Composite board
By setting the core plate layer, outer plate layer and rubber layer in the synthetic plate, and setting a buffer structure on both sides of the outer plate layer, the problems of fragility and wear during transportation, laying and use of synthetic plates are solved, and the effects of reducing weight, reducing transportation and laying costs and improving impact resistance are achieved.
Patent Information
- Application Number
- CN202420712384.9
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-08
- Publication Date
- 2025-03-14
- Estimated Expiration
- 2034-04-08
AI Technical Summary
During the transportation, laying and use of existing synthetic plates, they are prone to chipping and wear due to external forces, and are heavier in weight and are not convenient for transportation and laying, making it difficult to repair and replace.
A synthetic plate is designed, including a core plate layer, an outer plate layer and a rubber layer. A buffer structure is installed on both sides of the outer plate layer to reduce impact stress through the rubber layer and the buffer structure, reduce the risk of fragmentation and wear, and reduce the weight of the plate.
Effectively reduce the fragmentation and wear of synthetic plates during transportation, laying and use, reduce transportation and laying costs, and improve the impact resistance and service life of the plates.
Smart Images

Figure CN222610628U_ABST
Abstract
Description
Technical Field
[0001] The utility model belongs to the technical field of synthetic boards, and in particular relates to a synthetic board. Background Art
[0002] Synthetic boards (composite boards) are made of wood or other non-wood plants, separated into various unit materials through mechanical processing, and then bonded with or without adhesives to form boards or molded products. They mainly include plywood, particleboard, medium-density fiberboard, etc. In order to make the surface strength of synthetic boards higher and their service life longer, the selection, structure and combination of synthetic boards are generally modified.
[0003] Existing synthetic boards have a compact structure and can be used stably in a variety of environments. However, some larger and thicker boards are heavy and easily broken and worn during transportation, laying and later use. Their heavy weight makes them inconvenient to transport and lay, and they are difficult to repair after breaking and wearing, and the overall maintenance and replacement are also difficult.
[0004] Based on this, the applicant considered designing a synthetic board. Utility Model Content
[0005] In view of the above-mentioned deficiencies in the prior art, the technical problem to be solved by the present invention is: how to provide a synthetic board.
[0006] In order to solve the above technical problems, the utility model adopts the following technical solutions:
[0007] A synthetic board material comprises a core board layer and an outer board layer, wherein the outer board layer has two layers, which are respectively arranged on both sides of the core board layer, and a rubber layer is arranged between the core board layer and the two outer board layers. A plurality of groups of buffer structures are arranged in the core board layer at equal intervals along the length direction of the core board layer.
[0008] Compared with the prior art, the advantages of the synthetic board of the utility model are:
[0009] By setting the core plate layer, outer plate layer, rubber layer arranged between the core plate layer and the outer plate layer, and buffer structure inside the core plate layer, it is achieved that after the outer plate layer is impacted, the impact stress on the outer plate layer and the core plate layer can be reduced respectively under the action of the rubber layer and the buffer structure, thereby reducing the breakage and wear of the synthetic board caused by external forces during transportation, laying and later use. At the same time, by setting the rubber layer, the weight of boards of the same size can be reduced, the transportation and laying consumption can be reduced, and the cost can be reduced.
[0010] The above-mentioned synthetic board has the advantages of simple structure, easy implementation, low cost of use and can improve benefits. BRIEF DESCRIPTION OF THE DRAWINGS
[0011] Figure 1 This is a schematic diagram of the structure of the reflection of the laser light source of the utility model;
[0012] Figure 2 This is a structural axonometric diagram of the first embodiment of the synthetic board of the utility model;
[0013] Description of Reference Numerals
[0014] 100 core layers, 110 buffer channels, 120 buffer columns
[0015] 200 outer plate layers, 210 boost tanks
[0016] 300 rubber layers DETAILED DESCRIPTION
[0017] The utility model is further described in detail below in conjunction with the accompanying drawings.
[0018] When implementing: Figure 1 As shown, a synthetic board material comprises a core board layer 100 and an outer board layer 200 . The outer board layer 200 has two layers, which are respectively arranged on both sides of the core board layer 100 . A rubber layer 300 is arranged between the core board layer 100 and the two outer board layers 200 .
[0019] During implementation, the core plate layer 100 and the outer plate layer 200 are bonded together by adhesive.
[0020] Compared with the prior art, the advantages of the synthetic board of the utility model are:
[0021] By setting the core plate layer 100, the outer plate layer 200 and the rubber layer 300 arranged between the core plate layer 100 and the outer plate layer 200, it is achieved that after the outer plate layer 200 is impacted, the impact stresses on the outer plate layer 200 and the core plate layer 100 can be reduced respectively under the action of the rubber layer 300, thereby reducing the breakage and wear of the synthetic board due to external forces during transportation, laying and later use. At the same time, by setting the rubber layer 300, the weight of boards of the same size can be reduced, the transportation and laying consumption can be reduced, and the cost can be reduced.
[0022] The above-mentioned synthetic board has the advantages of simple structure, easy implementation, low cost of use and can improve benefits.
[0023] In this embodiment, a plurality of groups of buffer structures are disposed in the core plate layer 100 , and the plurality of groups of buffer structures are arranged in the core plate layer 100 at equal intervals along the length direction of the core plate layer 100 .
