat transport section is perpendicular to the gravity direction.

4. A heat transport device, wherein: have: A first heat transport portion having an evaporation portion thermally connected to the heat generating body; and a second heat transport section connected to the condensation section of the first heat transport section and having a heat transport direction different from that of the first heat transport section, The first heat transport section has an integral internal space that is connected from the evaporation section to the connection portion between the first heat transport section and the second heat transport section and is sealed with a working fluid, and the internal space of the first heat transport section is connected to the internal space of the second heat transport section. The heat transport device comprises: A first capillary structure is disposed in the inner space of the first heat transport portion and extends from the evaporation portion to the condensation portion; A second capillary structure is disposed on the inner surface of the second heat transport portion and extends along a heat transport direction of the second heat transport portion; as well as a reflux promoter, which is disposed on the second capillary structure and extends along the heat transport direction of the second heat transport portion and has a capillary force, The capillary force of the first capillary structure is greater than the capillary force of the reflux promoter, the capillary force of the reflux promoter is greater than the capillary force of the second capillary structure, or the capillary force of the reflux promoter is the same as the capillary force of the second capillary structure, The second heat transport section is disposed such that a leading end portion of the second heat transport section is located below a connecting portion between the second heat transport section and the first heat transport section in the direction of gravity.

5. The heat transport device according to any one of claims 1, 2 and 4, wherein: The first capillary structure and the backflow promoting body are connected via a connecting member having a capillary force.

6. The heat transport device according to claim 5, wherein: The capillary force of the first capillary structure is greater than the capillary force of the connecting member, the capillary force of the connecting member is greater than the capillary force of the reflux promoter, or the capillary force of the connecting member is the same as the capillary force of the reflux promoter.

7. The heat transport device according to claim 5, wherein: The connecting member is located at a connecting portion between the first heat transport portion and the second heat transport portion.

8. The heat transport device according to claim 4, wherein: The reflow promoter covers a region that accounts for 5% or more of a circumference of a cross section in a direction perpendicular to the heat transport direction of the second heat transport section.

9. The heat transport device according to any one of claims 1, 2 and 4, wherein: The backflow promoting body is composed of a plurality of backflow promoting portions, and the capillary forces of the plurality of backflow promoting portions are different from each other.

10. The heat transport device according to any one of claims 1, 2 and 4, wherein: The container of the first heat transport unit is a flat container.

11. The heat transport device according to any one of claims 1, 2 and 4, wherein: The container of the second heat transport unit is a flat container having an integral inner space.

12. The heat transport device according to any one of claims 1, 2 and 4, wherein: The second heat transport part is a plurality of tubes.

13. The heat transport device according to any one of claims 1, 2 and 4, wherein: A plurality of the second heat transport parts are provided, and the second heat transport parts extend from the first heat transport parts in a plurality of directions.

14. The heat transport device according to claim 12, wherein: The plurality of tubes extend downward in the direction of gravity.

15. The heat transport device according to any one of claims 1, 2 and 4, wherein: The heat transport device is a heat sink in which a plurality of heat sinks are thermally connected to the second heat transport section.

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