Dust removal mechanism and laser doping equipment

Abstract

The embodiment of the utility model relates to a dust removal mechanism and laser doping equipment. The laser doping equipment comprises a laser doping station used for carrying out laser doping and a cleaning station. The dust removal mechanism comprises a rotating assembly and a sweeping assembly. The rotating assembly comprises a rotating platform and at least one adsorption structure arranged on the rotating platform. The adsorption structure is used for adsorbing silicon wafers. The rotating platform is used for driving the adsorption structure to rotate so as to be switched between the laser doping station and the cleaning station. The cleaning assembly comprises an air knife and a draught hood. The air knife is used for blowing air to the adsorption structure at the cleaning station, and the draught hood comprises a hood body and a surrounding piece connected with the hood body. The cover body comprises a suction opening and a cover opening which are opposite and communicated. The air suction opening is used for being connected with an air suction device, and the cover opening is used for covering the adsorption structure at the cleaning station. The enclosure piece and the cover body jointly form an air duct opening facing the air outlet of the air knife. The size of the section, perpendicular to the first direction, of the draught hood is gradually reduced in the first direction from the hood opening to the suction opening.

Description

Technical Field

[0001] The present application relates to the technical field of photovoltaic cell processing, and in particular to a dust removal mechanism and laser doping equipment. Background Art

[0002] Silicon wafers are important semiconductor materials for making photovoltaic cells. It takes multiple processes to make silicon wafers into photovoltaic cells. Among them, laser doping of silicon wafers using laser doping equipment is one of the important processes for making photovoltaic cells. However, during the entire process of laser doping of silicon wafers by existing laser doping equipment, external dust and / or debris will inevitably be adsorbed on the silicon wafers, thereby affecting the entire doping process of the silicon wafers and further reducing the production yield of photovoltaic cells. Utility Model Content

[0003] The first aspect of the present application provides a dust removal mechanism. The dust removal mechanism is used for laser doping equipment. The laser doping equipment includes a laser doping station and a cleaning station for laser doping. The dust removal mechanism includes a rotating assembly and a cleaning assembly. The rotating assembly includes a rotating platform and at least one adsorption structure arranged on the rotating platform. The adsorption structure is used to adsorb silicon wafers. The rotating platform is used to drive the adsorption structure to rotate to switch between the laser doping station and the cleaning station. The cleaning assembly includes a wind knife and an exhaust hood. The wind knife is used to blow air to the adsorption structure rotated to the cleaning station, and the exhaust hood includes a cover body and a surrounding member connected to the cover body. The cover body includes an exhaust port and a cover cover opening that are opposite and connected. The exhaust port is used to connect to the exhaust device, and the cover cover opening is used to cover the adsorption structure rotated to the cleaning station. At the cover cover opening, the surrounding member is connected to a part of the edge of the cover body and encloses the cover body to form an air duct opening together, and the air duct opening is arranged toward the air outlet of the wind knife. From a first direction pointing from the cover opening to the air outlet, the cross-sectional dimension of the air exhaust hood along the first direction perpendicular to the first direction gradually decreases.

[0004] The dust removal mechanism provided in the first aspect of the present application can realize overall sweeping and adsorbing of dust and / or debris on the silicon wafer at the cleaning station under the joint action of the wind knife, the exhaust hood and the external exhaust device, and has a good dust removal effect, which is beneficial to improving the production yield of photovoltaic cells. In addition, during the cleaning process, the wind knife and the exhaust hood jointly form an air flow path along the air duct opening, the cover opening of the exhaust hood, the inner cavity of the exhaust hood, the exhaust port of the exhaust hood to the exhaust device, so that the dust and / or debris on the silicon wafer are swept by the wind knife and sucked by the exhaust device at the same time, which is beneficial to ensure the maximization of dust removal efficiency. In addition, from the direction of the cover opening to the exhaust port, the cross-sectional size of the exhaust hood along the direction perpendicular to the first direction gradually decreases, which is beneficial to the smoother airflow of the exhaust device to reduce turbulence and eddy currents. In addition, the setting of the enclosure is also beneficial to reduce the escape of dust and debris and prevent dust and debris from contaminating other stations.

[0005] In some embodiments, the cover body includes a plurality of inclined plates connected in series, and the enclosure includes a plurality of ribs connected in series. Each rib is connected to a corresponding inclined plate, and the inclined plate facing the air outlet of the wind knife is not connected to a rib to form an air duct opening.

[0006] In some embodiments, the distance between the wind knife and the rotation center of the rotating platform is smaller than the distance between the adsorption structure and the rotation center of the rotating platform.

[0007] In some embodiments, the cleaning assembly further includes an angle adjustment structure, which is connected to the wind knife and is used to adjust the air outlet angle of the wind knife.

