Solder paste coating device

Abstract

An embodiment of the utility model discloses a solder paste coating device which is characterized in that a first moving assembly is arranged on a mounting body, an alignment assembly and a fixing assembly are both arranged on the first moving assembly, the fixing assembly is used for fixing a product, and the first moving assembly is used for driving the alignment assembly and the fixing assembly to move along a first direction. The second moving assembly is arranged on the mounting body, the third moving assembly is arranged on the second moving assembly, the solder paste coating part is arranged on the third moving assembly, and the second moving assembly is used for driving the third moving assembly and the solder paste coating part to move in the second direction. The third moving assembly is used for driving the solder paste coating piece to move in the third direction so as to be close to or away from the product, and the first direction, the second direction and the third direction are not parallel in pairs and are not collinear. According to the solder paste coating device in the scheme, the efficiency is high when solder paste is coated.

Description

Technical Field

[0001] The utility model relates to the technical field of solder paste coating, in particular to a solder paste coating device. Background Art

[0002] In the medical field, solder paste needs to be applied on the grounding plate so that the grounding plate can be welded together with the wiring harness to achieve an anti-interference effect.

[0003] Currently, solder paste is generally applied manually, which is inefficient. Utility Model Content

[0004] The utility model aims to provide a solder paste coating device, aiming to solve the problem that the traditional solder paste coating device can only crimp one type of terminal and has a narrow application range.

[0005] To solve the above problems, the utility model provides a solder paste coating device, comprising a mounting body, a first moving component, an alignment component, a fixing component, a second moving component, a third moving component, a solder paste coating member and a control system, wherein the first moving component, the second moving component, the third moving component and the solder paste coating member are all electrically connected to the control system, the first moving component is arranged on the mounting body, the alignment component and the fixing component are both arranged on the first moving component, the fixing component is used to fix the product, the first moving component is used to drive the alignment component and the fixing component to move along a first direction, the second moving component is arranged on the mounting body, the third moving component is arranged on the second moving component, the solder paste coating member is arranged on the third moving component, the second moving component is used to drive the third moving component and the solder paste coating member to move along a second direction, the third moving component is used to drive the solder paste coating member to move along a third direction to approach or move away from the product, and the first direction, the second direction and the third direction are not parallel to each other and are not collinear;

[0006] The alignment component includes four optical fiber modules electrically connected to the control system, and the four optical fiber modules are divided into a first group and a second group. The two optical fiber modules of the first group are spaced apart and arranged opposite to each other, one of the optical fiber modules of the first group is a transmitting optical fiber, and the other optical fiber module of the first group is a receiving optical fiber, and the two optical fiber modules of the second group are spaced apart and arranged opposite to each other, one of the optical fiber modules of the second group is a transmitting optical fiber, and the other optical fiber module of the second group is a receiving optical fiber, and the straight line where the two optical fiber modules of the first group are located is arranged at an angle to the straight line where the two optical fiber modules of the second group are located.

[0007] In this solder paste coating device, when coating solder paste, the first moving component can drive the alignment component and the fixed component to approach the solder paste coating part, and then the solder paste coating part is aligned by the alignment component. After the alignment is completed, the solder paste coating part coats the solder paste on the product, which is highly efficient.

[0008] In some preferred embodiments of the solder paste coating device, the solder paste coating device also includes a connecting plate, the connecting plate includes a first connecting portion and a second connecting portion connected to each other, the first connecting portion is arranged on the first moving component, the fixed component is arranged on the first connecting portion, the first connecting portion extends along the second direction, the alignment component is arranged on the second connecting portion, and the second connecting portion extends along the first direction.

[0009] In this solder paste coating device, by providing the first connecting portion, the installation of the fixing component can be facilitated, and by providing the second connecting portion, the installation of the alignment component can be facilitated.

[0010] In some preferred embodiments of the solder paste coating device, the alignment component also includes a fixed block, which is a rectangular block, and the fixed block is arranged on the second connecting portion. Four fixing grooves are provided on a side of the fixed block away from the connecting plate, and the four fixing grooves are arranged in sequence along the circumference of the fixed block, and the four optical fiber modules are respectively and sequentially arranged in the four fixing grooves.

[0011] In this solder paste coating device, by providing a fixing block, the installation of four optical fiber modules can be facilitated.

