Stamping device for photovoltaic circuit board processing

Abstract

The utility model discloses a stamping device for photovoltaic circuit board processing, which comprises a mounting rack, the top of the mounting rack is provided with a bearing assembly, the bearing assembly comprises a blanking groove arranged at one end of the outer wall of the top of the mounting rack, and one end of the top of the blanking groove is rotatably connected with a bearing plate through a hinge. An extension frame is fixedly connected to one side of the outer wall of the top of the bearing plate, a supporting frame is fixedly connected to the outer wall of the top of the mounting frame, a hydraulic cylinder is fixedly mounted on the outer wall of the top of the supporting frame, a vertically-arranged telescopic rod is fixedly mounted at the output end of the hydraulic cylinder, and a spring is arranged in the telescopic rod; according to the utility model, through the arrangement of the bearing assembly, the bearing plate can be changed into an inclined state after processing is completed, so that a finished circuit board can automatically slide to the outside, and a worker only needs to continuously place raw materials.

Description

Technical Field

[0001] The utility model relates to the technical field of circuit board processing, in particular to a punching device for photovoltaic circuit board processing. Background Art

[0002] Photovoltaic circuit boards are also photovoltaic circuit boards, including PCB boards, aluminum substrates, ultra-thin circuit boards, ultra-thin circuit boards, etc. Circuit boards can make circuits miniaturized and intuitive, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layout. Conductive patterns made of printed circuits, printed components or a combination of the two on insulating materials according to predetermined designs are usually called printed circuits, and conductive patterns that provide electrical connections between components on insulating substrates are called printed circuits.

[0003] After searching, the utility model with Chinese patent announcement number CN214645275U discloses a stamping forming device for circuit board production and processing, which belongs to the field of circuit board production equipment, including a base, a stamping table is fixedly installed on the top surface of the base by screws, a mounting groove is opened on the top surface of the stamping table, a support frame is welded to the side wall of the top surface of the base, a servo electric cylinder is installed on the top surface of the support frame, and a sliding column is fixedly connected to the bottom end of the telescopic shaft of the servo electric cylinder.

[0004] When the device is put into use, after processing a circuit board, it needs to be removed before placing new materials. The operation is cumbersome and will affect production efficiency. There is room for improvement. Therefore, a stamping device for photovoltaic circuit board processing is proposed. Utility Model Content

[0005] The purpose of the utility model is to provide a punching device for processing photovoltaic circuit boards to solve the problems raised in the above-mentioned background technology.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a stamping device for processing photovoltaic circuit boards, comprising a mounting frame, characterized in that: a receiving assembly is installed on the top of the mounting frame, the receiving assembly comprises a blanking trough opened at one end of the top outer wall of the mounting frame, a receiving plate is rotatably connected to the top end of the blanking trough through a hinge, an extension frame is fixedly connected to one side of the top outer wall of the receiving plate, a support frame is fixedly connected to the top outer wall of the mounting frame, a hydraulic cylinder is fixedly installed on the top outer wall of the support frame, a vertically arranged telescopic rod is fixedly installed on the output end of the hydraulic cylinder, a spring is arranged inside the telescopic rod, and a hook plate is rotatably connected to the outer wall of one side of the telescopic rod through a hinge, and the hook plate can fit with the horizontal part of the extension frame.

[0007] After the processing is completed, the receiving plate can be turned into an inclined state, thereby ensuring that the finished circuit board automatically slides to the outside. The staff only needs to continue to place the raw materials. The telescopic rod is driven downward by the movable shaft of the hydraulic cylinder. When the hook plate contacts the extension frame, the hook plate will flip upward until it no longer contacts the extension frame and then returns to a horizontal state. When the hook plate is driven upward by the telescopic rod, it will not be able to flip. It can drive the receiving plate to flip through the extension frame, and the finished circuit board will also slide through the blanking chute along the slope of the receiving plate.

[0008] As a further preferred embodiment of the present technical solution, a stamping plate is fixedly mounted on the output end of the hydraulic cylinder, and the stamping plate is located at the top of the receiving plate.

[0009] As a further preferred embodiment of the present technical solution, a positioning assembly is installed on the top of the receiving plate, and the positioning assembly is located in the middle of the receiving plate.

