Integrated circuit ceramic mixed compression structure device

Abstract

The utility model provides a ceramic mixed compression structure device of an integrated circuit. According to the integrated circuit ceramic mixed pressing structure device, a mixed pressing table is fixedly connected to the top of a bottom frame, a mixed pressing frame is fixedly connected to the top of the mixed pressing table, a mounting opening is formed in the top of the mixed pressing frame, and a plurality of driven shafts with rotating rollers are rotationally connected into the mounting opening; the back face of the mixed pressing frame is fixedly connected with a protective shell, and a driving motor is installed in the protective shell. According to the integrated circuit ceramic mixed pressing structure device provided by the utility model, when mixed pressing and shaping are carried out on an integrated circuit material of a ceramic layer in one mixed pressing frame, the integrated circuit material of the ceramic layer needing to be shaped is put into the other mixed pressing frame to be heated by utilizing the heating assembly; and meanwhile, after the pressing plate is shaped for a period of time, a continuous shaping effect is achieved in cooperation with the connecting structure on the top cover, and the ceramic mixed pressing efficiency of the integrated circuit can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of integrated circuit mixing, in particular to an integrated circuit ceramic mixing structure device. Background Art

[0002] An integrated circuit is a miniature electronic device or component that uses a certain process to interconnect the transistors, resistors, capacitors, inductors and other components and wiring required in a circuit. It is made on a small piece or several small pieces of semiconductor chips or dielectric substrates, and then packaged in a tube shell to become a miniature structure with the required circuit function.

[0003] The production process of ceramic hybrid integrated circuit boards is to achieve layer addition through lamination. First, the inner layer board is made, and then the structural layer is added layer by layer through lamination. In order to completely solidify the material and increase the stability between the layers of the circuit board, the temperature of each lamination usually needs to reach 175°C and be maintained for more than 70 minutes to achieve the standard lamination environment for the application base layer.

[0004] During use, the traditional integrated circuit ceramic mixed pressing structure device needs to soften the multi-layer materials and then shape them through the mixed pressing structure. This process takes a long time and reduces the efficiency of the integrated circuit ceramic mixed pressing.

[0005] Therefore, it is necessary to provide an integrated circuit ceramic mixed pressure structure device to solve the above technical problems. Utility Model Content

[0006] The utility model provides an integrated circuit ceramic mixing pressing structure device, which solves the problem that the traditional integrated circuit ceramic mixing pressing process needs to be preheated first and then needs a long time for shaping and cooling, which reduces the efficiency of the integrated circuit ceramic mixing pressing.

[0007] In order to solve the above technical problems, the utility model provides an integrated circuit ceramic mixed pressure structure device comprising: a base frame;

[0008] A mixing and pressing table, wherein the mixing and pressing table is fixedly connected to the top of the base frame, a mixing and pressing frame is fixedly connected to the top of the mixing and pressing table, a mounting opening is provided at the top of the mixing and pressing frame, a plurality of driven shafts with rotating rollers are rotatably connected inside the mounting opening, a protective shell is fixedly connected to the back of the mixing and pressing frame, a driving motor is installed inside the protective shell, a driving shaft with rotating rollers is installed at the output end of the driving motor, a guide plate is installed at the back position of the top of the mixing and pressing frame, a second telescopic rod is installed at the front position of the top of the mixing and pressing frame through a support plate, the extended end of the second telescopic rod is fixedly connected to a limiting plate, and a mixing and pressing frame with a top cover is provided at the top position where the outer surface of the rotating roller is located;

[0009] A third telescopic rod, the third telescopic rod is fixedly connected to the bottom of the mixing and pressing platform, the protruding end of the third telescopic rod is fixedly connected to a movable plate, the top of the movable plate is fixedly connected to support blocks at positions on both sides, a heating component is installed at one side of the top of the mixing and pressing platform, a mounting bracket is fixedly connected to the top of the mixing and pressing platform near the back, the top of the mounting bracket is fixedly connected to the first telescopic rod, the protruding end of the first telescopic rod is fixedly connected to a pressing plate, a conveying component is installed at the top of the mixing and pressing platform near the other side, and a cooling box is fixedly connected to the top of the mixing and pressing platform near another side.