[0012] In some preferred embodiments of the solder paste coating device, the four optical fiber modules each include a fixed seat, an optical fiber head, and an optical fiber line. The fixed seat is provided with a receiving groove, the optical fiber head is arranged in the receiving groove, one end of the optical fiber line is fixedly and electrically connected to the optical fiber head, and the other end of the optical fiber line is electrically connected to the control system.

[0013] In this solder paste coating device, the installation of the optical fiber head can be facilitated by providing a receiving groove.

[0014] In some preferred embodiments of the solder paste coating device, the alignment component also includes two fiber optic amplifiers, both of which are arranged on the second connecting portion, one of the fiber optic amplifiers is electrically connected to the two fiber optic modules of the first group, and the other fiber optic amplifier is electrically connected to the two fiber optic modules of the second group, and both of the fiber optic amplifiers are electrically connected to the control system.

[0015] In this solder paste coating device, by providing two optical fiber amplifiers, it is convenient to electrically connect the two optical fiber modules of the first group and the two optical fiber modules of the second group to the control system.

[0016] In some preferred embodiments of the solder paste coating device, the alignment component further includes a support member, the support member includes a first support portion, a second support portion, a third support portion, a fourth support portion and a fifth support portion, the first support portion is arranged on the second connecting portion, the second support portion and the third support portion are respectively vertically connected to opposite sides of the first support portion, the second support portion and the third support portion are spaced apart along the second direction, the fourth support portion is vertically connected to an end of the second support portion away from the first support portion, the first support portion and the fourth support portion are respectively located at opposite sides of the second support portion, the fifth support portion is vertically connected to an end of the third support portion away from the first support portion, and the first support portion and the fifth support portion are respectively located at opposite sides of the third support portion;

[0017] A groove is provided on one side of the two optical fiber amplifiers close to the supporting member, and the fourth supporting portion and the fifth supporting portion are in contact with the bottoms of the two grooves.

[0018] In this solder paste coating device, by providing a support member, two optical fiber amplifiers can be easily supported.

[0019] In some preferred embodiments of the solder paste coating device, the straight line where the two optical fiber modules of the first group are located is perpendicular to the straight line where the two optical fiber modules of the second group are located.

[0020] In this solder paste coating device, the straight line where the two optical fiber modules of the first group are located is perpendicular to the straight line where the two optical fiber modules of the second group are located, so that the four optical fiber modules are evenly arranged.

[0021] In some preferred embodiments of the solder paste coating device, the fixing assembly includes a first fixing member and a second fixing member, the first fixing member is arranged on the first connecting part, the first fixing member is provided with a plurality of first protrusions matching the plurality of connecting through holes on the product, the first fixing member is also provided with a plurality of second protrusions, the second fixing member is provided with a plurality of first through holes matching the plurality of second protrusions, the product is clamped between the first fixing member and the second fixing member, the second fixing member is also provided with two second through holes extending along the second direction, and the two second through holes are spaced apart along the first direction.

[0022] In the solder paste coating device, by providing the first fixing member and the second fixing member, it is convenient to clamp the product between the first fixing member and the second fixing member.

[0023] In some preferred embodiments of the solder paste coating device, the solder paste coating device also includes a mounting member, the mounting member includes a first mounting portion, a second mounting portion and a third mounting portion, the first mounting portion is arranged on the third movable component, and the first mounting portion extends along the third direction, the second mounting portion and the third mounting portion are respectively vertically connected to the two ends of the first mounting portion, the second mounting portion is provided with a first mounting hole and a second mounting hole that are interconnected, the third mounting portion is provided with a third mounting hole and a fourth mounting hole that are interconnected, the aperture of the first mounting hole is larger than the aperture of the third mounting hole, the solder paste coating member sequentially passes through the first mounting hole and the third mounting hole, and fasteners are provided in the second mounting hole and the fourth mounting hole.

[0024] In this solder paste coating device, the first mounting hole and the third mounting hole facilitate installation of the solder paste coating member, and the second mounting hole and the fourth mounting hole facilitate installation of fasteners respectively, thereby fixing the solder paste coating member on the mounting member.

[0025] In some preferred embodiments of the solder paste coating device, the mounting body includes a first body and two second bodies, the two second bodies are respectively vertically connected to both sides of one end of the first body, the first movable component is arranged on the first body, and the two ends of the second movable component are respectively connected to the two second bodies.

