Quantitative adhesive dispensing device for high-voltage electrode assembling and bonding insulating adhesive

Abstract

The utility model discloses a high-voltage electrode assembly bonding insulation glue quantitative dispensing device which comprises a base and a glue box, and the base and the glue box are connected in a hinged mode. A workpiece positioning part is arranged on the base, the glue box is provided with a fluid insulation glue accommodating cavity, and a glue dispensing hole is formed in the bottom of the insulation glue accommodating cavity; and in a dispensing state, the dispensing hole is positioned right above the workpiece positioning part. According to the quantitative dispensing device disclosed by the utility model, the dispensing position is standardized through the dispensing hole and the workpiece positioning part, the insulating glue volume is standardized through the dispensing hole, and the dispensing hole is used for quickly and accurately dispensing, so that the bonding quality of a high-voltage electrode is greatly improved.

Description

Technical Field

[0001] The utility model belongs to the field of high-voltage electrode production equipment and relates to a quantitative glue dispensing device, in particular to a quantitative glue dispensing device for bonding insulating glue for high-voltage electrode assembly. Background Art

[0002] With the development of my country's power industry and high-end equipment, high-voltage switches are increasingly used in various large-scale, high-end equipment.

[0003] The high-voltage electrode that has been produced and used is composed of a base, a quartz rod, an electrode rod, a barium titanate ring, and a top cover that are coaxially bonded in sequence by adhesive. In order to improve the assembly accuracy and production efficiency of high-voltage electrodes, the applicant has proposed a solution for high-voltage electrode positioning and assembly kits.

[0004] In the process of implementing the utility model, the inventor discovered that the prior art has at least one of the following technical problems:

[0005] 1. In the process of using insulating glue to bond high-voltage electrode accessories, the amount of glue dispensed at a time is small, and manual dispensing is prone to excessive or insufficient glue. In addition, the deviation of the dispensing position causes the insulating glue to be unevenly distributed on the bonding surface, resulting in discharge in the high-voltage electrode. The product qualification rate needs to be further improved;

[0006] 2. In the past, in order to improve the product qualification rate, caution was required during the dispensing process, which in turn affected the assembly efficiency of the entire high-voltage electrode product.

[0007] Glue dispensing quality has become an important limiting factor for high-voltage electrode assembly quality and production efficiency. Utility Model Content

[0008] In view of this, the purpose of the utility model is to provide a quantitative dispensing device for high-voltage electrode assembly bonding insulating glue that can achieve precise dispensing. By using the dispensing device to dispense glue on the bonding surface, a specific amount of insulating glue can be quickly applied to the center of the bonding surface.

[0009] The inventor has continuously reformed and innovated through long-term exploration and attempts, as well as multiple experiments and efforts, to solve the above technical problems. The technical solution provided by the utility model is to provide a quantitative dispensing device for high-voltage electrode assembly bonding insulating glue, comprising a base and a glue box, the base and the glue box are hingedly connected; the base is provided with a workpiece positioning portion, the glue box is provided with a fluid insulating glue containing chamber, and a dispensing hole is provided at the bottom of the insulating glue containing chamber; in the dispensing state, the dispensing hole is located directly above the workpiece positioning portion.

[0010] According to an embodiment of the utility model of the quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, the workpiece positioning portion is a positioning groove capable of fixing the position of the workpiece.

[0011] According to an embodiment of the utility model of the quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, a positioning hole is also provided at the bottom of the positioning groove.

[0012] According to an embodiment of the utility model of the quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, the glue box includes a closed frame, a glue receiving plate is fixedly provided on the lower surface of the frame, and the dispensing holes are provided on the glue receiving plate.

[0013] According to an embodiment of the utility model, the device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding also includes an insulating glue pushing plate, which is provided with a gripping portion and a glue pushing portion, and the glue pushing portion is in clutch sliding contact with the glue supporting plate.

[0014] According to an embodiment of the utility model of the quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, the glue-bearing plate is an insulating plate printed with dielectric ink.

[0015] According to an embodiment of the utility model of the quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, the frame is a rectangular frame printed with CR-PLA material.

[0016] According to the utility model, a quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly is implemented

[0017]

[0018] Where:

[0019] R1 is the radius of the dispensing hole, h1 is the thickness of the adhesive plate, R2 is the radius of the adhesive sheet circle, and h2 is the thickness of the adhesive sheet.

[0020] According to an embodiment of the utility model of the quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, a handle is also provided on the frame.

[0021] According to an embodiment of the utility model of the quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, the base and the glue box are hingedly connected by a hinge.

