Multi-station electronic connector precision stamping die

Abstract

The utility model discloses a multi-station electronic connector precision stamping die which comprises a bottom plate, supporting rods are fixedly connected to the four sides of the top of the bottom plate, the positions, close to the tops, of the four supporting rods are sleeved with and slidably connected with a movable plate, an upper die base is fixedly installed at the bottom of the movable plate, and a lower die base is fixedly installed at the bottom of the upper die base. A reinforcing plate is fixedly connected to the center of the top of the bottom plate, a lower die base is arranged on the top of the reinforcing plate, and side edge plates are fixedly connected to the two sides of the lower die base. According to the multi-station electronic connector precision stamping die, the buffer mechanism composed of the buffer plate, the damping rod and the buffer spring is arranged at the bottom of the lower die base, impact force generated in the stamping process is effectively absorbed and dispersed, the overall stability of the die is greatly improved, the service life of the die is prolonged, and the production efficiency is improved. And the structural integrity of the die can be kept under the high-speed stamping condition, and damage caused by impact is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of stamping dies, in particular to a multi-station electronic connector precision stamping die. Background Art

[0002] Stamping dies are special process equipment used to process materials (metal or non-metal) into parts (or semi-finished products) during cold stamping. They are called cold stamping dies (commonly known as cold stamping dies). Stamping is a pressure processing method that uses a die installed on a press to apply pressure to the material at room temperature to separate or plastically deform it, thereby obtaining the desired parts.

[0003] The existing stamping dies often use a simple support structure in the design of the lower die seat and lack an effective buffer mechanism. During high-speed stamping, due to the large impact force, the lower die seat is easily subjected to a large impact, resulting in a decrease in the overall stability of the die and even damage to the die. In addition, the lack of a buffer mechanism may also reduce the accuracy of the stamped parts and fail to meet the manufacturing requirements of precision electronic connectors. Utility Model Content

[0004] The purpose of the utility model is to provide a multi-station electronic connector precision stamping die to solve the problem that the existing stamping dies mentioned in the above background technology often adopt a simple supporting structure in the design of the lower die seat, lack an effective buffer mechanism, and in the high-speed stamping process, due to the large impact force, the lower die seat is easily subjected to a large impact, resulting in a decrease in the overall stability of the die and even damage to the die. In addition, the lack of a buffer mechanism may also lead to a reduction in the accuracy of the stamped parts and fail to meet the manufacturing requirements of precision electronic connectors.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a multi-station electronic connector precision stamping die, comprising a base plate, four sides of the top of the base plate are fixedly connected with support rods, the four support rods are sleeved and slidably connected with a movable plate, the bottom of the movable plate is fixedly installed with an upper die seat, the center of the top of the base plate is fixedly connected with a reinforcing plate, the top of the reinforcing plate is provided with a lower die seat, both sides of the lower die seat are fixedly connected with side plates, five bottom grooves are opened at the bottom of the lower die seat, the top of the bottom groove is fixedly connected with a buffer plate, the bottom of the buffer plate is fixedly connected with a damping rod, the bottom of the damping rod is fixedly connected to the top of the reinforcing plate, the top of the reinforcing plate is fixedly connected with a fixed plate corresponding to the two damping rods, the top of the fixed plate is fixedly connected with a damping pad, the top of the damping pad is fixedly connected with a damping plate, the top of the damping plate is provided with a pressing plate, the top of the pressing plate is fixedly connected with a connecting block, and the top of the connecting block is fixedly connected to the bottom of the lower die seat.

[0006] Compared with the prior art, the beneficial effects of the utility model are:

[0007] The multi-station electronic connector precision stamping die effectively absorbs and disperses the impact force generated during the stamping process by arranging a buffer mechanism consisting of a buffer plate, a damping rod and a buffer spring at the bottom of the lower die base, greatly improving the overall stability of the die, which not only extends the service life of the die, but also ensures that the die can maintain its structural integrity under high-speed stamping conditions to avoid damage caused by impact. Due to the introduction of the buffer mechanism, the lower die base can maintain a more stable motion trajectory when impacted, reducing positioning errors caused by vibration, which helps to improve the accuracy of the stamped parts and make them more in line with the manufacturing requirements of precision electronic connectors. At the same time, the stable stamping process also helps to reduce deformation and surface damage of the stamped parts, thereby improving product quality. BRIEF DESCRIPTION OF THE DRAWINGS

[0008] Figure 1 It is a schematic diagram of the structure of the utility model;

[0009] Figure 2 For this utility model Figure 1 A is a partial enlarged schematic diagram;

[0010] Figure 3 This is a structural stereogram of the lower die base of the utility model;

[0011] Figure 4 This is a structural stereogram of the damping plate of the utility model;

[0012] Figure 5 It is a structural stereogram of the pressing plate of the utility model.

