Personnel density and environment temperature detection sensor

Abstract

The utility model relates to the technical field of personnel detection, in particular to a personnel density and environment temperature detection sensor. Comprising a power supply module, an infrared array sensor and an MCU module. The power supply module is used for supplying power to the infrared sensor and the MCU module; the infrared array sensor is in communication connection with the MCU module and is used for collecting environment temperature data; and the MCU module is used for determining the personnel density according to the environment temperature data of the infrared array sensor. According to the invention, the environment temperature data is collected through the infrared array sensor, and then the MCU determines the personnel density according to the environment temperature data of the infrared array, thereby achieving the detection of the personnel density in the region and the temperature of each position in the region under the condition of protecting the personal privacy. When the system is deployed in a large range in a detected area, the system can achieve the functions of temperature visualization and the like of the whole environment, and is low in layout and reconstruction cost and high in practicability.

Description

Technical Field

[0001] The present application relates to the technical field of personnel detection, and in particular to a personnel density and ambient temperature detection sensor. Background Art

[0002] Existing personnel density detection is generally implemented using image recognition, and the collected images may infringe on personal privacy. Common temperature detection solutions can only detect the temperature near the device, and cannot detect the temperature of various locations in the deployment area on a large scale.

[0003] Therefore, there is an urgent need for a device that can detect the density of people in an area and the temperature of each location in the area while protecting personal privacy. Utility Model Content

[0004] In view of the above problems in the prior art, the present application provides a personnel density and ambient temperature detection sensor, which can detect the personnel density in an area and the temperature of each position in the area while protecting personal privacy.

[0005] To achieve the above-mentioned object, the first aspect of the present application provides a device for detecting personnel density and ambient temperature, comprising: a power module, an infrared array sensor and an MCU module;

[0006] The power supply module is used to supply power to the infrared array sensor and the MCU module;

[0007] The infrared array sensor is connected to the MCU module for collecting ambient temperature data;

[0008] The MCU module is used to determine the density of people according to the ambient temperature data of the infrared array sensor.

[0009] In this implementation, the infrared array sensor collects ambient temperature data, and then the MCU determines the density of people based on the infrared array ambient temperature data. This realizes the detection of the density of people in the area and the temperature of each position in the area in an environment that protects personal privacy. When deployed over a large area in the detected area, it can realize functions such as temperature visualization of the overall environment, and has low deployment and modification costs and strong feasibility.

[0010] As a possible implementation manner of the first aspect, the MCU module has a SigMesh Bluetooth communication function.

[0011] As a possible implementation manner of the first aspect, the MCU module includes: a wired communication interface unit, which is used for wired communication.

[0012] As a possible implementation of the first aspect, the MCU module further includes: a DIP switch unit, which is communicatively connected to the MCU module and is used for switching the modes of wired communication and SigMesh communication; and is used for address setting of the infrared array sensor.

[0013] As a possible implementation of the first aspect, the MCU module further includes:

[0014] Key unit, used for parameter setting;

[0015] Indicator light unit, used for status display.

[0016] As a possible implementation manner of the first aspect, the MCU module further includes: a dry contact output unit, which is used for the MCU module to perform data communication with an external device.

[0017] As a possible implementation manner of the first aspect, the power module further includes a rectifier unit configured to convert an external power input into direct current.

[0018] A second aspect of the present application provides a personnel density and ambient temperature detection system, comprising at least two devices as described above, and a host computer;

[0019] The at least two personnel density and ambient temperature detection devices form a mesh network and communicate;

[0020] The host computer is connected to the personnel density and ambient temperature detection device through the mesh network, and obtains the ambient temperature data and personnel density.

[0021] The third aspect of the present application provides a sensor for detecting human density and ambient temperature, comprising the device as described above, wherein the sensor further comprises:

[0022] Main shell, ceiling frame, surface shell, interface board, main control board, infrared sensor, button, light guide column;

[0023] In the main housing, the interface board is positioned through the positioning holes and fixedly installed through the interface board fixing holes;

[0024] The main control board is fixedly installed through the main control board fixing hole, and the main control board is provided with a DIP switch and a pin, and the pin is used for the communication connection between the interface board and the main control board, and for connecting the power supply; the main control board is provided with the power supply module, the infrared array sensor and the MCU module;

[0025] The ceiling frame is provided with a terminal position for clamping the terminal, and the ceiling frame is finally clamped with the main housing with a clamping piece;

[0026] The face shell is provided with the button, and the button is fixedly installed corresponding to the button positioning hole; the main control board is equipped with an indicator light, and the indicator light is arranged in the light guide column; the face shell is snap-connected with the main shell and is screwed through the face shell fixing hole of the main shell; an infrared sensor window is provided in the center of the face shell, and a lens window piece is provided.

