Circuit board splitting equipment

Abstract

The utility model relates to circuit board splitting equipment. The circuit board splitting equipment comprises a board splitting platform, a reference assembly and an adjusting mechanism, the plate dividing platform is provided with a guide plate, a cutting assembly and a cutting position, the guide plate longitudinally extends in the first direction, the cutting position is located on the extending path of the guide plate, and the cutting assembly is movably connected with the plate dividing platform and can move to the cutting position in the second direction. The reference assembly is arranged on the plate dividing platform and configured to be used for obtaining the size of the sample plate and obtaining the reference distance according to the size of the sample plate. The adjusting mechanism is movably connected to the board dividing platform, and the adjusting mechanism can drive the original circuit board on the board dividing platform to move by the reference distance in the first direction so that the cutting assembly can cut the original circuit board at the cutting position according to the size of the sample board. Wherein the first direction intersects with the second direction. The problem that the board splitting efficiency of the original circuit board is low can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing equipment, and in particular to a circuit board separation equipment. Background Art

[0002] In the process of manufacturing printed circuit boards (PCB), the operation of separating the original circuit boards is involved. Although there are separation equipment in the related art, there is a problem of low separation efficiency. Summary of the invention

[0003] Based on this, it is necessary to provide a circuit board depaneling device to address the problem of low efficiency in depaneling original circuit boards.

[0004] According to one aspect of the present application, a circuit board depaneling device is provided, comprising: a depaneling platform, provided with a guide plate, a cutting assembly and a cutting position, the guide plate extending longitudinally along a first direction, the cutting position being located on an extension path of the guide plate, the cutting assembly being movably connected to the depaneling platform and being capable of moving to the cutting position along a second direction; a reference assembly, disposed on the depaneling platform, and the reference assembly being configured to obtain a template size and obtain a reference distance based on the template size; an adjustment mechanism, movably connected to the depaneling platform, and the adjustment mechanism being capable of driving an original circuit board on the depaneling platform to move the reference distance along the first direction, so that the cutting assembly can cut the original circuit board according to the template size at the cutting position; the first direction intersects with the second direction.

[0005] In some embodiments, the board separation platform has a supporting surface for supporting the original circuit board, and the guide plate has an abutting surface for abutting against the original circuit board; the adjustment mechanism includes a moving platform, a first adjustment component and a second adjustment component, and the moving platform is movably connected to the board separation platform and can move back and forth along the first direction; the first adjustment component includes a first push rod provided on the moving platform and a first pressing head connected to the telescopic end of the first push rod, and the first push rod is used to drive the first pressing head to move back and forth along the second direction; the second adjustment component includes a second push rod provided on the moving platform and a second pressing head connected to the telescopic end of the second push rod, and the second push rod is used to drive the second pressing head to move back and forth along a third direction; wherein, the second direction is perpendicular to the abutting surface, and the third direction is perpendicular to the supporting surface.

[0006] In some embodiments, the adjustment mechanism also includes a driving assembly, which includes a first motor, a threaded rod, and a threaded block; the first motor is arranged on the panel splitting platform, the threaded rod is connected to the first motor shaft of the first motor, the axial direction of the threaded rod and the motor shaft of the first motor are both parallel to the first direction, the threaded block is threadedly connected to the threaded rod, and the threaded block can move axially relative to the threaded rod as the threaded rod rotates; the movable platform is connected to the threaded block.

[0007] In some embodiments, the reference assembly includes a placement plate, an alignment plate and a laser rangefinder, the placement plate is configured to place a template, the alignment plate is disposed on the placement plate, and the alignment plate is configured to abut against the template, and the laser rangefinder is configured to measure the size of the template; wherein the laser rangefinder is electrically connected to the first motor, and the laser rangefinder is configured to send an electrical signal to the first motor according to the size of the template to control the operation of the first motor.

[0008] In some embodiments, the first adjustment component and the second adjustment component are spaced apart along the first direction.

[0009] In some embodiments, a groove and a movable cavity are provided at one end of the panel separation platform along the first direction, the movable cavity passes through a side wall of the groove, and the movable cavity extends longitudinally along the first direction; the movable platform is movably inserted into the movable cavity; the first adjustment component is connected to one end of the movable platform located in the groove, and the second adjustment component is connected to one end of the movable platform extending out of the groove; the orthographic projection of the guide plate on the panel separation platform partially overlaps with the orthographic projection of the movable platform on the panel separation platform.

