Manipulator device for wafer transmission

Abstract

The utility model discloses a mechanical arm device for wafer transmission. The mechanical arm device comprises mechanical fingers, a fixing module and a mechanical arm, the mechanical fingers are connected with the mechanical arm through the fixing module, and the mechanical fingers are used for bearing wafers; a plurality of non-slip mats are uniformly distributed on the mechanical fingers and are used for providing friction force so as to prevent the wafer from sliding; a leveling assembly is arranged on the fixing module and used for achieving horizontal calibration of the mechanical finger. The mechanical finger has the advantages of being compact in structure, small in size, high in stability and the like, and overcomes the limitation of using space of clamping type mechanical fingers, vacuum adsorption mechanical fingers and the like in the prior art.

Description

Technical Field

[0001] The utility model relates to the technical field of wafer transmission, in particular to a manipulator device used for wafer transmission. Background Art

[0002] The rapid development of semiconductor integrated circuit process technology has put forward higher requirements for the stability and production efficiency of semiconductor manufacturing equipment. When processing wafers, semiconductor manufacturing equipment often places wafers on the robot fingers, and the robot arm drives the robot to complete the transfer of wafers between various process chambers or workstations. The stability and accuracy of the robot's wafer transfer are related to the production efficiency and quality of the wafer. Therefore, the stability of the robot's wafer handling can be improved by designing a robot finger device. Utility Model Content

[0003] The technical problem to be solved by the utility model is: in view of the above-mentioned problems in the prior art, a robot arm device for wafer transmission is provided which has a compact structure, high stability and small size.

[0004] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0005] A robot device for wafer transmission comprises: a robot finger, a fixing module and a robot arm; the robot finger is connected to the robot arm through the fixing module, and the robot finger is used to carry the wafer; a plurality of anti-skid pads are evenly distributed on the robot finger, and the anti-skid pads are used to provide friction to prevent the wafer from sliding; a leveling component is provided on the fixing module, and the leveling component is used to realize horizontal calibration of the robot finger.

[0006] As a further improvement of the utility model, the fixing module includes a base, a lower fixing plate, an upper fixing plate, screws and springs; the base is detachably connected to the robotic arm; the base and the lower fixing plate are detachably connected by screws, and a spring is provided between the base and the lower fixing plate, and the screw passes through the spring; the lower fixing plate, the upper fixing plate and the robotic finger are detachably connected; when the screw is screwed, the horizontality between the lower fixing plate and the base can be adjusted, thereby realizing the horizontal calibration of the robotic finger.

[0007] As a further improvement of the present invention, a sensor is provided on the side of the lower fixing plate close to the robot finger, and the sensor is used to detect the position of the wafer on the robot finger.

[0008] As a further improvement of the present invention, a cable fixing piece is further provided on the side of the lower fixing plate, and the cable fixing piece is used to fix the cable of the sensor.

[0009] As a further improvement of the present invention, a circular arc having the same center as the wafer is provided on the side of the robotic finger, and the circular arc is used to assist in positioning the wafer on the robotic finger.

[0010] As a further improvement of the utility model, waist-shaped holes and circular holes are symmetrically provided on both sides of the mechanical finger to reduce the weight of the mechanical finger.

[0011] As a further improvement of the utility model, a plurality of grooves are evenly distributed on the mechanical finger, and the anti-slip pad is pasted in the grooves.

[0012] Compared with the prior art, the advantages of the utility model are:

[0013] The utility model discloses a manipulator device for wafer transmission, wherein a manipulator finger is connected to a manipulator arm through a fixed module, and the manipulator finger is used to carry the wafer, and driven by the manipulator arm, the wafer can automatically enter and exit various vacuum chambers of the ion implanter; further, a plurality of anti-skid pads are evenly distributed on the manipulator finger, and the friction force provided by the anti-skid pads can be used to prevent the wafer from sliding, and there is no need to clamp or vacuum-absorb the wafer, thereby improving the safety of wafer transmission; at the same time, a leveling component is also provided on the fixed module, and the leveling component is used to realize the horizontal calibration of the manipulator finger, thereby ensuring the reliability of wafer transmission, avoiding uneven force on the wafer on the manipulator finger due to the difference in levelness of the manipulator finger, and avoiding the phenomenon of slipping or falling of the wafer during transmission, and at the same time, it is also beneficial to monitor the state of the wafer on the manipulator finger. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the structural principle of the manipulator device in a specific embodiment of the utility model;

[0015] Figure 2 This is a schematic diagram of the structural principle of a fixed module in a specific embodiment of the utility model;

