Light emitting device and display unit

Abstract

The utility model relates to a light-emitting device and a display unit, the light-emitting device comprises a red light chip, a green light chip, a blue light chip and a substrate, the red light chip, the green light chip and the blue light chip are all arranged on the substrate, and the red light chip is arranged between the green light chip and the blue light chip. The red light chips are prevented from being arranged on the two sides of the light-emitting device, so that the fault probability during processing of the red light chips is reduced, the processing reliability of the red light chips can be improved, and the service life of the red light chips in the light-emitting device is effectively prolonged.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a light-emitting device and a display unit. Background Art

[0002] With the development of social science and technology, the application and demand of display screens are increasing. The size of traditional chip-type lamp beads is mostly above 1.0mm*1.0mm, and the chip size is mostly 5.5*5.5mil or 5*6mil. The substrate is square and has good stability. As the market's requirements for miniaturization of lamp beads become higher and higher, Mini chip-type lamp beads have emerged to meet the current demand for miniaturization of lamp beads.

[0003] However, the smaller the chip size, the lower the stability of the substrate. The chip substrate of the current Mini chip type lamp bead is rectangular. Under the same stress, the torque of the square chip substrate is larger, and the deformation effect at both ends is also larger. At the same time, the red light LED chip usually uses AlGaInP quaternary material. As the size of the lamp bead decreases, the maximum limit distance from the chip to the cutting edge of the lamp bead decreases, resulting in the problem that the red light LED chip is easy to break when processed on the substrate. Utility Model Content

[0004] Based on this, it is necessary to provide a light-emitting device and a display unit that can improve the processing reliability of the red light chip in order to solve the above technical problems.

[0005] In a first aspect, the present application provides a light-emitting device, comprising a red light chip, a green light chip, a blue light chip and a substrate, wherein the red light chip, the green light chip and the blue light chip are all arranged on the substrate, and the red light chip is arranged between the green light chip and the blue light chip.

[0006] In one embodiment, the red light chip, the green light chip and the blue light chip are all flip chips.

[0007] In one embodiment, the light emitting device further includes a solid crystal medium, and the solid crystal medium fixes the red light chip, the green light chip, and the blue light chip to the substrate respectively.

[0008] In one embodiment, the die-bonding medium is silver glue or solder paste.

[0009] In one embodiment, the light emitting device further includes a solidified layer, and the solidified layer is disposed on and covers the red light chip.

[0010] In one embodiment, the red light chip, the green light chip and the blue light chip are arranged along a straight line on the substrate.

[0011] In one embodiment, the cathode of the red light chip, the cathode of the green light chip and the cathode of the blue light chip are connected.

[0012] In one embodiment, the positive electrode of the red light chip, the positive electrode of the green light chip and the positive electrode of the blue light chip are connected.

[0013] In one of the embodiments, the length of the light emitting device is less than or equal to 0.6 mm.

[0014] In a second aspect, the present application further provides a display unit, which includes the above-mentioned light-emitting device.

[0015] The above-mentioned light emitting device and display unit include a red light chip, a green light chip, a blue light chip and a substrate, wherein the red light chip, the green light chip and the blue light chip are all arranged on the substrate, and the red light chip is arranged between the green light chip and the blue light chip. By avoiding arranging the red light chip on both sides of the light emitting device, the failure probability of the red light chip during processing is reduced, the processing reliability of the red light chip can be improved, and the life of the red light chip in the light emitting device can be effectively improved. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 is a schematic structural diagram of a light emitting device in one embodiment;

[0017] Figure 2 FIG. 4 is a schematic diagram of the structure of a light emitting device in another embodiment. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present application more clearly understood, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0019] It is understood that the terms "first", "second", etc. used in this application may be used herein to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish a first element from another element. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0020] It can be understood that the “connection” in the following embodiments should be understood as “electrical connection”, “communication connection”, etc. if the connected circuits, modules, units, etc. have electrical signals or data transmission between each other.

[0021] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.