[0013] In the figure: 1, bottom plate; 2, support rod; 3, top plate; 4, movable plate; 5, cylinder; 6, upper die seat; 7, reinforcement plate; 8, lower die seat; 9, side plate; 10, sliding groove; 11, side end slide plate; 12, bottom groove; 13, limiting sliding groove; 14, limiting column; 15, buffer plate; 16, damping rod; 17, buffer spring; 18, fixed plate; 19, damping pad; 20, damping plate; 21, pressure plate; 22, connecting block. DETAILED DESCRIPTION

[0014] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0015] See also Figure 1-5The utility model provides a technical solution: a multi-station electronic connector precision stamping die, comprising a bottom plate 1, four sides of the top of the bottom plate 1 are fixedly connected with support rods 2, the four support rods 2 are sleeved and slidably connected with a movable plate 4 near the top, an upper die seat 6 is fixedly installed at the bottom of the movable plate 4, a reinforcing plate 7 is fixedly connected to the center of the top of the bottom plate 1, a lower die seat 8 is arranged on the top of the reinforcing plate 7, side plates 9 are fixedly connected to both sides of the lower die seat 8, and five bottom grooves 12 are opened at the bottom of the lower die seat 8, and the bottom grooves 12 are provided with a plurality of bottom grooves 12. A buffer plate 15 is fixedly connected to the top, a damping rod 16 is fixedly connected to the bottom of the buffer plate 15, the bottom of the damping rod 16 is fixedly connected to the top of the reinforcing plate 7, a fixing plate 18 is fixedly connected between the two damping rods 16 at the top of the reinforcing plate 7, a damping pad 19 is fixedly connected to the top of the fixing plate 18, a damping plate 20 is fixedly connected to the top of the damping pad 19, a pressing plate 21 is provided on the top of the damping plate 20, a connecting block 22 is fixedly connected to the top of the pressing plate 21, and the top of the connecting block 22 is fixedly connected to the bottom of the lower mold base 8.

[0016] The tops of the four support rods 2 are fixedly connected to a top plate 3 , the center of the top of the top plate 3 is fixedly connected to a cylinder 5 , and the output end of the bottom of the cylinder 5 passes through the outside of the top plate 3 and is fixedly connected to the movable plate 4 .

[0017] Side end slides 11 are fixedly connected to both sides of the top of the reinforcing plate 7, and a sliding groove 10 is opened in the center of the side plate 9. The top of the side end slide 11 passes through the interior of the sliding groove 10 and is slidably connected to the sliding groove 10, which enhances the stability of the lower die base 8 in the horizontal direction and prevents deviation or shaking during the stamping process, thereby improving the stamping accuracy and stability.

[0018] Limiting grooves 13 are provided at the four corners of the lower die base 8, and limiting columns 14 are fixedly connected to the four corners of the top of the reinforcing plate 7. The top of the limiting column 14 passes through the interior of the limiting groove 13 and is slidably connected to the limiting groove 13, which not only limits the horizontal movement range of the lower die base 8, but also plays a guiding role, ensuring that the movement trajectory of the lower die base 8 during the stamping process is accurate.

[0019] A buffer spring 17 is sleeved on the outer side of the damping rod 16. The top and bottom of the buffer spring 17 are fixedly connected to the buffer plate 15 and the reinforcing plate 7 respectively, which can absorb and buffer the impact force during the stamping process, reduce damage to the mold, and improve the durability of the mold.

[0020] Two arc-shaped grooves are provided on the top of the damping plate 20, which can disperse the impact force, reduce the direct impact on the damping plate 20, and extend its service life.

[0021] Two convex strips are arranged on both sides of the bottom of the pressing plate 21 .

[0022] Working principle: When the cylinder 5 starts working, its output end pushes the movable plate 4 to move downward. The movable plate 4 drives the upper die base 6 to descend together until the upper die base 6 contacts the workpiece in the lower die base 8. During the stamping process, as the upper die base 6 continues to press downward, the lower die base 8 and its related components begin to be subjected to force. At this time, the buffer plate 15 at the bottom of the lower die base 8 is subjected to pressure, and part of the impact force is transmitted to the reinforcing plate 7 through the damping rod 16. At the same time, the buffer spring 17 begins to deform, absorbing and buffering part of the impact force, effectively reducing the direct impact on the mold. The deformation of the buffer spring 17 not only reduces the impact force, but also helps the lower die base 8 to quickly reset after the stamping is completed through its elastic restoring force. In addition, the side end slide 11 slides in the sliding groove 10 to ensure the stability of the lower die base 8 in the horizontal direction and prevent it from offsetting or shaking. The cooperation between the limit column 14 and the limit slide groove 13 further limits the movement range of the lower die base 8 and plays a guiding role to ensure the stamping process. The accuracy of the process, when the damping plate 20 is impacted, the arc groove on the top thereof can disperse the impact force and reduce the direct impact on the damping plate 20. At the same time, the materials of the damping pad 19 and the damping plate 20 have good damping performance, which can further absorb the impact energy and reduce vibration and noise. When the cylinder 5 completes the stamping action and retracts, the movable plate 4 drives the upper die seat 6 to rise, and the lower die seat 8 is quickly reset under the restoring force of the buffer spring 17. At this time, the convex strip at the bottom of the pressing plate 21 is separated from the damping plate 20, ready for the next stamping.