[0010] In some embodiments, the upper surface of the mobile platform is parallel to the horizontal direction; the portion of the mobile platform inserted into the moving cavity is recessed downward, and the upper surface of the portion of the mobile platform not inserted into the moving cavity is higher than the moving cavity.

[0011] In some embodiments, the circuit board depaneling equipment also includes a fixing mechanism disposed on the depaneling platform, and the fixing mechanism and the adjustment component are spaced apart along the first direction; the fixing mechanism includes a first fixing component and a second fixing component spaced apart along the first direction; the first fixing component includes a first fixed push rod disposed on the depaneling platform and a first fixed pressure head connected to the telescopic end of the first fixed push rod, and the first fixed push rod is used to drive the first fixed pressure head to move back and forth along the third direction; the second fixing component includes a second fixed push rod disposed on the depaneling platform and a second fixed pressure head connected to the telescopic end of the second fixed push rod, and the second fixed push rod is used to drive the second fixed pressure head to move back and forth along the third direction.

[0012] In some embodiments, the panel splitting platform is provided with a cutting groove located at the cutting position, and the guide plate is provided with an avoidance groove connected to and aligned with the cutting groove; the cutting assembly includes a driving rod and a blade, the driving rod extends longitudinally along the second direction, and the blade is connected to the driving end of the driving rod so that the driving rod can drive the blade to move back and forth in the cutting groove and the avoidance groove along the second direction.

[0013] In some embodiments, a collecting box is disposed on the panel separation platform and is located beside the guide plate along the first direction. The collecting box is configured to collect cut circuit boards.

[0014] The circuit board depaneling equipment provided in the present application sets a guide plate on the depaneling platform to guide the adjustment direction of the circuit board original plate, and sets a reference component to provide a reference distance that needs to be moved during the adjustment of the circuit board original plate. The adjustment mechanism is used to drive the circuit board original plate to move according to the reference distance, so that a specific part of the circuit board original plate is moved to the cutting position, thereby realizing automatic and precise adjustment of the circuit board original plate, thereby realizing precise cutting of the circuit board original plate and improving work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A three-dimensional diagram of a circuit board depaneling device in an embodiment of the present application is shown.

[0016] Figure 2 Shows Figure 1 Schematic diagram of the cross-sectional structure of the circuit board depaneling equipment.

[0017] Figure 3 Shows Figure 2 A schematic diagram of the structure of the circuit board depaneling equipment from another perspective.

[0018] Description of Figure Numbers:

[0019] 1. Circuit board separation equipment;

[0020] 10. Panel separation platform; 11. Support surface; 12. Groove; 13. Moving cavity; 14. Cutting groove; 15. Slide groove;

[0021] 20. guide plate; 21. abutment surface; 22. avoidance groove;

[0022] 30. cutting assembly; 31. driving rod; 32. blade; 33. driving block;

[0023] 40. Reference assembly; 41. Placement plate; 42. Alignment plate; 43. Laser rangefinder;

[0024] 51. moving platform; 52. first adjustment assembly; 521. first push rod; 522. first pressing head; 523. first fixing column; 53. second adjustment assembly; 531. second push rod; 532. second pressing head; 533. second fixing column; 534. second fixing plate; 54. driving assembly; 541. first motor; 542. threaded rod; 543. threaded block;

[0025] 61, first fixed assembly; 611, first fixed push rod; 612, first fixed pressure head; 62, second fixed assembly; 621, second fixed push rod; 622, second fixed pressure head;

[0026] 70. Collection box;

[0027] X, first direction; Y, second direction; Z, third direction. DETAILED DESCRIPTION

[0028] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0029] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0030] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0031] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0032] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0033] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0034] Printed Circuit Board (PCB) is an important electronic component. Because it is made using electronic printing technology, it can ensure the consistency of similar printed boards and avoid errors caused by manual wiring. It can also realize automatic insertion, automatic mounting, automatic soldering, and automatic detection of electronic components, thereby ensuring the quality of electronic equipment, improving labor productivity, reducing costs, and facilitating maintenance.

[0035] Usually, the printed circuit board needs to be cut into different lengths. However, the existing circuit board cutting equipment needs to debug its cutting parts before cutting, so that the size of the cut circuit board meets the requirements. A large number of debugging operations will greatly reduce the efficiency of circuit board cutting, thereby reducing the efficiency of subsequent processing.

[0036] In order to solve the above problems, the present application provides a circuit board splitting device, which provides a reference distance that needs to be moved during the adjustment of the circuit board original board by setting a reference component, and uses an adjustment mechanism to drive the circuit board original board to move according to the reference distance, so that a specific part of the circuit board original board is moved to the cutting position, thereby realizing precise cutting of the circuit board original board and improving work efficiency.

