Polishing wheel device
By designing both ends of the polishing pads into the mounting grooves in the polishing wheel device and fixing them with the pressing components, the problem of semiconductor wafer damage caused by the imperfect sticking of the traditional polishing pads is solved, and a more stable and high-quality polishing process is achieved.
Patent Information
- Application Number
- CN202421278386.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-06-05
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-06-05
AI Technical Summary
The traditional polishing pad technology is directly pasted on the polishing wheel, resulting in unstable pasting and easily causing damage to the semiconductor wafer during the polishing process.
A polishing wheel device is designed, including a polishing wheel body, a polishing pad and a compression assembly, with both ends of the polishing pad protruding into the mounting groove, and fixed by using the compression assembly to enhance the fixing strength and ensure a tight fit.
By enhancing the fixed strength and tight fit of the polishing pad, the offset or looseness of the polishing pad during the polishing process is avoided, and the problem of semiconductor wafer damage caused by traditional technology is solved, the stability and reliability of the system are improved, and the polishing quality is improved.
Smart Images
Figure CN222609157U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of polishing, in particular to a polishing wheel device. Background Art
[0002] As an advanced semiconductor material, indium phosphide (InP) substrates have shown unique value and broad application prospects in high-tech fields, especially in the manufacture of high-frequency and high-power devices and related radio frequency devices such as optical fiber communications, wireless transmission, and radio astronomy. InP substrates have become a key component of high-performance semiconductor devices due to their excellent physical and electronic properties, such as high saturated electron drift velocity, suitable emission wavelength, strong radiation resistance, high photoelectric conversion efficiency, and wide bandgap. These devices perform well in satellite communications and radar systems, especially in demanding RF front-end and analog / mixed signal wide-bandwidth circuit designs, and can meet the needs of high-speed data processing and high-precision wide-bandwidth analog-to-digital conversion.
[0003] However, to fully realize the potential of InP substrates, high-quality surface treatment is essential. Traditional polishing pad technology usually directly adheres the polishing pad to the polishing wheel and fixes it through the back colloid, but there is a problem that the adhesion is not strong enough, which may damage the semiconductor wafer during the polishing process. Utility Model Content
[0004] The technical problem to be solved by the utility model is that the conventional polishing pad technology usually directly adheres the polishing pad to the polishing wheel and fixes it through the back colloid, but there is a problem that the semiconductor wafer is damaged during the polishing process due to the loose adhesion.
[0005] In order to solve the above technical problems, the utility model provides a polishing wheel device, including a polishing wheel body, a polishing pad and a clamping assembly, the polishing wheel body having a mounting surface and a mounting groove opened on the mounting surface, the polishing pad being wrapped around the mounting surface, and both ends of the polishing pad extending into the mounting groove, the clamping assembly being installed in the mounting groove and fitting with the portion of the polishing pad located in the mounting groove so as to fix the portion of the polishing pad located in the mounting groove between the side wall of the mounting groove and the clamping assembly.
[0006] In some embodiments, the clamping assembly includes a pressing plate and a plurality of fixing parts, the mounting groove is provided with a plurality of first mounting holes adapted to the fixing parts, the pressing plate is provided with a plurality of second mounting holes corresponding to the first mounting holes, the fixing parts pass through the corresponding second mounting holes to be connected to the corresponding first mounting holes, and the part of the polishing pad located in the mounting groove is in contact with the pressing plate.
[0007] In some embodiments, the mounting groove is provided through both ends of the polishing wheel body, and the groove width of the mounting groove gradually increases upward from the groove bottom wall of the mounting groove;
[0008] The pressure plate includes a bottom surface and two pressing surfaces that are in contact with the polishing pad. The bottom surface is arranged toward the bottom wall of the mounting groove. The opposite sides of the bottom surface are respectively connected to the pressing surfaces. The pressing surfaces extend along the axis of the second mounting hole and are arranged to be inclined outward.
[0009] In some embodiments, the pressing surface is arranged parallel to the side wall of the corresponding mounting groove.
[0010] In some embodiments, a plurality of the first mounting holes are arranged at equal intervals along the length direction of the mounting slot;
[0011] A plurality of the second mounting holes are arranged at equal intervals along the length direction of the pressing plate.
