Test system

Abstract

The utility model discloses a test system. The testing system comprises a testing device and a plurality of conveying devices, the testing device comprises a supporting platform and a testing assembly, and the supporting platform is provided with a through hole extending in the first direction. The conveying device comprises a first moving assembly and a bearing part, the bearing part is used for bearing chips, the first moving assembly is connected with the bearing part, the first moving assembly can drive the bearing part to move in the first direction and the second direction, and the second direction is perpendicular to the first direction. The chip is fed to the bearing part, the bearing part moves to correspond to the through hole in the second direction and enters the through hole in the first direction to reach the test station, and then the bearing part can be matched with the test device to test the chip. After the test is completed, the bearing piece leaves the through hole in the first direction, and the test device does not need to avoid for feeding and discharging. And the bearing pieces of the plurality of conveying devices can alternately enter the through holes for chip detection, so that the testing process is compact, and the testing efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of chip testing, in particular to a testing system. Background Art

[0002] Chip testing is an essential process in chip preparation. In the chip testing system of the related art, the chip needs to be loaded to the test position, and after the test is completed, it needs to be picked up from the test position for unloading. The loading and unloading steps interfere with the test device, the mechanism movement is more complicated, and the process is not compact, which affects the production efficiency. Therefore, it is necessary to study and improve the above problems. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model provides a test system that can facilitate the loading and unloading of chips and improve the test efficiency.

[0004] According to the test system of the embodiment of the utility model, it includes a test device and a plurality of conveying devices, the test device includes a support platform and a test assembly, the support platform is provided with a through hole extending along a first direction, the test assembly is connected to the support platform, the test assembly includes a test head, and the test head is used to test the chip. The conveying device includes a first moving assembly and a carrier, the carrier is used to carry the chip, the first moving assembly is connected to the carrier, the first moving assembly can drive the carrier to move along the first direction and the second direction, the second direction is perpendicular to the first direction, and the carrier can move to correspond to the through hole.

[0005] According to the test system of the embodiment of the utility model, there are at least the following beneficial effects: the chip is loaded onto the carrier, the carrier moves along the second direction to correspond to the through hole, and enters the through hole along the first direction to reach the test station, and then cooperates with the test device to test the chip. After the test is completed, the carrier leaves the through hole along the first direction, and unloads away from the through hole along the second direction, and the test device does not need to avoid position for loading and unloading. And because the carrier will not always be in the through hole, the carriers of multiple conveying devices can alternately enter the through hole to perform chip detection, making the test process compact and improving the test efficiency.

[0006] According to some embodiments of the present utility model, the first moving assembly includes a first driver and a second driver, the first driver and the second driver are connected to the carrier, the first driver is used to drive the carrier to move along the first direction, and the second driver is used to drive the carrier to move along the second direction;

[0007] Among them, the first moving component also includes a third driver, the third driver is connected to the carrier, and the third driver is used to drive the carrier to move along a third direction, and the third direction, the second direction and the first direction are perpendicular to each other; and / or, the first moving component also includes a fourth driver, the fourth driver is connected to the carrier, and the fourth driver is used to drive the carrier to rotate around an axis parallel to the first direction.

[0008] According to some embodiments of the present invention, the test assembly includes a three-axis drive mechanism, the test head is connected to the three-axis drive mechanism, and the three-axis drive mechanism can drive the test head to move along an x-axis, a y-axis and a z-axis that are perpendicular to each other, and the z-axis is in the same direction as the first direction.

[0009] According to some embodiments of the present invention, the testing device includes at least four testing components, and each of the testing components is arranged around the through hole.

[0010] According to some embodiments of the utility model, the testing system includes a loading device and a first moving device, the loading device includes a loading platform, the loading platform is used to store the chips to be tested, the first moving device includes a loading head and a second moving component, the loading head is used to pick up or put down the chips to be tested, the second moving component is connected to the loading head, and the second moving component can drive the loading head to move to correspond to the loading platform and the carrier.