[0024] During implementation, the length direction of the core plate layer 100 is Figure 1 The length direction of the core board layer 100 is shown.
[0025] In this way, by setting up multiple groups of buffer structures, the impact of the composite board on the core board layer 100 when encountering external force can be reduced, thereby improving the impact resistance of the core board.
[0026] In this embodiment, the buffer structure includes a buffer column 120 , and a plurality of buffer channels 110 are arranged in the core plate layer 100 at equal intervals along the length direction. There are a plurality of buffer columns 120 , which are inserted into the plurality of buffer channels 110 in a one-to-one correspondence.
[0027] In this way, by opening the buffer channel 110 in the core panel layer 100, a buffer space is provided in the core panel layer 100. At the same time, by setting the buffer column 120, the buffer space in the buffer channel 110 can be supported, so that the impact force that should have been borne by the core panel layer 100 is transferred to the buffer column 120, thereby reducing the fragmentation rate of the core panel layer 100.
[0028] In this embodiment, the cross section of the buffer channel 110 is rhombus-shaped, and the four inner walls of the buffer channel 110 are in contact with the outer surface of the buffer column 120 .
[0029] In this way, the buffer channel 110 has a diamond-shaped cross-section, so that the buffer channel 110 can better withstand the impact forces from multiple angles outside the outer plate layer 200 and has a wider bearing range. At the same time, the buffer column 120 is in contact with the four inner wall surfaces on the diamond-shaped inner wall of the buffer channel 110, so that the external impact force can be borne by the buffer column 120 more quickly.
[0030] In this embodiment, a plurality of pressurizing grooves 210 are disposed on one side surface of the outer plate layer 200 , and the plurality of pressurizing grooves 210 are located between the outer plate layer 200 and the rubber layer 300 .
[0031] In this way, by setting the boosting groove 210, the contact area between the outer plate layer 200 and the rubber layer 300 becomes smaller, so that the pressure applied by the outer plate layer 200 to the rubber layer 300 after receiving the external impact force is increased, so that the outer plate layer 200 is easier to embed into the rubber layer 300 through the boss between two adjacent boosting grooves 210, the embedding depth is deeper, and the buffer space is increased.
[0032] In this embodiment, the position of the pressurizing groove 210 in the length direction of the outer plate layer 200 corresponds one-to-one to the position between every two adjacent buffer structures.
[0033] In this way, the boss between the two boost grooves 210 can correspond to the top of the buffer channel 110. Since the boss between the two boost grooves 210 can be embedded deeper in the rubber layer 300, more pressure is applied to the core plate layer 100, and the impact can be reduced through the buffer channel 110.
[0034] In this embodiment, the thickness of the core plate layer 100 is at least twice the thickness of the outer plate layer 200 .
[0035] During implementation, the thickness of the core board layer 100 is 0.5-3 cm, and the thickness of the outer board layer 200 is 0.25-1.5 cm.
[0036] In this way, the outer plate layer 200 is thinner and easier to withstand bending stress, and the core plate layer 100 is thicker, stronger and has stronger supporting force.
[0037] In this embodiment, the thickness of the outer plate layer 200 is at least three times greater than the thickness of the rubber layer 300 .
[0038] During implementation, the thickness of the rubber layer 300 is 0.08-0.5 cm.
[0039] In this way, the thickness of the rubber layer 300 is thinner than that of the outer plate layer 200, and has less influence on the supporting strength of the entire synthetic board.
[0040] The above are only preferred implementations of the present invention. It should be pointed out that a number of modifications and improved technical solutions made by those skilled in the art without departing from the technical solution should also be deemed to fall within the scope of protection required by the claims.
Claims
1. A synthetic board, characterized in that: It includes a core plate layer and an outer plate layer, wherein the outer plate layer has two layers, which are respectively arranged on both sides of the core plate layer, and a rubber layer is arranged between the core plate layer and the two outer plate layers. A plurality of groups of buffer structures are arranged in the core plate layer at equal intervals along the length direction of the core plate layer.
2. A synthetic board according to claim 1, characterized in that: The buffer structure includes a buffer column. A plurality of buffer channels are arranged in the core plate layer at equal intervals along the length direction. There are a plurality of buffer columns, which are inserted into the plurality of buffer channels in a one-to-one correspondence.
3. A synthetic board according to claim 2, characterized in that: The cross section of the buffer channel is rhombus-shaped, and the four inner walls of the buffer channel are all in contact with the outer surface of the buffer column.
4. A synthetic board according to claim 3, characterized in that: A plurality of pressure-increasing grooves are arranged on one side surface of the outer plate layer, and the plurality of pressure-increasing grooves are located between the outer plate layer and the rubber layer.
5. A synthetic board according to claim 4, characterized in that: The position of each of the pressurizing grooves in the length direction of the outer plate layer corresponds one-to-one to the position between every two adjacent buffer structures.
6. A synthetic board according to any one of claims 1 to 5, characterized in that: The thickness of the core ply is at least twice the thickness of the outer ply.
7. A synthetic board according to any one of claims 1 to 5, characterized in that: The thickness of the outer plate layer is at least three times greater than the thickness of the rubber layer.