[0026] In this solder paste coating device, the first moving component is easily installed by providing a first body, and the second moving component is easily installed by providing two second bodies.

[0027] In some preferred embodiments of the solder paste coating device, the first direction, the second direction and the third direction are perpendicular to each other.

[0028] In the solder paste coating device, the first direction, the second direction and the third direction are perpendicular to each other, so that the solder paste coating device has a compact structure.

[0029] Implementing the embodiments of the present utility model will have the following beneficial effects:

[0030] The above-mentioned solder paste coating device is adopted, wherein the first moving component, the second moving component, the third moving component and the solder paste coating part are all electrically connected to the control system, the first moving component is arranged on the mounting body, the alignment component and the fixed component are both arranged on the first moving component, the fixed component is used to fix the product, the first moving component is used to drive the alignment component and the fixed component to move along the first direction, the second moving component is arranged on the mounting body, the third moving component is arranged on the second moving component, the solder paste coating part is arranged on the third moving component, the second moving component is used to drive the third moving component and the solder paste coating part to move along the second direction, and the third moving component is used to drive the solder paste coating part to move along the third direction to approach or move away from the product, and the first direction, the second direction and the third direction are not parallel to each other and are not collinear. In the solder paste coating device of this scheme, when coating solder paste, the first moving component can drive the alignment component and the fixed component to approach the solder paste coating part, and then the solder paste coating part is aligned through the alignment component. After the alignment is completed, the solder paste coating part will apply solder paste on the product, which is highly efficient.

[0031] At present, solder paste is generally applied manually, which is inefficient. In the solder paste application device of this solution, when applying solder paste, the first moving component can drive the alignment component and the fixed component to approach the solder paste application part, and then the solder paste application part is aligned by the alignment component. After the alignment is completed, the solder paste application part applies the solder paste on the product, which is more efficient. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0033] in:

[0034] Figure 1 It is a schematic diagram of the three-dimensional structure of the solder paste coating device according to an embodiment of the utility model.

[0035] Figure 2 For Figure 1 An enlarged exploded view of the solder paste application device is shown.

[0036] Figure 3 For Figure 2 An enlarged view of the alignment components of the solder paste coating device is shown.

[0037] Figure 4 For Figure 2 An enlarged exploded view of the alignment components of the solder paste coating device is shown.

[0038] Figure 5 For Figure 4 An enlarged view of the optical fiber module of the alignment assembly of the solder paste coating device is shown.

[0039] Figure 6 For Figure 4 An enlarged view of the support member of the alignment component of the solder paste coating device is shown.

[0040] Figure 7 For Figure 2 An enlarged view of the connection board of the solder paste application device is shown.

[0041] Figure 8 For Figure 2 An enlarged exploded view of the fixing components of the solder paste application device is shown.

[0042] Fig. 9 It is a schematic diagram of the three-dimensional structure of the product of the embodiment of the utility model.

[0043] Fig.10 For Figure 2 An enlarged view of the mounting components of the solder paste application device is shown.

[0044] Reference numerals:

[0045] 1000. Solder paste coating device;

[0046] 10. Installing body; 11. First body; 13. Second body;

[0047] 20. A first moving component;

[0048] 30. Alignment assembly; 31. Optical fiber module; 311. Fixing seat; 3111. Accommodating groove; 313. Optical fiber head; 315. Optical fiber line; 32. Fixing block; 321. Fixing groove; 33. Optical fiber amplifier; 331. Groove; 34. Support member; 341. First supporting part; 342. Second supporting part; 343. Third supporting part; 344. Fourth supporting part; 345. Fifth supporting part;

[0049] 40, fixing assembly; 41, first fixing member; 411, first protrusion; 413, second protrusion; 43, second fixing member; 431, first through hole; 433, second through hole;

[0050] 50. A second mobile assembly;

[0051] 60. The third mobile component;

[0052] 70. Solder paste coated parts;

[0053] 80. connecting plate; 81. first connecting portion; 83. second connecting portion;

[0054] 90, mounting member; 91, first mounting portion; 93, second mounting portion; 931, first mounting hole; 933, second mounting hole; 95, third mounting portion; 951, third mounting hole; 953, fourth mounting hole;

[0055] 2000, product; 2100, connecting through hole. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0057] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relative position relationship, movement status, etc. between the various parts under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0058] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the said features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0059] In the medical field, solder paste needs to be applied on the grounding plate so that the grounding plate can be welded with the wiring harness to achieve the effect of anti-interference. Currently, solder paste is generally applied manually, which is inefficient.

