Metal substrate with positioning structure

Abstract

The utility model discloses a metal substrate with a positioning structure, which belongs to the technical field of metal substrate positioning and comprises a metal substrate body, a PCB (printed circuit board) body is movably mounted at the top of the metal substrate body, rectangular baffles are fixedly mounted on two sides of the top of the metal substrate body, and mounting grooves are formed in the two rectangular baffles. Two telescopic columns are fixedly mounted on the bottom wall of the mounting groove, U-shaped insertion plates are movably inserted into the two telescopic columns, a fixing plate is fixedly mounted between the U-shaped insertion plates, a rectangular insertion plate is fixedly mounted at the bottom of the fixing plate, a first circular insertion rod is movably inserted into the rectangular insertion plate, and one side of the first circular insertion rod is movably inserted into the PCB body. According to the utility model, through the mutual cooperation of the fixed pull ring, the circular insertion rod II, the telescopic column, the U-shaped insertion plate, the fixed plate, the circular pull plate, the rectangular insertion plate and the circular insertion rod I, the PCB body and the metal substrate body are more convenient and simpler to disassemble and assemble, and the time is greatly saved.

Description

Technical Field

[0001] The utility model relates to the technical field of metal substrate positioning, in particular to a metal substrate with a positioning structure. Background Art

[0002] Metal substrate materials are the basic materials for manufacturing semiconductor components and printed circuit boards, such as silicon, gallium arsenide, silicon epitaxial pyrophyllite, etc., which are used in the semiconductor industry. Ceramic substrates are made of high-purity aluminum oxide (alumina) as the main raw material through high-pressure molding, high-temperature sintering, cutting and polishing. They are the basic materials for manufacturing thick film and thin film circuits. (Foil-clad board for short) is the substrate material for manufacturing printed circuit boards. In addition to supporting various components, it can also achieve electrical connection or electrical insulation between them.

[0003] When the existing metal substrate is installed with the PCB circuit board, it is usually used to fix multiple small-sized PCB boards through a V-shaped platform, and then perform soldering to connect the PCB circuit board and the metal substrate together through the solder joints. However, this is more troublesome when disassembling and installing the PCB circuit board; therefore, we propose a metal substrate with a positioning structure to solve this problem. Utility Model Content

[0004] The purpose of the utility model is to provide a metal substrate with a positioning structure to solve the problems raised in the above background technology.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A metal substrate with a positioning structure comprises: a metal substrate body, a PCB circuit board body movably installed on the top of the metal substrate body, rectangular baffles fixedly installed on both sides of the top of the metal substrate body, mounting grooves are provided inside the two rectangular baffles, two telescopic columns are fixedly installed at the bottom of the mounting grooves, U-shaped plug-ins are movably inserted inside the two telescopic columns, a fixed plate is fixedly installed between the U-shaped plug-ins, a rectangular plug-in plate is fixedly installed at the bottom of the fixed plate, a circular plug-in rod 1 is movably inserted inside the rectangular baffle, one side of the circular plug-in rod 1 is movably inserted into the inside of the PCB circuit board body, the outer side of the bottom of the rectangular plug-in plate is movably inserted into the inside of the circular plug-in rod 1, a plurality of plug-in holes are provided on the outer sides of the U-shaped plug-in plate and the telescopic columns, two circular plug-in rods 2 are slidably inserted into the inside of the rectangular baffle, and the outer sides of the two circular plug-in rods 2 are movably inserted into the corresponding plug-in holes.

[0007] Preferably, a circular pull plate is fixedly installed on one side of the circular insertion rod, a fixing ring is fixedly installed on the outer side of the two circular insertion rods, a return spring is fixedly installed on the outer side of the two fixing rings, and one side of the two return springs is respectively fixedly installed on one side of the corresponding telescopic column.

[0008] Preferably, a plurality of positioning posts are fixedly mounted on the top of the metal substrate body, and outer sides of the plurality of positioning posts are movably plugged into the interior of a same PCB circuit board body.

[0009] Preferably, a fixed pull ring is fixedly installed between the two circular insertion rods located on the same side.

[0010] Preferably, a plurality of heat dissipation holes are formed on the outer side of the metal substrate body.

[0011] Preferably, the outer side of the U-shaped plug plate is slidably mounted inside the rectangular baffle.