[0010] The drive shaft is located inside the installation port, and the drive shaft is located in the middle of the installation port. Multiple driven shafts are located on both sides of the drive shaft. For details, please refer to Figure 4 There are blocks on both sides of the mixing and pressing frame and the top cover that can be connected by bolts. The two support blocks are located between two of the rotating rollers. When the support blocks contact the bottom of the mixing and pressing frame through the third telescopic rod, they can play a supporting role, which is convenient for cooperating with the pressure plate to mix and press the integrated circuit materials inside the mixing and pressing frame. The mounting frame is located on the back of the mixing and pressing frame. After the mixing and pressing frame is fixed by the limit plate and the guide plate, the pressure plate is located above the mixing and pressing frame. The specific position can be adjusted by manually controlling the driving motor. The conveying component can be a roller conveying structure or a belt conveying structure.

[0011] Preferably, a control box is fixedly connected to one side of the base frame, and a box door is rotatably connected to one side of the control box.

[0012] A power switch is installed inside the control box.

[0013] Preferably, the heating assembly comprises a heat insulation cover, and a heating plate is installed at the bottom of the inner wall of the heat insulation cover.

[0014] A groove is provided on the front of the heat insulation cover for placing the mixing and pressing frame into the heating plate. After placement, the opening is sealed by a cover plate. A hole is provided on one side of the heat insulation cover for pushing out the mixing and pressing frame. The top of the heating plate is flush with the rotating roller.

[0015] Preferably, a fourth telescopic rod is fixedly connected to the other side of the heat insulation cover, and one end of the fourth telescopic rod is fixedly connected to a push plate.

[0016] Preferably, the front and back sides of the mixing and pressing frame are fixedly connected with clips, one side of the inner wall of the clip is fixedly connected with a support spring, the other end of the support spring is fixedly connected to a movable disk with a pull rod, the other end of the movable disk is fixedly connected with a bolt, and the top of the mixing and pressing frame is provided with a top cover with an extrusion plate.

[0017] The pull rod is located on the side of the buckle away from the mixing and compression frame.

[0018] Preferably, each of the buckles is provided with a clamping block inside, and the tops of the four clamping blocks are fixedly connected to a limiting frame.

[0019] The card block is provided with a mouth into which the card bolt can be inserted.

[0020] Preferably, the tops of the limiting frames are all threadedly connected with threaded bolts, and the bottom ends of the two threaded bolts are rotatably connected to the limiting rods via a rotating ring.

[0021] The threaded bolt allows adjustment of the distance between the stop bar and the top cover.

[0022] Compared with the related art, the integrated circuit ceramic mixed pressure structure device provided by the utility model has the following beneficial effects:

[0023] The utility model provides an integrated circuit ceramic mixing and pressing structure device. When it is necessary to mix and press and add layers to an integrated circuit containing a ceramic layer, the integrated circuit raw materials that need to add layers are first laid in order inside the mixing and pressing frame, and then the mixing and pressing frame containing multi-layer materials such as ceramics is placed inside a heating component for heating. After the heating is completed, the heated mixing and pressing frame is pushed onto a mixing and pressing frame with a rotating roller through the structure inside the heating component, and then the mixing and pressing frame is moved along a guide plate to a middle position above the mixing and pressing frame by driving the rotating roller on the outer surface of the driving shaft driven by a driving motor. Then, the driving motor stops working, and the second telescopic rod is started to clamp the mixing and pressing frame between the guide plate and the limiting plate through a limiting plate. At the same time, the third telescopic rod is started to allow the support block to contact the bottom of the mixing and pressing frame to support the bottom of the mixing and pressing frame. Then, the top cover is placed on the mixing and pressing frame, and at the same time, the first telescopic rod is started to press the top cover into the interior of the mixing and pressing frame using a pressing plate, so as to assist in the mixing and pressing of the heated integrated circuit material containing ceramics. In this process, The integrated circuit material with the ceramic layer is put back into another mixing and pressing frame, and the device is located inside the heating component for heating. After the pressing plate has provided the extrusion force and the ceramic layer of the integrated circuit material mixing and pressing frame has reached a certain time, the top cover and the docking blocks on the mixing and pressing frame are fixed by bolts to achieve a continuous shaping effect. Then, the four telescopic rods are started to reset, and then the driving motor drives the rotating roller on the outer surface of the driving shaft to cooperate with the rotating roller on the outer surface of the driven shaft to transport the fixed mixing and pressing frame to the conveying component, and then transported to the inside of the cooling box through the conveying component for slow cooling and cooling. Through this structure, when the integrated circuit material of the ceramic layer inside the mixing and pressing frame is mixed and pressed, the integrated circuit material of the ceramic layer to be shaped inside the mixing and pressing frame can be placed in another mixing and pressing frame for heating by using the heating component, which saves the waiting time for heating. At the same time, after being shaped for a period of time by the pressing plate, it cooperates with the connecting structure on the top cover to achieve a continuous shaping effect, which is beneficial to improving the efficiency of integrated circuit ceramic mixing. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1A schematic structural diagram of a first embodiment of an integrated circuit ceramic mixed pressure structure device provided by the utility model;