[0010] As a further preferred embodiment of the present technical solution, the positioning assembly includes a mounting plate fixedly connected to the top outer wall of the receiving plate, and a limiting groove is formed at the beginning of the outer walls on both sides of the mounting plate, and the two limiting grooves are slidably connected to the same blocking frame, and the inner walls on both sides of the blocking frame are rotatably connected to the same bidirectional screw rod, and the threads at both ends of the bidirectional screw rod are threadedly connected to a baffle, and the two baffles are both fitted with the inner wall of the blocking frame, and a bolt is threadedly connected to the bottom of the outer wall on one side of the mounting plate, and the bolt can fit with the limiting groove.

[0011] The wheel is used to drive the bidirectional screw rod to rotate inside the blocking frame, and the two baffles fitted with the blocking frame will be driven by the bidirectional screw rod to slide toward each other, so that the two baffles are just in contact with the two sides of the circuit board. Then the blocking frame is pushed to slide in the limit groove, so that the circuit board fitted with it is just under the stamping plate. Then the bolt is turned to make it contact with the limit groove. Under the action of friction, the effect of fixing the blocking frame can be achieved. At this time, the blocking frame and the two baffles can form a fixed frame, and the staff only needs to place the circuit board to be processed in the formed space.

[0012] As a further preferred embodiment of the present technical solution, a plurality of buffer pads are provided on the top outer wall of the mounting frame, and the buffer pads are located directly below the receiving plate.

[0013] As a further preferred embodiment of the present technical solution, a collection box is slidably inserted into the inner wall at the top of the mounting frame, and the collection box is located directly below the material drop chute.

[0014] As a further preferred embodiment of the present technical solution, the hook plate cannot contact the outer wall of the vertical portion of the extension frame.

[0015] The utility model provides a punching device for processing photovoltaic circuit boards, which has the following beneficial effects:

[0016] (1) The utility model provides a receiving assembly so that the receiving plate can be turned into an inclined state after processing is completed, thereby ensuring that the finished circuit board automatically slides to the outside. The staff only needs to continue to place the raw materials. The telescopic rod is driven downward by the movable shaft of the hydraulic cylinder. When the hook plate contacts the extension frame, the hook plate will flip upward until it no longer contacts the extension frame and returns to a horizontal state. When the hook plate is driven upward by the telescopic rod, it will not be able to flip. It can drive the receiving plate to flip through the extension frame, and the finished circuit board will also slide through the blanking chute along the slope of the receiving plate.

[0017] (2) The utility model sets a positioning component and uses a wheel to drive the bidirectional screw to rotate inside the blocking frame. The two baffles that are in contact with the blocking frame will be driven by the bidirectional screw to slide towards each other, so that the two baffles are just in contact with the two sides of the circuit board. Then, the blocking frame is pushed to slide in the limit groove, so that the circuit board that is in contact with it is just under the stamping plate. Then, the bolt is turned to make it contact with the limit groove. Under the action of friction, the blocking frame can be fixed. At this time, the blocking frame and the two baffles can form a fixed frame. The staff only needs to place the circuit board to be processed in the formed space. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall first-view structure of the utility model;

[0019] Figure 2 It is a schematic diagram of the overall structure of the utility model from a second viewing angle;

[0020] Figure 3 For the utility model Figure 2 The enlarged structural diagram at A in the middle;

[0021] Figure 4 For the utility model Figure 2 The enlarged structural diagram at B in the middle;

[0022] In the figure: 1. mounting frame; 2. support frame; 3. hydraulic cylinder; 4. stamping plate; 5. collecting box; 6. buffer pad; 7. receiving assembly; 8. positioning assembly; 701. blanking chute; 702. receiving plate; 703. extension frame; 704. telescopic rod; 705. hook plate; 801. mounting plate; 802. limiting groove; 803. blocking frame; 804. baffle; 805. bidirectional screw rod; 806. bolt. DETAILED DESCRIPTION

