Wafer edge detection device

Abstract

The utility model relates to a wafer edge detection device, comprising a supporting seat which comprises a supporting platform; the buffering unit comprises a supporting frame, a first driving part and a plurality of supporting parts, the supporting frame is arranged on the supporting platform, the supporting parts are arranged on the supporting frame, the first driving part is used for driving the supporting frame to move in the height direction, and a wafer to be detected can be placed on the supporting parts; the rotating unit comprises a base, a clamping assembly, a lifting rod and a second driving part, the base is arranged on the supporting platform, a through hole is formed in the center of the base, the second driving part is used for driving the base to rotate, and the detection camera unit is used for collecting images of the wafer to be detected. According to the utility model, comprehensive detection of the edge of the wafer to be detected can be realized, and the detection precision is effectively improved, thereby ensuring the comprehensiveness and accuracy of the detection result.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer edge detection, in particular to a wafer edge detection device. Background Art

[0002] Wafers are indispensable in the production and manufacturing process of semiconductor components. Wafers refer to silicon wafers used to make silicon semiconductor circuits, and their original material is silicon. High-purity polycrystalline silicon is dissolved and doped with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After grinding, polishing, and slicing, the silicon crystal rod forms a silicon wafer, i.e., a wafer. In the prior art, when detecting the edge morphology of the wafer, a camera image recognition method is generally used for detection. In order to ensure the accuracy and comprehensiveness of the detection, the wafer is generally placed on a rotating platform for self-rotation, and the wafer is clamped by a clamp, and then photographed by a camera to achieve detection.

[0003] The shortcoming of the existing technology is that since the clamping part needs to clamp the edge of the wafer, the clamping part will block the partial edge of the wafer, resulting in the detection camera being unable to capture all edge parts of the wafer, causing deviations in detection accuracy and affecting the detection results. Utility Model Content

[0004] To this end, the technical problem to be solved by the utility model is to overcome the deficiencies in the prior art and provide a wafer edge detection device that can achieve comprehensive detection of the edge of the wafer to be detected, effectively improve the detection accuracy, and thus ensure the comprehensiveness and accuracy of the detection results.

[0005] In order to solve the above technical problems, the utility model provides a wafer edge detection device, comprising:

[0006] A support base, comprising a support platform;

[0007] A cache unit, comprising a support frame, a first driving member and a plurality of supporting members, wherein the support frame is arranged on the supporting platform, the plurality of supporting members are arranged on the support frame, the first driving member is used to drive the support frame to move along a height direction, and the wafer to be inspected can be placed on the supporting member;

[0008] The rotating unit comprises a base, a clamping assembly, a lifting rod and a second driving member, wherein the base is arranged on the supporting platform, a through hole is arranged at the center of the base, the lifting rod is passed through the through hole, the second driving member is used to drive the base to rotate, the lifting rod is also connected to the first driving member and moves along the height direction under the drive of the first driving member, the clamping assembly comprises a plurality of movable jaws, the plurality of movable jaws are radially arranged with the axis of the lifting rod as the center, and the movable jaws are slidably arranged on the base, the extension direction of the movable jaws is in the same direction as the radial direction of the lifting rod, a rolling member is arranged at one end of the movable jaw close to the lifting rod, the contact surface between the lifting rod and the rolling member is an inclined surface, the rolling member is in sliding contact with the lifting rod, and the wafer to be inspected rotates under the drive of the clamping assembly;

[0009] The detection camera unit comprises a plurality of cameras, wherein the plurality of cameras are arranged toward the wafer to be detected, and the detection camera unit is used for collecting images of the wafer to be detected.

[0010] In one embodiment of the present invention, the clamping assembly further comprises an elastic ring, each of the movable clamping jaws is provided with a fixing column, and the elastic ring is sequentially wound around each of the fixing columns.

[0011] In one embodiment of the present invention, the detection camera unit includes a first camera, the first camera is installed on the supporting platform, the first camera is arranged above the clamping assembly, and the first camera is used to take pictures of the wafer to be inspected along a first direction.

[0012] In one embodiment of the present invention, the second camera is disposed below the clamping assembly, and the second camera is used to take pictures of the wafer to be inspected along a second direction.

[0013] In one embodiment of the present invention, the third camera is arranged in a horizontal direction, and the third camera faces the edge of the wafer to be inspected.

[0014] In one embodiment of the present invention, the clamping assembly further includes a plurality of fixed clamping jaws, and the plurality of fixed clamping jaws are disposed on the base.