[0025] Figure 2 A top view of the structure of the mixing and pressing frame is provided for the utility model;

[0026] Figure 3 A schematic diagram of the structure of a heating plate is provided for the utility model;

[0027] Figure 4 Provided for the utility model Figure 3 An enlarged view of point A is shown;

[0028] Figure 5 A schematic diagram of the structure of a driving motor is provided for the utility model;

[0029] Figure 6 A schematic structural diagram of a second embodiment of the integrated circuit ceramic mixed pressure structure device provided by the utility model;

[0030] Figure 7 A schematic diagram of the structure of a buckle is provided for the utility model;

[0031] Figure 8 The utility model provides a structural schematic diagram of a support spring.

[0032] Numbers in the figure: 1, base frame, 2, control box, 3, box door, 4, heating component, 401, heat insulation cover, 402, push plate, 403, heating plate, 404, fourth telescopic rod, 5, mixing and pressing table, 6, mounting frame, 7, first telescopic rod, 8, cooling box, 9, pressing plate, 10, guide plate, 11, conveying component, 12, support plate, 13, second telescopic rod, 14, mixing and pressing frame, 15, mixing and pressing frame, 16, installation port, 1 7. Limit plate, 18. Top cover, 19. Protective shell, 20. Third telescopic rod, 21. Driving shaft, 22. Rotating roller, 23. Support block, 24. Driven shaft, 25. Movable plate, 26. Driving motor, 27. Extrusion plate, 28. Threaded bolt, 29. Limit frame, 30. Limit rod, 31. Rotating ring, 32. Buckle, 33. Block, 34. Support spring, 35. Bolt, 36. Movable disk, 37. Pull rod. DETAILED DESCRIPTION

[0033] The utility model is further described below in conjunction with the accompanying drawings and implementation modes.

[0034] Please refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 and Figure 5 ,in, Figure 1 A schematic structural diagram of a first embodiment of an integrated circuit ceramic mixed pressure structure device provided by the utility model; Figure 2 A top view of the structure of the mixing and pressing frame is provided for the utility model; Figure 3 A schematic diagram of the structure of a heating plate is provided for the utility model; Figure 4 Provided for the utility model Figure 3 An enlarged view of point A is shown; Figure 5 The utility model provides a structural schematic diagram of a driving motor. The integrated circuit ceramic mixed pressure structure device comprises: a base frame 1;

[0035] A mixing and pressing table 5, wherein the mixing and pressing table 5 is fixedly connected to the top of the base frame 1, a mixing and pressing frame 14 is fixedly connected to the top of the mixing and pressing frame 14, a mounting opening 16 is provided at the top of the mixing and pressing frame 14, a plurality of driven shafts 24 with rotating rollers 22 are rotatably connected inside the mounting opening 16, a protective shell 19 is fixedly connected to the back of the mixing and pressing frame 14, a driving motor 26 is installed inside the protective shell 19, a driving shaft 21 with rotating rollers 22 is installed at the output end of the driving motor 26, a guide plate 10 is installed at the back position of the top of the mixing and pressing frame 14, a second telescopic rod 13 is installed at the front position of the top of the mixing and pressing frame 14 through a support plate 12, a protruding end of the second telescopic rod 13 is fixedly connected to a limiting plate 17, and a mixing and pressing frame 15 with a top cover 18 is provided at the top position where the outer surface of the rotating roller 22 is located;

[0036] A third telescopic rod 20, the third telescopic rod 20 is fixedly connected to the bottom of the mixing and pressing platform 5, the protruding end of the third telescopic rod 20 is fixedly connected with a movable plate 25, the top of the movable plate 25 is fixedly connected with support blocks 23 at both sides, the top of the mixing and pressing platform 5 is located on one side and a heating component 4 is installed, the top of the mixing and pressing platform 5 is fixedly connected with a mounting frame 6 near the back, the top of the mounting frame 6 is fixedly connected with a first telescopic rod 7, the protruding end of the first telescopic rod 7 is fixedly connected with a pressing plate 9, the top of the mixing and pressing platform 5 is located near the other side and a conveying component 11 is installed, the top of the mixing and pressing platform 5 is located near another side and a cooling box 8 is fixedly connected.