[0023] In one embodiment, Figure 1 As shown, a light-emitting device is provided, which includes a red light chip 104, a green light chip 102, a blue light chip 106 and a substrate 108. The red light chip 104, the green light chip 102 and the blue light chip 106 are all arranged on the substrate 108, and the red light chip 104 is arranged between the green light chip 102 and the blue light chip 106.

[0024] The substrate may be a BT (Bismaleimide Triazine) board, which is a high-performance substrate material used for PCB (Printed Circuit Board). "BT" is a chemical trade name for a resin, which is synthesized from bismaleimide (Bismaleimide, BMI) and cyanate ester (CE) resin. BT boards have high glass transition temperature (Tg), excellent dielectric properties, low thermal expansion coefficient, good mechanical characteristics and other properties, which can make them widely used in the currently popular high-density interconnection (HDI) multi-layer printed boards and packaging substrates. For example, high-performance copper clad laminates, chip carriers, high-frequency copper clad laminates, resin-coated copper foils, etc.

[0025] The red light chip 104, the green light chip 102 and the blue light chip 106 are light-emitting elements that can emit light of corresponding colors, for example, the red light chip 104 emits red light. Each chip is disposed on the substrate 108, and the red light chip 104 is disposed between the blue light chip 106 and the green light chip 102, which can reduce the probability of damage to the red light chip 104 during the packaging or cutting process of the light-emitting device. The light-emitting device can emit light of different colors under the control of the driving circuit, and the light-emitting device can be put into use after packaging.

[0026] In one embodiment, the red chip 104, the green chip 102 and the blue chip 106 are all flip chips. That is, the red chip 104, the green chip 102 and the blue chip 106 can be arranged on the substrate 108 using the flip chip technology. The flip chip technology is to directly interconnect the components downward to the substrate 108 through the bumps on the chip, which reduces the redundant inductance, resistance and capacitance, ensures the reduction of signal delay, better high frequency, and better heat dissipation channel, and is also conducive to reducing the height and weight of the package.

[0027] Furthermore, the light-emitting device described in the present application is a Mini chip lamp bead. As the process of miniaturization of light-emitting devices progresses, Mini chip lamp beads are gradually coming into the public eye. It achieves the light-emitting display function of ordinary chip lamp beads through a smaller volume, and the size is less than 0.6mm*0.6mm. As the volume becomes smaller, the substrate in the Mini chip lamp bead no longer uses the square substrate of the chip lamp bead, but uses a rectangular substrate.

[0028] Relatively speaking, the rectangular substrate generates a greater torque than the square substrate under the same stress, so the deformation is greater and the stability is weaker than that of the square substrate. In the production process of Mini chip lamp beads, the chip needs to be fixed on the substrate. The usually allowed cutting deviation and solid crystal deviation are both 40um, that is, the error must be controlled within 80um. As the size of the Mini chip lamp beads becomes smaller, the distance from the chip to the cutting edge becomes smaller and smaller, and the probability of cutting damage or deformation loss becomes greater and greater.

[0029] At the same time, the growth environment of chips of different colors is also different, resulting in differences in physical properties between chips of different colors. For example, blue light chips and green light chips are ternary materials of InGaN grown on sapphire (Al2O3), silicon carbide (SiC) or silicon (Si) substrates, while red light chips are mostly quaternary materials of AlGaInP grown on GaAs substrates. AlGaInP material is the most mature semiconductor material for making red light chips, with the advantages of low cost, high brightness and good reliability. However, the quaternary material AlGaInP red light chip is more brittle in physical properties on the substrate (gallium arsenide substrate) compared with blue light chips and green light chips. This feature makes red light chips more susceptible to damage and fracture under external forces than chips of other colors when processing the chips.

[0030] In the case where the rectangular substrate is not stable enough, in order to ensure that the red light chip can be processed smoothly and reduce the chance of damage to the red light chip, the present application arranges the red light chip 104 between the blue light chip 106 and the green light chip 102 to avoid the red light chip 104 being at the edge of the substrate and reduce the impact of stress-induced deformation hazards on the red light chip 104.