[0011] According to some embodiments of the utility model, the loading device also includes a third moving component, the loading platform includes a first carrier and a second carrier, the first carrier and the second carrier are arranged in sequence along a direction perpendicular to the first direction, the third moving component is connected to the loading platform, and the third moving component is used to drive the loading platform to move along the arrangement direction of the first carrier and the second carrier so that the first carrier or the second carrier corresponds to the loading head in the first direction.

[0012] According to some embodiments of the utility model, the second carrier is configured as an iron ring carrier or a mother-and-child ring carrier, the loading device also includes a lifting assembly, the loading head, the loading platform and the lifting assembly are arranged in sequence along a first direction, the third moving assembly can drive the lifting assembly to correspond to the second carrier in the first direction, and the lifting assembly is used to lift the chip carried by the second carrier.

[0013] According to some embodiments of the present invention, the testing system further includes a first visual device, which includes a first visual camera, and the first visual camera is correspondingly provided at at least one of the loading platform, the conveying device and the testing device.

[0014] According to some embodiments of the utility model, the testing system includes a unloading device and a second material moving device, the unloading device includes a unloading platform, the unloading platform is used to store the chips that have completed the test, the second material moving device includes a unloading head and a fourth moving component, the unloading head is used to pick up or put down the chips that have completed the test, the fourth moving component is connected to the unloading head, and the fourth moving component can drive the unloading head to move to correspond to the unloading platform and the carrier.

[0015] According to some embodiments of the present invention, the testing system further includes a second visual device, which includes a second visual camera, and the visual camera is correspondingly provided at at least one of the unloading platform, the conveying device and the testing device.

[0016] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0018] Figure 1 A schematic diagram of a test system according to an embodiment of the present utility model;

[0019] Figure 2 for Figure 1 A schematic diagram of a conveying device in FIG.

[0020] Figure 3 for Figure 1 Schematic diagram of the test device in;

[0021] Figure 4 for Figure 1 A schematic diagram of a feeding device in FIG.

[0022] Figure 5 for Figure 1 A schematic diagram of a first material moving device in FIG.

[0023] Figure 6 for Figure 1 A schematic diagram of a second material moving device in FIG.

[0024] Figure 7 for Figure 1 Schematic diagram of the feeding device in.

[0025] Reference numerals:

[0026] Testing device 100, supporting platform 110, through hole 111, testing assembly 120, testing head 121, three-axis driving mechanism 122;

[0027] The conveying device 200, the carrier 210, the first moving assembly 220, the first driver 221, the second driver 222, the third driver 223, and the fourth driver 224;

[0028] A loading device 300, a loading platform 310, a first carrier 311, a second carrier 312, a third moving assembly 320, and a lifting assembly 330;

[0029] A first material moving device 400, a loading head 410, and a second moving assembly 420;

[0030] A first visual device 500, a first visual camera 510;

[0031] A material unloading device 600, a material unloading platform 610, and a two-axis driving mechanism 620;

[0032] The second material moving device 700, the material discharge head 710, and the fourth moving assembly 720;

[0033] Second vision device 800 , second vision camera 810 . DETAILED DESCRIPTION

[0034] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0035] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0036] In the description of the present utility model, "several" means more than one, "many" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used to distinguish the technical features, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0037] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0038] In the description of the utility model, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0039] The test system of the embodiment of the present application is described below with reference to the drawings of the specification. It should be noted that the drawings show the first direction in the up-down direction, the second direction in the left-right direction, and the third direction in the front-back direction.

[0040] Reference Figures 1 to 3 According to the test system of the embodiment of the utility model, the test device 100 and a plurality of conveying devices 200 are included. The test device 100 includes a support platform 110 and a test assembly 120. The support platform 110 is provided with a through hole 111 extending along a first direction. The test assembly 120 is connected to the support platform 110. The test assembly 120 includes a test head 121. The test head 121 is used to test the chip. The conveying device 200 includes a first moving assembly 220 and a carrier 210. The carrier 210 is used to carry the chip. The first moving assembly 220 is connected to the carrier 210. The first moving assembly 220 can drive the carrier 210 to move along the first direction and the second direction. The second direction is perpendicular to the first direction. The carrier 210 can move to correspond to the through hole 111.