[0012] In the utility model, the metal substrate with a positioning structure is driven by pulling the fixed pull ring to drive the two circular plug rods 2 to start to separate from the inside of the U-shaped plug plate and the corresponding plug hole, and then the U-shaped plug plate is pulled upward to make the U-shaped plug plate start to move upward, further driving the fixed plate to start to move upward, thereby driving the rectangular plug plate fixed thereto to start to move upward, so that the rectangular plug plate is separated from the inside of the circular plug rod 1;

[0013] In the utility model, the metal substrate with a positioning structure is loosened to allow the second circular plug rod to be reinserted into the U-shaped plug plate and the plug hole, thereby re-fixing the U-shaped plug plate, and then the circular pull plate is pulled to drive the first circular plug rod to be separated from the inside of the PCB circuit board body, thereby canceling the fixation of the PCB circuit board body, and then the PCB circuit board body is pulled to drive the PCB circuit board body to be separated from the positioning column, canceling the fixation of the PCB circuit board body by the positioning column, thereby replacing the PCB circuit board body;

[0014] The utility model has a reasonable structural design. Through the mutual cooperation among the fixed pull ring, the second round plug rod, the telescopic column, the U-shaped plug plate, the fixed plate, the round pull plate, the rectangular plug plate and the round plug rod, the disassembly and installation of the PCB circuit board body and the metal base plate body are more convenient and simple, which greatly saves time. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a schematic diagram of the three-dimensional structure of a metal substrate with a positioning structure proposed by the utility model;

[0016] Figure 2 This is a schematic cross-sectional view of a metal substrate with a positioning structure proposed by the utility model;

[0017] Figure 3 This is a structural schematic diagram of the telescopic column, rectangular plug plate and round plug rod proposed in the utility model;

[0018] Figure 4 for Figure 1 A partial enlarged view of part A;

[0019] Figure 5 for Figure 2 A partial enlarged view of part B.

[0020] In the figure: 1. Metal substrate body; 2. PCB circuit board body; 3. Rectangular baffle; 4. Round plug rod 1; 5. Round pull plate; 6. Rectangular plug plate; 7. U-shaped plug plate; 8. Fixed plate; 9. Plug hole; 10. Telescopic column; 11. Round plug rod 2; 12. Fixed ring; 13. Reset spring; 14. Fixed pull ring; 15. Mounting groove; 16. Heat dissipation hole; 17. Positioning column. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0022] Reference Figure 1-5 A metal substrate with a positioning structure comprises: a metal substrate body 1, a PCB circuit board body 2 is movably installed on the top of the metal substrate body 1, rectangular baffles 3 are fixedly installed on both sides of the top of the metal substrate body 1, mounting grooves 15 are provided inside the two rectangular baffles 3, two telescopic columns 10 are fixedly installed at the bottom of the mounting grooves 15, U-shaped plug-in plates 7 are movably inserted inside the two telescopic columns 10, a fixing plate 8 is fixedly installed between the U-shaped plug-in plates 7, a rectangular plug-in plate 6 is fixedly installed at the bottom of the fixing plate 8, a circular plug-in rod 4 is movably inserted inside the rectangular baffle 3, one side of the circular plug-in rod 4 is movably inserted into the inside of the PCB circuit board body 2, the outer side of the bottom of the rectangular plug-in plate 6 is movably inserted into the inside of the circular plug-in rod 4, a plurality of plug-in holes 9 are provided on the outer sides of the U-shaped plug-in plate 7 and the telescopic columns 10, two circular plug-in rods 11 are slidably inserted inside the rectangular baffle 3, and the outer sides of the two circular plug-in rods 11 are movably inserted into the corresponding plug-in holes 9.

[0023] In this embodiment, a circular pull plate 5 is fixedly installed on one side of the circular insertion rod 1 4, a fixing ring 12 is fixedly installed on the outer side of the two circular insertion rods 11, and a return spring 13 is fixedly installed on the outer side of the two fixing rings 12. One side of the two return springs 13 is respectively fixedly installed on one side of the corresponding telescopic column 10, so as to facilitate the control of the circular insertion rod 11 to be reinserted into the U-shaped insertion plate 7 and the plug-in hole 9.

[0024] In this embodiment, a plurality of positioning posts 17 are fixedly mounted on the top of the metal substrate body 1 , and the outer sides of the plurality of positioning posts 17 are movably plugged into the interior of the same PCB circuit board body 2 , so as to facilitate fixation through the positioning posts 17 .

[0025] In this embodiment, a fixed pull ring 14 is fixedly installed between the two circular insertion rods 11 located on the same side, and the top drives the circular insertion rod 11 to move.

