Patch equalizer

Abstract

The utility model discloses a patch equalizer which comprises a dielectric substrate, the dielectric substrate is provided with a first input impedance line and a first equalizer branch knot, and the first equalizer branch knot comprises a first high-impedance branch knot line, a first resistance bonding pad, a first radio frequency resistor and a first resonator. The first radio frequency resistor is welded on the first resistor bonding pad, the first input impedance line is connected with one end of the first high-impedance branch line, and the other end of the first high-impedance branch line is connected with one end of the first resistor bonding pad.

Description

Technical Field

[0001] The utility model relates to the technical field of equalizers, in particular to a patch equalizer. Background Art

[0002] Since the gain of many devices in the microwave band presents a negative slope characteristic, the gain in the channel is low at high frequencies and high at low frequencies. Similarly, the gain of KA-band satellite communications in the 27-31GHz band is prone to a negative slope characteristic, and an equalizer is needed to balance the gain in the band. However, the equalizer in this frequency band generally uses bare chips, which need to be bonded and sealed, and are not suitable for surface mount technology. Utility Model Content

[0003] The purpose of the utility model is to solve at least one of the technical problems existing in the prior art and to provide a low-cost KA-band patch equalizer suitable for surface mounting.

[0004] According to an embodiment of the utility model, the patch equalizer includes a dielectric substrate, on which a first input impedance line and a first equalizer branch are provided, the first equalizer branch includes a first high-impedance branch line, a first resistance pad, a first radio frequency resistor and a first resonator, the first radio frequency resistor is welded on the first resistance pad, the first input impedance line is connected to one end of the first high-impedance branch line, and the other end of the first high-impedance branch line is connected to one end of the first resistance pad.

[0005] According to some embodiments of the present utility model, a high impedance matching line, a second input impedance line and a second equalizer branch are included, the first input impedance line is connected to the second input impedance line through the high impedance matching line, the second equalizer branch is symmetrical with the first equalizer branch about the center of the dielectric substrate, the second equalizer branch includes a second high impedance branch line, a second resistance pad, a second RF resistor and a second resonator, the second RF resistor is welded on the second resistance pad, the second input impedance line is connected to one end of the second high impedance branch line, the other end of the second high impedance branch line is connected to one end of the second resistance pad, and the other end of the second resistance pad is connected to the second resonator.

[0006] According to some embodiments of the present invention, the dielectric substrate is provided with a first half hole and a second half hole penetrating the edge of the dielectric substrate, the first input impedance line extends to the first half hole, and the second input impedance line extends to the second half hole.

[0007] According to some embodiments of the present invention, the first half hole and the second half hole are symmetrical about the center of the dielectric substrate.

[0008] According to some embodiments of the present invention, the impedance of the first input impedance line and the impedance of the second input impedance line are 50 ohm respectively.

[0009] According to some embodiments of the present invention, the dielectric substrate includes two layers of ceramic plates.

[0010] According to some embodiments of the present invention, the first high-impedance branch line and the second high-impedance branch line are respectively bent.

[0011] According to some embodiments of the present invention, the first RF resistor and the second RF resistor are respectively chip resistors or thin film resistors.

[0012] According to some embodiments of the utility model, a copper sheet is provided on the dielectric substrate for welding on other circuit boards to achieve grounding.

[0013] The patch equalizer and antenna according to the embodiments of the utility model have at least the following beneficial effects: the present invention achieves the purpose of equalizing different amplitudes of KA-band satellite communications within the 27-31 GHz band by welding different first RF resistors through the first resistor pad, while meeting the requirements of SMT patches and reducing product costs and production costs.

[0014] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The specific implementation of the utility model is further described below in conjunction with the accompanying drawings;

[0016] Figure 1 It is a schematic diagram of the circuit structure of the patch equalizer;

[0017] Figure 2 This is the structural diagram of the patch equalizer. DETAILED DESCRIPTION

[0018] This section will describe in detail the specific embodiments of the utility model. The preferred embodiments of the utility model are shown in the accompanying drawings. The purpose of the accompanying drawings is to supplement the description of the text part of the specification with graphics, so that people can intuitively and vividly understand each technical feature and the overall technical solution of the utility model, but it cannot be understood as a limitation on the protection scope of the utility model.

