Alignment apparatus for semiconductor device placement

Abstract

The utility model provides an alignment device for placing a semiconductor device, the alignment device is configured as a pseudo unit or an actual unit of the semiconductor device (such as a tube core), so that when the semiconductor device is placed on a second semiconductor device carrier (703), the pseudo unit or the actual unit can be used as a dummy unit or an actual unit. The pre-placement alignment method should determine the position of the reference points of the alignment device (103) and the second imaging device (301) by analyzing images captured by the plurality of imaging devices on the alignment device (103) and the alignment pin (405) with at least one data processing device. The utility model further provides equipment for executing the method.

Description

Technical Field

[0001] The utility model provides a method for aligning the placement of a semiconductor device using at least one alignment device, wherein the alignment device is configured as a pseudo unit or an actual unit of a semiconductor device (such as a tube die), whereby, when the semiconductor device is placed on a second semiconductor device carrier, the pre-placement alignment method should analyze images captured by the alignment device, alignment pins, and multiple image capture devices on a pick-up and placement tip by having at least one data processing device, thereby determining the positions of reference points of the alignment device and the second imaging device. The utility model also proposes a device for executing the method. Background Art

[0002] Semiconductor packaging machines sort components from input carriers to output carriers. In order for the semiconductor packaging machine to accurately place the components at the desired position at the output carrier, a vision-guided positioning system is required, which generally includes a pre-placement vision system and a placement position vision system. The function of the pre-placement vision system is to obtain the position of the component when it is held by the pick and place tip of the semiconductor packaging machine before placing it on the output carrier. On the other hand, the placement position vision system guides the center of the placement position (which can be a small area or position referenced from a fiducial mark) to the center of the component.

[0003] One method of the prior art performs manual alignment such that a user or operator needs to pick up a component and check the position of the component under a pre-placement vision system before placing the same component on a carrier tape that is manually placed on an output carrier platform. Thereafter, the position of the same component is checked by a placement position vision system to calculate the correct center of the placement position vision relative to the pre-placement position vision system. After the manual alignment method, manual handling of the component and the carrier tape is required. This manual alignment method is time consuming and prone to errors.

[0004] AGRANAT EDWARD et al. disclose a flip chip assembly machine (FCAM) ​​in WO2005008726A2, which has a bonding head that picks up good dies from a flux well to present to an upward-looking camera to perform visual alignment, whereby the visual system determines the X, Y, and 0 offsets from the good dies to the bonding head before performing adjustments to the position of the bonding head to ensure that the good dies that have been fluxed are accurately placed on the substrate. However, having only an upward-looking camera is not sufficient to ensure that the dies are accurately placed on the substrate.

[0005] KOVACS ERNEST et al. in US4029536A discloses a device for aligning small items such as semiconductor chips with a reference axis and loading them on a predetermined position of a carrier; wherein the item alignment device includes a device for centering the items to a common center line and for orienting the items in a plane perpendicular to the common center line. The system is not suitable for compensation using a pick-and-place tip and alignment pins as proposed by the present invention.

[0006] Another solution of the prior art is to use a pick-up and place tip with an alignment device. However, the wear caused by the long-term operation of the pick-up and place tip may cause its size to be inconsistent, thereby affecting the accuracy of the alignment.

[0007] Another solution of the prior art is to use a mobile fixture such as a dummy component. However, it is necessary to convert the pick-and-place tip for carrying the mobile fixture. This conversion causes the time required for the alignment to be wasted.

[0008] Therefore, it would be advantageous to alleviate these disadvantages by providing a method and apparatus for aligning semiconductor device placement, which method and apparatus is capable of automatically picking up and / or placing at least one alignment device configured as a pseudo unit or an actual unit of a semiconductor device (e.g., a die); and determining the position of a reference point of a second imaging device used during placement of the actual semiconductor by analyzing images captured by multiple image capture devices. Utility Model Content

[0009] Therefore, the primary objective of the present invention is to provide a method and apparatus for aligning and placing a semiconductor device, which can automatically pick up and / or place a pseudo unit or an actual unit constructed into a semiconductor device (such as a tube core) on at least one alignment device; by analyzing images captured by multiple image capture devices to determine the position of a reference point of a second imaging device used when placing the actual semiconductor device, so as to reduce the time required to perform the alignment and reduce the errors caused by manual alignment.