[0031] Optionally, the number of red light chip 104, blue light chip 106 and green light chip 102 can be determined according to the display requirements of the light-emitting device, and can be one or more. The number of red light chip 104, blue light chip 106 and green light chip 102 can be the same or different, and is not limited in this application. Exemplarily, the number of red light chip 104, blue light chip 106 and green light chip 102 is one respectively.

[0032] When there are multiple red light chips 104, blue light chips 106 and green light chips 102, they can be arranged in a certain logical sequence. For example, the red light chip 104 is taken as the center of the circle, and the blue light chips 106 and the green light chips 102 are alternately arranged with equal radius, surrounding the red light chip 104. Or the red light chip 104 is taken as the symmetry center, and the blue light chips 106 and the green light chips 102 are arranged according to a certain rule, which will not be repeated here. It should be noted that the red light chip 104 must be between the blue light chip 106 and the green light chip 102.

[0033] In this embodiment, the light emitting device includes a red chip 104, a green chip 102, a blue chip 106 and a substrate 108. The red chip 104, the green chip 102 and the blue chip 106 are all arranged on the substrate 108, and the red chip 104 is arranged between the green chip 102 and the blue chip 106. By avoiding arranging the red chip 104 on both sides of the light emitting device, the failure probability of the red chip 104 during processing is reduced, the processing reliability of the red chip 104 can be improved, and the life of the red chip 104 in the light emitting device can be effectively improved.

[0034] In one embodiment, the light emitting device further includes a bonding medium, and the bonding medium fixes the red light chip 104 , the green light chip 102 , and the blue light chip 106 to the substrate 108 , respectively.

[0035] Among them, the solid crystal medium is used to assist the red light chip 104, the green light chip 102 and the blue light chip 106 to be fixed on the substrate 108, and is used to fix each chip during the solid crystal process of the light-emitting device. Specifically, the red light chip 104, the green light chip 102 and the blue light chip 106 are all arranged on the substrate 108, and the solid crystal medium is used to fix the red light chip 104, the green light chip 102 and the blue light chip 106 to the substrate 108 respectively to complete the solid crystal. The solid crystal process is also called chip loading, which is to bond the chip to the designated area of ​​the substrate 108 through the solid crystal medium to form an electrical path. The solid crystal medium can be selected from conductive glue. In one embodiment, the solid crystal medium is silver glue or solder paste. Both silver glue and solder paste are conductive glue. When the red light chip 104, the green light chip 102 and the blue light chip 106 are fixed using the solid crystal medium, solder paste can also be used for auxiliary fixation. The chip may also be transferred and welded to the substrate 108 by mass transfer, and then the chip may be packaged and protected by an insulating adhesive molding process.

[0036] In order to further ensure the processing reliability of the red light chip 104 , in one embodiment, the light emitting device further includes a curing layer, and the curing layer is covered and disposed on the red light chip 104 .

[0037] Specifically, the curing layer is used to reinforce the red light chip 104 that needs to be reinforced, and by covering and fixing, the secondary fixation and surface protection of the red light chip 104 are achieved in advance, reducing the risk of damage to the red light chip 104 during the packaging process or the cutting process of the substrate 108. In one embodiment, the curing layer is a glue layer. The surface of the red light chip 104 is filled with glue and cured, which can fix the red light chip 104 while protecting the red light chip 104.

[0038] Furthermore, the curing layer can also cover the blue chip 106 and the green chip 102, and the blue chip 106 and the green chip 102 are cured and protected, so as to further improve the reliability and stability of the light-emitting device. When there are multiple blue chips 106 and green chips 102, the blue chips 106 and the green chips 102 at the edge of the substrate 108 can be cured to set the curing layer, that is, the blue chips 106 and the green chips 102 are set at the outer edges of the substrate 108.

[0039] Specifically, in one embodiment, Figure 1 As shown in FIG. 1 , the red light chip 104, the green light chip 102 and the blue light chip 106 are arranged along a straight line on the substrate 108. Optionally, the red light chip 104, the green light chip 102 and the blue light chip 106 may also be arranged as shown in FIG. Figure 2 As shown, it is arranged in an "E" shape, that is, the blue light chip 106 and the green light chip 102 are arranged in the same straight line direction, but the red light chip 104 is arranged outside the straight line direction.