[0060] To solve the above problems, Figure 1 , Figure 2 , Figure 3 and Figure 4 As shown, Figure 1 It is a schematic diagram of the three-dimensional structure of the solder paste coating device according to an embodiment of the utility model. Figure 2 For Figure 1 An enlarged exploded view of the solder paste application device is shown. Figure 3 For Figure 2 An enlarged view of the alignment components of the solder paste coating device is shown. Figure 4 For Figure 2 The enlarged exploded view of the alignment component of the solder paste coating device is shown. The embodiment of the utility model provides a solder paste coating device 1000, including a mounting body 10, a first moving component 20, an alignment component 30, a fixing component 40, a second moving component 50, a third moving component 60, a solder paste coating member 70 and a control system. The first moving component 20, the second moving component 50, the third moving component 60 and the solder paste coating member 70 are all electrically connected to the control system. The first moving component 20 is arranged on the mounting body 10, the alignment component 30 and the fixing component 40 are both arranged on the first moving component 20, and the fixing component 40 is used to fix the product 2000. The first moving component 20 is used to drive the alignment component 30 and the fixing component 40 to move along the first direction, the second moving component 50 is arranged on the mounting body 10, the third moving component 60 is arranged on the second moving component 50, and the solder paste coating component 70 is arranged on the third moving component 60. The second moving component 50 is used to drive the third moving component 60 and the solder paste coating component 70 to move along the second direction, and the third moving component 60 is used to drive the solder paste coating component 70 to move along the third direction to approach or move away from the product 2000. The first direction, the second direction and the third direction are not parallel and not colinear.

[0061] The alignment component 30 includes four optical fiber modules 31 electrically connected to the control system, and the four optical fiber modules 31 are divided into a first group and a second group. The two optical fiber modules 31 of the first group are spaced apart and arranged opposite to each other, one optical fiber module 31 of the first group is a transmitting optical fiber, and another optical fiber module 31 of the first group is a receiving optical fiber, and the two optical fiber modules 31 of the second group are spaced apart and arranged opposite to each other, one optical fiber module 31 of the second group is a transmitting optical fiber, and another optical fiber module 31 of the second group is a receiving optical fiber, and the straight line where the two optical fiber modules 31 of the first group are located is arranged at an angle to the straight line where the two optical fiber modules 31 of the second group are located.

[0062] The above-mentioned solder paste coating device 1000 is adopted, wherein the first movable component 20, the second movable component 50, the third movable component 60 and the solder paste coating member 70 are all electrically connected to the control system, the first movable component 20 is arranged on the installation body 10, the alignment component 30 and the fixing component 40 are both arranged on the first movable component 20, the fixing component 40 is used to fix the product 2000, the first movable component 20 is used to drive the alignment component 30 and the fixing component 40 to move along the first direction, the second movable component 50 is arranged on the installation body 10, the third movable component 60 is arranged on the second movable component 50, the solder paste coating member 70 is arranged on the third movable component 60, the second movable component 50 is used to drive the third movable component 60 and the solder paste coating member 70 to move along the second direction, the third movable component 60 is used to drive the solder paste coating member 70 to move along the third direction to approach or move away from the product 2000, and the first direction, the second direction and the third direction are not parallel to each other and are not colinear. In the solder paste coating device 1000 of the present scheme, when coating solder paste, the first moving component 20 can drive the alignment component 30 and the fixed component 40 to approach the solder paste coating component 70, and then the solder paste coating component 70 is aligned through the alignment component 30. After the alignment is completed, the solder paste coating component 70 coats the solder paste on the product 2000, which is highly efficient.

[0063] At present, solder paste is generally applied manually, which is inefficient. In the solder paste application device of this solution, when applying solder paste, the first moving component can drive the alignment component and the fixed component to approach the solder paste application part, and then the solder paste application part is aligned by the alignment component. After the alignment is completed, the solder paste application part applies the solder paste on the product, which is more efficient.

[0064] In some preferred embodiments of the solder paste coating device 1000, the solder paste coating device 1000 also includes a connecting plate 80, the connecting plate 80 includes a first connecting portion 81 and a second connecting portion 83 connected to each other, the first connecting portion 81 is arranged on the first moving component 20, the fixing component 40 is arranged on the first connecting portion 81, the first connecting portion 81 extends along the second direction, the alignment component 30 is arranged on the second connecting portion 83, and the second connecting portion 83 extends along the first direction.

