Full-automatic wafer UV dispergation machine

Abstract

The full-automatic wafer UV dispergation machine comprises a rack, a basket lifting machine and a basket are arranged on the left side of the interior of the rack, a wafer track, a wafer conveying mechanism, a nitrogen injection mechanism and a UV dispergation mechanism are arranged on the right side of the interior of the rack, and a touch screen is arranged on the outer surface of the left side of the rack; a basket is arranged at one end of the basket lifter; a wafer to be peptized is placed in the lifting basket; the nitrogen injection mechanism is arranged above the wafer track; the UV peptizing mechanism is arranged at one end of the wafer track and moves along the wafer track; the basket elevator is arranged at the other end of the wafer track and moves the wafer to be peptized to the wafer track through the wafer transmission mechanism. Automatic feeding and discharging of wafers in the lifting basket and automatic UV dispergation are realized, the lifting basket lifter can realize extraction of wafers at different heights, and the production efficiency and the safety are improved.

Description

Technical Field

[0001] The present application relates to the technical field of adhesive dissolving machines, and in particular to a fully automatic wafer UV adhesive dissolving machine. Background Art

[0002] In the semiconductor chip production process, before chip dicing, the wafer is fixed on the frame with a dicing tape. After the dicing process is completed, the fixed tape is irradiated with UV light to cure and harden the UV tape to reduce the viscosity of the dicing fixed film, so as to facilitate the smooth production of the subsequent packaging process. When exposed to ultraviolet light, the bonding strength becomes lower. Therefore, after ultraviolet light exposure, the wafer or chip can easily peel off from the adhesive tape.

[0003] The UV degumming machine solves the degumming process of wafer, glass and ceramic cutting technology. The applicable industry is not only limited to the semiconductor packaging industry, but also suitable for UV film degumming of semiconductor materials such as optical lenses, LEDs, ICs, semiconductors, integrated circuit boards, mobile hard drives, etc. Utility Model Content

[0004] In order to solve the above-mentioned technical problems, the present application provides a fully automatic wafer UV debonding machine, including a frame, a basket elevator and a basket are provided on the left side of the frame, a wafer track, a wafer transmission mechanism, a nitrogen injection mechanism and a UV debonding mechanism are provided on the right side, and a touch screen is provided on the left outer surface of the frame; a basket is provided at one end of the basket elevator; the basket is used to place wafers to be debonded; the nitrogen injection mechanism is provided above the wafer track; the UV debonding mechanism is provided at one end of the wafer track and moves along the wafer track; the basket elevator is provided at the other end of the wafer track, and the wafer to be debonded is moved to the wafer track through the wafer transmission mechanism.

[0005] Specifically, the basket lift includes: a support frame, a Z-axis servo module and a placement table; the placement table is arranged on one side of the support frame, and is driven to move up and down along the Z-axis by the Z-axis servo module arranged on the same side; a positioning baffle and an elastic pin are arranged on the placement table.

[0006] Specifically, a positioning structure adapted to the positioning baffle and the elastic pin is provided at the bottom of the basket, and a patch ring for placing the wafer to be debonded is provided in the basket.

[0007] Specifically, the nitrogen injection mechanism includes: a nozzle, a nitrogen injection port and a lifting cylinder; the nozzle and the nitrogen injection port are arranged below the lifting cylinder.

[0008] Specifically, the wafer transfer mechanism includes: an on-board inspection sensor, a clamp, an overpressure sensor, a horizontal plate and a transfer mechanism; one end of the horizontal plate is movably connected to the transfer mechanism, and the other end of the horizontal plate is provided with an overpressure sensor, a sensor and a clamp.

[0009] Specifically, the UV degumming mechanism includes: a UV LED light source and a lead screw module; the UV LED light source is arranged above the lead screw module and can move along the lead screw module.

[0010] Specifically, it also includes: a material sensor and a protrusion detection sensor; the material sensor and the protrusion detection sensor are arranged at the front end of the wafer track.

[0011] Specifically, an alarm light is arranged on the top of the rack.

[0012] Specifically, steering pulleys are arranged at the four corners of the bottom of the frame.

[0013] This solution can use the basket elevator to lift the basket on the Z axis, detect the presence of materials in the basket and the health status of the materials, and at the same time, guide the patch ring to prevent it from running off track and getting stuck during the feeding and unloading process, thus achieving: the basket elevator can realize wafer extraction at different heights, improving production efficiency and safety. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The accompanying drawings are included to provide a further understanding of the embodiments and are incorporated into and constitute a part of this specification. The accompanying drawings illustrate the embodiments and are used together with the description to explain the principles of the present application. It will be easy to recognize other embodiments and many expected advantages of the embodiments because they become better understood by reference to the following detailed description. The elements of the drawings are not necessarily to scale with each other. The same reference numerals refer to corresponding similar parts.