[0008] In some embodiments, the laser doping device includes a mounting platform, and the cleaning assembly further includes a first connecting structure and a second connecting structure. The exhaust hood is mounted on the mounting platform via the first connecting structure. The wind knife is mounted on the mounting platform via the second connecting structure.

[0009] In some embodiments, the dust removal mechanism further comprises a dust removal cover connected to the exhaust device, the dust removal cover is used to cover the adsorption structure rotated to the laser doping station. The dust removal cover is provided with a light through hole so that the laser can pass through the light through hole to perform laser doping on the silicon wafer on the adsorption structure rotated to the laser doping station.

[0010] In some embodiments, the dust removal mechanism further includes a door panel, which is movably connected to the dust removal cover.

[0011] In some embodiments, four groups of adsorption structures are arranged on the rotating platform. The laser doping equipment also has a loading and unloading station and a detection station. Along the rotating path of the rotating platform, the loading and unloading station, the detection station, the laser doping station and the cleaning station are arranged in sequence. Driven by the rotating platform, at the same time, there is an adsorption structure on the loading and unloading station, the detection station, the laser doping station and the cleaning station.

[0012] The second aspect of the present application provides a laser doping device. The laser doping device includes a laser doping station and a cleaning station, and the laser doping device also includes the dust removal mechanism and the laser doping mechanism of the first aspect of the present application. The laser doping mechanism is used to laser dope a silicon wafer on an adsorption structure rotated to the laser doping station.

[0013] The laser doping equipment provided in the second aspect of the present application has at least the same advantages as the dust removal mechanism provided in the first aspect of the present application, which will not be repeated here.

[0014] In some embodiments, the laser doping equipment further includes a loading and unloading station and a detection station. Along the rotation path of the rotating platform, the loading and unloading station, the detection station, the laser doping station and the cleaning station are sequentially arranged. The laser doping equipment further includes a loading and unloading mechanism and a debris detection mechanism. The loading and unloading mechanism is arranged corresponding to the loading and unloading station, and is used to load and unload materials to the adsorption structure rotated to the loading and unloading station. The debris detection mechanism is arranged corresponding to the detection station, and is used to locate and detect debris on the silicon wafer on the adsorption structure rotated to the detection station. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A module schematic diagram of a laser doping device according to an embodiment of the present application.

[0016] Figure 2 for Figure 1 A three-dimensional schematic diagram of the dust removal mechanism and installation platform of the laser doping equipment.

[0017] Figure 3 for Figure 2 A three-dimensional schematic diagram of the rotating component.

[0018] Figure 4 for Figure 3 A three-dimensional schematic diagram of the center exhaust hood assembly.

[0019] Figure 5 for Figure 3 A three-dimensional schematic diagram of the stroke knife assembly.

[0020] Figure 6 for Figure 3 A three-dimensional schematic diagram of the dust removal component.

[0021] Description of main component symbols:

[0022] Laser doping equipment 100

[0023] Loading and unloading mechanism 110

[0024] Debris detection mechanism 120

[0025] Laser doping mechanism 130

[0026] Dust removal mechanism 140

[0027] Installation platform 150

[0028] The first installation platform 151

[0029] Second installation platform 152

[0030] Through hole 152h

[0031] Rotating assembly 10

[0032] Motor 11

[0033] Rotating platform 12

[0034] Connection part 121

[0035] Carrying arm 122

[0036] Adsorption structure 13

[0037] Adsorption hole 13h

[0038] Cleaning kit 20

[0039] Exhaust hood assembly 20a

[0040] Exhaust hood 21

[0041] Cover body 211

[0042] First inclined plate 211a

[0043] Second inclined plate 211b

[0044] Third inclined plate 211c

[0045] Fourth inclined plate 211d

[0046] Connector 213

[0047] Enclosure 212

[0048] Retaining edge 2121

[0049] Air outlet H1

[0050] Cover opening H2

[0051] Air duct H3

[0052] The first connecting structure 22

[0053] First fixing plate 221

[0054] Second fixing plate 222

[0055] Reinforcement 223

[0056] Air knife assembly 20b

[0057] Wind Knife 23

[0058] Air outlet 23h

[0059] Angle adjustment structure 24

[0060] The second connecting structure 25

[0061] Fixing 251

[0062] First connecting plate 252

[0063] Second connecting plate 253

[0064] The third fixing plate 254

[0065] Dust removal component 30

[0066] Dust hood 31

[0067] Light hole 31h

[0068] Top plate 311

[0069] Side Panel 312

[0070] First side plate 312a

[0071] Second side plate 312b

[0072] The third side plate 312c

[0073] Fourth side plate 312d

[0074] Exhaust pipe 32

[0075] Door panel 33

[0076] Hinge 34

[0077] Handle 35

[0078] Support structure 36

[0079] Bottom plate 361

[0080] Riser 362

[0081] Reinforcement plate 363

[0082] Loading and unloading station A

[0083] Inspection station B

[0084] Laser doping station C

[0085] Cleaning station D

[0086] Silicon Wafer S DETAILED DESCRIPTION

[0087] Laser doping equipment can be used to prepare selective emitter electrodes (SE) for photovoltaic cells. That is, high-concentration doping is performed in the contact part between the metal electrode and the silicon wafer and its vicinity, while low-concentration doping is performed in the area outside the electrode to reduce the contact resistance and contact recombination between the silicon wafer and the electrode, and reduce the series resistance of the battery. The method of preparing selective emitter electrodes using laser doping equipment can achieve a high-precision, high-efficiency and low-cost doping process. Compared with general doping methods, the method of preparing selective emitter electrodes using laser doping equipment can achieve very precise doping depth and concentration control, can complete the doping process in a short time, and improve production efficiency.

[0088] However, during the entire laser doping process, the silicon wafer needs to be picked up, transported, straightened, and inspected. During the loading and unloading process, the silicon wafer is quickly picked up and placed by a vacuum breaking device. During the picking and placing process, external dust and debris will inevitably be adsorbed on the silicon wafer, thus affecting the doping process and doping efficiency of the silicon wafer.

[0089] The laser doping device according to the embodiment of the present application is described in detail below with reference to the accompanying drawings.

[0090] like Figure 1 As shown, the laser doping equipment 100 includes a loading and unloading mechanism 110 , a debris detection mechanism 120 , a laser doping mechanism 130 , a dust removal mechanism 140 and a mounting platform 150 .

[0091] The loading and unloading mechanism 110 is used for loading and unloading.

[0092] The debris detection mechanism 120 is used to locate and detect debris on the silicon wafer to be doped, so as to timely remove defective silicon wafers before the laser doping operation to avoid flowing into the laser doping mechanism 130 and affecting the production yield. The debris detection mechanism 120 includes, for example, a camera. The camera is, for example, a charge-coupled device (CCD). The camera can obtain an image of the silicon wafer to be doped and detect whether there are defects such as defects and cracks at the corners of the silicon wafer to be doped. In addition, the image of the silicon wafer is analyzed and processed by software to obtain the size of the silicon wafer for the subsequent setting of processing parameters.

[0093] The laser doping mechanism 130 is used to perform laser doping on the qualified silicon wafers. The laser doping mechanism 130 includes, for example, a laser generator and a galvanometer, but is not limited thereto.

[0094] The dust removal mechanism 140 is used to clean dust and / or debris on the silicon wafer. The silicon wafer may be a silicon wafer that has been detected as unqualified by the debris detection mechanism 120 and has not been doped by the laser doping mechanism 130, or a silicon wafer that has been transferred from the laser doping mechanism 130 and has been doped.

[0095] The mounting platform 150 is used to mount and support at least one of the loading and unloading mechanism 110 , the debris detection mechanism 120 , the laser doping mechanism 130 , and the dust removal mechanism 140 .

[0096] Specifically, Figure 2 As shown, the laser doping equipment 100 includes a loading and unloading station A, a detection station B, a laser doping station C and a cleaning station D which are arranged in sequence. The loading and unloading station A is arranged opposite to the laser doping station C, and the detection station B is arranged opposite to the cleaning station D. The loading and unloading mechanism 110, the debris detection mechanism 120, and the laser doping mechanism 130 are arranged corresponding to the loading and unloading station A, the detection station B, and the laser doping station C, respectively.

[0097] Please refer to Figure 2 and Figure 3 The dust removal mechanism 140 includes a rotating assembly 10 and a cleaning assembly 20 arranged corresponding to the cleaning station D. The rotating assembly 10 includes a motor 11, a rotating platform 12 connected to the motor 11, and at least one adsorption structure 13 arranged on the rotating platform 12. Each adsorption structure 13 is provided with a plurality of adsorption holes 13h for adsorbing a silicon wafer S.

[0098] Specifically, a vacuum passage (not shown) is formed in the rotating platform 12, and the multiple adsorption holes 13h of each adsorption structure 13 can be connected to a vacuum pumping device (not shown) through the vacuum passage. When the loading and unloading mechanism 110 places the silicon wafer S on the adsorption structure 13, the vacuum pumping device is turned on to form a negative pressure between the silicon wafer S and the adsorption structure 13, so as to achieve the adsorption of the silicon wafer S by the adsorption structure 13, and keep the adsorbed silicon wafer S from shifting relative to the rotating platform 12 during the rotation of the rotating platform 12. When the loading and unloading mechanism 110 needs to remove the silicon wafer S, the vacuum pumping device is controlled to break the negative pressure state between the silicon wafer S and the rotating platform 12, thereby achieving the separation of the silicon wafer S from the adsorption structure 13.

[0099] In this embodiment, the rotating platform 12 includes a connecting portion 121 and a plurality of carrying arms 122. The connecting portion 121 is connected to the output end of the motor 11. The plurality of carrying arms 122 extend from the connecting portion 121 at equidistant intervals in the circumferential direction. Each carrying arm 122 is provided with an adsorption structure 13.