[0023] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0024] The utility model provides a technical solution: Figure 1 As shown in Figure 4, in this embodiment, a stamping device for processing photovoltaic circuit boards includes a mounting frame 1, which is characterized in that: a receiving assembly 7 is installed on the top of the mounting frame 1, the receiving assembly 7 includes a blanking trough 701 opened at one end of the top outer wall of the mounting frame 1, a receiving plate 702 is rotatably connected to the top end of the blanking trough 701 through a hinge, an extension frame 703 is fixedly connected to one side of the top outer wall of the receiving plate 702, a support frame 2 is fixedly connected to the top outer wall of the mounting frame 1, a hydraulic cylinder 3 is fixedly installed on the top outer wall of the support frame 2, a vertically arranged telescopic rod 704 is fixedly installed on the output end of the hydraulic cylinder 3, a spring is arranged inside the telescopic rod 704 (the telescopic rod 704 can shrink and shorten when following the hydraulic cylinder 3 to move toward the mounting frame 1 to avoid affecting the normal progress of the stamping work), and a hook plate 705 is rotatably connected to the outer wall of one side of the telescopic rod 704 through a hinge, and the hook plate 705 can fit the horizontal part of the extension frame 703.

[0025] A stamping plate 4 is fixedly mounted on the output end of the hydraulic cylinder 3 , and the stamping plate 4 is located at the top of the receiving plate 702 .

[0026] The two-way screw rod 805 is driven by the wheel to rotate inside the blocking frame 803, and the two baffles 804 that are in contact with the blocking frame 803 will be driven by the two-way screw rod 805 to slide toward each other, so that the two baffles 804 are just in contact with the two sides of the circuit board, and then the blocking frame 803 is pushed to slide in the limiting groove 802, so that the circuit board that is in contact with it is just under the stamping plate 4, and then the bolt 806 is rotated to make it contact with the limiting groove 802. Under the action of friction, the effect of fixing the blocking frame 803 can be achieved. At this time, the blocking frame 803 and the two baffles 804 can form a fixed frame. The staff only needs to place the circuit board to be processed in the formed space, and then control the hydraulic cylinder 3 to make the stamping plate 4 move downward, and the stamping plate 4 can be squeezed toward the circuit board, and the processing can be completed at this time.

[0027] like Figure 2 and Figure 3 As shown, a positioning assembly 8 is installed on the top of the receiving plate 702 , and the positioning assembly 8 is located in the middle of the receiving plate 702 .

[0028] The positioning assembly 8 includes a mounting plate 801 fixedly connected to the top outer wall of the receiving plate 702, and a limiting groove 802 is formed on the outer walls on both sides of the mounting plate 801, and the two limiting grooves 802 are slidably connected to the same blocking frame 803, and the inner walls on both sides of the blocking frame 803 are rotatably connected to the same bidirectional screw rod 805, and the threads at both ends of the bidirectional screw rod 805 are threadedly connected to a baffle 804, and the two baffle plates 804 are both fitted with the inner wall of the blocking frame 803, and a bolt 806 is threadedly connected to the bottom of the outer wall on one side of the mounting plate 801, and the bolt 806 can fit with the limiting groove 802.

[0029] The telescopic rod 704 is driven downward by the movable shaft of the hydraulic cylinder 3. When the hook plate 705 contacts the extension frame 703, the hook plate 705 will flip upward until it no longer contacts the extension frame 703 and then returns to a horizontal state. When the hook plate 705 is driven upward by the telescopic rod 704, it will not be able to flip. It can drive the receiving plate 702 to flip through the extension frame 703, and the finished circuit board will also slide through the blanking trough 701 along the slope of the receiving plate 702.

[0030] like Figure 1 As shown in FIG. 2 , a plurality of buffer pads 6 are disposed on the top outer wall of the mounting frame 1 . The buffer pads 6 are located directly below the receiving plate 702 , so as to prevent the receiving plate 702 from colliding too violently when it falls back out of the restriction.

[0031] like Figure 1 As shown, a collection box 5 is slidably inserted into the inner wall of the top of the mounting frame 1. The collection box 5 is located directly below the blanking chute 701 and can collect the finished circuit boards in a centralized manner.

[0032] like Figure 4 As shown, the hook plate 705 cannot contact the outer wall of the vertical portion of the extension frame 703, so that the hook plate 705 will not be squeezed in a vertical state, ensuring that subsequent work can proceed normally.

