LED packaging structure and LED lamp
By setting a reflective layer in the LED package structure, the light beam emitted by the LED chip is reflected, and the problem of insufficient luminance of a single LED lamp bead is solved, and the effect of improving the luminance of the LED package structure and reducing power consumption is achieved.
Patent Information
- Application Number
- CN202420627484.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-03-27
- Publication Date
- 2025-03-11
- Estimated Expiration
- 2034-03-27
AI Technical Summary
The luminance of a single LED lamp bead in the prior art is not sufficient to meet the increasing light source requirements, and the brightness is usually increased by increasing the current of the LED lamp bead, but this increases power consumption.
By providing a reflective layer in the LED package structure, the reflective layer surrounds the periphery of the LED chip to reflect the light beam emitted by the LED chip, thereby increasing the number of reflected light and increasing the reflectivity and luminance of the LED package structure.
The luminance of the LED package structure is improved, and the need to increase operating current to increase brightness is reduced, thereby reducing overall power consumption.
Smart Images
Figure CN222602940U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of LED technology, and in particular to an LED packaging structure and an LED luminaire. Background Technology
[0002] LED lights are widely used in home appliances, drones, and other fields, such as air conditioner indicator lights, temperature display panels for air conditioners and refrigerators, operation display panels for washing machines, drone status displays, and drone outline displays. LED lights are characterized by high efficiency, energy saving, and environmental friendliness, and can be used in various types of displays, such as digital displays, LED screens, outline indicator lights, and low-power LED panels.
[0003] However, in some scenarios, the luminous intensity of a single LED is insufficient to meet the increasingly demanding requirements of light sources. Current solutions typically involve increasing the current of each LED in the luminaire to achieve the required brightness, but this undoubtedly increases overall power consumption.
[0004] Therefore, there is still a need to improve and develop the existing technology. Utility Model Content
[0005] In view of the shortcomings of the prior art, the purpose of this application is to provide an LED packaging structure and an LED lamp, which aims to solve the problem of insufficient luminous intensity of a single LED bead in the prior art.
[0006] The technical solution of this application is as follows: An LED packaging structure is provided, comprising: a substrate; a plurality of pads arranged in an array on the substrate; an LED chip disposed on the pads by die bond adhesive; a reflective layer disposed around the LED chip for reflecting the light beam emitted by the LED chip; and an encapsulating layer disposed on the LED chip.
[0007] A further provision of this application includes: a plurality of first reflective walls, each of the first reflective walls being disposed on the substrate along a first direction, and the reflective layer being located between the respective first reflective walls, the reflective layer being connected to the first reflective walls.
[0008] A further provision of this application includes: a plurality of second reflective walls, each of the second reflective walls being disposed on the substrate along a second direction, the second reflective walls being located between each of the first reflective walls and also being connected to the reflective layer, wherein the first direction and the second direction are perpendicular to each other.
[0009] In a further embodiment of this application, the reflective layer is either white or black.
[0010] In a further embodiment of this application, the LED chip is a standard-mounted chip or an inverted-mounted chip.
[0011] In a further embodiment of this application, the first reflective wall is made by means of marking lines with glue, spraying glue, or printing.
[0012] In a further embodiment of this application, the reflective layer is a wall structure and is disposed around the periphery of the LED chip, wrapping each side of the LED chip.
[0013] In a further embodiment of this application, the substrate is a BT substrate, an FPC substrate, a ceramic substrate, or an FR4 substrate.
[0014] This application also provides an LED lamp, which includes: a lamp body and the LED encapsulation structure described above, wherein the LED encapsulation structure is disposed within the lamp body.