[0022] Compared with the prior art, one of the above technical solutions has the following advantages:

[0023] a) An embodiment of the utility model of a quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, which standardizes the dispensing position through the dispensing hole and the workpiece positioning part, standardizes the volume of the insulating glue through the dispensing hole, and uses the dispensing hole for fast and accurate dispensing, thereby greatly improving the bonding quality of the high-voltage electrode.

[0024] b) In one embodiment of the utility model, dielectric ink is used to print the adhesive board, and a high-precision adhesive board can be quickly modeled and printed according to the dispensing amount requirements. Printing with CR-PLA material has green raw materials, light weight, low shrinkage, high rigidity, excellent impact toughness, wear resistance, good dimensional stability, economical and affordable, and can quickly conduct concept verification and design development. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solution of the implementation mode of the utility model, the drawings required for use in the implementation mode will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0026] Figure 1 The utility model is a front structural schematic diagram of a preferred embodiment of a quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly.

[0027] Figure 2 yes Figure 1 The left view is symmetrical to the right view.

[0028] Figure 3 yes Figure 1 Schematic diagram of the top view structure.

[0029] Figure 4 yes Figure 1 Schematic diagram of the structure viewed from above.

[0030] Figure 5 yes Figure 1 Schematic diagram of the three-dimensional structure.

[0031] Figure 6 yes Figure 1 AA cross-sectional view.

[0032] Figure 7 yes Figure 1 Schematic diagram of the three-dimensional structure in the open state.

[0033] Figure 8 A schematic diagram of the three-dimensional structure of an insulating glue push plate in a preferred embodiment of a quantitative dispensing device for insulating glue for high-voltage electrode assembly bonding according to the utility model.

[0034] The marks in the figure are:

[0035] 100 bases,

[0036] 110 positioning slots,

[0037] 120 positioning holes,

[0038] 200 plastic boxes,

[0039] 210 borders,

[0040] 211 handle,

[0041] 220 adhesive board,

[0042] 221 glue holes,

[0043] 300 hinges,

[0044] 400 Insulation Rubber Push Plate,

[0045] 401 grip part,

[0046] 402 Glue Pushing Department. DETAILED DESCRIPTION

[0047] The following is a description with reference to the accompanying drawings and a specific embodiment.

[0048] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model. Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the utility model for which protection is claimed, but merely represents selected embodiments of the utility model.

[0049] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and thus, once an item is defined in one drawing, it may not be further defined or explained in the subsequent drawings.

[0050] See also Figures 1 to 7 . The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding described in this embodiment includes a base 100 and a glue box 200, and the base 100 and the glue box 200 are hingedly connected. This embodiment shows a situation where the base 100 and the glue box 200 are hingedly connected by a hinge 300. The base 100 is a thick plate member used to fix the device on a workbench, and is also a thick plate member used to fix the workpiece. The workpiece refers to a high-voltage electrode part with a circular end face, such as a quartz rod, an electrode rod, etc. bonded with insulating adhesive, or a combination of a quartz rod or an electrode rod and an assembly tool.

[0051] The workpiece is fixed in the base 100 with the adhesive surface of the workpiece facing upwards, so as to receive the adhesive released from the adhesive box 200. Figure 7 The base 100 is provided with a workpiece positioning portion, which is a positioning groove 110 capable of fixing the position of the workpiece. Further, a positioning hole 120 is also provided at the bottom of the positioning groove 110 .

[0052] See also Figures 1 to 6 The glue box 200 is provided with a fluid insulating glue containing cavity, and a glue dispensing hole 221 is provided at the bottom of the insulating glue containing cavity; in the glue dispensing state, that is, Figures 1 to 6 In the state shown, the glue box 200 is fitted with the base 100, and the glue dispensing hole 221 is located directly above the workpiece positioning portion. Specifically, the glue dispensing hole 221 is located directly above the positioning hole 120, and the glue dispensing hole 221 is coaxially arranged with the positioning hole 120. The end face of the high-voltage electrode part is circular, and the axis of the circular part is colinearly arranged with the axis of the glue dispensing hole 221 and the positioning hole 120, ensuring that the glue in the glue dispensing hole 221 is located at the center of the circular end face of the high-voltage electrode part, so that the glue can evenly extend from the center to the surroundings when pressed, and form a circular glue thin layer on the end face.

[0053] See also Figure 5 The plastic box 200 includes a closed frame 210. In this embodiment, the frame 210 is a rectangular frame. The frame 210 is a rectangular frame printed with CR-PLA material. In a preferred embodiment, a handle 211 is also provided on the frame 210 to facilitate flipping the plastic box 200 so that the plastic box 200 can be opened and closed. Figure 5 The closed state shown and Figure 7 Switch to the on state shown.