[0016] Figure 3 This is a schematic diagram of the structural principle of the lower fixing plate in a specific embodiment of the utility model;

[0017] Legend: 1. Robotic finger; 11. Waist-shaped hole; 12. Round hole; 13. Arc; 14. Groove; 2. Anti-slip pad; 3. Fixing module; 31. Base; 311. First connecting hole; 312. Second connecting hole; 32. Lower fixing plate; 321. Third connecting hole; 322. Fourth connecting hole; 33. Upper fixing plate; 331. Fifth connecting hole; 34. Screw; 35. Spring; 36. Cable fixing; 37. Sensor; 4. Robotic arm. DETAILED DESCRIPTION

[0018] The present invention is further described below in conjunction with the accompanying drawings and specific preferred embodiments, but the protection scope of the present invention is not limited thereby.

[0019] In the description of the present invention, it should be understood that the terms "side", "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0020] In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present utility model, "multiple" means two or more, unless otherwise clearly and specifically defined.

[0021] Example

[0022] like Figure 1 and Figure 3 As shown, the robotic arm device for wafer transmission of the utility model comprises: a robotic finger 1, a fixed module 3 and a robotic arm 4. The robotic finger 1 is connected to the robotic arm 4 through the fixed module 3, the robotic finger 1 is used to carry the wafer, and the robotic arm 4 drives the robotic finger 1 and the wafer in and out of each vacuum chamber of the ion implanter. A plurality of anti-skid pads 2 are evenly distributed on the robotic finger 1, and the anti-skid pads 2 are used to provide friction to prevent the wafer from sliding on the robotic finger 1. A leveling component is provided on the fixed module 3, and the leveling component is used to realize the horizontal calibration of the robotic finger 1.

[0023] In this embodiment, the robot finger 1 is connected to the robot arm 4 through the fixed module 3. The robot finger 1 is mainly used to carry the wafer. Driven by the robot arm 4, the wafer can automatically enter and exit the vacuum chambers of the ion implanter. Furthermore, a plurality of anti-skid pads 2 are evenly distributed on the robot finger 1. The friction provided by the anti-skid pads 2 can prevent the wafer from sliding, and there is no need to clamp or vacuum adsorb the wafer, thereby improving the safety of wafer transmission. At the same time, a leveling component is also provided on the fixed module 3. The leveling component is used to achieve horizontal calibration of the robot finger 1, ensuring the reliability of wafer transmission, avoiding uneven force on the wafer on the robot finger 1 due to the difference in levelness of the robot finger 1, and avoiding slippage or falling during the transmission process. It is also beneficial to monitor the state of the wafer on the robot finger 1.

[0024] like Figure 1 As shown, in this embodiment, the side of the robot finger 1 is provided with an arc 13 with the same center as the wafer, and the arc 13 is used to assist the wafer in positioning on the robot finger 1, and the position of the wafer on the robot finger 1 can be determined by the arc 13. Furthermore, three round holes and a pair of waist holes are provided on the robot finger 1 near the arc 13 to fix the calibration tooling and ensure the uniformity of the station calibration.

[0025] like Figure 1 As shown, in this embodiment, waist-shaped holes 11 and circular holes 12 are symmetrically provided on both sides of the robot finger 1 to reduce the weight of the robot finger 1 and improve the transmission speed of the robot.

[0026] like Figure 1 As shown, in this embodiment, three grooves 14 are evenly distributed on the robot finger 1, and the three grooves 14 are on the same circular plane. The anti-slip pad 2 is pasted in the groove 14 to provide friction for the wafer when it follows the robot finger 1 for transmission, thereby ensuring that no relative sliding occurs during the wafer transmission process, thereby improving the robot's transmission position accuracy and stability; and compared with clamping type and vacuum adsorption type robot fingers, it has the characteristics of simple structure, small size and lower cost.

[0027] like Figure 2 and Figure 3 As shown, in this embodiment, the fixing module 3 includes a base 31, a lower fixing plate 32, an upper fixing plate 33, a screw 34 and a spring 35. The base 31 is detachably connected to the robot arm 4. The base 31 and the lower fixing plate 32 are detachably connected by screws 34, and a spring 35 is provided between the base 31 and the lower fixing plate 32, and the screw 34 passes through the spring 35. The lower fixing plate 32, the upper fixing plate 33 and the robot finger 1 are detachably connected. When the screw 34 is screwed, the relative position between the lower fixing plate 32 and the base 31 can be adjusted to achieve horizontal calibration of the robot finger 1.