[0037] See also Figure 1-Figure 3 , a circuit board depaneling device 1 provided in an embodiment of the present application includes a depaneling platform 10, a reference component 40 and an adjustment component. A guide plate 20, a cutting component 30 and a cutting position are provided on the depaneling platform 10, the guide plate 20 extends longitudinally along a first direction X, the cutting position is located on the extension path of the guide plate 20, and the cutting component 30 is movably connected to the depaneling platform 10 and can be moved to the cutting position along a second direction Y. Among them, the first direction X intersects with the second direction Y. For example, the first direction X is perpendicular to the second direction Y, or the angle between the first direction X and the second direction Y is an acute angle.

[0038] The panel separation platform 10 can be a regular shape such as a rectangle or a circle, or an irregular shape. The guide plate 20 and the panel separation platform 10 are integrally formed, or the guide plate 20 and the panel separation platform 10 are two independent components, which are fixed by gluing or screws.

[0039] The reference assembly 40 is disposed on the panel separation platform 10, and the reference assembly 40 is configured to obtain the size of the template and obtain the reference distance according to the size of the template. The adjustment mechanism is movably connected to the panel separation platform 10, and the adjustment mechanism can drive the original circuit board on the panel separation platform 10 to move the reference distance along the first direction X, so that the cutting assembly 30 can cut the original circuit board according to the size of the template at the cutting position.

[0040] Based on this, a guide plate 20 is set on the board separation platform 10 to guide the adjustment direction of the circuit board original board, and a reference component 40 is set to provide a reference distance that needs to be moved during the adjustment process of the circuit board original board. The adjustment mechanism is used to drive the circuit board original board to move according to the reference distance, so that a specific part of the circuit board original board is moved to the cutting position, and automatic and precise adjustment of the circuit board original board is achieved, thereby achieving precise cutting of the circuit board original board and improving work efficiency.

[0041] Optionally, the circuit board depaneling device 1 also includes a controller, and the reference component 40 obtains the reference distance and converts it into an electrical signal. After obtaining the electrical signal, the controller controls the adjustment mechanism to drive the depaneling platform 10 to move, thereby moving the original circuit board to achieve position adjustment of the original circuit board.

[0042] See also Figure 1 In some embodiments, the panel separation platform 10 has a support surface 11 for supporting the original board of the circuit board, and the guide plate 20 has an abutment surface 21 for abutting against the original board of the circuit board. The adjustment mechanism includes a moving platform 51, a first adjustment component 52, and a second adjustment component 53. The moving platform 51 is movably connected to the panel separation platform 10 and can move back and forth along the first direction X. The first adjustment component 52 includes a first push rod 521 provided on the moving platform 51 and a first pressing head 522 connected to the telescopic end of the first push rod 521. The first push rod 521 is used to drive the first pressing head 522 to move back and forth along the second direction Y. The second adjustment component 53 includes a second push rod 531 provided on the moving platform 51 and a second pressing head 532 connected to the telescopic end of the second push rod 531. The second push rod 531 is used to drive the second pressing head 532 to move back and forth along the third direction Z. Among them, the second direction Y is perpendicular to the abutment surface 21, and the third direction Z is perpendicular to the support surface 11.

[0043] In this way, the first pressing head 522 can press the original circuit board against the abutting surface 21 of the guide plate 20, and the second pressing head 532 can press the original circuit board against the supporting surface 11 of the depaneling platform 10, so that the original circuit board remains stable. At the same time, when the moving platform 51 moves along the first direction X, the first adjustment component 52 and the second adjustment component 53 will move along the first direction X synchronously, so that the first pressing head 522 and the second pressing head 532 can generate frictional force along the first direction X on the original circuit board, thereby driving the original circuit board to slide along the abutting surface 21 of the baffle, thereby achieving position adjustment of the original circuit board.

[0044] Optionally, the first adjustment assembly 52 further includes a first fixing column 523, one end of which is fixed to the moving platform 51, and the first push rod 521 is connected to the other end of the first fixing column 523. In this way, the connection of the first push rod 521 to the moving platform 51 is facilitated.

[0045] Optionally, the second adjustment assembly 53 further includes a second fixing column 533 and a second fixing plate 534, one end of the second fixing column 533 is fixed to the moving platform 51, one end of the second fixing plate 534 is fixed to the second fixing column 533, and the second push rod 531 is connected to the other end of the second fixing column 533. In this way, the second push rod 531 is easily connected to the moving platform 51.