[0010] Yet another object of the present invention is to provide a method and apparatus for aligning semiconductor device placement, whereby the same semiconductor device from an input carrier can be used as an alignment medium without changing equipment (eg, a pick and place tip).

[0011] Another object of the present invention is to provide a method and apparatus for aligning semiconductor device placement, whereby using the semiconductor device as an alignment medium is better than using a pick and place tip as an alignment medium as performed in the prior art, because the semiconductor device generally has a consistent size that can ensure good alignment accuracy.

[0012] Another object of the present invention is to provide a method and apparatus for aligning and placing a semiconductor device, which ensures that the time required for the alignment is shorter because there is no need to convert the pick-up and placement tips.

[0013] Additional objects of the present invention will become apparent by understanding the following detailed description of the present invention or using the present invention in actual practice.

[0014] According to the preferred embodiment of the present utility model, the following contents are provided:

[0015] A method for aligning and placing a semiconductor device, comprising the following steps:

[0016] (i) picking up at least one alignment device from at least one first semiconductor device carrier by at least one pick and place tip;

[0017] (ii) transferring the alignment device to a first visual inspection station by at least one pick and place arm while the pick and place tip holds the alignment device;

[0018] (iii) capturing at least one first image of the alignment device by at least one first imaging device at the first visual inspection station while the pick and place tip holds the alignment device; wherein the first image depicts a side of the alignment device opposite to the side held by the pick and place tip;

[0019] (iv) determining the position of the alignment device relative to a reference point of the first imaging device by analysing the first image using any suitable data processing means;

[0020] (v) transferring the alignment device to a second visual inspection station via the pick and place arm;

[0021] (vi) determining a position of a top surface of at least one alignment pin using at least one second imaging device;

[0022] (vii) determining a position of the alignment device held by the pick and place tip relative to that side of the alignment pin;

[0023] (viii) determining a corrected XY position of a reference point of the second imaging device based on the XY position relationship obtained from step (iv), step (vi) and step (vii), wherein when the semiconductor device is placed on a second semiconductor device carrier, the coordinates of the placement point of at least one second semiconductor device carrier are guided to the center of at least one semiconductor device using the corrected XY position of the reference point of the second imaging device.

[0024] In another embodiment of the present invention, there is provided:

[0025] An alignment device for semiconductor device placement, comprising:

[0026] at least one pick and place arm having at least one pick and place tip;

[0027] at least one first visual inspection station having at least one first imaging device;

[0028] at least one any suitable data processing device;

[0029] at least one second visual inspection station;

[0030] at least one second imaging device configured to be used when the pick and place tip places the at least one semiconductor device on at least one second semiconductor device carrier;

[0031] The pick and place tip is configured to pick up or place at least one alignment device;

[0032] wherein the first imaging device is configured to capture at least one first image of the alignment device while the pick and place tip is holding the alignment device; wherein the first image depicts a side of the alignment device opposite to a side held by the pick and place tip;

[0033] The corrected XY position of the reference point of the second imaging device is based on the relationship between the XY position of the alignment device relative to the reference point of the first imaging device, the position of the top surface of at least one alignment pin, and the position of the alignment device held by the pick and place tip relative to one side of the alignment pin. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Other aspects and advantages of the present invention will be apparent after studying the detailed description in conjunction with the accompanying drawings, in which:

[0035] Figure 1 A front view of a pick and place tip picking up an alignment device from a first semiconductor device carrier is shown.

[0036] Figure 2A 2 shows a front view of a first imaging device capturing a first image 207 of the alignment device through a first reflecting device, and Figure 2B is a sample of a first image 207 captured by the first imaging device.

[0037] Figure 3 A front view of a second imaging device capturing a top view of the alignment pin is shown.

[0038] Figure 4An elevation view showing the pick and place tip moving the alignment device to a position such that the alignment device is proximate the center of the top surface of the alignment pin.