[0015] Beneficial Effects: This application discloses an LED packaging structure and an LED lamp. The LED packaging structure includes: a substrate; multiple pads arranged in an array on the substrate; an LED chip disposed on the pads by die-attach adhesive; a reflective layer disposed around the LED chip for reflecting the light emitted by the LED chip; and an encapsulating layer disposed on the LED chip. The reflective layer in the LED packaging structure reflects the light emitted by the LED chip, increasing the amount of reflected light and improving the reflectivity of the LED packaging structure, thereby enhancing the luminous efficacy of the LED packaging structure. Attached Figure Description
[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0017] Figure 1 A three-dimensional structural diagram of an LED packaging structure provided in this application when the LED chip is a front-mounted chip;
[0018] Figure 2 for Figure 1 An exploded view of the LED packaging structure described herein;
[0019] Figure 3A three-dimensional structural diagram of an LED packaging structure provided in this application when the LED chip is an inverted chip;
[0020] Figure 4 for Figure 3 An exploded view of the LED packaging structure described herein;
[0021] Figure 5 For the reason Figure 1 A three-dimensional structural diagram of the LED packaging structure described herein, with the first and second reflective walls provided;
[0022] Figure 6 for Figure 5 An exploded view of the LED packaging structure described herein;
[0023] Figure 7 For the reason Figure 3 A three-dimensional structural diagram of the LED packaging structure described herein, with the first and second reflective walls provided;
[0024] Figure 8 for Figure 7 An exploded view of the LED packaging structure described herein;
[0025] Figure 9 For the reason Figure 5 A three-dimensional structural diagram of the LED packaging structure described herein, in which the heights of the first and second reflective walls are flush with the top of the encapsulation layer.
[0026] Figure 10 For the reason Figure 1 A three-dimensional structural diagram of an LED array composed of the LED packaging structure described herein;
[0027] Figure 11 for Figure 10 An exploded view of the LED array described above;
[0028] Figure 12 For the reason Figure 3 A three-dimensional structural diagram of an LED array composed of the LED packaging structure described herein;
[0029] Figure 13 for Figure 12 An exploded view of the LED array described above;
[0030] Figure 14 For the reason Figure 5 A three-dimensional structural diagram of an LED array composed of the LED packaging structure described herein;
[0031] Figure 15 for Figure 14 An exploded view of the LED array described above;
[0032] Figure 16 For the reason Figure 7 A three-dimensional structural diagram of an LED array composed of the LED packaging structure described herein;
[0033] Figure 17 for Figure 16 An exploded view of the LED array described above;
[0034] Explanation of reference numerals in the attached figures: 10, substrate; 20, pad; 30, die bond; 40, first reflective wall; 50, second reflective wall; 60, LED chip; 70, reflective layer; 80, encapsulating layer; aa, first direction; bb, second direction. Detailed Implementation
[0035] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present application.
[0036] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other.
[0037] Currently, in some scenarios, the luminous intensity of a single LED is insufficient to meet the ever-increasing demands of light sources. Existing solutions typically involve increasing the current of each LED in the luminaire to achieve the required brightness, but this undoubtedly increases overall power consumption.
[0038] Therefore, in order to improve the luminous intensity of LED chips and reduce power consumption, this application provides an LED packaging structure and an LED lamp, which are described below in conjunction with specific embodiments. Figures 1 to 17 Please provide an explanation. For example... Figures 1 to 9 As shown, this application provides an LED packaging structure, which includes: a substrate 10, a plurality of pads 20, an LED chip 60, a reflective layer 70 and an encapsulating layer 80.
[0039] like Figures 1 to 4 As shown, each of the pads 20 is disposed on the substrate 10, and each pad 20 has a circular hole; the LED chip 60 is disposed on the pad 20 by die bond 30; the reflective layer 70 is disposed around the LED chip 60, and the reflective layer 70 is used to reflect the light beam emitted by the LED chip 60; the encapsulating layer 80 is disposed on the LED chip 60.
[0040] Specifically, the substrate 10 is an LED substrate 10. For example, the substrate 10 can be one of a BT substrate 10, an FPC substrate 10, a ceramic substrate 10, or an FR4 substrate 10. Multiple pairs of pads 20 are soldered onto the substrate 10. The pads 20 are specifically metal polarity pads 20, and can be copper, gold-plated, or silver-plated pads 20. Each pad 20 has a circular hole, and the pads 20 are specifically disposed on the substrate 10 by soldering. The die-attach adhesive 30 is disposed on the pads 20, and the LED chip 60 can be disposed on the pads 20 through the die-attach adhesive 30. In this application, as... Figure 1 and Figure 2 As shown, the LED chip 60 can be a standard-sized chip; as Figure 3 and Figure 4 As shown, the LED chip 60 can also be an inverted chip. Furthermore, the LED chip 60 can also be a single-electrode red or yellow chip, or a dual-electrode blue / green chip, etc.