[0012] In some embodiments, the polishing wheel body includes a wheel body, a first shoulder, a second shoulder and a connecting shaft. The connecting shaft is respectively installed at both ends of the wheel body. The first shoulder is provided at the connection between the connecting shaft and the wheel body. The connecting shaft is provided with a second shoulder. The second shoulder is connected to the side of the first shoulder away from the wheel body. The wheel body has the mounting surface and the mounting groove.
[0013] In some embodiments, the wheel body, the first shoulder, the second shoulder and the connecting shaft are an integrally formed structure.
[0014] In some embodiments, it also includes a mounting bracket, a bearing and a synchronous wheel, the wheel body is connected to the mounting bracket through the connecting shaft, the bearing sleeve is arranged on the corresponding circumferential side of the connecting shaft, and the synchronous wheel sleeve is arranged on the circumferential side of the connecting shaft having the second shaft shoulder.
[0015] In some embodiments, the mounting bracket includes a mounting base and two mounting arms, the opposite sides of the mounting base are respectively connected to the corresponding mounting arms, the mounting arms are connected to the corresponding connecting shafts, and the bearings are arranged in the corresponding mounting arms, and there is a gap between the mounting base and the polishing wheel body.
[0016] In some embodiments, the mounting base has a threaded hole for connection with an external structure.
[0017] Compared with the prior art, the polishing wheel device of the utility model has the following beneficial effects:
[0018] The embodiment of the utility model extends the two ends of the polishing pad into the mounting groove and fixes them with a clamping assembly, which not only enhances the fixing strength of the polishing pad, but also ensures a close fit between the mounting surface and the polishing pad, thereby avoiding deviation or loosening of the polishing pad during polishing, and solves the problem of damage to semiconductor wafers during polishing caused by weak direct bonding of traditional polishing pads, thereby improving the stability and reliability of the entire system and improving the polishing quality. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 It is a structural schematic diagram of the polishing wheel device provided by an embodiment of the utility model;
[0020] Figure 2 It is a structural schematic diagram of the polishing wheel device provided by the embodiment of the utility model without the mounting bracket;
[0021] Figure 3 It is a structural schematic diagram of the mounting bracket provided by an embodiment of the utility model;
[0022] Figure 4 It is a structural schematic diagram of a polishing wheel body provided by an embodiment of the utility model;
[0023] Figure 5 It is provided along the embodiment of the utility model Figure 4 Cross-sectional view in the AA direction;
[0024] Figure 6 It is a structural schematic diagram of a pressing plate provided in an embodiment of the utility model;
[0025] In the figure, 1. polishing wheel body; 11. mounting surface; 12. mounting groove; 121. side wall; 122. first mounting hole; 123. groove bottom wall; 13. wheel body; 14. first shoulder; 15. second shoulder; 16. connecting shaft; 2. polishing pad; 3. clamping assembly; 31. pressure plate; 311. second mounting hole; 312. bottom surface; 313. clamping surface; 32. fixing part; 4. mounting bracket; 41. mounting base; 42. mounting arm; 43. threaded hole; 5. bearing; 6. synchronous wheel. DETAILED DESCRIPTION
[0026] The following is a further detailed description of the specific implementation of the present invention in conjunction with the accompanying drawings and examples. The following examples are used to illustrate the present invention, but are not intended to limit the scope of the present invention.
[0027] like Figure 1 , Figure 2 and Figure 4As shown, the utility model provides a polishing wheel device for polishing substrate sheets, such as semiconductor crystals, etc. The polishing device includes a polishing wheel body 1, a polishing pad 2 and a clamping assembly 3. The polishing wheel body 1 has a mounting surface 11 and a mounting groove 12 opened on the mounting surface 11. The polishing pad 2 is wrapped around the mounting surface 11, and both ends of the polishing pad 2 extend into the mounting groove 12. The clamping assembly 3 is installed in the mounting groove 12 and fits with the portion of the polishing pad 2 located in the mounting groove 12, so as to fix the portion of the polishing pad 2 located in the mounting groove 12 between the side wall 121 of the mounting groove 12 and the clamping assembly 3, and ensure that the polishing pad 2 is stable through physical pressure to prevent displacement or falling off during high-speed rotation.