[0039] Figure 5A and Figure 5D A top view is shown of at least one image of one side of an alignment device and an alignment pin and another image on a vertical side being captured using a third imaging device through at least one second reflecting device, wherein the third imaging device is repeatedly moved back and forth by a third actuator, wherein the alignment device and the alignment pin are illuminated using backlight and / or frontlight, respectively. Figure 5B A second embodiment of the third imaging device of step (vii) (b) of the method of the present invention is shown, and Figure 5C A third embodiment of a third imaging device according to step (vii)(b) of the method of the present invention is shown.

[0040] Figure 6 A front view of a second imaging device is shown, which is configured for use when the pick and place tip places a semiconductor device on a second semiconductor device carrier.

[0041] Figure 7 A top view of one embodiment of an alignment device for placing a semiconductor device according to the present invention is shown.

[0042] Figure 8 is a flow chart showing the method of the present invention. DETAILED DESCRIPTION

[0043] In the detailed description below, many specific details are provided to provide a comprehensive understanding of the present invention. However, it will be appreciated by those skilled in the art that the present invention can be practiced without these specific details. In other cases, well-known methods, processes and / or components are not described in detail to avoid confusing the present invention.

[0044] The present invention will be more clearly understood from the following description of embodiments of the present invention, which is given by way of example only with reference to the accompanying drawings which are not drawn to scale.

[0045] The utility model provides a method for aligning and placing a semiconductor device, comprising the following steps. Step (i) is to pick up at least one alignment device 103 from at least one first semiconductor device carrier 107 by at least one pick and place tip 105. The device carrier 107 can be a wafer, a wafer frame, a tray, a waffle package, a tube, a bowl, a carrier tape, a holder or any suitable input substrate capable of carrying a semiconductor device.

[0046] Step (ii) is to transfer the alignment device 103 to a first visual inspection station 603 by at least one pick and place arm 601 while the alignment device 103 is held by the pick and place tip 105 .

[0047] Step (iii) is capturing at least one first image 207 of the alignment device 103 at the first visual inspection station 603 by at least one first imaging device 201 while the alignment device 103 is held by the pick and place tip 105, wherein the first image 207 depicts the side of the alignment device 103 opposite to the side held by the pick and place tip 105. Therefore, the capturing of the alignment device 103 depends on whether the alignment device 103 is flipped after picking up the alignment device 103 from the first semiconductor device carrier 107. Step (iv) is determining the position of the alignment device 103 relative to the reference point 205 of the imaging device 201 by analyzing the first image 207 using any suitable data processing device. The position may be further defined as an XY position difference or offset between the alignment device 103 and the reference point 205 of the first imaging device 201. Step (v) is transferring the alignment device 103 to a second visual inspection station 605 by the pick and place arm 601.

[0048] Step (vi) is to determine the position of the top surface of at least one alignment pin 405 using at least one second imaging device 301. Step (vi) includes the following sub-steps. Sub-step (vi)(a) is to move at least one alignment pin module 403 along the XY axis at the second visual inspection station 605 by at least one first actuator (not shown) until the top surface of the alignment pin 405 in the alignment pin module 403 is within the field of view of the second imaging device 301 and the alignment pin 405 is close to the center point of the alignment device 103, as shown in FIG. Figure 4 shown.

[0049] Sub-step (vi)(b) is to move the alignment pin module 403 along the Z-axis at the second visual inspection station 605 by at least one second actuator 409 until the top surface of the alignment pins 405 in the alignment pin module 403 is within the depth of field of the second imaging device 301 .

[0050] Sub-step (vi)(c) is to capture at least one second image of a top view of the alignment pin 405 at the second visual inspection station 605 by the second imaging device 301, such as Figure 3 shown.

[0051] Sub-step (vi)(d) is to determine the position of the alignment pin 405 by analyzing the second image using any suitable data processing means.

[0052] Step (vii) is to determine the position of the alignment device 103 held by the pick and place tip 105 relative to the side of the alignment pin 405 .