[0041] For the upright LED chip 60, a die bond 30 is placed on one of the pads 20, and then the LED chip 60 is placed on the die bond 30 for fixation. However, for the inverted LED chip 60, because the inverted LED chip 60 has two electrodes at the bottom, such as... Figure 4 As shown, two pieces of the die bond adhesive 30 are needed to be placed on the two pads 20, and then the LED chip 60 is placed on the die bond adhesive 30 for fixation. In this application, the die bond adhesive 30 can be made of conductive silver paste, insulating adhesive, or solder paste, etc.
[0042] In this application, to improve the luminous efficacy of the LED packaging structure, a reflective layer 70 is provided around the LED chip 60, and the reflective layer 70 is located on the surface of the substrate 10. The reflective layer 70 has a certain thickness, capable of covering the pads 20, connecting lines, and the natural color of the substrate 10. Furthermore, the reflective layer 70 has a certain height, capable of partially or completely enclosing the various sides of the LED chip 60. By providing the reflective layer 70, the light emitted from the LED chip 60 is directly reflected by the reflective layer 70, thereby avoiding light absorption and scattering loss by the substrate 10, the pads 20, and the connecting lines of the pads 20. This allows the LED packaging structure to directly reflect the light emitted by the LED chip 60 through the reflective layer 70.
[0043] The reflective layer 70 can be made of high-reflectivity ink, epoxy resin with titanium dioxide, or silicone resin with white high-reflectivity particles (white pigment, white pigment, black pigment, black pigment), so that the reflectivity of the reflective layer 70 can be greater than 90%; the reflective layer 70 can also be made of white oil, so that the reflectivity of the reflective layer 70 is greater than 95%; in addition, the reflective layer 70 can also be made of reflective material, so that the reflectivity of the reflective layer 70 can reach 99%, thereby increasing the reflectivity of the LED packaging structure.
[0044] Furthermore, the reflective layer 70 is a wall structure and is arranged around the periphery of the LED chip 60, wrapping around all sides of the LED chip 60. By wrapping around all sides of the LED chip 60, the reflective layer 70 can shield the light emitted from the sides of the LED chip 60, allowing only the light emitted from the front of the LED chip 60 to pass through. This makes the light emitted by the LED chip 60 easier to use in subsequent optical design, thereby increasing the usability of the LED packaging structure.
[0045] Furthermore, regarding the relative position of the reflective layer 70 and the LED chip 60, the reflective layer 70 is disposed on the periphery of the LED chip 60, and the reflective layer 70 may be disposed in contact with the LED chip 60; similarly, the reflective layer 70 may also be disposed at a distance from the LED chip 60, and the reflective layer 70 reflects the light beams emitted from the LED chip 60 from its various sides.
[0046] Of course, the height of the reflective layer 70 is set to a certain height, so that the light emitted by the LED chip 60 towards the reflective layer 70 will be blocked. By setting the reflective layer 70, this light is blocked on the inner wall of the reflective layer 70, thereby avoiding the scattering and loss of this part of the light, allowing the LED chip 60 to emit light more concentratedly on its front side. In this way, by setting the reflective layer 70, the light beam emitted by the LED packaging structure is more concentrated and stronger, thereby improving the luminous efficacy of the LED packaging structure.
[0047] The height of the reflective layer 70 can be higher than, equal to, or lower than the height of the LED chip 60, and can be set according to the user's actual situation. It is understood that when the height of the reflective layer 70 is higher than the LED chip 60, the reflectivity of the LED package structure can be increased; of course, if the user needs to reduce the reflectivity of the LED package structure, the height of the reflective layer 70 can be set to be lower than or equal to the height of the LED chip 60.
[0048] In this way, in the LED packaging structure, the reflective layer 70 reflects the light emitted by the LED chip 60, thereby increasing the amount of reflected light and improving the reflectivity of the LED packaging structure. This achieves the effect of increasing the luminous intensity of a single LED packaging structure. Furthermore, it does not require increasing the operating current to improve brightness and also reduces the overall power consumption.