[0015] Figure 1 It is a structural schematic diagram of a fully automatic wafer UV dissolving machine according to an embodiment of the present application;

[0016] Figure 2 It is a structural schematic diagram of a UV dissolving machine of a fully automatic wafer UV dissolving machine according to an embodiment of the present application;

[0017] Figure 3 It is a structural schematic diagram of a nitrogen injection mechanism of a fully automatic wafer UV disintegrator according to an embodiment of the present application;

[0018] Figure 4 It is a schematic diagram of the wafer track structure of a fully automatic wafer UV disintegrator according to an embodiment of the present application;

[0019] Figure 5 It is a structural schematic diagram of a wafer transmission mechanism of a fully automatic wafer UV disintegrator according to an embodiment of the present application;

[0020] Figure 6 It is a structural schematic diagram of a basket of a fully automatic wafer UV dissolving machine according to an embodiment of the present application;

[0021] Figure 7It is a structural schematic diagram of a basket lifter of a fully automatic wafer UV disintegrator according to an embodiment of the present application.

[0022] The meaning of the numbers in the figure are: 1. Rack; 2. UV dissolving machine; 3. Wafer transmission mechanism; 4. Wafer track; 5. Nitrogen injection mechanism; 6. Warning light; 7. Touch screen; 8. Basket lift; 9. Basket; 10. Patch ring; 1a. Steering pulley; 2a. UV LED light source; 2b. Screw module; 3a. Transmission mechanism; 3b. Cross plate; 3c. Overpressure sensor; 3d. Gripper; 3e. Sensor; 4a. Material sensor; 4b. Protrusion detection sensor; 5a. Nitrogen injection port; 5b. Lifting cylinder; 5c. Nozzle; 8a. Support frame; 8b. Z-axis servo module; 8c. Placement table; 8c1. Positioning baffle; 8c2. Elastic pin. DETAILED DESCRIPTION

[0023] In the following detailed description, reference is made to the accompanying drawings, which form a part of the detailed description and are shown by illustrative specific embodiments in which the present application can be practiced. To this end, directional terms, such as "top", "bottom", "left", "right", "up", "down", etc., are used with reference to the orientation of the figures described. Because the components of the embodiments can be positioned in several different orientations, directional terms are used for the purpose of illustration and are by no means limiting. It should be understood that other embodiments may be utilized or logical changes may be made without departing from the scope of the present application. Therefore, the following detailed description should not be adopted in a limiting sense, and the scope of the present application is defined by the appended claims.

[0024] Figure 1 is a structural schematic diagram of a fully automatic wafer UV disintegrator according to an embodiment of the present application, such as Figure 1 As shown, a fully automatic wafer UV disintegrator 2 includes a frame 1, a basket 9, an elevator 8 and a basket 9 are provided on the left side of the frame 1, a wafer track 4, a wafer transmission mechanism 3, a nitrogen injection mechanism 5 and a UV disintegrator 2 are provided on the right side, and a touch screen 7 is provided on the left outer surface of the frame 1; a basket 9 is provided at one end of the basket 9 elevator 8; the basket 9 is used to place wafers to be disintegrated; the nitrogen injection mechanism 5 is provided above the wafer track 4; the UV disintegrator 2 is provided at one end of the wafer track 4 and moves along the wafer track 4; the basket 9 elevator 8 is provided at the other end of the wafer track 4, and the wafer to be disintegrated is moved to the wafer track 4 through the wafer transmission mechanism 3.

[0025] Specifically, an alarm light 6 is provided at the top of the frame 1 ; and steering pulleys 1 a are provided at the four corners of the bottom of the frame 1 .

[0026] When an abnormality occurs during the working process of the device, the alarm light 6 will flash to remind the staff; and the steering pulley 1a can facilitate the movement of the entire device.

[0027] Specifically, Figure 2 As shown, the UV dissolving machine 2 includes: a UV LED light source 2a and a lead screw module 2b; the UV LED light source 2a is arranged above the lead screw module 2b and can move along the lead screw module 2b.

[0028] The device uses a UV LED light source 2a scanning method to debond the wafer. The characteristics of this method are: saving light source costs and higher debonding uniformity.

[0029] Specifically, Figure 3 As shown, the nitrogen injection mechanism 5 includes: a nozzle 5c, a nitrogen injection port 5a and a lifting cylinder 5b; the nozzle 5c and the nitrogen injection port 5a are arranged below the lifting cylinder 5b.

[0030] The device is used to fill the wafer surface with nitrogen during the debonding process, so that the debonding space is isolated from oxygen and the debonding effect is improved.

[0031] Specifically, Figure 4 As shown, it also includes: a material sensor 4a and a protrusion detection sensor 4b; the material sensor 4a and the protrusion detection sensor 4b are arranged at the front end of the wafer track 4.

[0032] The material sensor 4a and the protrusion detection sensor 4b are provided to detect whether there is material in the basket 9 and the healthy state of the material position. At the same time, the wafer track 4 is used to prevent the chip ring 10 from running off the track and getting stuck during the material feeding and discharging process.

[0033] Specifically, Figure 5 As shown, the wafer transfer mechanism 3 includes: a detection sensor, a clamp 3d, an overpressure sensor 3c, a horizontal plate 3b and a conveying mechanism 3a; one end of the horizontal plate 3b is movably connected to the conveying mechanism 3a, and the other end of the horizontal plate 3b is provided with an overpressure sensor 3c, a sensor 3e and a clamp 3d.