[0053] Step (vii) includes the following sub-steps: Sub-step (vii)(a) is to move the alignment device 103 held by the pick and place tip 105 to a position by the pick and place arm 601 so that the alignment device 103 is close to the center of the top surface of the alignment pin 405 .

[0054] Sub-step (vii)(b) is to capture at least two third images of vertical side views of the alignment device 103 and the alignment pin 405 by at least one third imaging device 501 at the second visual inspection station 605; while the alignment device 103 and the alignment pin 405 are illuminated by at least one lighting device 503. In one embodiment, Figure 5AAs shown, step (vii) (b) can be completed using a third imaging device 501, which captures at least one image of one side of the alignment device 103 and the alignment pin 405; and at the same time, captures the other vertical side of the alignment device 103 and the alignment pin 405 through at least one second reflecting device 411, and the at least one second reflecting device 411 is configured to reflect light from the vertical side of the alignment device 103 and the alignment pin 405 to the third imaging device 501; wherein the third imaging device 501 is configured to move reciprocally from a first position for capturing an image of the first side of the alignment device 103 and the alignment pin 405 to a second position for capturing an image of the vertical side of the alignment device 103 and the alignment pin 405 through at least one third actuator 505. In another embodiment, the step (vii)(b) may be performed using one third imaging device 501 and another third imaging device 501, the one third imaging device 501 being configured to capture an image of one side of the alignment device 103 and the alignment pin 405, and the other third imaging device 501 being configured to capture an image of the other vertical side of the alignment device 103 and the alignment pin 405 through the second reflecting device 411. In a third embodiment, the step (vii)(b) may be performed using one third imaging device 501 and another third imaging device 501, the one third imaging device 501 being configured to capture an image of one side of the alignment device 103 and the alignment pin 405, and the other third imaging device 501 being positioned to directly capture an image of the other vertical side of the alignment device 103 and the alignment pin 405 without any reflecting device 411. In a fourth embodiment, step (vii)(b) may be accomplished using the second imaging device 301, whereby the multiple side views of the alignment device 103 and alignment pins 405 are reflected by a set of reflecting devices such as prisms, mirrors or a combination thereof.

[0055] In one embodiment, the light emitting device 503 in step (vii)(b) is placed on the side opposite to the side where the third imaging device 501 captures the second image, thereby generating backlighting of the alignment device 103 and the alignment pin 405, such as Figure 5A In another embodiment, the light emitting device 503 in step (vii)(b) emits light toward the side of the third imaging device 501 capturing the third image, as shown in FIG. Figure 5B As shown, the light emitting device 503 can be positioned at any suitable angle relative to the alignment device 103 and the alignment pin 405.

[0056] Sub-step (vii)(c) is determining the position of the alignment device 103 held by the pick and place tip 105 relative to at least two perpendicular sides of the alignment pin 405 by analyzing the third image using any suitable data processing equipment.

[0057] Step (viii) is to determine a corrected XY position of the reference point of the second imaging device 301 based on the correlation of the XY positions obtained from step (iv), step (vi) and step (vii), wherein the corrected XY position of the reference point of the second imaging device 301 is used when placing the semiconductor device on the second semiconductor device carrier 703. The corrected XY position of the reference point of the second imaging device 301 is obtained after calculating the offset data obtained from the first imaging device 201, the second imaging device 301 and the third imaging device 501. It is important that when performing the placement of the semiconductor device, the coordinates of the placement point of the output carrier (the second semiconductor device carrier 703) are guided to the center of the semiconductor device 103 using the second imaging device 301.

[0058] An example of how to calculate the corrected XY position of the reference point of the second imaging device 301 is as follows. First, the X component is calculated, thereby obtaining the X-axis offset data (X501.D) of the alignment device 103 by analyzing the first-side third image captured by a third imaging device 501; and obtaining the X-axis offset data (X501.P) of the alignment pin 405 by analyzing the same first-side third image. The difference between the X-axis offset data (X501.D) of the alignment device 103 and the X-axis offset data (X501.P) of the alignment pin 405 is calculated, hereinafter referred to as the first difference. Thereafter, by analyzing the first image 207 (such as the first image 207 captured by the first imaging device 201) Figure 2B As shown in FIG. 1 ), obtain the first top X-axis offset data (X201) between the center point of the alignment device 103 and the reference point 205 of the first imaging device 201. Calculate the difference between the first top X-axis offset data (X201) and the first difference value, hereinafter referred to as the second difference value. Thereafter, by analyzing the second image captured by the second imaging device 301, obtain the second top X-axis offset data (X301) between the alignment pin 405 and the reference point of the third imaging device 301. Finally, as described in step (viii) of the method of the present invention, obtain the corrected X-axis position of the reference point of the second imaging device 301 by calculating the difference between the second top X-axis offset data (X301) and the second difference value.