[0037] The drive shaft 21 is located inside the mounting opening 16, and the drive shaft 21 is located in the middle of the mounting opening 16, and the plurality of driven shafts 24 are respectively located on both sides of the drive shaft 21. Figure 4, blocks that can be connected by bolts are provided on both sides of the mixing and pressing frame 15 and the top cover 18, and two support blocks 23 are located between two rotating rollers 22. When the support block 23 contacts the bottom of the mixing and pressing frame 15 through the third telescopic rod 20, it can play a supporting role, so that the integrated circuit materials inside the mixing and pressing frame 15 can be mixed and pressed by the pressing plate 9. The mounting frame 6 is located on the back of the mixing and pressing frame 14. After the mixing and pressing frame 15 is fixed by the limiting plate 17 and the guide plate 10, the pressing plate 9 is located above the mixing and pressing frame 15. The specific position can be adjusted by manually controlling the driving motor 26. The conveying assembly 11 can be a roller conveying structure or a belt conveying structure. The cooling box 8 can gradually cool down the mixing and pressing frame 15 in the process of shaping, which can be cooled by air circulation or by heat exchange.

[0038] A control box 2 is fixedly connected to one side of the base frame 1 , and a box door 3 is rotatably connected to one side of the control box 2 .

[0039] A power switch is installed inside the control box 2, and a lock is provided on the box door 3.

[0040] The heating assembly 4 comprises a heat insulation cover 401 , and a heating plate 403 is installed at the bottom of the inner wall of the heat insulation cover 401 .

[0041] A groove is provided on the front of the heat insulation cover 401 to allow the mixing and pressing frame 15 to be placed into the heating plate 403. After the placement is completed, the opening is sealed by a cover plate. An opening is provided on one side of the heat insulation cover 401 to allow the mixing and pressing frame 15 to be pushed out. The top of the heating plate 403 is flush with the rotating roller 22.

[0042] A fourth telescopic rod 404 is fixedly connected to the other side of the heat insulation cover 401 , and a push plate 402 is fixedly connected to one end of the fourth telescopic rod 404 .

[0043] The push plate 402 can push the heated mixing and pressing frame 15 toward the mixing and pressing rack 14 .

[0044] The working principle of the integrated circuit ceramic mixed pressure structure device provided by the utility model is as follows:

[0045] First, the integrated circuit raw materials that need to be layered are laid in order inside the mixing frame 15, and then the mixing frame 15 filled with multi-layer materials such as ceramics is placed inside the heating component 4 for heating. After the heating is completed, the heated mixing frame 15 is pushed onto the mixing frame 14 with the rotating roller 22 through the structure inside the heating component 4, and then the rotating roller 22 on the outer surface of the driving shaft 21 is driven by the driving motor 26 to move the mixing frame 15 along the guide plate 10 to the middle position above the mixing frame 14, and then the driving motor 26 stops working, and the second telescopic rod 13 is started to clamp the mixing frame 15 between the guide plate 10 and the limiting plate 17 through the limiting plate 17, and at the same time, the third telescopic rod 20 is started to make the support block 23 contact with the bottom of the mixing frame 15 to support its bottom, and then the top cover 18 is placed on the mixing frame 15, and the first The telescopic rod 7 uses the pressing plate 9 to press the top cover 18 into the interior of the mixing and pressing frame 15, and the integrated circuit material with ceramics after auxiliary heating is mixed and pressed to shape. In this process, the integrated circuit material with the ceramic layer can be put back into another mixing and pressing frame 15, so that the device is located inside the heating component 4 for heating. After the pressing plate 9 has provided the extrusion force and the ceramic layer of the integrated circuit material mixing and pressing frame 15 has reached a certain time, the top cover 18 and the docking block on the mixing and pressing frame 15 are fixed by bolts to achieve the effect of continuous shaping, and then the four telescopic rods are started to reset, and then the driving motor 26 drives the rotating roller 22 on the outer surface of the driving shaft 21 to cooperate with the rotating roller 22 on the outer surface of the driven shaft 24 to transport the fixed mixing and pressing frame 15 to the conveying component 11, and then transported to the interior of the cooling box 8 through the conveying component 11 for slow cooling and cooling.

