Efficient heat dissipation module for computer host

Abstract

The utility model discloses an efficient heat dissipation module of a computer host, which comprises a host shell and a computer mainboard fixedly arranged in the host shell, a heat conduction silica gel plate is fixedly arranged on the rear side surface in the host shell, and the other side surface of the heat conduction silica gel plate is in contact with a heating surface of the computer mainboard. A plurality of heat dissipation fins are fixedly arranged on the side face, fixedly connected with the host shell, of the heat conduction silica gel plate and penetrate through the host shell to extend out of the host shell, and a circulating cooling device used for conducting liquid cooling on the heat dissipation fins is fixedly arranged on the rear side face of the host shell. Elements such as the heat conduction silica gel plate, the heat dissipation fins and the circulating cooling device are introduced, so that a high-efficiency heat dissipation mode is realized. Compared with a traditional heat dissipation mode, the heat dissipation efficiency is high, and the occupied space is small.

Description

Technical Field

[0001] The utility model relates to the technical field of air dust removal devices, in particular to a high-efficiency heat dissipation module for a computer host. Background Art

[0002] As computer performance continues to improve, the heat dissipation problem of computer hosts has become increasingly prominent. The traditional heat dissipation method of computer hosts is mainly to dissipate heat through fans, which circulate air inside the host shell to transfer heat to achieve the purpose of lowering the internal temperature of the computer. The cooling fan is generally connected to the motherboard. The traditional heat dissipation method of computer hosts has the following problems:

[0003] Low heat dissipation efficiency: Traditional fan heat dissipation is limited by the heat transfer efficiency of air to the heat sink, and the heat dissipation effect is limited, especially in high-performance computer hosts.

[0004] Large space occupation: The fan and the corresponding heat dissipation structure occupy a large installation space on the motherboard, restricting the overall design. Utility Model Content

[0005] The utility model provides a computer host high-efficiency heat dissipation module to solve the above-mentioned various problems.

[0006] In order to solve the above technical problems, the technical solution of the utility model is: a computer host efficient heat dissipation module, including a host shell and a computer motherboard fixedly arranged inside the host shell, a thermally conductive silicone plate is fixedly arranged on the rear side surface inside the host shell, and the other side surface of the thermally conductive silicone plate is in contact with the heating surface of the computer motherboard, and a plurality of heat dissipation fins are fixedly arranged on the side surface of the thermally conductive silicone plate fixedly connected to the host shell, and the plurality of heat dissipation fins all pass through the host shell and extend to the outside of the host shell, and a circulating cooling device for liquid cooling the heat dissipation fins is fixedly arranged on the rear side surface of the host shell.

[0007] Furthermore, the circulating cooling device includes a circulation box body fixedly arranged on the rear side of the main engine housing, and also includes a coolant storage tank fixedly arranged on the outer side of the main engine housing. The coolant storage tank is connected to a circulating liquid pump, the other end of the circulating liquid pump is connected to the circulation box body, and the other end of the circulation box body is connected to the coolant storage tank.

[0008] Furthermore, the circulation box is located outside the heat dissipation fins and seals and wraps the heat dissipation fins.

[0009] Furthermore, the heat dissipation fins are made of aluminum or copper.

[0010] Furthermore, a heat dissipation fan and an air intake grille are respectively provided on opposite sides of the mainframe housing.

[0011] The utility model realizes a more efficient heat dissipation method by introducing components such as heat-conducting silicone plates, heat dissipation fins and circulating cooling devices. Compared with traditional heat dissipation methods, the heat dissipation module of this patent has the following beneficial effects:

[0012] 1. High heat dissipation efficiency: The structural design of thermal conductive silicone plate, heat dissipation fins and circulating cooling device effectively improves the heat dissipation efficiency, effectively reduces the temperature inside the computer host, and improves the stability and performance of the computer.

[0013] 2. Small space occupation: The heat sink fins extend from the back of the motherboard to the outside of the host casing. The heat dissipation components will not occupy the motherboard installation space, which is conducive to the flexibility and innovation of the overall design. The cooling fan is retained, but the cooling fan is designed on the host casing, which does not occupy the motherboard space and plays an auxiliary heat dissipation role. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a three-dimensional structure diagram of a computer host high-efficiency heat dissipation module of the utility model Figure 1 .

[0015] Figure 2 This is a three-dimensional structure diagram of a computer host high-efficiency heat dissipation module of the utility model Figure 2 .

[0016] Figure 3 This is a three-dimensional structure diagram of a computer host high-efficiency heat dissipation module of the utility model Figure 3 .

[0017] Figure 4 This is a schematic diagram of the cross-sectional structure of a high-efficiency heat dissipation module for a computer host according to the utility model. Figure 1 .

[0018] Figure 5 This is a schematic diagram of the cross-sectional structure of a high-efficiency heat dissipation module for a computer host according to the utility model. Figure 2 .

[0019] As shown in the figure: 1. Host housing; 2. Computer motherboard; 3. Thermal conductive silicone plate; 4. Heat dissipation fins; 5. Circulation box; 6. Coolant storage tank; 7. Circulation liquid pump; 8. Cooling fan; 9. Air intake grille. DETAILED DESCRIPTION

[0020] In the description of the present invention, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inside", "outside", "center", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction structure and operation. Therefore, they should not be understood as limitations on the present invention.