[0100] Specifically, four carrying arms 122 are provided, and there are four adsorption structures 13. The motor 11 is a direct drive (DD) motor. Along the rotating path of the rotating platform 12, the loading and unloading station A, the detection station B, the laser doping station C and the cleaning station D are arranged in sequence. The DD motor can drive the rotating platform 12 to drive the adsorption structure 13 to rotate 90 degrees each time, so that the same adsorption structure 13 rotates to switch between the loading and unloading station A, the detection station B, the laser doping station C and the cleaning station D. At the same time, there is an adsorption structure 13 on the loading and unloading station A, the detection station B, the laser doping station C and the cleaning station D, so that the above four stations can work at the same time, which is beneficial to improve the production efficiency of laser doping.

[0101] In other embodiments, the motor 11 is not limited to being a DD motor, but may be other types of driving devices.

[0102] Please refer to Figure 2 and Figure 4 The cleaning assembly 20 includes an exhaust hood assembly 20a and an air knife assembly 20b. The air knife assembly 20b is used to blow away dust and / or debris on the silicon wafer S located at the cleaning station D. The exhaust hood assembly 20a is used to connect with an exhaust device (not shown) and to absorb dust and / or debris on the silicon wafer S located at the cleaning station D. The exhaust device is, for example, an exhaust fan or a vacuum cleaner. The dust and / or debris on the silicon wafer S may be generated during the loading and unloading station A or during the transportation between the previous stations.

[0103] Specifically, the exhaust hood assembly 20a includes an exhaust hood 21. The exhaust hood 21 includes a hood body 211 and an enclosure 212 connected to the hood body 211. The hood body 211 is roughly umbrella-shaped. The hood body 211 includes an exhaust port H1 and a cover port H2 that are relative and connected. The exhaust port H1 is used to connect to the exhaust device. The cover port H2 is used to cover the adsorption structure 13 that rotates to the cleaning station D. At the cover port H2, the enclosure 212 is connected to a partial edge of the hood body 211 and is enclosed with the hood body 211 to form an air duct port H3 together, and the air duct port H3 is arranged toward the air outlet 23h of the wind knife assembly 20b.

[0104] From the first direction from the cover opening H2 to the exhaust port H1, the cross-sectional size of the exhaust hood 21 in the direction perpendicular to the first direction gradually decreases. That is, the cover body 211 adopts a tightened structural design, which can mainly increase the pressure at the connection port between the cover body 211 and the exhaust device. Since the space at the exhaust port H1 becomes smaller, the exhaust device has the maximum suction force at the exhaust port H1 under the condition of the same suction force, which can better suck away the dust and debris on the silicon wafer S. Moreover, the cover body 211 is roughly umbrella-shaped, and from the cover opening H2 to the direction of the exhaust port H1, the cross-sectional size of the exhaust hood 21 gradually decreases, which is conducive to smoother airflow of the exhaust device to reduce turbulence and eddy currents. In addition, the provision of the enclosure 212 is also conducive to reducing the escape of dust and debris, and preventing dust and debris from contaminating other workstations.

[0105] The cover 211 includes a plurality of inclined plates connected in series. The enclosure 212 includes a plurality of ribs 2121 connected in series. Each rib 2121 is connected to a corresponding inclined plate, and the inclined plate facing the air outlet 23h of the wind knife assembly 20b is not connected to the rib 2121 to form an air duct opening H3. Figure 4 In the embodiment shown, the number of inclined plates is four, and the number of retaining edges 2121 is three. The four inclined plates are respectively the first inclined plate 211a, the second inclined plate 211b, the third inclined plate 211c and the fourth inclined plate 211d connected in sequence. The fourth inclined plate 211d is the inclined plate facing the wind knife assembly 20b. The four inclined plates are connected to form an internal space that is narrow at the top and wide at the bottom of the cover body 211. Among the four inclined plates, except for the fourth inclined plate 211d, each is connected with a retaining edge 2121. The fourth inclined plate 211d and the two retaining edges 2121 adjacent to it jointly form the air duct opening H3. The sequential connection of multiple inclined plates helps to concentrate or disperse the airflow as needed, so that it is more in line with specific working requirements. For example, the size of the exhaust port H1 formed by multiple inclined plates is small, which is conducive to concentrating the airflow to improve the suction force. The internal space of the cavity formed by multiple inclined plates gradually becomes smaller in the direction from the cover opening H2 to the exhaust port H1, which is conducive to dispersing the airflow and making the exhaust airflow of the exhaust device smoother. In addition, the effective connection between the retaining edge 2121 and the corresponding inclined plate can effectively prevent the high-speed airflow and the dust it carries from escaping in an undesirable direction.