[0027] These and other aspects of the present invention will become more apparent from the following description of the embodiment(s). BRIEF DESCRIPTION OF THE DRAWINGS

[0028] The following further illustrates the various features of the present invention and the relationship between the various features with reference to the accompanying drawings. The accompanying drawings are all exemplary, and some features are not shown in actual proportion. Some drawings may omit the features that are conventional in the field involved in the present application and are not necessary for the present application, or additionally show features that are not necessary for the present application. The combination of the various features shown in the accompanying drawings is not intended to limit the present application. In addition, throughout this specification, the same figure numerals refer to the same content. The specific description of the drawings is as follows:

[0029] Figure 1 It is a structural schematic diagram of a device for detecting personnel density and ambient temperature provided in an embodiment of the present application;

[0030] Figure 2 It is a structural schematic diagram of a personnel density and ambient temperature detection device provided by another embodiment of the present application;

[0031] Figure 3 It is a structural schematic diagram of a sensor for detecting human density and ambient temperature provided in an embodiment of the present application;

[0032] Figure 4 It is a structural schematic diagram of a personnel density and ambient temperature detection system provided in an embodiment of the present application. DETAILED DESCRIPTION

[0033] The technical solution provided by the present application is further described below with reference to the accompanying drawings and examples. It should be understood that the system structure and business scenarios provided in the examples of the present application are mainly to illustrate the possible implementation methods of the technical solution of the present application and should not be interpreted as the only limitation on the technical solution of the present application. It is known to those of ordinary skill in the art that with the evolution of the system structure and the emergence of new business scenarios, the technical solution provided by the present application is also applicable to similar technical problems.

[0034] It should be understood that the personnel density and ambient temperature detection devices, systems, sensors, etc. provided in the embodiments of the present application, since the principles of these technical solutions to solve the problems are the same or similar, certain repetitive parts may not be repeated in the introduction of the following specific embodiments, but it should be regarded as that these specific embodiments have been referenced to each other and can be combined with each other.

[0035] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by technicians in the technical field of this application. In the event of any inconsistency, the meaning described in this specification or the meaning derived from the contents recorded in this specification shall prevail. In addition, the terms used herein are only for the purpose of describing the embodiments of the present application and are not intended to limit the present application. In order to accurately describe the technical content in this application and to accurately understand the present utility model, the following explanations or definitions are given to the terms used in this specification before describing the specific implementation methods:

[0036] 1) SigMesh protocol: It is a wireless communication protocol based on Bluetooth technology and is used to build large-scale Internet of Things (IoT) networks.

[0037] 2) Microcontroller Unit (MCU) is an integrated circuit consisting of a central processing unit (CPU), memory and various input and output interfaces. MCU modules are usually used in embedded systems and can control and perform various tasks such as data processing, communication, control, sensing, etc. It has its own memory and clock system and can run independently without the need for external devices.

[0038] In the prior art, the detection of population density and ambient temperature generally uses a camera to obtain images and videos and then perform image recognition. The use of a camera will have the risk of infringing personal privacy. In addition, there is a detection scheme for millimeter-wave radar, but it can only detect the presence of people in the area and cannot detect the density level of people. In addition, common temperature detection schemes can only detect the temperature near the device, and cannot detect the temperature conditions at various locations in the deployment area on a large scale. Therefore, the main purpose of this application is to provide a method that can detect the density of people in the area and the temperature at various locations in the area, as well as deployment and detection in a large area, in an environment that protects personal privacy, such as normal office and life scenarios.

[0039] like Figure 1 As shown, Figure 1 1 is a structural schematic diagram of a personnel density and ambient temperature detection device 100 provided in an embodiment of the present application. The personnel density and ambient temperature detection device provided in this embodiment includes: a power module 101, an infrared array sensor 102 and an MCU module 103;

[0040] The power module 101 is used to supply power to the infrared array sensor 102 and the MCU module 103 ; the power module 101 may include a rectifier unit 1011 for converting an external power input into direct current.

[0041] The infrared array sensor 102 is connected to the MCU module 103 for collecting ambient temperature data;

[0042] The MCU module 103 is used to determine the density of people according to the ambient temperature data of the infrared array sensor.

[0043] In some embodiments, the MCU module 103 may be a single-chip microcomputer with a BLE function, especially a SigMesh Bluetooth communication function. By selecting a single-chip microcomputer with a BLE function, this embodiment enables data communication between multiple detection devices through Bluetooth mesh networking, effectively improving the accuracy and comprehensiveness of ambient temperature detection and personnel density detection. In addition, based on the SigMesh Bluetooth communication function, it also realizes connection with more advanced Bluetooth communication sensors, increasing compatibility.