[0021] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "provided with", "installed", "connected", "connected" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection, it can be a mechanical connection, it can be an electrical connection, it can be a direct connection, it can be indirectly connected through an intermediate medium, and it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0022] The utility model is further described in detail below in conjunction with the accompanying drawings.

[0023] Combined with Figure 1 To Attachment Figure 5 A computer host efficient heat dissipation module comprises a host housing 1 and a computer motherboard 2 fixedly arranged inside the host housing 1, a heat-conducting silicone plate 3 is fixedly arranged on the rear side of the host housing 1, and the other side of the heat-conducting silicone plate 3 contacts the heating surface of the computer motherboard 2, a plurality of heat-dissipating fins 4 are fixedly arranged on the side where the heat-conducting silicone plate 3 is fixedly connected to the host housing 1, and the plurality of heat-dissipating fins 4 all pass through the host housing 1 and extend to the outside of the host housing 1, a circulating cooling device for liquid-cooling the heat-dissipating fins 4 is fixedly arranged on the rear side of the host housing 1, and a heat-dissipating fan 8 and an air intake grille 9 are respectively arranged on opposite sides of the host housing 1.

[0024] In this embodiment, the circulating cooling device includes a circulating box body 5 fixedly arranged on the rear side of the main engine housing 1, and also includes a coolant storage tank 6 fixedly arranged on the outer side of the main engine housing 1. The coolant storage tank 6 is connected to a circulating liquid pump 7, and the other end of the circulating liquid pump 7 is connected to the circulating box body 5, and the other end of the circulating box body 5 is connected to the coolant storage tank 6. The circulating box body 5 is located outside the heat dissipation fins 4 and seals and wraps the heat dissipation fins 4. The heat dissipation fins 4 are made of aluminum or copper.

[0025] Specific implementation of the utility model: Before using the utility model, the external power supply is first connected. When the computer host is working, various components on the mainboard, such as the processor, graphics card, etc., will generate a lot of heat. In order to effectively dissipate heat, a thermal conductive silicone plate 3 is introduced into the design, and its function is to quickly conduct the heat generated on the mainboard to the heat dissipation fins 4. The thermal conductive silicone plate 3 has good thermal conductivity and can ensure that the heat is quickly transferred and concentrated on the heat dissipation fins 4.

[0026] As a key component of the radiator, the heat dissipation fins 4 are made of metal materials with excellent thermal conductivity such as aluminum or copper. These heat dissipation materials have good thermal conductivity and heat dissipation effect, and can quickly transfer heat to the external environment, thereby effectively improving the heat dissipation efficiency. By increasing the surface area of ​​the heat dissipation fins 4, the heat dissipation and cooling can be accelerated to ensure the stable operation of the computer host.

[0027] The circulating cooling device is an important part of the entire heat dissipation system, and its function is to further cool down the heat dissipation fins 4 to ensure the heat dissipation effect. The circulating liquid pump 7 will extract the coolant from the coolant storage tank 6, and then transport the coolant to the circulation box 5 through the pipeline. In the circulation box 5, the coolant will contact the heat dissipation fins 4, and take away the heat through liquid cooling, thereby effectively reducing the temperature of the heat dissipation fins 4. This liquid cooling method can reduce the temperature of the heat dissipation component more quickly and effectively, further improve the overall heat dissipation efficiency, and ensure the stability and performance of the computer host.

[0028] The air inlet grille 9 of the cooling fan 8 plays a role in assisting heat dissipation.

[0029] The above description of the utility model and its implementation methods is not restrictive. The drawings show only one implementation method of the utility model, and the actual structure is not limited thereto. In short, if ordinary technicians in this field are inspired by it and design structural methods and embodiments similar to the technical solution without creativity without departing from the purpose of the invention of the utility model, they should all fall within the protection scope of the utility model.

Claims

1. A computer host efficient heat dissipation module, comprising a host housing (1) and a computer mainboard (2) fixedly arranged inside the host housing (1), characterized in that: A heat-conducting silicone plate (3) is fixedly provided on the rear side of the host housing (1), and the other side of the heat-conducting silicone plate (3) contacts the heating surface of the computer motherboard (2). A plurality of heat-dissipating fins (4) are fixedly provided on the side of the heat-conducting silicone plate (3) fixedly connected to the host housing (1). The plurality of heat-dissipating fins (4) all pass through the host housing (1) and extend to the outside of the host housing (1). A circulating cooling device for liquid cooling the heat-dissipating fins (4) is fixedly provided on the rear side of the host housing (1).

2. The computer host efficient heat dissipation module according to claim 1, characterized in that: The circulating cooling device comprises a circulating box (5) fixedly arranged on the rear side of a main engine housing (1), and also comprises a cooling liquid storage tank (6) fixedly arranged on the outer side of the main engine housing (1); the cooling liquid storage tank (6) is connected to a circulating liquid pump (7); the other end of the circulating liquid pump (7) is connected to the circulating box (5); and the other end of the circulating box (5) is connected to the cooling liquid storage tank (6).

3. The computer host efficient heat dissipation module according to claim 2, characterized in that: The circulation box (5) is located outside the heat dissipation fins (4) and seals and wraps the heat dissipation fins (4).

4. The computer host efficient heat dissipation module according to claim 3, characterized in that: The heat dissipation fins (4) are made of aluminum or copper.

5. The computer host efficient heat dissipation module according to claim 1, characterized in that: A heat dissipation fan (8) and an air intake grille (9) are respectively provided on opposite sides of the mainframe housing (1).

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