[0046] See also Figure 3Optionally, the adjustment mechanism further includes a driving assembly 54, which includes a first motor 541, a threaded rod 542, and a threaded block 543. The first motor 541 is disposed on the panel splitting platform 10, the threaded rod 542 is connected to the motor shaft of the first motor 541, the axial direction of the threaded rod 542 and the motor shaft of the first motor 541 are both parallel to the first direction X, the threaded block 543 is threadedly connected to the threaded rod 542, and the threaded block 543 can move axially relative to the threaded rod 542 as the threaded rod 542 rotates. The moving platform 51 is connected to the threaded block 543. Based on this, when the first motor 541 is working, its motor shaft drives the threaded rod 542 to rotate, while the threaded block 543 is restricted by the moving platform 51 and the panel splitting platform 10 and cannot rotate, so that the threaded block 543 moves along the axial direction of the threaded rod 542, thereby driving the moving platform 51 to move along the first direction X.

[0047] See also Figure 1 In some embodiments, the reference assembly 40 includes a placement plate 41 and a laser rangefinder 43, wherein the placement plate 41 is configured to place the template, and the laser rangefinder 43 is configured to measure the size of the template. The laser rangefinder 43 is electrically connected to the motor, and the laser rangefinder 43 is configured to send an electrical signal to the motor according to the size of the template to control the operation of the motor. In this way, with the cooperation of the laser rangefinder 43 and the motor, the automatic board separation operation of the original circuit board can be realized according to the length of the template on the placement plate 41, which greatly improves the work efficiency and improves the quality of the board separation.

[0048] Optionally, an alignment plate 42 is provided on the placement plate 41, and the alignment plate 42 is configured to abut against the template. The arrangement of the alignment plate 42 makes the placement position of the template more accurate, thereby making the size measurement of the template more accurate. The cooperation between the guide plate 20 and the alignment plate 42 enables the original circuit board and the template to maintain a state of being parallel to each other, thereby facilitating the pushing and cutting operations, and increasing the accuracy of the measurement, thereby ensuring the quality of the board separation.

[0049] Optionally, there are two laser rangefinders 43, which are spaced apart along the first direction X. The sample is placed between the two laser rangefinders 43, and one side of the sample is attached to the side of the alignment plate 42, so that the measurement is more accurate. After the sample is placed, the laser rangefinder 43 is started, the length of the sample is measured by laser, and the measurement data is converted into an electrical signal, and then the motor is controlled to work, so that the moving platform 51 moves a corresponding distance.

[0050] Optionally, the first adjustment component 52 and the second adjustment component 53 are arranged at intervals along the first direction X. Exemplarily, the second adjustment component 53 is located on a side of the first adjustment component 52 away from the cutting position. In this way, the first adjustment component 52 and the second adjustment component 53 will not interfere with each other, and can be applicable to the adjustment of circuit board original plates of different thicknesses.

[0051] Combination Figure 1-Figure 3 In some embodiments, a groove 12 and a movable cavity 13 are provided at one end of the panel separation platform 10 along the first direction X, and the movable cavity 13 penetrates a side wall of the groove 12, and the movable cavity 13 extends longitudinally along the first direction X. The movable platform 51 is movably inserted into the movable cavity 13. The first adjustment component 52 is connected to the end of the movable platform 51 located in the groove 12, and the second adjustment component 53 is connected to the end of the movable platform 51 extending out of the groove 12. The orthographic projection of the guide plate 20 on the panel separation platform 10 partially overlaps with the orthographic projection of the movable platform 51 on the panel separation platform 10. Based on this, the groove 12 avoids the movable platform 51, and the cavity wall of the movable cavity 13 can play a limiting and guiding role in the movement of the movable platform 51, so that the movement of the movable platform 51 is more stable. The first adjustment component 52 and the second adjustment component 53 are respectively arranged at two opposite ends of the movable platform 51, so that the effective utilization rate of the space is higher.

[0052] Optionally, the upper surface of the moving platform 51 is parallel to the horizontal direction, the portion of the moving platform 51 inserted into the moving cavity 13 is recessed downward, and the upper surface of the portion of the moving platform 51 not inserted into the moving cavity 13 is higher than the moving cavity 13, that is, the moving platform 51 is constructed in a similar U-shape. In this way, the moving cavity 13 plays a good limiting role on the moving platform 51, so that the process of the moving platform 51 driving the original circuit board to move is more stable, and the moving platform 51 will not interfere with the original circuit board when resetting.