[0059] At the same time, the Y component is also calculated, thereby obtaining the Y-axis offset data (Y501.D) of the alignment device 103 by analyzing the second side third image captured by another third imaging device or the same third imaging device at another position 501, wherein the second side is perpendicular to the first side. The Y-axis offset data (Y501.P) of the alignment pin 405 is obtained by analyzing the same second side third image. The difference between the Y-axis offset data (Y501.D) of the alignment device 103 and the Y-axis offset data (Y501.P) of the alignment pin 405 is calculated, which is referred to as the first difference value hereinafter. Thereafter, by analyzing the first image 207 (such as the first image 207 captured by the first imaging device 201) Figure 2B As shown in FIG. 1 ), the first top Y-axis offset data (Y201) between the center point of the alignment device 103 and the reference point 205 of the first imaging device 201 is obtained. The difference between the first top Y-axis offset data (Y201) and the first difference value is calculated, hereinafter referred to as the second difference value. Thereafter, the second top Y-axis offset data (Y301) between the alignment pin 405 and the reference point of the second imaging device 301 is obtained by analyzing the second image captured by the second imaging device 301. Finally, as described in step (viii) of the method of the present invention, the corrected Y-axis position of the reference point of the second imaging device 301 is obtained by calculating the difference between the second top Y-axis offset data (Y301) and the second difference value.

[0060] Step (ix) is to optionally place the alignment device 103 used in the alignment method, placing the alignment device on the first semiconductor carrier, or placing the alignment device on the second semiconductor carrier; after step (viii). The placement can be performed at at least one placement station 707.

[0061] like Figure 7 As shown, the present invention also proposes an alignment device 401 for semiconductor device placement, comprising at least one pick-and-place arm 601 having at least one pick-and-place tip 105 and at least one first visual inspection station 603 having at least one first imaging device 201. The pick-and-place arm 601 may be a rotary turntable, a rotary wheel, or a linear motion actuator.

[0062] The alignment device 401 further comprises at least one any suitable data processing device, at least one second visual inspection station 605, at least one second imaging device 301, wherein the at least one second imaging device 301 is configured to be used when the pick-and-place tip 105 places the at least one semiconductor device on the at least one second semiconductor device carrier 703, as Figure 6As shown. The pick and place tip 105 is configured to pick up or place at least one alignment device 103. The alignment device 103 may be an electronic component, a dummy package, or a fixture. If a fixture is used as an alignment device, the fixture will be obtained from a movable fixture carrier instead of the first semiconductor device carrier 107. The second semiconductor device carrier 703 may be a carrier tape, a tray, a waffle pack, a substrate, a tape, or a film.

[0063] The first imaging device 201 is configured to capture at least one first image 207 of the alignment device 103 when the alignment device 103 is held by the pick and place tip 105, wherein the first image 207 depicts a side of the alignment device 103 opposite to the side held by the pick and place tip 105. The first imaging device 201 may capture the first image 207 by at least one first reflection device 203, such as Figure 2A The first imaging device 201 can also directly capture the first image 207 without a reflection device. Figure 2B A sample of a first image 207 captured by a first imaging device 201 is shown, where ∆X is the X-axis offset between the center point of the alignment device 103 and the reference point 205 of the first imaging device 201, and ∆Y is the Y-axis offset between the center point of the alignment device 103 and the reference point of the first imaging device 201. It is important to note that the reference point of the first imaging device 201 can be set to any position deemed suitable within the field of view of the first imaging device 201 (i.e., a corner, center, any other position).