[0106] also, Figure 4 In the embodiment shown, the upper tightening part of the four inclined plates is further extended to form a connecting piece 213. The connecting piece 213 is cylindrical and connected to the exhaust device through a pipeline. In other embodiments, the number of inclined plates and retaining edges 2121 is not limited to the above.

[0107] In some embodiments, the multiple inclined plates, the connecting member 213 and the multiple retaining edges 2121 in the cover body 211 are integrally formed. Each retaining edge 2121 is formed by bending the bottom of the corresponding inclined plate. The integrally formed cover body 211 has a simple structure and is easy to process.

[0108] In some embodiments, to achieve a better dust removal effect, the shape of the cover opening H2 is adapted to the shape of the adsorption structure 13, and the size of the cover opening H2 is slightly larger than the size of the adsorption structure 13, so that the cover opening H2 can completely cover the silicon wafer S on the adsorption structure 13 rotated to the cleaning station D.

[0109] The exhaust hood assembly 20a also includes a first connecting structure 22. The mounting platform 150 includes a first mounting platform 151 and a second mounting platform 152 connected to the first mounting platform 151 and located above the first mounting platform 151. The first connecting structure 22 is used to mount the exhaust hood 21 on the first mounting platform 151. In this way, the first connecting structure 22 can provide stable and reliable support for the exhaust hood 21; and the modular first connecting structure 22 helps to standardize the production and installation process and reduce the manufacturing and assembly costs.

[0110] Specifically, the first connection structure 22 includes a first fixing plate 221, a second fixing plate 222 and a reinforcing rib 223. The first fixing plate 221 is sleeved with a connecting piece 213 and is connected to a plurality of inclined plates of the cover body 211. The second fixing plate 222 is connected to one end of the second fixing plate 222. The first connection structure 22 also includes a fastener. The first fixing plate 221 is fixed to the first mounting platform 151 by a fastener. The second fixing plate 222 is approximately perpendicular to the first fixing plate 221, and the reinforcing rib 223 is approximately in the shape of a right-angled plate. The two right-angled sides of the reinforcing rib 223 are respectively connected to the first fixing plate 221 and the second fixing plate 222 to enhance the structural stability of the connection of the exhaust hood 21. In other embodiments, the first connection structure 22 is not limited to Figure 4 .

[0111] The second mounting platform 152 has an extension portion extending beyond the first mounting platform 151, and the extension portion has a through hole. In this way, the pipeline connected to the exhaust hood 21 can pass through the through hole and connect to the exhaust device upward.

[0112] In some embodiments, the cleaning station D can be used as an automated optical inspection (AOI) station. Specifically, when an automated optical inspection is required, the hood assembly 20a is removed, and an automated optical inspection mechanism (not shown) is disposed above the second mounting platform 152 to perform an automated optical inspection on the doped silicon wafer S at the cleaning station D using the automated optical inspection mechanism.

[0113] Please refer to Figure 2 and Figure 5 The wind knife assembly 20b includes a wind knife 23. The wind knife 23 is used to blow air toward the adsorption structure 13 that rotates to the cleaning station D. The wind knife 23 has a plurality of air outlets 23h that are arranged at equal intervals to achieve uniform air outlet.

[0114] In some embodiments, each air outlet 23h may be in the shape of a small round hole, a small square, etc., but is not limited thereto.

[0115] The multiple air outlets 23h are all oriented toward the air duct opening H3 of the exhaust hood 21, or in other words, the air outlets 23h of the wind knife 23 are oriented toward the side of the hood body 211 of the exhaust hood 21 where the retaining edge 2121 is not provided, so as to purge the surface of the silicon wafer S below the exhaust hood 21.

[0116] In some embodiments, the wind knife 23 is an ion wind knife to achieve the effect of removing static electricity while removing dust, but it is not limited thereto.

[0117] The wind knife assembly 20b further includes an angle adjustment structure 24. The angle adjustment structure 24 is connected to one side of the wind knife 23 and is used to adjust the wind outlet angle of the wind knife 23. This is conducive to more accurately controlling the direction and range of the airflow, thereby optimizing the airflow coverage effect of the swept surface and improving the dust removal efficiency.

[0118] In some embodiments, the adjustable range of the air outlet angle of the wind knife 23 is approximately 0 to 45 degrees, but is not limited thereto.

[0119] The distance between the wind knife 23 and the rotation center of the rotating platform 12 is smaller than the distance between the adsorption structure 13 and the rotation center of the rotating platform 12. Thus, the wind knife 23 is closer to the rotation center of the rotating platform 12 than the adsorption structure 13, so as to prevent the dust accumulated on the inner side of the adsorption structure 13 from being thrown outwards under the action of centrifugal force and scratching the silicon wafer S.