[0034] The device is used to transfer wafers. The wafer feed is pulled to the working position by the clamping patch ring 10, and the unloaded wafer is pushed to the basket 9 by the clamping patch ring 10. The sensor 3e is used to detect whether the patch ring 10 is separated from the clamping cylinder during the pulling process, and the overpressure sensor 3e is used for overpressure protection when encountering obstacles in front during the pushing process.

[0035] Specifically, Figure 6 As shown, a positioning structure adapted to the positioning baffle 8c1 and the elastic pin 8c2 is arranged at the bottom of the basket 9, and a patch ring 10 for placing the wafer to be debonded is arranged inside the basket 9.

[0036] Specifically, Figure 7As shown, the basket lifting mechanism 8 includes: a support frame 8a, a Z-axis servo module 8b and a placement table 8c; the placement table 8c is arranged on one side of the support frame 8a, and is driven to move up and down along the Z-axis by the Z-axis servo module 8b arranged on the same side; a positioning baffle 8c1 and an elastic pin 8c2 are arranged on the placement table 8c.

[0037] Through the above technical solution, the height of the basket can be controlled so as to take out wafers of different heights.

[0038] For ease of understanding, the present application is further described with a specific embodiment.

[0039] First, manually place the basket 9 (with the wafers to be debonded) on the basket elevator 8. After detecting the presence of material, the clamp 3d comes over to clamp and take the material, and pulls the patch ring 10 onto the wafer track 4. After the patch ring 10 is in place, the clamp 3d withdraws to avoid it, and the cylinder above lowers the nitrogen injection mechanism 5 and blows nitrogen. The Y-axis below drives the UV LED light source 2a to translate and debond the cutting film. After the debonding is completed, the nitrogen injection mechanism 5 rises, and the material-taking arm pushes the patch ring 10 into the basket 9.

[0040] Obviously, those skilled in the art can make various modifications and changes to the embodiments of the present application without departing from the spirit and scope of the present application. In this way, if these modifications and changes are within the scope of the claims of the present application and their equivalents, the present application is also intended to cover these modifications and changes. The word "comprising" does not exclude the presence of other elements or steps not listed in the claims. The simple fact that certain measures are recorded in mutually different dependent claims does not indicate that the combination of these measures cannot be used to profit. Any figure mark in the claims should not be considered to limit the scope.

Claims

1. A fully automatic wafer UV dissolving machine, characterized in that: It comprises a frame, wherein a basket lift and a basket are arranged on the left side of the frame, a wafer track, a wafer transfer mechanism, a nitrogen injection mechanism and a UV debonding mechanism are arranged on the right side, and a touch screen is arranged on the left outer surface of the frame; the basket is arranged at one end of the basket lift; the basket is used to place wafers to be debonded; the nitrogen injection mechanism is arranged above the wafer track; the UV debonding mechanism is arranged at one end of the wafer track and moves along the wafer track; the basket lift is arranged at the other end of the wafer track, and the wafer to be debonded is moved to the wafer track through the wafer transfer mechanism.

2. A fully automatic wafer UV dissolving machine according to claim 1, characterized in that: The basket lifter comprises: a support frame, a Z-axis servo module and a placement table; the placement table is arranged on one side of the support frame and is driven to move up and down along the Z-axis by the Z-axis servo module arranged on the same side; a positioning baffle and an elastic pin are arranged on the placement table.

3. A fully automatic wafer UV dissolving machine according to claim 2, characterized in that: The bottom of the basket is provided with a positioning structure matched with the positioning baffle and the elastic pin, and the basket is provided with a patch ring for placing the wafer to be debonded.

4. The fully automatic wafer UV dissolving machine according to claim 1, characterized in that: The nitrogen injection mechanism comprises: a nozzle, a nitrogen injection port and a lifting cylinder; the nozzle and the nitrogen injection port are arranged below the lifting cylinder.

5. The fully automatic wafer UV dissolving machine according to claim 1, characterized in that: The wafer transfer mechanism comprises: an on-board inspection sensor, a clamp, an overpressure sensor, a transverse plate and a conveying mechanism; one end of the transverse plate is movably connected to the conveying mechanism, and the other end of the transverse plate is provided with an overpressure sensor, a sensor and a clamp.

6. The fully automatic wafer UV dissolving machine according to claim 1, characterized in that: The UV degumming mechanism comprises: a UV LED light source and a lead screw module; the UV LED light source is arranged above the lead screw module and can move along the lead screw module.

7. The fully automatic wafer UV dissolving machine according to claim 1, characterized in that: Also includes: A material sensor and a protrusion detection sensor; the material sensor and the protrusion detection sensor are arranged at the front end of the wafer track.

8. The fully automatic wafer UV dissolving machine according to claim 1, characterized in that: An alarm light is arranged on the top of the frame.

9. The fully automatic wafer UV dissolving machine according to claim 1, characterized in that: The four corners of the bottom of the frame are provided with steering pulleys.

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