[0028] Based on the above structure, by extending the two ends of the polishing pad 2 into the mounting groove 12 and fixing it with the clamping assembly 3, not only the fixing strength of the polishing pad 2 is enhanced, but also the close fit between the mounting surface 11 and the polishing pad 2 is ensured, thereby avoiding the deviation or loosening of the polishing pad 2 during the polishing process, solving the problem of damage to the semiconductor wafer during polishing caused by the weak direct bonding of the traditional polishing pad 2, improving the stability and reliability of the entire system, and improving the polishing quality.
[0029] like Figure 2 As shown, the clamping assembly 3 includes a pressing plate 31 and a plurality of fixing members 32. A plurality of first mounting holes 122 adapted to the fixing members 32 are provided in the mounting groove 12. A plurality of second mounting holes 311 corresponding to the first mounting holes 122 are provided on the pressing plate 31. The fixing members 32 pass through the corresponding second mounting holes 311 to be connected with the corresponding first mounting holes 122 to fix the pressing plate 31 on the mounting groove 12. The portion of the polishing pad 2 located in the mounting groove 12 fits with the pressing plate 31 to apply pressure to keep the polishing pad 2 stable.
[0030] In this embodiment, the first mounting hole 122 and the second mounting hole 311 are arranged correspondingly, and the fixing member 32 is used to fix the pressing plate 31 at a predetermined position, so as to ensure that the pressing plate 31 and the polishing pad 2 are closely fitted, thereby maintaining a stable pressing force during the polishing process and improving the polishing effect. In addition, this structure facilitates the installation and removal of the pressing plate 31, so as to replace the polishing pad 2 or adjust the pressing degree, thereby improving the flexibility and efficiency of the production process.
[0031] In some embodiments, the mounting groove 12 is arranged through both ends of the polishing wheel body 1, so as to facilitate the installation and adjustment of the clamping assembly 3 from either end of the polishing wheel body 1. The slot width of the mounting groove 12 gradually increases upward from the bottom wall 123 of the mounting groove 12, forming a conical or trapezoidal structure to facilitate the insertion and fixation of the pressure plate 31. When the pressure plate 31 is pressed downward, due to the gradual widening of the slot, the pressure plate 31 can be naturally guided to smoothly descend along the surface of the polishing pad 2, while increasing the contact area to make the clamping more uniform.
[0032] In addition, if Figure 6 As shown, the pressure plate 31 includes a bottom surface 312 and two pressing surfaces 313 that are in contact with the polishing pad 2. The bottom surface 312 is arranged toward the bottom wall 123 of the mounting groove 12. The opposite sides of the bottom surface 312 are respectively connected to the pressing surfaces 313. The pressing surfaces 313 extend along the axis of the second mounting hole 311 and are inclined outward, so that the pressure plate 31 can adapt well to the shape of the mounting groove 12, and at the same time ensure that when pressing, the pressing force is more evenly distributed on the polishing pad 2 to reduce local overpressure or underpressure.
[0033] The through-going setting of the installation groove 12 of this embodiment simplifies the assembly process of the clamping component 3, while providing the convenience of operation from both ends. At the same time, the change in the groove width and the inclined clamping surface 313 of the pressure plate 31 work together to make the clamping force distribution more uniform.
[0034] In some embodiments, the pressing surface 313 is arranged parallel to the side wall 121 of the corresponding mounting groove 12. When the pressing plate 31 is installed and pressed onto the polishing wheel body 1, the pressing surface 313 is parallel to the side wall 121 corresponding to the mounting groove 12, ensuring that the pressing force can be evenly distributed over the entire length or width of the contact between the polishing pad 2 and the pressing surface 313, avoiding excessive or insufficient local pressure, thereby achieving more uniform material removal during the polishing process and improving the polishing quality. In addition, parallelism improves the matching accuracy between the pressing plate 31 and the mounting groove 12, allowing the pressing plate 31 to be more tightly and correctly positioned, simplifying the installation process, and reducing subsequent polishing problems caused by installation errors.