[0040] exist Figure 1 In the embodiment, when there are multiple red light chips 104, green light chips 102 and blue light chips 106, and the number of green light chips 102 and blue light chips 106 is the same, the green light chips 102 and blue light chips 106 can be symmetrically arranged along the straight line direction with the red light chip 104 as the symmetry center. If there are multiple red light chips 104, the red light chip 104 at the center is the symmetry center.

[0041] Furthermore, the setting distances between the red light chip 104, the green light chip 102 and the blue light chip 106 can be the same. When the number of the red light chip 104, the green light chip 102 and the blue light chip 106 is multiple, the setting distances between the chips can also be the same. To ensure that the display color of the light-emitting device is uniform and the hue is stable. The setting distances between the red light chip 104, the green light chip 102 and the blue light chip 106 can also be different. The staff can adjust them in any way according to the needs of the required light-emitting device so that the light-emitting device can achieve different functions. For example, the distance between the red light chip 104 and the green light chip 102 is set to be greater than the distance between the red light chip 104 and the blue light chip 106, or the distance between the red light chip 104 and the blue light chip 106 is set to be greater than the distance between the red light chip 104 and the green light chip 102.

[0042] In another embodiment, the number of red light chips 104, green light chips 102 and blue light chips 106 is multiple and the number of chips of different colors is the same. Then the red light chips 104, green light chips 102 and blue light chips 106 can also be arranged in the order of "green-red-blue", that is, one red light chip 104, one green light chip 102 and one blue light chip 106 are regarded as a group of chips, and the settings in the chipset can be as follows: Figure 1 As shown, each group of chips is then arranged along a straight line within the chipset.

[0043] In this embodiment, Figure 1 The light emitting device with the arrangement shown has good display accuracy, natural imaging when in use, and improved applicability. Figure 2 The light emitting device of the arrangement shown has a higher saturation and color mixing effect, which can improve the picture quality. In fact, during use, the staff can select light emitting devices of different arrangement modes according to the use requirements to cope with different display environments.

[0044] In one embodiment, the light emitting device is a common cathode lamp bead, and the cathode of the red light chip 104, the cathode of the green light chip 102 and the cathode of the blue light chip 106 are connected. When in use, the positive electrode of each chip is connected to the respective power input terminal, and the negative electrodes of each chip are connected to each other and connected to the same power output terminal. The lamp bead using the common cathode technology has the advantages of low power consumption, low temperature rise, long life and more realistic display effect.

[0045] In one embodiment, the light emitting device is a common anode lamp bead, and the positive electrode of the red light chip 104, the positive electrode of the green light chip 102 and the positive electrode of the blue light chip 106 are connected. When in use, the positive electrodes of each chip are connected to each other and connected to the same power input terminal, and the negative electrode of each chip is connected to its own power output terminal. The common anode technology is relatively mature, the industrial chain and supporting facilities are complete, and the cost is low.

[0046] In one embodiment, in order to achieve the goal of miniaturization of the light-emitting device and meet the demand for miniaturization. The length of the light-emitting device provided in this embodiment is less than or equal to 0.6 mm, wherein the length of the light-emitting device may refer to any side length of the light-emitting device, that is, it may include the length of the light-emitting device, and may also include the width of the light-emitting device (the definition of the length and width is determined according to the type and specification of the light-emitting device). In one embodiment, the length and width of the light-emitting device may be less than or equal to 0.6 mm. In other words, the size of the light-emitting device is less than or equal to 0.6 mm*0.6 mm, which is a Mini chip type lamp bead. The light-emitting device in this embodiment limits the length to achieve miniaturization of the light-emitting device, so that the light-emitting device can be suitable for more application scenarios and narrower installation locations, thereby improving the applicability of the light-emitting device.