[0065] Specifically, the solder paste coating device 1000 further includes a connecting plate 80, and the connecting plate 80 includes a first connecting portion 81 and a second connecting portion 83 connected to each other, the first connecting portion 81 is arranged on the first moving component 20, the fixing component 40 is arranged on the first connecting portion 81, the first connecting portion 81 extends along the second direction, and the alignment component 30 is arranged on the second connecting portion 83, and the second connecting portion 83 extends along the first direction. By providing the first connecting portion 81, the installation of the fixing component 40 can be facilitated, and by providing the second connecting portion 83, the installation of the alignment component 30 can be facilitated.

[0066] In some preferred embodiments of the solder paste coating device 1000, the alignment component 30 also includes a fixed block 32, which is a rectangular block. The fixed block 32 is arranged on the second connecting portion 83, and four fixed grooves 321 are provided on a side of the fixed block 32 away from the connecting plate 80. The four fixed grooves 321 are arranged in sequence along the circumference of the fixed block 32, and the four optical fiber modules 31 are respectively and sequentially arranged in the four fixed grooves 321.

[0067] Specifically, the alignment assembly 30 further includes a fixing block 32, which is a rectangular block and is disposed on the second connection portion 83. A side of the fixing block 32 away from the connection plate 80 is provided with four fixing grooves 321, which are sequentially arranged along the circumference of the fixing block 32, and the four optical fiber modules 31 are respectively and sequentially arranged in the four fixing grooves 321. By providing the fixing block 32, the installation of the four optical fiber modules 31 can be facilitated.

[0068] In some preferred embodiments of the solder paste coating device 1000, Figure 5 As shown, the four optical fiber modules 31 each include a fixed seat 311, an optical fiber head 313 and an optical fiber line 315. The fixed seat 311 is provided with a receiving groove 3111, the optical fiber head 313 is arranged in the receiving groove 3111, one end of the optical fiber line 315 is fixedly connected and electrically connected to the optical fiber head 313, and the other end of the optical fiber line 315 is electrically connected to the control system.

[0069] Specifically, the four optical fiber modules 31 each include a fixing seat 311, an optical fiber head 313, and an optical fiber line 315. The fixing seat 311 is provided with a receiving groove 3111, the optical fiber head 313 is arranged in the receiving groove 3111, one end of the optical fiber line 315 is fixedly connected and electrically connected to the optical fiber head 313, and the other end of the optical fiber line 315 is electrically connected to the control system. By providing the receiving groove 3111, the installation of the optical fiber head 313 can be facilitated.

[0070] In some preferred embodiments of the solder paste coating device 1000, the alignment component 30 also includes two optical fiber amplifiers 33, both of which are arranged on the second connecting portion 83, one optical fiber amplifier 33 is electrically connected to the two optical fiber modules 31 of the first group, and the other optical fiber amplifier 33 is electrically connected to the two optical fiber modules 31 of the second group, and both of the optical fiber amplifiers 33 are electrically connected to the control system.

[0071] Specifically, the alignment component 30 further includes two optical fiber amplifiers 33, both of which are arranged on the second connecting portion 83, one optical fiber amplifier 33 is electrically connected to the two optical fiber modules 31 of the first group, and the other optical fiber amplifier 33 is electrically connected to the two optical fiber modules 31 of the second group, and both optical fiber amplifiers 33 are electrically connected to the control system. By providing two optical fiber amplifiers 33, it is convenient to electrically connect the two optical fiber modules 31 of the first group and the two optical fiber modules 31 of the second group to the control system.

[0072] In some preferred embodiments of the solder paste coating device 1000, Figure 6 As shown, the alignment component 30 also includes a support member 34, which includes a first support portion 341, a second support portion 342, a third support portion 343, a fourth support portion 344 and a fifth support portion 345. The first support portion 341 is arranged on the second connecting portion 83, the second support portion 342 and the third support portion 343 are respectively vertically connected to the opposite sides of the first support portion 341, the second support portion 342 and the third support portion 343 are spaced apart along the second direction, the fourth support portion 344 is vertically connected to one end of the second support portion 342 away from the first support portion 341, the first support portion 341 and the fourth support portion 344 are respectively located on the opposite sides of the second support portion 342, the fifth support portion 345 is vertically connected to one end of the third support portion 343 away from the first support portion 341, and the first support portion 341 and the fifth support portion 345 are respectively located on the opposite sides of the third support portion 343.