[0015] In one embodiment of the present invention, the movable jaw comprises a first movable jaw, a second movable jaw and a third movable jaw which are evenly spaced.

[0016] In one embodiment of the present invention, the fixed jaws include a first fixed jaw, a second fixed jaw and a third fixed jaw that are evenly spaced, and the fixed jaws are staggered with the movable jaws.

[0017] In one embodiment of the utility model, the camera detection unit also includes a notch detection module, the notch detection module includes a light source, a mounting base and a fourth camera, the light source is arranged on the base, the mounting base is connected to the base, the fourth camera is assembled on the mounting base, and the fourth camera is set toward the edge of the wafer to be inspected.

[0018] In one embodiment of the present invention, the rolling element is a ball.

[0019] The above technical solution of the utility model has the following advantages compared with the prior art:

[0020] The utility model discloses a wafer edge detection device, which is provided with a support platform, a buffer unit, a rotation unit and a detection camera unit. The buffer unit is used to buffer the wafer to be detected, and the rotation unit is used to clamp the wafer to be detected and drive the wafer to be detected to rotate, so that the detection camera unit can collect images of the edge of the wafer to be detected and upload them to the control end to determine whether the edge of the wafer to be detected meets the standard. After the first detection is completed, the buffer unit cooperates with the rotation unit to adjust the clamping position of the wafer to be detected by multiple movable clamps, and then a second detection is performed, so that the parts blocked by the movable clamps in the first detection can also be detected, thereby achieving a comprehensive detection of the edge of the wafer to be detected, effectively improving the detection accuracy, and thus ensuring the comprehensiveness and accuracy of the detection results. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to make the content of the utility model easier to understand, the utility model is further described in detail according to the specific embodiments of the utility model in combination with the accompanying drawings, wherein:

[0022] Figure 1 It is a schematic diagram of the overall structure of a wafer edge detection device according to a preferred embodiment of the utility model.

[0023] Figure 2 It is a partial structural schematic diagram of a cache unit and a rotation unit in a preferred embodiment of the utility model.

[0024] Figure 3 yes Figure 2 A partial enlarged view of .

[0025] Figure 4 yes Figure 2 Top view of the .

[0026] Figure 5 yes Figure 2 Bottom view of .

[0027] Figure 6 It is a partial structural schematic diagram of a lifting rod of a preferred embodiment of the utility model.

[0028] Figure 7 It is an overall schematic diagram of a wafer edge detection device according to a preferred embodiment of the present utility model.

[0029] Explanation of the reference numerals in the specification: 1. support platform; 10. wafer to be tested; 20. support frame; 21. first driving member; 210. pull rod; 212. support plate; 220. support column; 221. support block; 2110. limit stop bar; 22. support member; 30. base; 301. first movable jaw; 302. second movable jaw; 303. third movable jaw; 304. first fixed jaw; 305. second fixed jaw; 306. third fixed jaw; 31. lifting rod; 310. first cylinder; 32. second driving member; 33. elastic ring; 34. rolling member; 41. first camera; 410. first fine-tuning platform; 42. second camera; 43. third camera; 430. third fine-tuning platform; 50. light source; 51. mounting seat; 52. fourth camera; 6. wafer grabbing device. DETAILED DESCRIPTION

[0030] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0031] Embodiment 1

[0032] Reference Figures 1 to 7 As shown, the utility model discloses a wafer edge detection device, including a support base, wherein the support base includes a support platform 1, and the support platform 1 is used to carry a wafer 10 to be detected;

[0033] The wafer edge detection device further includes a cache unit, which includes a support frame 20, a first driving member 21 and a plurality of supporting members 22. The support frame 20 is arranged on the supporting platform 1, and a plurality of supporting members 22 are arranged on the support frame 20. The first driving member 21 is used to drive the supporting frame 20 to move in the height direction. The wafer 10 to be detected can be placed on the supporting member 22. Specifically, the supporting member 22 can support the edge of the wafer 10 to be detected. It should be noted that when the wafer 10 to be detected is transferred to the wafer edge detection device by the transfer equipment, it is first placed on the support structure formed by the plurality of supporting members 22.

[0034] The wafer edge detection device further includes a rotating unit, which includes a base 30, a clamping assembly, a lifting rod 31 and a second driving member 32. The base 30 is disposed on the supporting platform 1, and the second driving member 32 is assembled on the supporting seat.