[0041] When testing, the chip is loaded onto the carrier 210, and the carrier 210 moves along the second direction to correspond to the through hole 111, and enters the through hole 111 along the first direction to reach the test station, and can cooperate with the test device 100 to test the chip. After the test is completed, the carrier 210 leaves the through hole 111 along the first direction, and unloads away from the through hole 111 along the second direction, and the test device 100 does not need to avoid position for loading and unloading. And because the carrier 210 will not always be in the through hole 111, the carriers 210 of multiple conveying devices 200 can alternately enter the through hole 111 to perform chip testing, making the test process compact and improving test efficiency.

[0042] Reference Figure 2In some embodiments, the first moving assembly 220 includes a first driver 221 and a second driver 222, which are connected to the carrier 210, the first driver 221 is used to drive the carrier 210 to move along the first direction, and the second driver 222 is used to drive the carrier 210 to move along the second direction, so as to achieve the movement of the carrier 210 entering and exiting the through hole 111 and conveying the chip. Among them, the first moving assembly 220 also includes a third driver 223, which is connected to the carrier 210, and the third driver 223 is used to drive the carrier 210 to move along the third direction, and the third direction, the second direction and the first direction are perpendicular to each other, so as to facilitate the positioning of the chip and the test head 121. In some embodiments, the first moving assembly 220 also includes a fourth driver 224, which is connected to the carrier 210, and the fourth driver 224 is used to drive the carrier 210 to rotate around an axis parallel to the first direction, so as to further facilitate the positioning of the chip and the test head 121.

[0043] Among them, the first driver 221, the second driver 222 and the third driver 223 can all be selected as linear motors or other conventional drivers in the field for achieving linear motion, and the fourth driver 224 can be selected as a servo motor or other conventional driver in the field for achieving rotation.

[0044] Reference Figure 3 In some embodiments, the test assembly 120 includes a three-axis driving mechanism 122, and the test head 121 is connected to the three-axis driving mechanism 122. The three-axis driving mechanism 122 can drive the test head 121 to move along the mutually perpendicular x-axis, y-axis, and z-axis, and the z-axis is in the same direction as the first direction to improve the positioning accuracy of the test assembly 120. The first moving assembly 220 realizes rough positioning, and the three-axis driving mechanism 122 realizes fine positioning to ensure that the test head 121 tests the chip. The directions of the y-axis and the x-axis can be in the same direction as the second direction and the third direction, respectively, or can be other directions perpendicular to the first direction.

[0045] Reference Figure 3 In some embodiments, the test device 100 includes at least four test assemblies 120, and each test assembly 120 is arranged around the through hole 111. When the test head 121 performs a power-on test on the chip, the positive test head 121 and the negative test head 121 are used to test the chip. When a larger current is used for testing, at least four test assemblies 120 are used to reduce the probability of large current damaging the chip, ensuring the test and product safety. It can be understood that among the multiple test assemblies 120, the positive test heads 121 and the negative test heads 121 are grouped one by one.

[0046] Reference Figure 1 , Figure 4 and Figure 5 In some embodiments, the test system includes a loading device 300 and a first material moving device 400. The loading device 300 includes a loading platform 310. The loading platform 310 is used to store the chips to be tested. The first material moving device 400 includes a loading head 410 and a second moving component 420. The loading head 410 is used to pick up or put down the chip to be tested. The second moving component 420 is connected to the loading head 410. The second moving component 420 can drive the loading head 410 to move to correspond to the loading platform 310 and the carrier 210. The loading platform 310 stores multiple chips to be tested in batches. The first material moving device 400 moves a single chip to be tested to the carrier 210, which is convenient for loading and testing, and the process is compact to ensure production efficiency.

[0047] The loading head 410 may be a conventional picking mechanism in the art such as a vacuum suction head.