[0049] Furthermore, the reflective layer 70 is white or black. Specifically, the reflective layer 70 can be made of epoxy resin with titanium dioxide, silicone with titanium dioxide, or white ink, making the reflective layer 70 white.
[0050] To further improve the luminous brightness of the LED packaging structure, the reflective layer 70 can be white. By setting the reflective layer 70 to white, more light emitted by the LED chip can be reflected, effectively increasing the reflectivity and luminous brightness of the LED packaging structure.
[0051] Furthermore, in specific applications, there may be situations where it is necessary to reduce the luminous brightness of the LED packaging structure. In this case, the reflective layer 70 can be set to black. The reflective layer 70 can be made of black ink, epoxy resin with carbon black powder, silicone with carbon black powder, epoxy resin with carbon black, or silicone with carbon black. The carbon black powder can also be black pigment, making the reflective layer 70 black, so as to appropriately reduce the reflectivity and luminous brightness of the LED packaging structure.
[0052] Furthermore, in one possible implementation, in order to further improve the luminous efficacy of the LED packaging structure, this application may further... Figures 1 to 4 Based on the LED packaging structure shown, as Figures 5 to 9 As shown, the LED packaging structure further includes: a plurality of first reflective walls 40 and a plurality of second reflective walls 50.
[0053] Specifically, this application provides a plurality of first reflective walls 40 on the substrate 10. Each first reflective wall 40 is disposed on the substrate 10 along a first direction aa, and the reflective layer 70 is located between each first reflective wall 40, and the reflective layer 70 is connected to the first reflective wall 40. When setting the first reflective wall 40, the circular holes on the pad 20 can be blocked by means of scribing, spraying, or printing to form the first reflective wall 40. Of course, the circular holes on the pad 20 can also be blocked by printing first, and then the first reflective wall 40 can be formed on the substrate 10 by dispensing.
[0054] The first reflective wall 40, positioned along the first direction aa on both sides of the LED chip 60, can reflect a portion of the light beam emitted by the LED chip 60, thereby increasing the amount of reflected light and improving light utilization. Simultaneously, the reflective layer 70 may allow some light beam to pass through; the first reflective wall 40 can further reflect this transmitted light beam. In this way, more light emitted by the LED chip 60 will be reflected, thus increasing the overall reflectivity and brightness of the LED packaging structure. The first reflective wall 40 can be made of white ink, epoxy resin with titanium dioxide, or silicone with titanium dioxide, meaning it is white.
[0055] Therefore, in this application, the light emitted by the LED chip 60 is reflected by the first reflective wall 40 and the reflective layer 70, thereby increasing the amount of reflected light and improving light utilization. Furthermore, the light beam emitted by the LED chip 60 towards the first reflective wall 40 and the reflective layer 70 is blocked and reflected from them, thus avoiding scattering and loss of this light. This allows the LED chip 60 to emit light more concentratedly on its front side, making the light beam emitted by the LED packaging structure more focused and stronger, thereby improving the luminous efficacy of the LED packaging structure.
[0056] In addition, in order to encapsulate the LED packaging structure, such as Figures 1 to 9 As shown, this application provides an encapsulation layer 80 on the LED chip 60 to encapsulate the LED packaging structure. The encapsulation layer 80 is specifically a transparent colloid. Exemplary examples of the encapsulation layer 80 may include one of epoxy resin, silicone resin, transparent colloid with phosphor, or transparent colloid with melanin.
[0057] And, as Figures 10 to 17 As shown, in the actual fabrication of the LED packaging structure, an LED packaging array containing multiple LED packaging structures is first fabricated, and then cut to form a single LED packaging structure.
[0058] Furthermore, in one possible implementation, such as Figures 5 to 9As shown, the LED packaging structure further includes a plurality of second reflective walls 50, each of which is disposed on the substrate 10 along a second direction bb. The second reflective walls 50 are located between the first reflective walls 40 and are also connected to the reflective layer 70. The first direction aa and the second direction bb are perpendicular to each other. Furthermore, the second reflective walls 50 also have a certain height, thus blocking the light emitted by the LED chip 60 towards the second reflective walls 50. By setting the second reflective walls 50, this light is blocked, thereby avoiding scattering and loss of this light, allowing the LED chip 60 to emit light more concentratedly on its front side. Thus, the arrangement of the second reflective walls 50 makes the light beam emitted by the LED packaging structure more concentrated and stronger, further improving the luminous efficacy of the LED packaging structure.