[0033] The utility model provides a punching device for processing photovoltaic circuit boards, and the specific working principle is as follows:

[0034] When the device is working, the positioning component 8 is adjusted according to the specifications of the circuit board, and the wheel is used to drive the bidirectional screw rod 805 to rotate inside the blocking frame 803, and the two baffles 804 that are in contact with the blocking frame 803 will be driven by the bidirectional screw rod 805 to slide toward each other, so that the two baffles 804 are just in contact with the two sides of the circuit board, and then the blocking frame 803 is pushed to slide in the limiting groove 802, so that the circuit board that is in contact with it is just under the stamping plate 4, and then the bolt 806 is rotated to make it contact with the limiting groove 802. Under the action of friction, the effect of fixing the blocking frame 803 can be achieved. At this time, the blocking frame 803 and the two baffles 804 can form a fixed frame, and the working The operator only needs to place the circuit board to be processed in the formed space, and then control the hydraulic cylinder 3 to move the stamping plate 4 downward, and the stamping plate 4 can be pressed toward the circuit board. At this time, the processing can be completed, and the telescopic rod 704 is driven by the movable shaft of the hydraulic cylinder 3 to move downward. When the hook plate 705 contacts the extension frame 703, the hook plate 705 will flip upward until it no longer contacts the extension frame 703 and then returns to a horizontal state. When the hook plate 705 is driven upward by the telescopic rod 704, it will not be able to flip. It can drive the receiving plate 702 to flip through the extension frame 703, and the finished circuit board will also slide through the blanking trough 701 along the slope of the receiving plate 702.

[0035] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A punching device for processing photovoltaic circuit boards, comprising a mounting frame (1), characterized in that: A receiving assembly (7) is installed on the top of the mounting frame (1), and the receiving assembly (7) comprises a material drop trough (701) provided at one end of the top outer wall of the mounting frame (1); a receiving plate (702) is rotatably connected to the top end of the material drop trough (701) via a hinge; an extension frame (703) is fixedly connected to one side of the top outer wall of the receiving plate (702); a support frame (2) is fixedly connected to the top outer wall of the mounting frame (1); a hydraulic cylinder (3) is fixedly installed on the top outer wall of the support frame (2); a vertically arranged telescopic rod (704) is fixedly installed on the output end of the hydraulic cylinder (3); a spring is arranged inside the telescopic rod (704); a hook plate (705) is rotatably connected to the outer wall of one side of the telescopic rod (704) via a hinge; and the hook plate (705) can fit the horizontal part of the extension frame (703).

2. A punching device for processing photovoltaic circuit boards according to claim 1, characterized in that: A stamping plate (4) is fixedly mounted on the output end of the hydraulic cylinder (3), and the stamping plate (4) is located at the top of the receiving plate (702).

3. A punching device for processing photovoltaic circuit boards according to claim 1, characterized in that: A positioning assembly (8) is installed on the top of the receiving plate (702), and the positioning assembly (8) is located in the middle of the receiving plate (702).

4. A punching device for processing photovoltaic circuit boards according to claim 3, characterized in that: The positioning assembly (8) comprises a mounting plate (801) fixedly connected to the top outer wall of the receiving plate (702); both outer walls of the mounting plate (801) start with a limiting groove (802); the two limiting grooves (802) are slidably connected to the same blocking frame (803); the inner walls of both sides of the blocking frame (803) are rotatably connected to the same bidirectional screw rod (805); both ends of the bidirectional screw rod (805) are threadedly connected to a baffle plate (804); the two baffle plates (804) are both fitted with the inner wall of the blocking frame (803); a bolt (806) is threadedly connected to the bottom of the outer wall of one side of the mounting plate (801); the bolt (806) can fit with the limiting groove (802).

5. A punching device for processing photovoltaic circuit boards according to claim 1, characterized in that: A plurality of buffer pads (6) are provided on the top outer wall of the mounting frame (1), and the buffer pads (6) are located directly below the receiving plate (702).

6. A punching device for processing photovoltaic circuit boards according to claim 1, characterized in that: A collection box (5) is slidably plugged into the inner wall of the top of the mounting frame (1), and the collection box (5) is located directly below the material drop chute (701).

7. A punching device for processing photovoltaic circuit boards according to claim 1, characterized in that: The hook plate (705) cannot contact the outer wall of the vertical portion of the extension frame (703).

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