[0048] Reference Figure 4 In some embodiments, the loading device 300 further includes a third moving component 320, the loading platform 310 includes a first carrier 311 and a second carrier 312, the first carrier 311 and the second carrier 312 are arranged in sequence along a direction perpendicular to the first direction, the third moving component 320 is connected to the loading platform 310, and the third moving component 320 is used to drive the loading platform 310 to move along the arrangement direction of the first carrier 311 and the second carrier 312, so that the first carrier 311 or the second carrier 312 corresponds to the loading head 410 in the first direction. The first carrier 311 and the second carrier 312 can cope with different loading methods of multiple chips to improve the applicability of the loading platform 310, and the driving of the third moving component 320 can ensure that the loading head 410 picks up the chips on the first carrier 311 and the second carrier 312. Among them, the first carrier 311 can be a waffle box carrier, and the second carrier 312 can be an iron ring carrier or a mother-and-child ring carrier.

[0049] Further, the second carrier 312 is set as an iron ring carrier or a mother-and-child ring carrier, and the loading device 300 also includes a lifting component 330. The loading head 410, the loading platform 310 and the lifting component 330 are arranged in sequence along the first direction. The third moving component 320 can drive the lifting component 330 to correspond to the second carrier 312 in the first direction, and the lifting component 330 is used to lift the chip carried by the second carrier 312. By setting the lifting component 330, the chip of the iron ring carrier or the mother-and-child ring carrier can be lifted to make the chip detach from the blue film package, so that the loading head 410 can pick up the chip.

[0050] Reference Figure 1 and Figure 5In some embodiments, the test system further includes a first visual device 500, the first visual device 500 includes a first visual camera 510, and at least one of the loading platform 310, the conveying device 200 and the testing device 100 is correspondingly provided with the first visual camera 510. The first visual camera 510 can assist in positioning to ensure that the chip test is in place. Among them, the first visual camera 510 is correspondingly provided at the loading platform 310, which can ensure that the loading head 410 picks up the battery cell carried by the loading platform 310. The first visual camera 510 is correspondingly provided at the conveying device 200, which can ensure that the loading head 410 places the chip on the carrier 210. The first visual camera 510 is correspondingly provided at the testing device 100, which can ensure the positioning of the test head 121 and the chip.

[0051] Reference Figure 1 , Figure 6 and Figure 7 The test system also includes a feeding device 600 and a second material moving device 700. The feeding device 600 includes a feeding platform 610. The feeding platform 610 is used to store the chips that have completed the test. The second material moving device 700 includes a feeding head 710 and a fourth moving component 720. The feeding head 710 is used to pick up or put down the chips that have completed the test. The fourth moving component 720 is connected to the feeding head 710. The fourth moving component 720 can drive the feeding head 710 to move to correspond to the feeding platform 610 and the carrier 210. The second material moving device 700 moves a single tested chip from the carrier 210 to the feeding platform 610. The feeding platform 610 stores multiple tested chips in batches, which is convenient for testing and feeding. The process is compact and production efficiency is ensured.

[0052] The unloading platform 610 can be connected to the two-axis driving mechanism 620 to drive the unloading platform 610 to move along the second direction and the third direction, so as to facilitate the adjustment of the relative position between the unloading platform 610 and the unloading head 710, or to facilitate the adjustment of the material picking position after full material. The unloading head 710 can be selected as a conventional picking mechanism in the art such as a vacuum suction head.

[0053] Reference Figure 6In some embodiments, the test system further includes a second visual device 800, and the second visual device 800 includes a second visual camera 810, and at least one of the unloading platform 610, the conveying device 200 and the testing device 100 is correspondingly provided with a visual camera. The second visual camera 810 can assist in positioning to ensure that the chip is tested in place. Among them, the second visual camera 810 is correspondingly provided at the testing device 100, which can ensure the positioning of the test head 121 and the chip. The second visual camera 810 is correspondingly provided at the conveying device 200, which can ensure the positioning of the unloading head 710 and the chip after the test on the carrier 210. The second visual camera 810 is correspondingly provided at the unloading platform 610, which can ensure the positioning of the unloading head 710 and the chip placement position on the unloading platform 610.