[0035] In some embodiments, the plurality of first mounting holes 122 are arranged at equal intervals along the length direction of the mounting slot 12 , and the plurality of second mounting holes 311 are arranged at equal intervals along the length direction of the pressing plate 31 .
[0036] This embodiment ensures that when the pressure plate 31 is fixed, the pressure can be evenly distributed along the entire contact length of the polishing pad 2 by equidistantly arranging multiple first mounting holes 122 and corresponding second mounting holes 311 along the length direction. This design can avoid deformation or uneven wear of the polishing pad 2 caused by excessive pressure in certain areas. In addition, the equidistant multi-point fixing method can provide more balanced support and stronger fixing strength compared to single-point or non-equidistant fixing. In polishing operations with high-speed rotation or high pressure, the pressure plate 31 can be effectively prevented from shifting or loosening, thereby enhancing the stability and durability of the entire polishing system.
[0037] Read also Figure 5 and Figure 6The polishing wheel body 1 includes a wheel body 13, a first shoulder 14, a second shoulder 15 and a connecting shaft 16. The wheel body 13 is used to carry the polishing pad 2 and provide sufficient mechanical strength to withstand the pressure and rotational force during the polishing process. The connecting shafts 16 are respectively installed at both ends to transmit the rotational motion. The connection between the connecting shaft 16 and the wheel body 13 is provided with a first shoulder 14, and the connecting shaft 16 is provided with a second shoulder 15. The second shoulder 15 is connected to the side of the first shoulder 14 away from the wheel body 13 to strengthen the structural strength of the connection part, ensure the stability and reliability of the connection, and prevent displacement or breakage when rotating at high speed or under large external force. In addition, the wheel body 13 has a mounting surface 11 and a mounting groove 12, which cooperate with the clamping assembly 3 to not only ensure the correct installation and fixation of the polishing pad 2, but also reduce the uneven polishing or damage caused by the displacement of the polishing pad 2.
[0038] In some embodiments, it also includes a mounting bracket 4, a bearing 5 and a synchronous wheel 6. The mounting bracket 4 provides a stable mounting base for the polishing wheel. The wheel body 13 is connected to the mounting bracket 4 through a connecting shaft 16. The bearing 5 is sleeved on the side of the corresponding connecting shaft 16 to reduce friction and wear during rotation and ensure the smooth rotation of the connecting shaft 16. The synchronous wheel 6 is sleeved on the side of the connecting shaft 16 having a second shoulder 15 to ensure that the rotation speed of the polishing wheel body 1 is consistent with other components (such as a driving wheel).
[0039] In addition, the first shoulder 14 is used to limit the bearing 5, and the second shoulder 15 is used to limit the synchronous wheel 6, so as to improve the stability of the structural operation.
[0040] In some embodiments, the wheel body 13, the first shoulder 14, the second shoulder 15 and the connecting shaft 16 are an integrally formed structure. It can be understood that the integrally formed structure eliminates potential weak links such as welding points and screw connections, making the entire polishing wheel body 1 more solid and durable in terms of mechanical properties, and can better withstand high-speed rotation and dynamic loads during polishing, reducing the risk of failure caused by fatigue or fracture of the connection. In addition, the integral molding reduces the number of parts and assembly steps, simplifies the manufacturing process, and reduces production costs and time.
[0041] like Figure 3As shown, the mounting bracket 4 includes a mounting base 41 and two mounting arms 42, and the opposite sides of the mounting base 41 are respectively connected to the corresponding mounting arms 42, providing a stable suspension and support for the polishing wheel body 1, and enhancing the stability and reliability of the entire system. Among them, the mounting arms 42 are connected to the corresponding connecting shafts 16, and the polishing wheel body 1 is fixed on the mounting base 41 through the connecting shafts 16, and the bearings 5 are arranged in the corresponding mounting arms 42 to allow the connecting shafts 16 to rotate freely, reducing friction and wear, and ensuring the smooth operation of the polishing wheel body 1. There is a gap between the mounting base 41 and the polishing wheel body 1 to avoid interference with the rotation of the polishing wheel body 1.
[0042] In some embodiments, the mounting base 41 has a threaded hole 43 connected to the external structure so that the mounting base 41 of the polishing wheel device can be firmly fixed to the external structure by fasteners such as bolts or screws to ensure its stability and safety and prevent displacement due to vibration or external force during operation.