[0019] In the description of the present invention, it should be understood that descriptions involving orientation, such as up, down, front, back, left, right, etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0020] In the description of the present utility model, "several" means one or more, "more" means more than two, "greater than", "less than", "exceed" etc. are understood to exclude the number itself, and "above", "below", "within" etc. are understood to include the number itself. If there is a description of "first" or "second", it is only used for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0021] Reference Figure 1 to Figure 2 The utility model discloses a patch equalizer, comprising a dielectric substrate 10, on which a first input impedance line 11 and a first equalizer branch are arranged, wherein the first equalizer branch comprises a first high impedance branch line 12, a first resistance pad, a first radio frequency resistor 13 and a first resonator 14, wherein the first radio frequency resistor 13 is welded on the first resistance pad, the first input impedance line 11 is connected to one end of the first high impedance branch line 12, and the other end of the first high impedance branch line 12 is connected to one end of the first resistance pad. Figure 1 In some embodiments, a symmetrical two-stage equalizer is provided, the second equalizer branch is symmetrical with the first equalizer branch about the center of the dielectric substrate 10, the first input impedance line 11 is connected to the second input impedance line 21 through the high impedance matching line 20, the second equalizer branch includes a second high impedance branch 22 line, a second resistor pad, a second RF resistor 23 and a second resonator 24, the second RF resistor 23 is welded on the second resistor pad, the second input impedance line 21 is connected to one end of the second high impedance branch 22 line, the other end of the second high impedance branch 22 line is connected to one end of the second resistor pad, and the other end of the second resistor pad is connected to the second resonator 24. The first RF resistor 13 and the second RF resistor 23 are respectively chip resistors or thin film resistors. The present invention achieves the purpose of equalizing different amplitudes of KA-band satellite communication in the 27-31GHz band by welding different first RF resistors 13 and second RF resistors 23 through the first resistor pad and the second resistor pad, while meeting the requirements of SMT patches and reducing the cost of products and production costs.

[0022] Furthermore, a first half hole 31 and a second half hole 32 are provided on the dielectric substrate 10, which penetrate the edge of the dielectric substrate 10. The first input impedance line 11 extends to the first half hole 31, and the second input impedance line 21 extends to the second half hole 32. The first half hole 31 and the second half hole 32 are symmetrical about the center of the dielectric substrate 10. The first half hole 31 and the second half hole 32 are used to solder the dielectric substrate to other PCB boards to realize a KA-band satellite communication equalizer.

[0023] In some embodiments, the impedance of the first input impedance line 11 and the impedance of the second input impedance line 21 are 50 ohms respectively, and the dielectric substrate 10 includes two layers of AL2O3 ceramic plates.

[0024] In some embodiments, the first high impedance branch line 12 and the second high impedance branch line 22 are respectively bent, and the operating frequency can be changed by changing the length of the line. The same effect can be achieved by changing the bend to an arc line or a serpentine line.

[0025] like Figure 2 Furthermore, a copper sheet 30 is provided on the dielectric substrate 10 for welding on other circuit boards to achieve grounding, and the first half hole 31 and the second half hole 32 can avoid welding short circuits.

[0026] It is easy for those skilled in the art to understand that the above preferred embodiments can be freely combined and superimposed without conflict.

[0027] The above are only preferred embodiments of the present invention, and are not intended to limit the patent scope of the present invention. All equivalent structural changes made using the contents of the present invention specification and drawings under the utility model concept, or directly or indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A patch equalizer, characterized in that: include: A dielectric substrate (10), wherein a first input impedance line (11) and a first equalizer branch are provided on the dielectric substrate (10), wherein the first equalizer branch comprises a first high-impedance branch line (12), a first resistance pad, a first radio frequency resistor (13) and a first resonator (14), wherein the first radio frequency resistor (13) is welded on the first resistance pad, the first input impedance line (11) is connected to one end of the first high-impedance branch line (12), and the other end of the first high-impedance branch line (12) is connected to one end of the first resistance pad.

2. A patch equalizer according to claim 1, characterized in that: The invention comprises a high impedance matching line (20), a second input impedance line (21) and a second equalizer branch, wherein the first input impedance line (11) is connected to the second input impedance line (21) via the high impedance matching line (20), the second equalizer branch is symmetrical with the first equalizer branch about the center of the dielectric substrate (10), the second equalizer branch comprises a second high impedance branch line (22), a second resistance pad, a second radio frequency resistor (23) and a second resonator (24), the second radio frequency resistor (23) is welded on the second resistance pad, the second input impedance line (21) is connected to one end of the second high impedance branch line (22), the other end of the second high impedance branch line (22) is connected to one end of the second resistance pad, and the other end of the second resistance pad is connected to the second resonator (24).

3. A patch equalizer according to claim 2, characterized in that: The dielectric substrate (10) is provided with a first half hole (31) and a second half hole (32) penetrating the edge of the dielectric substrate (10); the first input impedance line (11) extends to the first half hole (31); and the second input impedance line (21) extends to the second half hole (32).

4. A patch equalizer according to claim 3, characterized in that: The first half hole (31) and the second half hole (32) are symmetrical about the center of the dielectric substrate (10).

5. A patch equalizer according to claim 2, characterized in that: The impedances of the first input impedance line (11) and the second input impedance line (21) are respectively 50 ohms.

6. A patch equalizer according to claim 2, characterized in that: The dielectric substrate (10) comprises two layers of ceramic plates.

7. A patch equalizer according to claim 2, characterized in that: The first high-impedance branch line (12) and the second high-impedance branch line (22) are respectively in a bent shape.

8. A patch equalizer according to claim 2, characterized in that: The first radio frequency resistor (13) and the second radio frequency resistor (23) are respectively chip resistors or thin film resistors.

9. A patch equalizer according to claim 2, characterized in that: The dielectric substrate (10) is provided with a copper sheet (30) for welding on other circuit boards to achieve grounding.

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