[0054] The embodiments of the utility model are described in detail above in conjunction with the accompanying drawings, but the utility model is not limited to the above embodiments. Various changes can be made within the knowledge of ordinary technicians in the relevant technical field without departing from the purpose of the utility model. In addition, the embodiments of the utility model and the features in the embodiments can be combined with each other without conflict.

Claims

1. A test system, characterized in that include: A testing device, comprising a supporting platform and a testing assembly, wherein the supporting platform is provided with a through hole extending along a first direction, the testing assembly is connected to the supporting platform, and the testing assembly comprises a testing head, and the testing head is used to test a chip; A plurality of conveying devices, wherein the conveying devices include a first moving component and a carrier, wherein the carrier is used to carry the chip, the first moving component is connected to the carrier, the first moving component can drive the carrier to move along the first direction and the second direction, the second direction is perpendicular to the first direction, and the carrier can move to correspond to the through hole.

2. The test system according to claim 1, characterized in that: The first moving assembly includes a first driver and a second driver, the first driver and the second driver are connected to the carrier, the first driver is used to drive the carrier to move along the first direction, and the second driver is used to drive the carrier to move along the second direction; Among them, the first moving component also includes a third driver, the third driver is connected to the carrier, and the third driver is used to drive the carrier to move along a third direction, and the third direction, the second direction and the first direction are perpendicular to each other; and / or, the first moving component also includes a fourth driver, the fourth driver is connected to the carrier, and the fourth driver is used to drive the carrier to rotate around an axis parallel to the first direction.

3. The test system according to claim 1, characterized in that: The test assembly includes a three-axis driving mechanism, the test head is connected to the three-axis driving mechanism, and the three-axis driving mechanism can drive the test head to move along an x-axis, a y-axis and a z-axis that are perpendicular to each other, and the z-axis is in the same direction as the first direction.

4. The test system according to claim 1, characterized in that: The testing device comprises at least four testing components, each of which is arranged around the through hole.

5. The test system according to claim 1, characterized in that: It includes a loading device and a first moving device, the loading device includes a loading platform, the loading platform is used to store the chip to be tested, the first moving device includes a loading head and a second moving component, the loading head is used to pick up or put down the chip to be tested, the second moving component is connected to the loading head, and the second moving component can drive the loading head to move to correspond to the loading platform and the carrier.

6. The test system according to claim 5, characterized in that: The loading device also includes a third moving component, the loading platform includes a first carrier and a second carrier, the first carrier and the second carrier are arranged in sequence along a direction perpendicular to the first direction, the third moving component is connected to the loading platform, and the third moving component is used to drive the loading platform to move along the arrangement direction of the first carrier and the second carrier so that the first carrier or the second carrier corresponds to the loading head in the first direction.

7. The test system according to claim 6, characterized in that: The second carrier is configured as an iron ring carrier or a mother-and-child ring carrier, the loading device also includes a lifting component, the loading head, the loading platform and the lifting component are arranged in sequence along a first direction, the third moving component can drive the lifting component to correspond to the second carrier in the first direction, and the lifting component is used to lift the chip carried by the second carrier.

8. The test system according to claim 5, characterized in that: It also includes a first visual device, which includes a first visual camera. The first visual camera is correspondingly arranged at at least one of the loading platform, the conveying device and the testing device.

9. The test system according to claim 1, characterized in that: It includes a unloading device and a second material moving device, the unloading device includes a unloading platform, the unloading platform is used to store the chips that have completed the test, the second material moving device includes a unloading head and a fourth moving component, the unloading head is used to pick up or put down the chips that have completed the test, the fourth moving component is connected to the unloading head, and the fourth moving component can drive the unloading head to move to correspond to the unloading platform and the carrier.

10. The test system according to claim 9, characterized in that: It also includes a second visual device, which includes a second visual camera. The visual camera is correspondingly arranged at at least one of the unloading platform, the conveying device and the testing device.

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