[0044] In some embodiments, the MCU module further includes a wired communication interface unit 1031, a dip switch 1032, a button unit 1033, an indicator light unit 1034, and a dry contact output unit 1035, etc.

[0045] The wired communication interface unit 1031 can be an RS485 port, which can be reserved for inter-device linkage, or used as an uplink communication interface of a sensor, etc. The dip switch 1032 is used for switching between wired communication and SigMesh communication modes; and for address setting of the infrared array sensor; for example, an 8-bit dip switch, in which 1 bit is used for switching between RS485 and SigMesh communication modes. The button unit 1033 is used for parameter setting; for example, the button unit can be a touch switch, which is used for device initialization and network configuration (press and hold for 5 seconds after powering on to enter the network configuration state; press and hold for 10 seconds after powering on to restore the device to the initialization state). The indicator light unit 1034 is used for status display, etc.

[0046] In this embodiment, the MCU module detects the ambient temperature and change data through an infrared array sensor, and analyzes the indoor population density after processing by the MCU's software algorithm. It can detect the population density and temperature of each location in the area in an environment that protects personal privacy.

[0047] The following is a further introduction to the personnel density and ambient temperature detection device 100 provided in the application in conjunction with a specific implementation.

[0048] like Figure 2 As shown, Figure 2 It is a structural schematic diagram of a personnel density and ambient temperature detection device 100 provided in an embodiment of the present application.

[0049] The power module can be selected as DC12V / 0.1A, 2-pin 5.08mm pitch spring-type PCB quick-connect terminal, the rectifier can be selected as 100V / 0.8A, the external power input is converted to DC power, and the DC-DC power supply polarity must be correct when connected. The power module steps down the 12V input power to 3.3V and outputs it to the infrared array sensor and MCU module.

[0050] The MCU module can use the CH32F208 domestic single-chip microcomputer with BLE function, which is a wireless microcontroller designed based on the Cortex-M3 core. The main frequency of this series is up to 144MHz. The chip integrates 2Mbps low-power Bluetooth BLE communication module, 10M Ethernet MAC+PHY module, USB2.0 full-speed device+host / device interface, CAN controller, etc.

[0051] The MCU module can also set a key unit, which can be used for device initialization and network configuration, etc. For example, the key module can use a touch switch, and can be configured to restore the device to the initialization state after pressing it for 5 seconds.

[0052] The MCU module can also set an indicator light. The Bluetooth MCU sends a signal to the indicator light through pulse width modulation (PWM) and other methods to display the device status. For example, the indicator light can be an RGB three-color LED. The Bluetooth MCU can be controlled by 3-way PWM to configure a blue light: successful network configuration; a yellow light: fault / uninitialized state, etc.

[0053] The wired communication interface unit configured by the MCU module may be an RS485 port, such as a 2-pin 5.08 mm pitch spring-type PCB quick-connect terminal, which is reserved and can be used as linkage between devices or as an uplink communication interface of a sensor.

[0054] The MCU module is also equipped with a dip switch, for example, an 8-bit dip switch, 1 bit is used for RS485 and SigMesh communication mode switching, and the rest are used as address bits, 3 bits are used for sensor address setting, the address range is 1-8; 5 bits are used for 485 address setting, the address range is 1-32, and the rest are reserved for other devices to access. It can also be used for switching between wired communication and SigMesh communication modes; and for address setting of the infrared array sensor, etc.

[0055] The infrared array sensor can use Panasonic's AMG883543 infrared array sensor to collect indoor temperature data. The specific number of people within the sensor range is calculated through the software algorithm inside the MCU.

[0056] In addition, based on the Bluetooth MCU with BLE and SigMesh, mesh networking communication can be carried out, and perception and communication with other detection devices can be performed.

[0057] This application also provides a sensor based on the above-mentioned personnel density and ambient temperature detection, please refer to Figure 3 , Figure 3 : is a schematic diagram of the structure of a sensor of a personnel density and ambient temperature detection device provided in an embodiment of the present application. The sensor of the personnel density and ambient temperature detection device mainly includes:

[0058] Main shell 1, ceiling frame 2, surface shell 3, interface board 4, main control board 5, infrared sensor 6, button 7, light guide column 8, etc.

[0059] The main housing 1 includes an interface board 4, which is installed and positioned through the positioning hole 9 and fixed through the interface board fixing hole 10 in the main housing 1. The main control board 5 is fixed through the main control board fixing hole 11 in the main housing 1. At this time, the main housing (bottom) exposes the DIP switch 12 and the pin 13, wherein the pin 13 can be used for connecting the interface board 4 and the main control board 5, and can also be used for connecting the circuit board and external devices, such as connecting the development board and the sensor, connecting the power supply and the circuit board, etc. An NTC compartment 14 is also provided in the main housing 1, and the NTC compartment 14 is used to install the NTC resistor 15 to isolate the internal temperature of the device.