[0120] The wind knife assembly 20b further includes a second connection structure 25. The second connection structure 25 is connected to the angle adjustment structure 24 and is used to install the wind knife 23 and the angle adjustment structure 24 to the second installation platform 152. In this way, the second connection structure 25 can provide stable and reliable support for the wind knife 23 and the angle adjustment structure 24; and the modular second connection structure 25 helps to standardize the production and installation process and reduce the manufacturing and assembly costs.

[0121] Specifically, the second connection structure 25 includes a fixing member 251, a first connection plate 252, a second connection plate 253 and a third fixing plate 254. The fixing member 251 is a sheet metal member, and the fixing member 251 is connected to the angle adjustment structure 24 by a fastener. The first connection plate 252 is connected to the fixing member 251 and is substantially perpendicular to the fixing member 251. The third fixing plate 254 is substantially parallel to the first connection plate 252, and the second connection plate 253 is connected between the first connection plate 252 and the third fixing plate 254. The third fixing plate 254 is connected to the second mounting platform 152.

[0122] In other embodiments, the second connection structure 25 is not limited to Figure 5 shown.

[0123] Please refer to Figure 2 and Figure 6 The dust removal mechanism 140 further includes a dust removal assembly 30. The dust removal assembly 30 is provided corresponding to the laser doping station C and is used to perform dust removal operations on the silicon wafer S undergoing laser doping simultaneously.

[0124] The dust removal assembly 30 includes a dust cover 31. The dust cover 31 is a hollow shell. The dust cover 31 includes a top plate 311 and a plurality of side plates 312 connected to the top plate 311. The outer edge contour of the top plate 311 is rectangular, and the plurality of side plates 312 are respectively a first side plate 312a, a second side plate 312b, a third side plate 312c and a fourth side plate 312d which are sequentially connected to the four edges of the top plate 311. The bottom of the dust cover 31 opposite to the top plate 311 is hollow. A rectangular opening is formed by the first side plate 312a, the second side plate 312b, the third side plate 312c and the fourth side plate 312d. A light hole 31h is provided in the middle area of ​​the top plate 311 so that the laser generated by the laser doping mechanism 130 can pass through the light hole 31h to laser-dope the silicon wafer S on the adsorption structure 13 rotated to the laser doping station C.

[0125] In some embodiments, the dust cover 31 is formed in one piece by bending ordinary carbon steel sheet metal, and has a simple structure. In other embodiments, the material and forming method of the dust cover 31 are not limited thereto.

[0126] The dust removal assembly 30 further includes an exhaust pipe 32. One end of the exhaust pipe 32 is connected to the second side plate 312b and communicates with the inner cavity of the dust removal cover 31. The other end of the exhaust pipe 32 is connected to the exhaust device. In this way, while the laser doping device 100 performs laser doping on the silicon wafer S on the adsorption structure 13 rotated to the laser doping station C, the exhaust device can simultaneously perform dust removal on the silicon wafer S rotated to the laser doping station C, which is conducive to further improving the dust removal effect.

[0127] In some embodiments, the exhaust pipe 32 connected to the cleaning assembly 20 and the exhaust pipe 32 connected to the dust removal assembly 30 are connected to the same exhaust device through a three-way connecting pipe. That is, the exhaust device exhausts the cleaning station D and the laser doping station C at the same time, so as to absorb the dust and / or debris on the surface of the silicon wafer S located on the absorption structures 13 of the cleaning station D and the laser doping station C at the same time.

[0128] The dust removal assembly 30 further includes a door panel 33. The door panel 33 is movably connected to the dust removal cover 31. In this way, when a problem occurs during the operation of the dust removal assembly 30, the door panel 33 can be opened to adjust the position of the silicon wafer S at the laser doping station C or to remove the silicon wafer S. Therefore, the provision of the door panel 33 facilitates timely intervention in the production process, rapid fault diagnosis and problem solving, and thus helps to improve production flexibility.

[0129] The dust removal assembly 30 further includes a hinge 34. The door panel 33 and the fourth side panel 312d of the dust removal cover 31 are movably connected via the hinge 34, but the present invention is not limited thereto.

[0130] The dust removal assembly 30 also includes a handle 35. The handle 35 is provided on the door panel 33 to facilitate the opening and closing of the door panel 33. The dust removal assembly 30 also includes a support structure 36. The support structure 36 is used to relatively rotate the dust cover 31 until the adsorption structure 13 of the laser doping station C is suspended. The support structure 36 includes a bottom plate 361, a vertical plate 362 and a reinforcing plate 363. The vertical plate 362 is located on the bottom plate 361 and connected to the bottom plate 361. The first side plate 312a of the dust cover 31 is connected to the vertical plate 362, and the bottom of the dust cover 31 has a predetermined distance from the bottom plate 361 to reserve a specific space for the rotating platform 12 and the adsorption structure 13. The reinforcing plate 363 is connected to the bottom plate 361 and the vertical plate 362 to enhance the support strength of the vertical plate 362 to the dust cover 31. A plurality of reinforcing plates 363 may be provided to enhance the structural stability of the dust cover 31, but is not limited thereto.