[0053] Optionally, a slide groove 15 is provided on the board separation platform 10, one end of the placement plate 41 is slidably connected to the inner wall of the slide groove 15, the other end of the placement plate 41 extends out of the slide groove 15, and the slide groove 15 is connected to the moving cavity 13, and the placement plate 41 can move synchronously with the moving platform 51. In this way, the original circuit board can be directly separated in batches by placing the samples on the placement plate 41.

[0054] In some embodiments, the circuit board depaneling device 1 further includes a fixing mechanism disposed on the depaneling platform 10, and the fixing mechanism and the adjustment assembly are spaced apart along the first direction X. The fixing mechanism includes a first fixing assembly 61 and a second fixing assembly 62 spaced apart along the first direction X. The first fixing assembly 61 includes a first fixed push rod 611 disposed on the depaneling platform 10 and a first fixed pressure head 612 connected to the telescopic end of the first fixed push rod 611, and the first fixed push rod 611 is used to drive the first fixed pressure head 612 to move back and forth along the third direction Z. The second fixing assembly 62 includes a second fixed push rod 621 disposed on the depaneling platform 10 and a second fixed pressure head 622 connected to the telescopic end of the second fixed push rod 621, and the second fixed push rod 621 is used to drive the second fixed pressure head 622 to move back and forth along the third direction Z.

[0055] Based on this, after the adjustment mechanism adjusts the original circuit board to a suitable position, the first push rod 521 drives the first pressing head 522 away from the surface of the original circuit board, and the second push rod 531 drives the second pressing head 532 away from the surface of the original circuit board, and the moving platform 51 performs a reset operation. At this time, the first fixed push rod 611 drives the first fixed pressing head 612, and the second fixed push rod 621 drives the second fixed pressing head 622 to press and fix the original circuit board, and the cutting assembly 30 moves to the cutting position to cut the original circuit board.

[0056] In some embodiments, the panel separation platform 10 is provided with a cutting groove 14 located at the cutting position, and the guide plate 20 is provided with an avoidance groove 22 connected to and aligned with the cutting groove 14. The cutting assembly 30 includes a driving rod 31 and a blade 32, the driving rod 31 extends longitudinally along the second direction Y, and the blade 32 is connected to the driving end of the driving rod 31, so that the driving rod 31 can drive the blade 32 to move back and forth in the cutting groove 14 and the avoidance groove 22 along the second direction Y. Based on this, the driving rod 31 drives the blade 32 to move in the cutting groove 14 and the avoidance groove 22 to perform a cutting operation on the original circuit board. After the cutting is completed, the first fixed push rod 611 drives the first fixed pressure head 612, and the second fixed push rod 621 drives the second fixed pressure head 622 to leave the surface of the original circuit board, and then the blade 32 is reset under the drive of the driving rod 31.

[0057] Optionally, the driving rod 31 can be driven by a motor. For example, a second motor is provided on the panel separation platform 10, the driving rod 31 is connected to the motor shaft of the second motor, and a driving block 33 is provided on the driving rod 31 and is threadedly connected to the motor shaft. When the motor shaft rotates, the driving rod 31 rotates synchronously, while the driving block 33 cannot rotate, so that the driving block 33 moves along the driving rod 31. The blade 32 is connected to the driving block 33, so that the blade 32 is driven by the second motor to move along the second direction Y.

[0058] Furthermore, the original board after the previous cutting needs to be recovered as the original board for the next cutting, and then the above steps are repeated to realize the operations of pressing, pushing, fixing and cutting, thereby realizing the automated board separation operation of the original board of the circuit board, greatly improving work efficiency.

[0059] In some embodiments, the panel separation platform 10 is provided with a collection box 70 located beside the guide plate 20 along the first direction X. The collection box 70 is configured to collect the cut circuit boards. In this way, the cut circuit boards will fall into the collection box 70 for collection as the subsequent original circuit boards are pushed.

[0060] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0061] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. A circuit board depaneling device, characterized in that: include: The panel separation platform is provided with a guide plate, a cutting assembly and a cutting position, wherein the guide plate extends longitudinally along a first direction, the cutting position is located on the extension path of the guide plate, and the cutting assembly is movably connected to the panel separation platform and can be moved to the cutting position along a second direction; A reference component is disposed on the panel separation platform, and the reference component is configured to obtain the size of the template and obtain the reference distance according to the size of the template; An adjustment mechanism is movably connected to the panel separation platform, and the adjustment mechanism can drive the original circuit board on the panel separation platform to move the reference distance along the first direction, so that the cutting assembly can cut the original circuit board according to the template size at the cutting position; The first direction intersects the second direction.