[0035] The center of the base 30 is provided with a through hole, and the lifting rod 31 is passed through the through hole. At the same time, the lifting rod 31 is also connected to the first driving member 21. The lifting rod 31 is connected to the first driving member 21 through a pull rod 210. The lifting rod 31 can move in the height direction driven by the first driving member 21. The second driving member 32 can drive the base 30 to rotate in a horizontal plane with the lifting rod 31 as the center.

[0036] In detail, the clamping assembly includes a plurality of movable jaws, which are radially arranged with the axis of the lifting rod 31 as the center, and the movable jaws are slidably arranged on the base 30, and the extension direction of the movable jaws is in the same direction as the radial direction of the lifting rod 31, and a rolling member 34 is provided at one end of the movable jaw close to the lifting rod 31. The diameter of the end of the lifting rod 31 close to the clamping assembly decreases successively to form an inclined surface, so that the contact surface between the lifting rod 31 and the rolling member 34 is an inclined surface, and the rolling member 34 is in rolling contact with the contact surface. During the lifting of the lifting rod 31, the movable jaw can move in a direction away from the lifting rod 31, thereby loosening the wafer 10 to be inspected. During the lowering of the lifting rod 31, the movable jaw can move in a direction close to the lifting rod 31, thereby clamping the wafer 10 to be inspected.

[0037] The wafer edge detection device further includes a detection camera unit, which includes a plurality of cameras. The plurality of cameras are arranged toward the wafer 10 to be detected, so as to capture images of the wafer to be detected.

[0038] The working principle and process of the utility model are as follows:

[0039] The wafer 10 to be detected is grasped by the transfer device and transported to the wafer edge detection device. The wafer 10 to be detected is first placed in the cache unit, specifically, the wafer 10 to be detected is placed on the support member 22. Then, the first driving member 21 is started, and the support member 22 is driven to descend by the first driving member 21. When the support member 22 descends to be flush with the movable clamping claw, the support member 22 continues to descend. At this time, the wafer 10 to be detected falls to the movable clamping claw, and because the lifting rod 31 is in the first The first driving member 21 is driven to synchronously descend, thereby driving the movable clamping claw to continuously move toward the direction close to the lifting rod 31, and clamping the wafer 10 to be inspected. After the clamping is completed, the first driving member 21 stops, and the second driving member 32 is started. At this time, the wafer 10 to be inspected can be rotated under the drive of the second driving member 32. At this time, the edge of the wafer 10 to be inspected is captured by the inspection camera unit, and uploaded to the control end, the integrity of the edge of the wafer 10 to be inspected is identified and judged, and the first inspection is completed;

[0040] After the first detection is completed, the first driving member 21 is controlled to drive the cache unit to rise. At this time, the lifting rod 31 moves upward, and the movable jaw releases the wafer 10 to be detected. At the same time, the support member 22 of the cache unit moves to contact the wafer 10 to be detected, and continues to move upward to lift the wafer 10 to be detected. At this time, the wafer 10 to be detected is separated from the movable jaw and placed on the support structure formed by the multiple support members 22. Then, the second driving member 32 drives the movable jaw to rotate a certain angle and then stops. At this time, the position of the movable jaw does not overlap with the position when the wafer 10 to be detected was clamped for the first time, so that the position blocked by the movable jaw during the first detection can also be exposed, and photo detection can be performed during the next detection process;

[0041] Then, repeat the above steps, clamp the wafer 10 to be inspected by the movable clamping jaws, rotate the wafer 10 to be inspected, take a picture of the edge of the wafer 10 to be inspected by the camera detection unit, identify and determine the integrity of the edge of the wafer 10 to be inspected, and complete the second inspection;

[0042] By combining the first detection result and the second detection result, a more comprehensive detection can be achieved on the edge of the wafer 10 to be detected, and it can be determined whether the edge of the wafer 10 to be detected meets the requirements, thereby effectively avoiding detection loopholes.

[0043] It can be known from this that the wafer edge detection device to be protected by the utility model is provided with a support platform, a cache unit, a rotation unit and a detection camera unit. The cache unit is used to cache the wafer to be detected, and the rotation unit is used to clamp the wafer to be detected and drive the wafer to be detected to rotate, so that the detection camera unit can collect images of the edge of the wafer to be detected and upload them to the control end to determine whether the edge of the wafer to be detected meets the standard. After the first detection is completed, the clamping position of the wafer to be detected by multiple movable clamps is adjusted by cooperating with the cache unit and the rotation unit, and then a second detection is performed, so that the parts blocked by the movable clamps in the first detection can also be detected, thereby achieving a comprehensive detection of the edge of the wafer to be detected, effectively improving the detection accuracy, and thus ensuring the comprehensiveness and accuracy of the detection results.