[0023] To sum up: the multi-station electronic connector precision stamping die, by arranging a buffer mechanism consisting of a buffer plate 15, a damping rod 16 and a buffer spring 17 at the bottom of the lower die base 8, effectively absorbs and disperses the impact force generated during the stamping process, greatly improving the overall stability of the die, which not only extends the service life of the die, but also ensures that the die can maintain its structural integrity under high-speed stamping conditions to avoid damage caused by impact. Due to the introduction of the buffer mechanism, the lower die base 8 can maintain a more stable motion trajectory when impacted, reducing the positioning error caused by vibration, which helps to improve the accuracy of the stamped parts and make them more in line with the manufacturing requirements of precision electronic connectors. At the same time, the stable stamping process also helps to reduce the deformation and surface damage of the stamped parts, thereby improving product quality.

[0024] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0025] The electrical components mentioned in this article are all connected to an external main controller and 220V mains electricity, and the main controller can be a conventional known device for controlling a computer or the like.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A multi-station electronic connector precision stamping die, comprising a base plate (1), characterized in that: The four sides of the top of the bottom plate (1) are fixedly connected with support rods (2), and the four support rods (2) are sleeved and slidably connected with a movable plate (4), and the bottom of the movable plate (4) is fixedly installed with an upper mold base (6), and the center of the top of the bottom plate (1) is fixedly connected with a reinforcing plate (7), and the top of the reinforcing plate (7) is provided with a lower mold base (8), and the two sides of the lower mold base (8) are fixedly connected with side plates (9), and the bottom of the lower mold base (8) is provided with five bottom grooves (12), and the top of the bottom groove (12) is fixedly connected with a buffer plate (15), and the buffer plate (15) A damping rod (16) is fixedly connected to the bottom of the reinforcing plate (7), the bottom of the damping rod (16) is fixedly connected to the top of the reinforcing plate (7), a fixing plate (18) is fixedly connected between the top of the reinforcing plate (7) and the two damping rods (16), the top of the fixing plate (18) is fixedly connected to a damping pad (19), the top of the damping pad (19) is fixedly connected to a damping plate (20), a pressing plate (21) is provided on the top of the damping plate (20), the top of the pressing plate (21) is fixedly connected to a connecting block (22), and the top of the connecting block (22) is fixedly connected to the bottom of the lower die base (8).

2. A multi-station electronic connector precision stamping die according to claim 1, characterized in that: The tops of the four support rods (2) are fixedly connected to a top plate (3), the center of the top of the top plate (3) is fixedly connected to a cylinder (5), and the output end of the bottom of the cylinder (5) penetrates to the outside of the top plate (3) and is fixedly connected to the movable plate (4).

3. The multi-station electronic connector precision stamping die according to claim 1, characterized in that: Side end slides (11) are fixedly connected to both sides of the top of the reinforcing plate (7), a sliding groove (10) is opened in the center of the side plate (9), and the top of the side end slide (11) passes through the interior of the sliding groove (10) and is slidably connected to the sliding groove (10).

4. The multi-station electronic connector precision stamping die according to claim 1, characterized in that: The lower die seat (8) is provided with limiting slide grooves (13) at the four corners, and the top of the reinforcing plate (7) is fixedly connected to limiting columns (14) at the four corners. The top of the limiting column (14) penetrates into the interior of the limiting slide groove (13) and is slidably connected to the limiting slide groove (13).

5. The multi-station electronic connector precision stamping die according to claim 1, characterized in that: A buffer spring (17) is sleeved on the outer side of the damping rod (16), and the top and bottom of the buffer spring (17) are fixedly connected to the buffer plate (15) and the reinforcing plate (7) respectively.

6. The multi-station electronic connector precision stamping die according to claim 1, characterized in that: The top of the damping plate (20) is provided with two arc-shaped grooves.

7. The multi-station electronic connector precision stamping die according to claim 1, characterized in that: Two convex strips are arranged on both sides of the bottom of the pressing plate (21).

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