2. The circuit board depaneling device according to claim 1, characterized in that: The board separation platform has a supporting surface for supporting the original circuit board, and the guide plate has a contact surface for contacting with the original circuit board; The adjustment mechanism comprises a moving platform, a first adjustment component and a second adjustment component, wherein the moving platform is movably connected to the panel separation platform and can move back and forth along the first direction; The first adjustment assembly includes a first push rod disposed on the moving platform and a first pressing head connected to the telescopic end of the first push rod, and the first push rod is used to drive the first pressing head to move back and forth along the second direction; The second adjustment assembly includes a second push rod disposed on the moving platform and a second pressing head connected to the telescopic end of the second push rod, wherein the second push rod is used to drive the second pressing head to move back and forth along the third direction; Wherein, the second direction is perpendicular to the abutting surface, and the third direction is perpendicular to the supporting surface.

3. The circuit board depaneling device according to claim 2, characterized in that: The adjustment mechanism further includes a driving assembly, which includes a first motor, a threaded rod, and a threaded block; The first motor is arranged on the plate splitting platform, the threaded rod is connected to the motor shaft of the first motor, the axial direction of the threaded rod and the first motor shaft of the first motor are parallel to the first direction, the threaded block is threadedly connected to the threaded rod, and the threaded block can move axially relative to the threaded rod as the threaded rod rotates; The moving platform is connected with the threaded block.

4. The circuit board depaneling device according to claim 3, characterized in that: The reference assembly includes a placement plate, an alignment plate and a laser rangefinder, wherein the placement plate is configured to place a template, the alignment plate is disposed on the placement plate, and the alignment plate is configured to abut against the template, and the laser rangefinder is configured to measure the size of the template; The laser rangefinder is electrically connected to the first motor, and the laser rangefinder is configured to send an electrical signal to the first motor according to the size of the template to control the operation of the first motor.

5. The circuit board depaneling device according to claim 2, characterized in that: The first adjustment component and the second adjustment component are arranged at intervals along the first direction.

6. The circuit board depaneling device according to claim 2, characterized in that: A groove and a moving cavity are provided at one end of the panel separation platform along the first direction, the moving cavity passes through a side wall of the groove, and the moving cavity extends longitudinally along the first direction; The mobile platform is movably inserted into the mobile cavity; The first adjustment component is connected to one end of the mobile platform located in the groove, and the second adjustment component is connected to one end of the mobile platform extending out of the groove; The orthographic projection of the guide plate on the panel separation platform partially overlaps with the orthographic projection of the moving platform on the panel separation platform.

7. The circuit board depaneling device according to claim 6, characterized in that: The upper surface of the mobile platform is parallel to the horizontal direction; The portion of the moving platform inserted into the moving cavity is recessed downward, and the upper surface of the portion of the moving platform not inserted into the moving cavity is higher than the moving cavity.

8. The circuit board depaneling device according to claim 2, characterized in that: The circuit board depaneling device further comprises a fixing mechanism disposed on the depaneling platform, wherein the fixing mechanism and the adjusting component are spaced apart along the first direction; The fixing mechanism comprises a first fixing component and a second fixing component spaced apart along the first direction; The first fixing assembly includes a first fixing push rod disposed on the panel splitting platform and a first fixing pressure head connected to a telescopic end of the first fixing push rod, wherein the first fixing push rod is used to drive the first fixing pressure head to move back and forth along the third direction; The second fixing assembly includes a second fixed push rod disposed on the panel separation platform and a second fixed pressure head connected to the telescopic end of the second fixed push rod, and the second fixed push rod is used to drive the second fixed pressure head to move back and forth along the third direction.

9. The circuit board depaneling device according to any one of claims 1 to 8, characterized in that: The panel splitting platform is provided with a cutting groove located at the cutting position, and the guide plate is provided with an avoidance groove connected to and aligned with the cutting groove; The cutting assembly includes a driving rod and a blade, wherein the driving rod extends longitudinally along the second direction, and the blade is connected to the driving end of the driving rod so that the driving rod can drive the blade to move back and forth in the cutting groove and the avoidance groove along the second direction.

10. The circuit board depaneling device according to any one of claims 1 to 8, characterized in that: The panel separation platform is provided with a collecting box located beside the guide plate along the first direction, and the collecting box is configured to collect the cut circuit boards.

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