[0073] A groove 331 is formed on one side of the two optical fiber amplifiers 33 close to the supporting member 34 , and the fourth supporting portion 344 and the fifth supporting portion 345 are in contact with the bottoms of the two grooves 331 .

[0074] Specifically, the alignment component 30 also includes a support member 34, which includes a first support portion 341, a second support portion 342, a third support portion 343, a fourth support portion 344 and a fifth support portion 345. The first support portion 341 is arranged on the second connecting portion 83, the second support portion 342 and the third support portion 343 are respectively vertically connected to the opposite sides of the first support portion 341, the second support portion 342 and the third support portion 343 are spaced apart along the second direction, the fourth support portion 344 is vertically connected to one end of the second support portion 342 away from the first support portion 341, the first support portion 341 and the fourth support portion 344 are respectively located on the opposite sides of the second support portion 342, the fifth support portion 345 is vertically connected to one end of the third support portion 343 away from the first support portion 341, and the first support portion 341 and the fifth support portion 345 are respectively located on the opposite sides of the third support portion 343. The two fiber amplifiers 33 are provided with grooves 331 on one side close to the support member 34, and the fourth support portion 344 and the fifth support portion 345 are in contact with the bottoms of the two grooves 331. By providing the support member 34, the two fiber amplifiers 33 can be supported conveniently.

[0075] In some preferred embodiments of the solder paste coating device 1000 , the straight line where the two optical fiber modules 31 of the first group are located is perpendicular to the straight line where the two optical fiber modules 31 of the second group are located.

[0076] Specifically, the straight line where the two optical fiber modules 31 of the first group are located is perpendicular to the straight line where the two optical fiber modules 31 of the second group are located, so that the four optical fiber modules 31 are evenly arranged.

[0077] When the solder paste coating member 70 is located at the intersection of the straight line where the two optical fiber modules 31 of the first group are located and the straight line where the two optical fiber modules 31 of the second group are located, the solder paste coating member 70 is aligned and the subsequent solder paste coating action can be performed.

[0078] In some preferred embodiments of the solder paste coating device 1000, Figure 7 , Figure 8 and Fig. 9 As shown, the fixing assembly 40 includes a first fixing member 41 and a second fixing member 43. The first fixing member 41 is arranged on the first connecting portion 81. The first fixing member 41 is provided with a plurality of first protrusions 411 matching the plurality of connecting through holes 2100 on the product 2000. The first fixing member 41 is also provided with a plurality of second protrusions 413. The second fixing member 43 is provided with a plurality of first through holes 431 matching the plurality of second protrusions 413. The product 2000 is clamped between the first fixing member 41 and the second fixing member 43. The second fixing member 43 is also provided with two second through holes 433 extending along the second direction. The two second through holes 433 are spaced apart along the first direction.

[0079] Specifically, the fixing assembly 40 includes a first fixing member 41 and a second fixing member 43. The first fixing member 41 is arranged on the first connecting portion 81. The first fixing member 41 is provided with a plurality of first protrusions 411 matching the plurality of connecting through holes 2100 on the product 2000. The first fixing member 41 is also provided with a plurality of second protrusions 413. The second fixing member 43 is provided with a plurality of first through holes 431 matching the plurality of second protrusions 413. The product 2000 is sandwiched between the first fixing member 41 and the second fixing member 43. The second fixing member 43 is also provided with two second through holes 433 extending along the second direction. The two second through holes 433 are spaced apart along the first direction. By providing the first fixing member 41 and the second fixing member 43, it is convenient to sandwich the product 2000 between the first fixing member 41 and the second fixing member 43.

[0080] In some preferred embodiments of the solder paste coating device 1000, Fig.10 As shown, the solder paste coating device 1000 also includes a mounting member 90, and the mounting member 90 includes a first mounting portion 91, a second mounting portion 93 and a third mounting portion 95. The first mounting portion 91 is arranged on the third movable component 60, and the first mounting portion 91 extends along the third direction. The second mounting portion 93 and the third mounting portion 95 are respectively vertically connected to the two ends of the first mounting portion 91, and the second mounting portion 93 is provided with a first mounting hole 931 and a second mounting hole 933 that are interconnected. The third mounting portion 95 is provided with a third mounting hole 951 and a fourth mounting hole 953 that are interconnected. The aperture of the first mounting hole 931 is larger than the aperture of the third mounting hole 951. The solder paste coating member 70 passes through the first mounting hole 931 and the third mounting hole 951 in sequence, and fasteners are provided in the second mounting hole 933 and the fourth mounting hole 953.