[0028] Specifically, a first connection hole 311 is provided on the base 31, and by installing a fastener in the first connection hole 311, the base 31 and the robot arm 4 can be detachably connected. Three second connection holes 312 are also provided on the base 31, and three third connection holes 321 are correspondingly provided on the lower fixing plate 32. By screwing screws 34 into the second connection holes 312 and the third connection holes 321, the lower fixing plate 32 and the base 31 can be detachably connected. One of the screws 34 is tightened and kept fixed, and the front-back and left-right horizontality of the robot finger 1 is calibrated by screwing the other two screws 34. A plurality of fourth connection holes 322 are also provided on the lower fixing plate 32, and a plurality of fifth connection holes 331 are correspondingly provided on the upper fixing plate 33. A corresponding plurality of mounting holes are provided on the robot finger 1. The robot finger 1 is placed between the upper fixing plate 33 and the lower fixing plate 32, and fasteners are screwed into the fourth connection holes 322 and the fifth connection holes 331, so as to realize a detachable connection between the lower fixing plate 32, the upper fixing plate 33 and the robot finger 1.

[0029] like Figure 3 As shown, in this embodiment, sensors 37 are symmetrically provided on both sides of the lower fixing plate 32 close to the robot finger 1 , and the sensors 37 are used to detect the position of the wafer on the robot finger 1 .

[0030] Furthermore, a cable fixing member 36 is provided on the side of the lower fixing plate 32 , and the cable fixing member 36 is used to fix the cable of the sensor 37 , and the cable is led out from the vacuum to the atmosphere through the robot arm 4 .

[0031] In this embodiment, the sensor 37 is installed on the lower fixing plate 32, and the fake wafer is placed on the robot finger 1. The edge of the fake wafer coincides with the arc 13 on the robot finger 1, and the distance data measured by the two sensors 37 are configured in the robot control system. During the wafer handling process, the distance value fed back by the sensor 37 is used to determine whether the wafer is offset on the robot finger 1. At the same time, this data signal can also be used to detect whether there is a wafer on the robot finger 1, which can effectively prevent the wafer from slipping and falling.

[0032] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A robot device for wafer transfer, characterized in that: include: A robotic finger (1), a fixing module (3) and a robotic arm (4); the robotic finger (1) is connected to the robotic arm (4) via the fixing module (3), and the robotic finger (1) is used to carry a wafer; a plurality of anti-skid pads (2) are evenly distributed on the robotic finger (1), and the anti-skid pads (2) are used to provide friction to prevent the wafer from sliding; a leveling component is provided on the fixing module (3), and the leveling component is used to realize horizontal calibration of the robotic finger (1).

2. The robot device for wafer transfer according to claim 1, characterized in that: The fixing module (3) comprises a base (31), a lower fixing plate (32), an upper fixing plate (33), a screw (34) and a spring (35); the base (31) is detachably connected to the robot arm (4); the base (31) is detachably connected to the lower fixing plate (32) via the screw (34), and a spring (35) is provided between the base (31) and the lower fixing plate (32), and the screw (34) passes through the spring (35); the lower fixing plate (32), the upper fixing plate (33) and the robot finger (1) are detachably connected; when the screw (34) is screwed, the horizontality between the lower fixing plate (32) and the base (31) can be adjusted, thereby realizing the horizontal calibration of the robot finger (1).

3. The robot device for wafer transfer according to claim 2, characterized in that: A sensor (37) is provided on the side of the lower fixing plate (32) close to the mechanical finger (1), and the sensor (37) is used to detect the position of the wafer on the mechanical finger (1).

4. The robot device for wafer transfer according to claim 3, characterized in that: A cable fixing member (36) is also provided on the side of the lower fixing plate (32), and the cable fixing member (36) is used to fix the cable of the sensor (37).

5. The robot device for wafer transfer according to any one of claims 1 to 4, characterized in that: A circular arc (13) having the same center as the wafer is provided on the side of the mechanical finger (1), and the circular arc (13) is used to assist in positioning the wafer on the mechanical finger (1).

6. The robot device for wafer transfer according to any one of claims 1 to 4, characterized in that: The mechanical finger (1) is symmetrically provided with waist-shaped holes (11) and circular holes (12) on both sides, so as to reduce the weight of the mechanical finger (1).

7. The robot device for wafer transfer according to any one of claims 1 to 4, characterized in that: The mechanical finger (1) is evenly distributed with a plurality of grooves (14), and the anti-slip pad (2) is adhered in the grooves (14).

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