[0047] Based on the same technical concept, the embodiment of the present application also provides a display unit, which includes the light-emitting devices described in the above embodiments. Specifically, the display unit may include a plurality of light-emitting devices, and different display units are formed by different connection methods between the light-emitting devices, so that the display unit has different performances. Exemplarily, the light-emitting devices can be connected in series in sequence, and the circuit is simple and the connection is convenient. After the light-emitting devices are connected in series, a parallel Zener diode can also be provided, and each light-emitting device is connected in parallel with a Zener diode. The breakdown voltage of the Zener diode is higher than the working voltage of the light-emitting device, which can improve the reliability of the display unit. The light-emitting devices can also be connected in parallel, and the light-emitting devices can be grouped and connected in parallel. The light-emitting devices in the group are connected in series in sequence. This connection method is simple and convenient to set up.

[0048] The above description is only an exemplary description, and the connection method of the light-emitting device in the display unit is not limited here. The staff can choose different connection methods according to the needs.

[0049] In one embodiment, the light emitting device includes a red chip, a green chip, a blue chip and a substrate, wherein the red chip, the green chip and the blue chip are all arranged on the substrate, and the red chip is arranged between the green chip and the blue chip. The light emitting device may also include a solid crystal medium, which connects the red chip, the green chip, the blue chip and the substrate, and is used to fix the red chip, the green chip and the blue chip to the substrate. The light emitting device may also include a solidifying layer, which covers the red chip. Optionally, the red chip, the green chip and the blue chip are arranged along a straight line on the substrate.

[0050] In order to better understand the above solution, a detailed explanation is given below in conjunction with a specific embodiment.

[0051] In one embodiment, a display unit is provided, the display unit includes a plurality of light emitting devices, the light emitting devices are Mini chip type lamp beads, including a red light chip, a green light chip, a blue light chip, a solid crystal medium, a curing layer and a substrate, the red light chip, the green light chip and the blue light chip are all arranged on the substrate through the solid crystal medium, and the surface of the red light chip is also covered with a curing layer. Among them, the red light chip, the green light chip and the blue light chip are flip chips, the solid crystal medium is silver glue or solder paste, and the curing layer is a glue layer.

[0052] The red chip is placed between the green chip and the blue chip. The chip can be bonded to the substrate (BT board) using silver glue, solder paste, flux paste, or mass transfer. Then, glue is filled on the upper surface of the red chip and solidified by dispensing, and other processes such as molding, cutting, and sorting are completed. Finally, it is packaged into a light-emitting device.

[0053] In this embodiment, by avoiding arranging the red light chip on both sides of the light-emitting device, the failure probability of the red light chip during processing is reduced, and the life of the red light chip is effectively increased.

[0054] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0055] The above-mentioned embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent of the present application shall be subject to the attached claims.

Claims

1. A light emitting device, characterized in that: The light emitting device comprises a red light chip, a green light chip, a blue light chip and a substrate. The red light chip, the green light chip and the blue light chip are all arranged on the substrate, and the red light chip is arranged between the green light chip and the blue light chip.

2. The light emitting device according to claim 1, characterized in that: The red light chip, the green light chip and the blue light chip are all flip chips.

3. The light emitting device according to claim 1 or 2, characterized in that: The light emitting device further comprises a crystal-bonding medium, and the crystal-bonding medium fixes the red light chip, the green light chip, and the blue light chip to the substrate respectively.

4. The light emitting device according to claim 3, characterized in that: The solid crystal medium is silver glue or solder paste.

5. The light emitting device according to any one of claims 1 to 4, characterized in that: The light emitting device further includes a solidified layer, and the solidified layer is disposed on and covers the red light chip.

6. The light emitting device according to claim 1, characterized in that: The red light chip, the green light chip and the blue light chip are arranged along a straight line on the substrate.

7. The light emitting device according to claim 1, characterized in that: The cathode of the red light chip, the cathode of the green light chip and the cathode of the blue light chip are connected.

8. The light emitting device according to claim 1, characterized in that: The positive electrode of the red light chip, the positive electrode of the green light chip and the positive electrode of the blue light chip are connected.

9. The light emitting device according to any one of claims 1 to 8, characterized in that: The length of the light emitting device is less than or equal to 0.6 mm.

10. A display unit, characterized in that: The display unit comprises the light emitting device according to any one of claims 1 to 9.

Images