[0081] Specifically, the solder paste coating device 1000 also includes a mounting member 90, which includes a first mounting portion 91, a second mounting portion 93 and a third mounting portion 95. The first mounting portion 91 is arranged on the third movable component 60, and the first mounting portion 91 extends along the third direction. The second mounting portion 93 and the third mounting portion 95 are respectively vertically connected to the two ends of the first mounting portion 91. The second mounting portion 93 is provided with a first mounting hole 931 and a second mounting hole 933 that are interconnected. The third mounting portion 95 is provided with a third mounting hole 951 and a fourth mounting hole 953 that are interconnected. The aperture of the first mounting hole 931 is larger than the aperture of the third mounting hole 951. The solder paste coating member 70 passes through the first mounting hole 931 and the third mounting hole 951 in sequence, and fasteners are provided in the second mounting hole 933 and the fourth mounting hole 953. The first mounting hole 931 and the third mounting hole 951 facilitate installation of the solder paste coating member 70 , and the second mounting hole 933 and the fourth mounting hole 953 facilitate installation of fasteners respectively, thereby fixing the solder paste coating member 70 on the mounting member 90 .

[0082] In some preferred embodiments of the solder paste coating device 1000, the mounting body 10 includes a first body 11 and two second bodies 13, the two second bodies 13 are respectively vertically connected to the two sides of one end of the first body 11, the first movable component 20 is arranged on the first body 11, and the two ends of the second movable component 50 are respectively connected to the two second bodies 13.

[0083] Specifically, the installation body 10 includes a first body 11 and two second bodies 13, the two second bodies 13 are respectively vertically connected to both sides of one end of the first body 11, the first moving assembly 20 is arranged on the first body 11, and the two ends of the second moving assembly 50 are respectively connected to the two second bodies 13. By setting the first body 11, it is convenient to install the first moving assembly 20, and by setting the two second bodies 13, it is convenient to install the second moving assembly 50.

[0084] In some preferred embodiments of the solder paste coating device 1000 , the first direction, the second direction, and the third direction are perpendicular to each other.

[0085] Specifically, the first direction, the second direction and the third direction are perpendicular to each other, so that the solder paste coating device 1000 has a compact structure.

[0086] In some preferred embodiments of the solder paste coating device 1000 , the first direction is the length direction of the first body 11 , the second direction is the width direction of the first body 11 , and the third direction is the height direction of the first body 11 .

[0087] The above disclosure is only a preferred embodiment of the present invention, and certainly cannot be used to limit the scope of rights of the present invention. Therefore, equivalent changes made according to the claims of the present invention are still within the scope covered by the present invention.

Claims

1. A solder paste coating device, characterized in that: The invention comprises a mounting body, a first moving component, an alignment component, a fixing component, a second moving component, a third moving component, a solder paste coating member and a control system, wherein the first moving component, the second moving component, the third moving component and the solder paste coating member are all electrically connected to the control system, the first moving component is arranged on the mounting body, the alignment component and the fixing component are both arranged on the first moving component, the fixing component is used to fix the product, the first moving component is used to drive the alignment component and the fixing component to move along a first direction, the second moving component is arranged on the mounting body, the third moving component is arranged on the second moving component, the solder paste coating member is arranged on the third moving component, the second moving component is used to drive the third moving component and the solder paste coating member to move along a second direction, the third moving component is used to drive the solder paste coating member to move along a third direction to approach or move away from the product, and the first direction, the second direction and the third direction are not parallel to each other and are not collinear; The alignment component includes four optical fiber modules electrically connected to the control system, and the four optical fiber modules are divided into a first group and a second group. The two optical fiber modules of the first group are spaced apart and arranged opposite to each other, one of the optical fiber modules of the first group is a transmitting optical fiber, and the other optical fiber module of the first group is a receiving optical fiber, and the two optical fiber modules of the second group are spaced apart and arranged opposite to each other, one of the optical fiber modules of the second group is a transmitting optical fiber, and the other optical fiber module of the second group is a receiving optical fiber, and the straight line where the two optical fiber modules of the first group are located is arranged at an angle to the straight line where the two optical fiber modules of the second group are located.