[0026] In this embodiment, a plurality of heat dissipation holes 16 are opened on the outer side of the metal substrate body 1 , and the outer side of the U-shaped plug board 7 is slidably mounted inside the rectangular baffle 3 , so that the U-shaped plug board 7 can be easily moved.

[0027] In this embodiment, when the PCB circuit board body 2 needs to be replaced during use, the fixing pull ring 14 is pulled to drive the two circular plug rods 11 to start to disengage from the U-shaped plug plate 7 and the corresponding plug hole 9, and then the U-shaped plug plate 7 is pulled upward to make the U-shaped plug plate 7 start to move upward, further driving the fixing plate 8 to start to move upward, thereby driving the rectangular plug plate 6 fixed thereto to start to move upward, so that the rectangular plug plate 6 is disengaged from the inside of the circular plug rod 1 4, and then the fixing pull ring 14 is released to allow the circular plug rod 11 to be reinserted into the inside of the U-shaped plug plate 7 and the plug hole 9, thereby re-fixing the U-shaped plug plate 7. , and then pull the circular pull plate 5 to drive the circular insertion rod 4 to separate from the inside of the PCB circuit board body 2, thereby canceling the fixation of the PCB circuit board body 2, and then pull the PCB circuit board body 2 to drive the PCB circuit board body 2 to separate from the positioning column 17, cancel the fixation of the PCB circuit board body 2 by the positioning column 17, so as to replace the PCB circuit board body 2. After the replacement is completed, repeat the above operation in reverse, so that the metal base plate body 1 and the PCB circuit board body 2 are reinstalled, further making the disassembly and installation of the PCB circuit board body 2 and the metal base plate body 1 more convenient and simple, greatly saving time.

[0028] The above is a detailed introduction to a metal substrate with a positioning structure provided by the utility model. This article uses specific embodiments to illustrate the principle and implementation method of the utility model. The description of the above embodiments is only used to help understand the method and core idea of ​​the utility model. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the utility model, the utility model can also be improved and modified, and these improvements and modifications also fall within the scope of protection of the claims of the utility model.

Claims

1. A metal substrate with a positioning structure, characterized in that: include: A metal substrate body (1), a PCB circuit board body (2) is movably mounted on the top of the metal substrate body (1), rectangular baffles (3) are fixedly mounted on both sides of the top of the metal substrate body (1), mounting grooves (15) are provided inside the two rectangular baffles (3), two telescopic columns (10) are fixedly mounted at the bottom of the mounting grooves (15), U-shaped plug-in plates (7) are movably inserted inside the two telescopic columns (10), a fixing plate (8) is fixedly mounted between the U-shaped plug-in plates (7), and a rectangular plug-in plate (8) is fixedly mounted at the bottom of the fixing plate (8). The plug plate (6) comprises a circular plug rod (4) movably inserted inside the rectangular baffle (3), one side of the circular plug rod (4) is movably inserted inside the PCB circuit board body (2), the outer side of the bottom of the rectangular plug plate (6) is movably inserted inside the circular plug rod (4), the outer sides of the U-shaped plug plate (7) and the telescopic column (10) are both provided with a plurality of plug holes (9), the inner side of the rectangular baffle (3) comprises two circular plug rods (11) slidably inserted, and the outer sides of the two circular plug rods (11) are movably inserted into the corresponding plug holes (9).

2. The metal substrate with a positioning structure according to claim 1, characterized in that: A circular pull plate (5) is fixedly mounted on one side of the circular insertion rod (4), a fixing ring (12) is fixedly mounted on the outer sides of the two circular insertion rods (11), a return spring (13) is fixedly mounted on the outer sides of the two fixing rings (12), and one side of the two return springs (13) is respectively fixedly mounted on one side of the corresponding telescopic column (10).

3. The metal substrate with a positioning structure according to claim 1, characterized in that: A plurality of positioning posts (17) are fixedly mounted on the top of the metal substrate body (1), and the outer sides of the plurality of positioning posts (17) are movably plugged into the interior of the same PCB circuit board body (2).

4. The metal substrate with a positioning structure according to claim 1, characterized in that: A fixed pull ring (14) is fixedly installed between the two circular insertion rods (11) located on the same side.

5. The metal substrate with a positioning structure according to claim 1, characterized in that: A plurality of heat dissipation holes (16) are provided on the outer side of the metal substrate body (1).

6. The metal substrate with a positioning structure according to claim 1, characterized in that: The outer side of the U-shaped plug plate (7) is slidably mounted inside the rectangular baffle (3).

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