[0044] As a preferred embodiment, the support member 22 includes a support column 220 and a support block 221. The support column 220 is installed on the support frame 20 along the height direction, and the support block 221 is arranged at the top of the support column 220. In order to limit the wafer 10 to be inspected and prevent the wafer 10 to be inspected from shifting, one end of the support block 221 is raised to form a limit stop bar 2110.

[0045] In detail, a support plate 212 is further provided at the output end of the first driving member 21 , and the support plate 212 is connected to the bottom of the support frame 20 , so that the first driving member 21 drives the support frame 20 to move in the height direction through the support plate 212 .

[0046] Furthermore, in order to ensure the consistency and stability of the movable jaws when they are extended and retracted, the clamping assembly further includes an elastic ring 33. Each movable jaw is provided with a fixed column, and the elastic ring 33 is sequentially connected around each fixed column to form a closed loop.

[0047] Specifically, the detection camera unit includes a first camera 41, the first camera 41 is installed on the support platform 1 through a first fine-tuning platform 410, the first camera 41 is arranged above the clamping assembly, and the first camera 41 is used to take pictures of the wafer to be detected 10 along a first direction. As a preferred embodiment, the first camera 41 is arranged toward the upper surface of the wafer to be detected 10, and takes pictures of the upper surface of the wafer to be detected 10.

[0048] The second camera 42 is arranged below the clamping assembly, and the second camera 42 is used to take pictures of the wafer 10 to be inspected along the second direction. The second camera 42 is installed on the support platform 1 through the second fine-tuning platform, and the second camera 42 is arranged below the clamping assembly, and the second camera 42 takes pictures of the wafer 10 to be inspected along the second direction. As a preferred embodiment, the second camera 42 is arranged toward the lower surface of the wafer 10 to be inspected, and takes pictures of the lower surface of the wafer 10 to be inspected. The second direction is opposite to the first direction.

[0049] The third camera 43 is arranged in the horizontal direction, and is installed on the supporting platform 1 through a third fine-tuning platform 430 . The third camera 43 faces the edge of the wafer 10 to be inspected, and is used to take pictures of the edge of the wafer 10 to be inspected.

[0050] In detail, in order to more stably clamp the wafer 10 to be inspected and avoid slipping during rotation, the clamping assembly further includes a plurality of fixed jaws, and the plurality of fixed jaws are disposed on the base 30 .

[0051] As a preferred embodiment, the movable jaws include a first movable jaw 301, a second movable jaw 302 and a third movable jaw 303 which are evenly spaced. The angle between two adjacent movable jaws is 120°.

[0052] In addition, the fixed jaws include a first fixed jaw 304, a second fixed jaw 305 and a third fixed jaw 306 which are evenly spaced. The angle between two adjacent fixed jaws is 120°.

[0053] In order to ensure the stability of the wafer 1 to be inspected, the fixed jaws and the movable jaws are arranged in an interlaced manner. As a preferred embodiment, the fixed jaws and the movable jaws are arranged in an evenly interlaced manner. Thus, the angle between the adjacent fixed jaws and the movable jaws is 60°.

[0054] Furthermore, since the edge of the wafer 10 to be inspected has a notch, in order to detect whether the morphology of the notch meets the standard, the camera detection unit also includes a notch detection module, and the notch detection module includes a light source 50, a mounting seat 51 and a fourth camera 52. The light source 51 is arranged on the support platform 1, and the mounting seat 51 is connected to the support platform 1. The fourth camera 52 is assembled on the mounting seat 51, and the fourth camera 52 is set toward the edge of the wafer 10 to be inspected, so that the morphology of the notch is detected by the fourth camera 52 to detect whether there are defects such as cracks and edge collapse.

[0055] As a preferred embodiment, the rolling element 34 is a ball. It should be explained that when the clamping assembly is rotating, the lifting rod 31 can be lowered to a point where it does not contact the ball, thereby avoiding friction and vibration that may affect the detection result.

[0056] As a preferred embodiment, the rotating unit further includes a first cylinder 310, which is disposed at the output end of the first driving member 21, and the output end of the first cylinder 310 is connected to the lifting rod 31. The first cylinder 310 can play a buffering role between the first driving member 21 and the lifting rod 21, and is used as an elastic member.