[0054] A glue-bearing plate 220 is fixedly disposed on the lower surface of the frame 210 . The glue-bearing plate 220 is an insulating plate printed with dielectric ink. The glue-dispensing holes 221 are disposed on the glue-bearing plate 220 .

[0055] In order to ensure that the adhesive thickness and area of ​​the circular adhesive layer meet the requirements, it is necessary to

[0056]

[0057] In Formula I:

[0058] R1 is the radius of the glue dispensing hole 221, h1 is the thickness of the glue supporting plate 220, R2 is the radius of the adhesive sheet circle, and h2 is the thickness of the adhesive sheet.

[0059] For example, in a high-voltage electrode product, the quartz rod is a cylinder with a diameter of 7.4 mm. When bonding, the radius R2 of the adhesive sheet is required to be 3.6 mm. The bonding parts are squeezed by a constant pressure (for example, 5 kg). When the diameter of the adhesive sheet is 7.2 mm, the thickness of the adhesive sheet is recorded, that is, the thickness h2 of the adhesive sheet (for example, 0.09 mm). The printing thickness h1 of the adhesive plate 220 is preferably 1 mm. After calculation, the radius R1 of the glue dispensing hole 221 should be 1.08 mm. Of course, it should be pointed out that there are many other options for the thickness h2 of the adhesive sheet.

[0060] See also Figure 8 , and also includes an insulating glue push plate 400, wherein the insulating glue push plate 400 is provided with a gripping portion 401 and a glue pushing portion 402, and the glue pushing portion 402 is in clutch sliding contact with the glue supporting plate 220. The main function of setting the insulating glue push plate 400 is to push the insulating glue on the glue supporting plate 220 into the glue dispensing hole 221, and to push away the excess insulating glue above the glue dispensing hole 221, so as to accurately control the amount of insulating glue in the glue dispensing hole 221. The glue box 200 is rotated to separate the insulating glue in the glue supporting plate 220 and the glue dispensing hole 221, and the insulating glue is released from the glue dispensing hole 221. The two bonded parts are flattened on the insulating glue released from the glue dispensing hole 221 under the same constant pressure to obtain a thin adhesive sheet with a radius of R1.

[0061] By dispensing glue using the quantitative dispensing device for the high-voltage electrode assembly bonding insulating glue of this embodiment and then assembling it using the high-voltage electrode positioning assembly kit, the obtained adhesive sheets have high consistency in size and are free of insufficient glue, excessive glue, and uneven distribution.

[0062] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present invention.

[0063] In the present invention, unless otherwise clearly specified and limited, the terms "install", "connect", "connect", "fix" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0064] The above are only preferred embodiments of the present invention. It should be noted that the above preferred embodiments should not be regarded as limiting the present invention. The protection scope of the present invention should be based on the scope defined by the claims. For ordinary technicians in this technical field, several improvements and modifications can be made without departing from the spirit and scope of the present invention, and these improvements and modifications should also be regarded as the protection scope of the present invention.

Claims

1. A quantitative dispensing device for bonding insulating glue for high-voltage electrode assembly, characterized in that: It includes a base and a glue box, which are hingedly connected; a workpiece positioning portion is provided on the base, and the glue box is provided with a fluid insulating glue accommodating chamber, and a glue dispensing hole is provided at the bottom of the insulating glue accommodating chamber; in the glue dispensing state, the glue dispensing hole is located directly above the workpiece positioning portion.

2. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 1 is characterized in that: The workpiece positioning portion is a positioning groove capable of fixing the position of the workpiece.

3. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 2 is characterized in that: A positioning hole is also provided at the bottom of the positioning groove.

4. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to any one of claims 1 to 3, characterized in that: The glue box comprises a closed frame, a glue receiving plate is fixedly arranged on the lower surface of the frame, and the glue dispensing holes are arranged on the glue receiving plate.

5. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 4 is characterized in that: It also includes an insulating rubber pushing plate, which is provided with a gripping portion and a rubber pushing portion, and the rubber pushing portion is in clutch sliding contact with the rubber bearing plate.

6. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 4 is characterized in that: The adhesive board is an insulating board printed with dielectric ink.

7. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 4 is characterized in that: The frame is a rectangular frame printed with CR-PLA material.

8. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 4 is characterized in that: The radius R1 of the dispensing hole is: Where: R1 is the radius of the dispensing hole, h1 is the thickness of the adhesive plate, R2 is the radius of the adhesive sheet circle, and h2 is the thickness of the adhesive sheet.

9. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 7, characterized in that: A handle is also provided on the frame.

10. The device for quantitatively dispensing insulating glue for high-voltage electrode assembly bonding according to claim 1, characterized in that: The base and the plastic box are hingedly connected via a hinge.

Images