[0064] The corrected XY position of the reference point of the second imaging device 301 is based on a correlation between the XY position of the alignment device 103 relative to the reference point 205 of the first imaging device 201, the position of the top surface of at least one alignment pin 405, and the position of the side of the alignment device 103 held by the pick and place tip 105 relative to the alignment pin 405.

[0065] The second inspection station 605 includes at least one first actuator configured to move at least one alignment pin module 403 including the alignment pin 405 along the XY axis and at least one second actuator 409 configured to move the alignment pin module 403 including the alignment pin 405 along the Z axis. The first actuator and the second actuator 409 may be cylinders, electric actuators, or motors.

[0066] The second inspection station 605 further comprises at least one second imaging device 301 configured to capture at least one second image of a top view of the alignment pin 405, such as Figure 3The second inspection station 605 further comprises at least one third imaging device 501 configured to capture at least two third images of vertical side views of the alignment device 103 and the alignment pin 405 when the alignment device 103 and the alignment pin 405 are illuminated by at least one light emitting device 503; and at least one any suitable data processing device configured to determine the position of the alignment pin 405 by analyzing the second image, determine the position of the alignment device 103 held by the pick and place tip 105 relative to at least two vertical sides of the alignment pin 405 by analyzing the third image or a combination thereof.

[0067] The third imaging device 501 is configured to capture at least one image of one side of the alignment device 103 and the alignment pin 405; and simultaneously capture another vertical side of the alignment device 103 and the alignment pin 405 through at least one second reflecting device 411, and the at least one second reflecting device 411 is configured to reflect light from the vertical side of the alignment device 103 and the alignment pin 405 to the third imaging device 501; wherein at least one third actuator 505 is configured to repeatedly move the third imaging device 501 back and forth from a first position for capturing an image of the first side of the alignment device 103 and the alignment pin 405 to a second position for capturing an image of the vertical side of the alignment device 103 and the alignment pin 405 through the second reflecting device 411. The third actuator 505 may be a pneumatic cylinder, an electric actuator, or an electric motor.

[0068] In another embodiment, one third imaging device 501 is configured to capture images of one side of the alignment device 103 and the alignment pin 405 , and another third imaging device 501 is configured to capture images of another perpendicular side of the alignment device 103 and the alignment pin 405 .

[0069] In one embodiment, the light emitting device 503 may be placed on the opposite side of the third imaging device 501 on which the third image is captured, thereby generating backlight to the alignment device 103 and the alignment pin 405 .

[0070] In another embodiment, the light emitting device 503 may also be configured to emit light toward a side of the third imaging device 501 that captures the third image.

[0071] The alignment device 401 for semiconductor device placement also includes at least one placement station configured to place the alignment device 103. It is important to note that the first visual inspection station 603, the second visual inspection station 605, the placement station and the placement station 707 can also be arranged linearly instead of in a straight line. Figure 7 The rotary arrangement shown here benefits from a linearly actuated pick and place arm.

[0072] Although the present invention is shown and described in what are considered to be its preferred embodiments herein, illustrating the results obtained by the present invention and the advantages over the prior art, the present invention is not limited to those specific embodiments. Therefore, the forms of the present invention shown and described herein are only illustrative, and other embodiments may be selected without departing from the scope of the present invention, as described in the appended claims.

Claims

1. An alignment device (401) for placing a semiconductor device, comprising: at least one pick and place arm (601) having at least one pick and place tip (105); at least one first visual inspection station (603) having at least one first imaging device (201); at least one any suitable data processing device; at least one second visual inspection station (605); at least one second imaging device (301) configured to be used when the pick and place tip (105) places at least one semiconductor device on at least one second semiconductor device carrier (703); It is characterized in that The pick and place tip (105) is configured to pick up or place at least one alignment device (103); wherein the first imaging device (201) is configured to capture at least one first image (207) of the alignment device (103) while the pick and place tip (105) is holding the alignment device (103); wherein the first image (207) depicts a side of the alignment device (103) opposite to a side held by the pick and place tip (105); The corrected XY position of the reference point of the second imaging device (301) is based on the XY position of the alignment device (103) relative to the reference point (205) of the first imaging device (201), the position of the top surface of at least one alignment pin (405), and the position of one side of the alignment device (103) held by the pick and place tip (105) relative to the alignment pin (405).