[0043] In summary, the embodiment of the utility model provides a polishing wheel device, which extends the two ends of the polishing pad 2 into the mounting groove 12 and fixes it with the clamping assembly 3, which not only enhances the fixing strength of the polishing pad 2, but also ensures the close fit between the mounting surface 11 and the polishing pad 2, thereby avoiding the deviation or loosening of the polishing pad 2 during the polishing process, and solves the problem of damage to the semiconductor wafer during polishing due to the weak direct bonding of the traditional polishing pad 2, thereby improving the stability and reliability of the entire system and improving the polishing quality.
[0044] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and substitutions can be made without departing from the technical principle of the present invention. These improvements and substitutions should also be regarded as the protection scope of the present invention.
Claims
1. A polishing wheel device, characterized in that: It includes a polishing wheel body, a polishing pad and a clamping assembly, the polishing wheel body having a mounting surface and a mounting groove opened on the mounting surface, the polishing pad is wrapped around the mounting surface, and both ends of the polishing pad extend into the mounting groove, the clamping assembly is installed in the mounting groove and fits with the part of the polishing pad located in the mounting groove so as to fix the part of the polishing pad located in the mounting groove between the side wall of the mounting groove and the clamping assembly.
2. The polishing wheel device according to claim 1, characterized in that: The clamping assembly includes a pressing plate and a plurality of fixing parts. A plurality of first mounting holes matching the fixing parts are provided in the mounting groove. A plurality of second mounting holes corresponding to the first mounting holes are provided on the pressing plate. The fixing parts pass through the corresponding second mounting holes to be connected with the corresponding first mounting holes. The part of the polishing pad located in the mounting groove is in contact with the pressing plate.
3. The polishing wheel device according to claim 2, characterized in that: The mounting groove is arranged through both ends of the polishing wheel body, and the groove width of the mounting groove gradually increases from the groove bottom wall of the mounting groove upward; The pressure plate includes a bottom surface and two pressing surfaces that are in contact with the polishing pad. The bottom surface is arranged toward the bottom wall of the mounting groove. The opposite sides of the bottom surface are respectively connected to the pressing surfaces. The pressing surfaces extend along the axis of the second mounting hole and are arranged to be inclined outward.
4. The polishing wheel device according to claim 3, characterized in that: The pressing surface is arranged parallel to the side wall of the corresponding mounting groove.
5. The polishing wheel device according to claim 2, characterized in that: A plurality of the first mounting holes are arranged at equal intervals along the length direction of the mounting slot; A plurality of the second mounting holes are arranged at equal intervals along the length direction of the pressing plate.
6. The polishing wheel device according to claim 1, characterized in that: The polishing wheel body includes a wheel body, a first shoulder, a second shoulder and a connecting shaft. The connecting shaft is respectively installed at both ends of the wheel body. The first shoulder is provided at the connection between the connecting shaft and the wheel body. The connecting shaft is provided with a second shoulder. The second shoulder is connected to the side of the first shoulder away from the wheel body. The wheel body has the mounting surface and the mounting groove.
7. The polishing wheel device according to claim 6, characterized in that: The wheel body, the first shaft shoulder, the second shaft shoulder and the connecting shaft are an integrally formed structure.
8. The polishing wheel device according to claim 6, characterized in that: It also includes a mounting bracket, a bearing and a synchronous wheel. The wheel body is connected to the mounting bracket through the connecting shaft. The bearing sleeve is arranged on the corresponding peripheral side of the connecting shaft. The synchronous wheel sleeve is arranged on the peripheral side of the connecting shaft having the second shaft shoulder.
9. The polishing wheel device according to claim 8, characterized in that: The mounting bracket includes a mounting base and two mounting arms. The opposite sides of the mounting base are respectively connected to the corresponding mounting arms. The mounting arms are connected to the corresponding connecting shafts, and the bearings are arranged in the corresponding mounting arms. There is a gap between the mounting base and the polishing wheel body.
10. The polishing wheel device according to claim 9, characterized in that: The mounting base has a threaded hole connected to an external structure.