[0046] Compared with the related art, the integrated circuit ceramic mixed pressure structure device provided by the utility model has the following beneficial effects:

[0047] When it is necessary to perform mixed pressure adding layers on an integrated circuit containing a ceramic layer, the integrated circuit raw materials to be added are first laid in order inside the mixed pressure frame 15, and then the mixed pressure frame 15 containing multi-layer materials such as ceramics is placed inside the heating component 4 for heating. After the heating is completed, the heated mixed pressure frame 15 is pushed onto the mixed pressure rack 14 with the rotating roller 22 through the structure inside the heating component 4, and then the rotating roller 22 on the outer surface of the driving shaft 21 is driven by the driving motor 26 to move the mixed pressure frame 15 along the guide plate 10 to the middle above the mixed pressure rack 14. The driving motor 26 stops working, the second telescopic rod 13 is started to clamp the mixing frame 15 between the guide plate 10 and the limiting plate 17 through the limiting plate 17, and the third telescopic rod 20 is started to make the support block 23 contact the bottom of the mixing frame 15 to support its bottom, and then the top cover 18 is placed on the mixing frame 15, and the first telescopic rod 7 is started to press the top cover 18 into the mixing frame 15 by using the pressing plate 9, so as to assist the heating of the integrated circuit material with ceramics for mixing and shaping. The integrated circuit material of the ceramic layer is put back into another mixing and pressing frame 15, and the device is located inside the heating component 4 for heating. After the pressing plate 9 provides the extrusion force and the ceramic layer integrated circuit material mixing and pressing frame 15 reaches a certain time, the top cover 18 and the docking block on the mixing and pressing frame 15 are fixed by bolts to achieve the effect of continuous shaping. Then, the four telescopic rods are started to reset, and then the rotating roller 22 on the outer surface of the driving shaft 21 is driven by the driving motor 26 to cooperate with the rotating roller 22 on the outer surface of the driven shaft 24 to transport the fixed mixing and pressing frame 15 to the conveying component 11, and then transported to the inside of the cooling box 8 through the conveying component 11 for slow cooling and cooling. Through this structure, when the integrated circuit material of the ceramic layer inside the mixing and pressing frame 15 is mixed and pressed, the integrated circuit material of the ceramic layer to be shaped can be placed in another mixing and pressing frame 15 for heating by using the heating component 4, which saves the waiting time for heating. At the same time, after being shaped for a period of time by the pressing plate 9, it cooperates with the connection structure on the top cover 18 to achieve a continuous shaping effect, which is beneficial to improving the efficiency of integrated circuit ceramic mixing. Example

[0048] Please refer to Figure 6-Figure 7 - Figure 8 , Figure 6 A schematic structural diagram of a second embodiment of the integrated circuit ceramic mixed pressure structure device provided by the utility model; Figure 7 A schematic diagram of the structure of a buckle is provided for the utility model; Figure 8 The utility model provides a structural schematic diagram of a support spring. Based on the integrated circuit ceramic mixed pressure structure device provided in the first embodiment of the present application, the second embodiment of the present application proposes another integrated circuit ceramic mixed pressure structure device. The second embodiment is only a preferred method of the first embodiment, and the implementation of the second embodiment will not affect the independent implementation of the first embodiment.

[0049] Specifically, the difference of the integrated circuit ceramic mixing structure device provided in the second embodiment of the present application is that the front and back sides of the mixing frame 15 are fixedly connected with buckles 32, one side of the inner wall of the buckle 32 is fixedly connected with a support spring 34, the other end of the support spring 34 is fixedly connected with a movable disk 36 with a pull rod 37, the other end of the movable disk 36 is fixedly connected with a bolt 35, and the top of the mixing frame 15 is provided with a top cover 18 with an extrusion plate 27.

[0050] The pull rod 37 is located on a side of the buckle 32 away from the mixing and compression frame 15 , and the latch 35 is inserted into the inside of the latch block 33 .

[0051] The buckles 32 are each provided with a clamping block 33 inside, and the tops of the four clamping blocks 33 are fixedly connected to the limiting frame 29 .

[0052] The block 33 is provided with an opening into which the latch 35 can be inserted. The shape of the limit frame 29 can be referred to Figure 6 .

[0053] The top of each of the limiting frames 29 is threadedly connected with a threaded bolt 28 , and the bottom ends of the two threaded bolts 28 are rotatably connected to a limiting rod 30 via a rotating ring 31 .

[0054] The threaded bolt 28 can adjust the distance between the limiting rod 30 and the top cover 18 , and the rotating ring 31 allows the threaded bolt 28 and the limiting rod 30 to be rotatably connected.