2. The alignment device (401) for semiconductor device placement according to claim 1, wherein: The second visual inspection station (605) comprises: at least one first actuator configured to move at least one alignment pin module (403) including the alignment pin (405) along an XY axis; at least one second actuator (409) configured to move the alignment pin module (403) including the alignment pin (405) along the Z axis; at least one second imaging device (301) configured to capture at least one second top view image of the alignment pin (405); at least one third imaging device (501) configured to capture at least two third perpendicular side views of the alignment device (103) and the alignment pin (405) when at least one light emitting device (503) illuminates the alignment device (103) and the alignment pin (405); At least one any suitable data processing device configured to determine the position of the alignment pin (405) by analyzing the second top view image, determine the position of at least two vertical sides of the alignment device (103) held by the pick and place tip (105) relative to the alignment pin (405) by analyzing the third vertical side view image, or a combination of both.

3. The alignment device (401) for semiconductor device placement according to claim 1, wherein: The first imaging device (201) captures the first image (207) through at least one first reflecting device (203).

4. The alignment device (401) for semiconductor device placement according to claim 2, wherein: When capturing another vertical side of the alignment device (103) and the alignment pin (405) through at least one second reflecting device (411), wherein the second reflecting device (411) is configured to reflect light from the vertical side of the alignment device (103) and the alignment pin (405) to a third imaging device (501), the third imaging device (501) is configured to capture at least one image of one side of the alignment device (103) and the alignment pin (405) through at least one third actuator (505); the third actuator (505) is configured to move the third imaging device (501) in a reciprocating manner from a first position for capturing an image of a first side of the alignment device (103) and the alignment pin (405) to a second position for capturing an image of the vertical side of the alignment device (103) and the alignment pin (405) through the second reflecting device (411).

5. The alignment device (401) for semiconductor device placement according to claim 2, wherein: One third imaging device (501) is configured to capture an image of one side of the alignment device (103) and the alignment pin (405), while another third imaging device (501) is configured to capture an image of another perpendicular side of the alignment device (103) and the alignment pin (405).

6. The alignment device (401) for semiconductor device placement according to claim 2, wherein: The light emitting device (503) is placed on the side opposite to the side where the third vertical side view image captured by the third imaging device (501) is located, forming background light for the alignment device (103) and the alignment pin (405).

7. The alignment device (401) for semiconductor device placement according to claim 2, wherein: The light emitting device (503) is configured to emit light toward the side where the third vertical side view image captured by the third imaging device (501) is located.

8. The alignment equipment (401) for semiconductor device placement according to claim 2, further comprising at least one placement station configured to place the alignment device (103).

9. The alignment apparatus (401) for semiconductor device placement according to claim 1, wherein the alignment device (103) is an electronic component, a dummy package or a fixture.

10. The alignment apparatus (401) for semiconductor device placement according to claim 2, wherein the first actuator and the second actuator (409) are pneumatic cylinders, electric actuators or electric motors.

11. The alignment apparatus (401) for semiconductor device placement according to claim 4, wherein the third actuator (505) is a pneumatic cylinder, an electric actuator or an electric motor.

12. The alignment apparatus (401) for semiconductor device placement according to claim 1, wherein the device carrier (107) is a wafer, a tray, a waffle pack, a tube, a bowl or any suitable input substrate capable of carrying semiconductor devices.

13. The alignment apparatus (401) for semiconductor device placement according to claim 1, wherein the second semiconductor device carrier (703) is a carrier tape, a tray, a waffle package, a substrate, a tape or a film.

14. The alignment apparatus (401) for semiconductor device placement according to claim 1, wherein the pick and place arm (601) is a rotary turntable, a rotary wheel or a linear motion actuator.

15. The alignment apparatus (401) for semiconductor device placement according to claim 1, wherein the first imaging device (201) is configured to directly capture the first image (207) without a reflection device.

Images