[0059] Therefore, by setting the first reflective wall 40 in the first direction aa and the second reflective wall 50 in the second direction bb, the first reflective wall 40 and the second reflective wall 50 form a fence structure around the LED chip 60. Furthermore, as... Figure 9 As shown, regarding the heights of the first reflective wall 40 and the second reflective wall 50, the heights of the first reflective wall 40 and the second reflective wall 50 can be set flush with the top of the sealant layer 80. Alternatively, the heights of the first reflective wall 40 and the second reflective wall 50 can be set higher than the top of the sealant layer 80, meaning the sealant layer 80 does not cover the first reflective wall 40 and the second reflective wall 50. Furthermore, as... Figure 5 and Figure 7 As shown, the sealing layer 80 can also be set to seal and cover the first reflective wall 40 and the second reflective wall 50.
[0060] Of course, the second reflective wall 50 can also be formed by scribe-and-apply adhesive followed by baking. Alternatively, it can be formed by spraying adhesive or printing. The second reflective wall 50, positioned along the second direction bb on both sides of the LED chip 60, can reflect the light emitted by the LED chip 60, increasing the amount of reflected light and improving light utilization. This way, more light emitted by the LED chip 60 will be reflected, thereby increasing the overall brightness of the LED package structure. The second reflective wall 50 can be made of white ink, epoxy resin with titanium dioxide, or silicone with titanium dioxide, making it white.
[0061] In this application, multiple second reflective walls 50 can be provided in the LED packaging structure to further improve the luminous intensity of the LED packaging structure.
[0062] This application also provides an LED lamp fixture, which includes: a lamp fixture body and the LED encapsulation structure described above, wherein the LED encapsulation structure is disposed within the lamp fixture body. Since the LED encapsulation structure 100 has been described in detail above, it will not be repeated here.
[0063] It should be noted that this application uses an LED packaging structure and an LED lamp as examples to introduce the specific structure and working principle of this application, but the application of this application is not limited to LED packaging structures and LED lamps, and can also be applied to other similar workpieces.
[0064] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.
[0065] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. An LED packaging structure, characterized in that: include: substrate; A plurality of pads, wherein the plurality of pads are arranged in an array on the substrate; An LED chip, wherein the LED chip is arranged on the pad by a bonding adhesive; A reflective layer, the reflective layer is arranged at the periphery of the LED chip, and the reflective layer is used to reflect the light beam emitted by the LED chip; A sealing layer is arranged on the LED chip.
2. The LED packaging structure according to claim 1, characterized in that: Also includes: A plurality of first reflection walls are provided, each of the first reflection walls is arranged on the substrate along a first direction, and the reflection layer is located between each of the first reflection walls, and the reflection layer is connected to the first reflection walls.
3. The LED packaging structure according to claim 2, characterized in that: Also includes: A plurality of second reflection walls, each of which is arranged on the substrate along a second direction, is located between each of the first reflection walls and is also connected to the reflection layer, and the first direction is perpendicular to the second direction.
4. The LED packaging structure according to claim 1, characterized in that: The reflective layer is white or black.
5. The LED packaging structure according to claim 1, characterized in that: The LED chip is a front mounted chip or a reverse mounted chip.
6. The LED packaging structure according to claim 2, characterized in that: The first reflection wall is made by scribing, dispensing, spraying or printing.
7. The LED packaging structure according to claim 1, characterized in that: The reflective layer is a wall structure and is arranged around the periphery of the LED chip to wrap each side of the LED chip.
8. The LED packaging structure according to claim 1, characterized in that: The substrate is a BT substrate, an FPC substrate, a ceramic substrate or an FR4 substrate.
9. An LED lamp, characterized in that: The LED lamp comprises: a lamp body and the LED packaging structure according to any one of claims 1 to 8, wherein the LED packaging structure is arranged in the lamp body.