2. The solder paste coating device according to claim 1, characterized in that: The solder paste coating device also includes a connecting plate, which includes a first connecting portion and a second connecting portion connected to each other, the first connecting portion is arranged on the first moving component, the fixed component is arranged on the first connecting portion, the first connecting portion extends along the second direction, and the alignment component is arranged on the second connecting portion, and the second connecting portion extends along the first direction.

3. The solder paste coating device according to claim 2, characterized in that: The alignment component also includes a fixed block, which is a rectangular block. The fixed block is arranged on the second connecting portion. Four fixed grooves are provided on a side of the fixed block away from the connecting plate. The four fixed grooves are arranged in sequence along the circumference of the fixed block, and the four optical fiber modules are respectively and sequentially arranged in the four fixed grooves.

4. The solder paste coating device according to claim 3, characterized in that: The four optical fiber modules each include a fixed seat, an optical fiber head and an optical fiber line. The fixed seat is provided with a receiving groove, the optical fiber head is arranged in the receiving groove, one end of the optical fiber line is fixedly and electrically connected to the optical fiber head, and the other end of the optical fiber line is electrically connected to the control system.

5. The solder paste coating device according to claim 4, characterized in that: The alignment component also includes two fiber optic amplifiers, both of which are arranged on the second connecting portion, one of which is electrically connected to the two fiber optic modules of the first group, and the other of which is electrically connected to the two fiber optic modules of the second group, and both of which are electrically connected to the control system.

6. The solder paste coating device according to claim 5, characterized in that: The alignment assembly also includes a support member, which includes a first support portion, a second support portion, a third support portion, a fourth support portion and a fifth support portion, wherein the first support portion is arranged on the second connecting portion, the second support portion and the third support portion are respectively vertically connected to opposite sides of the first support portion, the second support portion and the third support portion are spaced apart along the second direction, the fourth support portion is vertically connected to an end of the second support portion away from the first support portion, the first support portion and the fourth support portion are respectively located at opposite sides of the second support portion, the fifth support portion is vertically connected to an end of the third support portion away from the first support portion, and the first support portion and the fifth support portion are respectively located at opposite sides of the third support portion; A groove is provided on one side of the two optical fiber amplifiers close to the supporting member, and the fourth supporting portion and the fifth supporting portion are in contact with the bottoms of the two grooves.

7. The solder paste coating device according to claim 1, characterized in that: The straight line where the two optical fiber modules of the first group are located is perpendicular to the straight line where the two optical fiber modules of the second group are located.

8. The solder paste coating device according to any one of claims 2 to 6, characterized in that: The fixing assembly includes a first fixing member and a second fixing member, the first fixing member is arranged on the first connecting portion, the first fixing member is provided with a plurality of first protrusions matching the plurality of connecting through holes on the product, the first fixing member is also provided with a plurality of second protrusions, the second fixing member is provided with a plurality of first through holes matching the plurality of second protrusions, the product is clamped between the first fixing member and the second fixing member, the second fixing member is also provided with two second through holes extending along the second direction, and the two second through holes are spaced apart along the first direction.

9. The solder paste coating device according to claim 8, characterized in that: The solder paste coating device also includes a mounting member, which includes a first mounting portion, a second mounting portion and a third mounting portion. The first mounting portion is arranged on the third movable component, and the first mounting portion extends along the third direction. The second mounting portion and the third mounting portion are respectively vertically connected to two ends of the first mounting portion. The second mounting portion is provided with a first mounting hole and a second mounting hole that are interconnected. The third mounting portion is provided with a third mounting hole and a fourth mounting hole that are interconnected. The aperture of the first mounting hole is larger than the aperture of the third mounting hole. The solder paste coating member passes through the first mounting hole and the third mounting hole in sequence. Fasteners are provided in the second mounting hole and the fourth mounting hole.

10. The solder paste coating device according to claim 9, characterized in that: The mounting body comprises a first body and two second bodies, the two second bodies are respectively vertically connected to both sides of one end of the first body, the first moving assembly is arranged on the first body, and the two ends of the second moving assembly are respectively connected to the two second bodies; The first direction, the second direction and the third direction are perpendicular to each other.

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