[0057] The first driving member 21 includes but is not limited to an electric cylinder. As a preferred embodiment, the first driving member 21 is an electric slide. A protective cover 11 is also provided outside the first driving member 21 .

[0058] Embodiment 2

[0059] The utility model also discloses a wafer edge detection device, including a wafer grasping device 6 and a wafer edge detection device as described in Example 1, wherein the wafer grasping device 6 is used to grasp the wafer 10 to be inspected and place it on the wafer edge detection device, and after the inspection is completed, the wafer is moved away and transported to the next workstation.

[0060] Through the wafer edge detection device, the edge detection can be performed on the wafer 10 to be detected from three angles: directly above, horizontally, and directly below. In addition, the morphology of the notch of the wafer 10 to be detected can also be detected. The utility model can realize comprehensive detection of the edge of the wafer to be detected, effectively improve the detection accuracy, and thus ensure the comprehensiveness and accuracy of the detection results.

[0061] In the description of the embodiments of the present utility model, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0062] In the description of the present utility model, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0063] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] Obviously, the above embodiments are merely examples for the purpose of clear explanation and are not intended to limit the implementation methods. For those skilled in the art, other different forms of changes or modifications can be made based on the above description. It is not necessary and impossible to list all the implementation methods here. The obvious changes or modifications derived therefrom are still within the scope of protection of the invention of the utility model.

Claims

1. A wafer edge detection device, characterized in that: include, A support base, comprising a support platform; A cache unit, comprising a support frame, a first driving member and a plurality of supporting members, wherein the support frame is arranged on the supporting platform, the plurality of supporting members are arranged on the support frame, the first driving member is used to drive the support frame to move along a height direction, and the wafer to be inspected can be placed on the supporting member; The rotating unit comprises a base, a clamping assembly, a lifting rod and a second driving member, wherein the base is arranged on the supporting platform, a through hole is arranged at the center of the base, the lifting rod is passed through the through hole, the second driving member is used to drive the base to rotate, the lifting rod is also connected to the first driving member and moves along the height direction under the drive of the first driving member, the clamping assembly comprises a plurality of movable jaws, the plurality of movable jaws are radially arranged with the axis of the lifting rod as the center, and the movable jaws are slidably arranged on the base, the extension direction of the movable jaws is in the same direction as the radial direction of the lifting rod, a rolling member is arranged at one end of the movable jaw close to the lifting rod, the contact surface between the lifting rod and the rolling member is an inclined surface, the rolling member is in sliding contact with the lifting rod, and the wafer to be inspected rotates under the drive of the clamping assembly; The detection camera unit comprises a plurality of cameras, wherein the plurality of cameras are arranged toward the wafer to be detected, and the detection camera unit is used for collecting images of the wafer to be detected.

2. A wafer edge detection device according to claim 1, characterized in that: The clamping assembly also includes an elastic ring, each of the movable clamping jaws is provided with a fixed column, and the elastic ring is sequentially wound around each of the fixed columns.

3. The wafer edge detection device according to claim 1, characterized in that: The detection camera unit includes a first camera, which is installed on the supporting platform and disposed above the clamping assembly. The first camera is used to take pictures of the wafer to be detected along a first direction.

4. The wafer edge detection device according to claim 1, characterized in that: The second camera is arranged below the clamping assembly, and the second camera is used to take pictures of the wafer to be inspected along a second direction.

5. The wafer edge detection device according to claim 1, characterized in that: The third camera is arranged in a horizontal direction, and faces the edge of the wafer to be inspected.

6. The wafer edge detection device according to claim 1, characterized in that: The clamping assembly further comprises a plurality of fixed clamping jaws, and the plurality of fixed clamping jaws are arranged on the base.

7. The wafer edge detection device according to claim 6, characterized in that: The movable jaws include a first movable jaw, a second movable jaw and a third movable jaw which are evenly spaced.

8. The wafer edge detection device according to claim 7, characterized in that: The fixed jaws include a first fixed jaw, a second fixed jaw and a third fixed jaw which are evenly spaced, and the fixed jaws are staggered with the movable jaws.

9. The wafer edge detection device according to claim 1, characterized in that: The camera detection unit also includes a notch detection module, which includes a light source, a mounting seat and a fourth camera. The light source is arranged on the base, the mounting seat is connected to the base, the fourth camera is assembled on the mounting seat, and the fourth camera is set toward the edge of the wafer to be inspected.

10. The wafer edge detection device according to claim 1, characterized in that: The rolling element is a ball.

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