[0055] Compared with the related art, the integrated circuit ceramic mixed pressure structure device provided by the utility model has the following beneficial effects:

[0056] In order to increase the continuous shaping effect of the mixing and pressing frame 15, two buckles 32 are installed on the front and back of the mixing and pressing frame 15. After the top cover 18 on the top of the mixing and pressing frame 15 is squeezed by the pressure plate 9 for a certain period of time, it is only necessary to insert the blocks 33 at both ends of the two limit frames 29 into the inside of the buckles 32 respectively, and use the support spring 34 to provide a thrust to clamp the clamping bolt 35 into the inside of the clamping block 33, so that the limit frame 29 and the mixing and pressing frame 15 can be connected. Then, the threaded bolt 28 is rotated as needed to adjust the distance between the limit rod 30 and the top cover 18. The limit rod 30 is used to provide support force for the top cover 18, so that the extrusion plate 27 at the bottom of the top cover 18 can continuously extrude the hybrid circuit material containing the ceramic layer. Through this structure, the stability of the support force provided to the top cover 18 can be increased, and the support strength can be adjusted as needed, which is beneficial to the mixed pressing molding effect of the hybrid circuit material of the ceramic layer.

[0057] The above description is only an embodiment of the present invention, and does not limit the patent scope of the present invention. Any equivalent structure or equivalent process transformation made by using the contents of the specification and drawings of the present invention, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present invention.

Claims

1. An integrated circuit ceramic mixed pressure structure device, characterized in that: include: chassis; A mixing and pressing table, wherein the mixing and pressing table is fixedly connected to the top of the base frame, a mixing and pressing frame is fixedly connected to the top of the mixing and pressing table, a mounting opening is provided at the top of the mixing and pressing frame, a plurality of driven shafts with rotating rollers are rotatably connected inside the mounting opening, a protective shell is fixedly connected to the back of the mixing and pressing frame, a driving motor is installed inside the protective shell, a driving shaft with rotating rollers is installed at the output end of the driving motor, a guide plate is installed at the back position of the top of the mixing and pressing frame, a second telescopic rod is installed at the front position of the top of the mixing and pressing frame through a support plate, the extended end of the second telescopic rod is fixedly connected to a limiting plate, and a mixing and pressing frame with a top cover is provided at the top position where the outer surface of the rotating roller is located; A third telescopic rod, the third telescopic rod is fixedly connected to the bottom of the mixing and pressing platform, the protruding end of the third telescopic rod is fixedly connected to a movable plate, the top of the movable plate is fixedly connected to support blocks at positions on both sides, a heating component is installed at one side of the top of the mixing and pressing platform, a mounting bracket is fixedly connected to the top of the mixing and pressing platform near the back, the top of the mounting bracket is fixedly connected to the first telescopic rod, the protruding end of the first telescopic rod is fixedly connected to a pressing plate, a conveying component is installed at the top of the mixing and pressing platform near the other side, and a cooling box is fixedly connected to the top of the mixing and pressing platform near another side.

2. The integrated circuit ceramic mixed pressure structure device according to claim 1, characterized in that: A control box is fixedly connected to one side of the base frame, and a box door is rotatably connected to one side of the control box.

3. The integrated circuit ceramic mixed pressure structure device according to claim 1, characterized in that: The heating assembly comprises a heat insulation cover, and a heating plate is installed at the bottom of the inner wall of the heat insulation cover.

4. The integrated circuit ceramic mixed pressure structure device according to claim 3, characterized in that: A fourth telescopic rod is fixedly connected to the other side of the heat insulation cover, and one end of the fourth telescopic rod is fixedly connected to a push plate.

5. The integrated circuit ceramic mixed pressure structure device according to claim 1, characterized in that: The front and back sides of the mixing and pressing frame are fixedly connected with buckles, one side of the inner wall of the buckle is fixedly connected with a support spring, the other end of the support spring is fixedly connected to a movable disk with a pull rod, the other end of the movable disk is fixedly connected with a bolt, and a top cover with an extrusion plate is provided on the top of the mixing and pressing frame.

6. The integrated circuit ceramic mixed pressure structure device according to claim 5, characterized in that: The buckles are each provided with a clamping block inside, and the tops of the four clamping blocks are fixedly connected to a limiting frame.

7. The integrated circuit ceramic mixed pressure structure device according to claim 6, characterized in that: The tops of the limit frames are all threadedly connected with threaded bolts, and the bottom ends of the two threaded bolts are rotatably connected to the limit rods through a rotating ring.

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