[0131] The specific working process of the laser doping device 100 according to the embodiment of the present application is described in detail below.

[0132] When there is no silicon wafer S adsorbed on the adsorption structure 13 at the loading and unloading station A, or the adsorption structure 13 at the loading and unloading station A is in an empty state, the loading and unloading mechanism 110 performs a loading operation on the adsorption structure 13 at the loading and unloading station A to load the silicon wafer S to be doped onto the adsorption structure 13. After the silicon wafer S is adsorbed on the adsorption structure 13, the motor 11 drives the rotating platform 12 to rotate 90 degrees counterclockwise, so that the adsorption structure 13 is at the detection station B. At this time, the debris detection mechanism 120 locates the silicon wafer S on the adsorption structure 13 at the detection station B and detects debris.

[0133] If the silicon wafer S adsorbed on the adsorption structure 13 is qualified after inspection, the motor 11 drives the rotating platform 12 to rotate counterclockwise by 90 degrees, so that the adsorption structure 13 is in the laser doping station C. The laser doping mechanism 130 performs laser doping on the qualified silicon wafer S on the adsorption structure 13 located at the laser doping station C; the dust removal component 30 simultaneously performs dust removal on the silicon wafer S undergoing laser doping. After the doping is completed, the motor 11 drives the rotating platform 12 to rotate counterclockwise by 90 degrees, so that the adsorption structure 13 is in the cleaning station D, and the cleaning component 20 cleans the doped silicon wafer S. During the cleaning process, the wind knife 23 blows air on one side of the silicon wafer S, and the exhaust device exhausts air above the exhaust hood 21, thereby forming an airflow along the air duct opening H3, the cover opening H2 of the exhaust hood 21, the inner cavity of the exhaust hood 21, and the exhaust port H1 of the exhaust hood 21 to the exhaust device, so that dust and debris are sucked into the exhaust device. After cleaning is completed, the motor 11 drives the rotating platform 12 to rotate counterclockwise 90 degrees, so that the adsorption structure 13 is in the loading and unloading station A. The loading and unloading mechanism 110 removes the silicon wafer S that has been doped and cleaned, and loads another silicon wafer S to be doped onto the adsorption structure 13, and then the next cycle is carried out.

[0134] In addition, if the silicon wafer S adsorbed on the adsorption structure 13 is unqualified after detection, the motor 11 drives the rotating platform 12 to rotate counterclockwise by 90 degrees, so that the adsorption structure 13 is in the laser doping station C. It should be noted that when the silicon wafer on the laser doping station is an unqualified silicon wafer, the laser doping mechanism 130 suspends its operation, and the laser doping mechanism 130 will not laser dope the unqualified silicon wafer S on the adsorption structure 13 located at the laser doping station C. Then, the motor 11 drives the rotating platform 12 to rotate counterclockwise by 90 degrees, so that the adsorption structure 13 and the unqualified silicon wafer adsorbed thereon are in the cleaning station D, and the cleaning component 20 cleans the unqualified silicon wafer S to remove the debris and dust on the unqualified silicon wafer S. Similarly, during the cleaning process, the wind knife 23 blows air on one side of the silicon wafer S, and the exhaust device extracts air above the exhaust hood 21, thereby forming an airflow along the air duct opening H3, the cover opening H2 of the exhaust hood 21, the inner cavity of the exhaust hood 21, and the exhaust port H1 of the exhaust hood 21 to the exhaust device, so that dust and / or debris are quickly sucked into the exhaust device to maximize the dust removal efficiency. After the cleaning is completed, the motor 11 drives the rotating platform 12 to rotate counterclockwise by 90 degrees, so that the adsorption structure 13 is in the loading and unloading station A, and the loading and unloading mechanism 110 removes the unqualified silicon wafer S, and loads another silicon wafer S to be doped onto the adsorption structure 13, and then the next cycle is carried out.

[0135] In the laser doping equipment of the related art, a plurality of air blowing pipes are provided to blow air to the silicon wafers during the process of clamping and carrying. The air blowing of the pipes is uneven, the air blowing dust removal effect is poor, the structure is relatively complex, and the cost is high. In the laser doping equipment 100 of the embodiment of the present application, the exhaust hood 21 and the air knife 23 in the dust removal mechanism 140 have a simple structure, which is convenient for installation and disassembly as well as after-sales maintenance. It can reduce the manpower and material costs caused by the wear of parts and the replacement of corresponding parts to a certain extent, and also shorten the debugging time of the dust removal structure, which is convenient for the maintenance and maintenance of the dust removal structure in the later stage. At the same time, it also improves the economic applicability of the dust removal structure, and achieves the purpose of reducing costs and increasing efficiency. In addition, in the laser doping equipment 100 of the embodiment of the present application, under the joint action of the air knife 23, the exhaust hood 21 and the exhaust device, the dust removal mechanism 140 can realize the overall blowing and adsorption of dust and debris on the silicon wafer S at the cleaning station D, with good dust removal effect and low cost. Moreover, in the laser doping equipment 100 of the embodiment of the present application, the rotating platform 12 can drive the adsorption structure 13 to rotate to switch between the laser doping station C and the cleaning station D, so that the cleaning station D can further remove dust from the doped silicon wafer S, or remove dust and absorb debris from the cracked silicon wafer S during the previous transportation process, which is beneficial to improving the production yield of photovoltaic cells.

[0136] The above implementation modes are only used to illustrate the technical solutions of the present application and are not intended to limit the present application. Although the present application has been described in detail with reference to the above preferred implementation modes, a person skilled in the art should understand that the technical solutions of the present application may be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present application.

Claims

1. A dust removal mechanism for laser doping equipment, the laser doping equipment comprising a laser doping station and a cleaning station for laser doping, characterized in that: The dust removal mechanism comprises: A rotating assembly, comprising a rotating platform and at least one adsorption structure disposed on the rotating platform, wherein the adsorption structure is used to adsorb silicon wafers, and the rotating platform is used to drive the adsorption structure to rotate to switch between the laser doping station and the cleaning station; and A cleaning assembly, comprising an air knife and an exhaust hood, wherein the air knife is used to blow air toward the adsorption structure rotating to the cleaning station, the exhaust hood comprises a hood body and a blocking member connected to the hood body, the hood body comprises an exhaust port and a cover opening that are opposite and connected, the exhaust port is used to be connected to an exhaust device, and the cover opening is used to cover the adsorption structure rotating to the cleaning station; At the cover opening, the enclosure is connected to a portion of the edge of the cover body and is enclosed with the cover body to form an air duct opening, and the air duct opening is arranged toward the air outlet of the wind knife; From a first direction from the cover opening to the air outlet, a cross-sectional dimension of the air exhaust hood along a direction perpendicular to the first direction gradually decreases.

2. The dust removal mechanism according to claim 1, characterized in that: The cover body includes a plurality of inclined plates connected in series, and the enclosure includes a plurality of ribs connected in series; each rib is connected to a corresponding inclined plate, and the inclined plate facing the air outlet of the wind knife is not connected to the rib to form the air duct opening.

3. The dust removal mechanism according to claim 1, characterized in that: The distance between the wind knife and the rotation center of the rotating platform is smaller than the distance between the adsorption structure and the rotation center of the rotating platform.

4. The dust removal mechanism according to claim 1, characterized in that: The cleaning component also includes an angle adjustment structure, which is connected to the wind knife and is used to adjust the air outlet angle of the wind knife.

5. The dust removal mechanism according to claim 1, characterized in that: The laser doping equipment includes a mounting platform, and the cleaning assembly also includes a first connecting structure and a second connecting structure; the exhaust hood is installed on the mounting platform through the first connecting structure; and the wind knife is installed on the mounting platform through the second connecting structure.

6. The dust removal mechanism according to claim 1, characterized in that: The dust removal mechanism also includes a dust cover connected to the exhaust device, and the dust cover is used to cover the adsorption structure rotated to the laser doping station; the dust cover is provided with a light through hole so that the laser can pass through the light through hole to perform laser doping on the silicon wafer on the adsorption structure rotated to the laser doping station.

7. The dust removal mechanism according to claim 6, characterized in that: The dust removal mechanism also includes a door plate, and the door plate is movably connected to the dust removal cover.

8. The dust removal mechanism according to any one of claims 1 to 7, characterized in that: Four groups of the adsorption structures are arranged on the rotating platform; the laser doping equipment also has a loading and unloading station and a detection station. Along the rotating path of the rotating platform, the loading and unloading station, the detection station, the laser doping station and the cleaning station are arranged in sequence; Driven by the rotating platform, at the same time, there is an adsorption structure at the loading and unloading station, the detection station, the laser doping station and the cleaning station.

9. A laser doping device, characterized in that: The laser doping device includes a laser doping station and a cleaning station for laser doping, and the laser doping device also includes: The dust removal mechanism according to any one of claims 1 to 8; and The laser doping mechanism is used to perform laser doping on the silicon wafer on the adsorption structure rotated to the laser doping station.

10. The laser doping device according to claim 9, characterized in that: The laser doping equipment further comprises a loading and unloading station and a detection station, and the loading and unloading station, the detection station, the laser doping station and the cleaning station are sequentially arranged along the rotation path of the rotating platform; The laser doping equipment also includes a loading and unloading mechanism and a debris detection mechanism; The loading and unloading mechanism is arranged corresponding to the loading and unloading station, and is used for loading and unloading the adsorption structure rotated to the loading and unloading station; The debris detection mechanism is arranged corresponding to the detection station and is used to position and detect debris on the silicon wafer on the adsorption structure rotated to the detection station.

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