[0060] The ceiling frame 2 is provided with a wiring terminal position to clip into the wiring terminal 16 , and the ceiling frame 2 is finally clipped to the main housing 1 through a tight-fitting clip 17 .

[0061] The cover 3 includes a button 7, which corresponds to a button positioning hole 18, and the button positioning hole 18 is fixed to the cover 3 by hot melting. In addition, an indicator light is also arranged on the main control board 5, and the indicator light is placed in the light guide column 8. The cover 3 and the main housing 1 are provided with a snap-on panel to prevent the position from being lost, and the screws are locked through the cover fixing hole 19 in the main housing 1. An infrared sensor window is arranged in the center of the cover 3, and a lens window sheet 20 can be pasted.

[0062] The sensor for detecting population density and ambient temperature provided in this embodiment can detect the population density and the temperature of each location in the area in an environment that protects personal privacy, and can realize low-cost and high-efficiency deployment and implementation of Bluetooth data conversion and communication in modern building operation and maintenance scenarios.

[0063] Based on the same inventive concept, the present application also provides a personnel density and ambient temperature detection system 200, such as Figure 4 As shown, Figure 4 1 is a structural diagram of a personnel density and ambient temperature detection system provided in an embodiment of the present application; the personnel density and ambient temperature detection system comprises at least two personnel density and ambient temperature detection devices 100 as described above, and a host computer 210;

[0064] At least two personnel density and ambient temperature detection devices 100 can form a mesh network and communicate;

[0065] The host computer 210 is connected to the personnel density and ambient temperature detection device 100 through a mesh network. Specifically, after multiple personnel density and ambient temperature detection devices 100 communicate data based on the mesh network, a preset personnel density and ambient temperature detection device 100 can transmit data to the host computer through wired or wireless methods. The host computer can perform data collection and monitoring, remote control and operation, data storage and analysis, interface and integration, alarm and early warning, etc.

[0066] The term "comprising" as used in the description and claims should not be interpreted as being limited to what is listed thereafter; it does not exclude other elements or steps. Therefore, it should be interpreted as specifying the presence of the features, integers, steps or components mentioned, but does not exclude the presence or addition of one or more other features, integers, steps or components and groups thereof. Therefore, the expression "a device comprising means A and B" should not be limited to a device consisting of components A and B only.

[0067] References to "one embodiment" or "an embodiment" in this specification mean that a particular feature, structure, or characteristic described in conjunction with the embodiment is included in at least one embodiment of the present application. Therefore, the phrases "in one embodiment" or "in an embodiment" appearing in various places in this specification do not necessarily refer to the same embodiment, but may refer to the same embodiment. In addition, in one or more embodiments, the particular features, structures, or characteristics can be combined in any appropriate manner, as would be apparent to one of ordinary skill in the art from this disclosure.

[0068] Note that the above are only preferred embodiments of the present application and the technical principles used. Those skilled in the art will understand that the present application is not limited to the specific embodiments described herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present application. Therefore, although the present application is described in more detail through the above embodiments, the present application is not limited to the above embodiments, and may also include more other equivalent embodiments without departing from the concept of the present application, all of which belong to the scope of protection of the present application.

Claims

1. A sensor for detecting human density and ambient temperature, characterized in that: include: A device for detecting human density and ambient temperature, the device comprising: a power module, an infrared array sensor and an MCU module; the power module is used to supply power to the infrared array sensor and the MCU module; the infrared array sensor is communicatively connected with the MCU module and is used to collect ambient temperature data; the MCU module is used to determine human density according to the ambient temperature data of the infrared array sensor; Main housing (1), ceiling frame (2), surface housing (3), interface board (4), main control board (5), infrared sensor (6), button (7), light guide column (8); In the main housing (1), the interface board (4) is positioned through the positioning hole (9) and fixedly installed through the interface board fixing hole (10); The main control board (5) is fixedly installed through the main control board fixing hole (11), and the main control board (5) is provided with a DIP switch (12) and a plug pin (13), and the plug pin (13) is used for communication connection between the interface board (4) and the main control board (5), and for connecting a power supply; the main control board (5) is provided with the power supply module, the infrared array sensor and the MCU module; The ceiling frame (2) is provided with a wiring terminal position for clamping a wiring terminal (16), and the ceiling frame (2) is finally clamped with a clamping piece (17) and connected with the main housing (1); The face shell (3) is provided with the button (7), and the button (7) is fixedly installed corresponding to the button positioning hole (18); the main control board (5) is provided with an indicator light, and the indicator light is arranged in the light guide column (8); the face shell (3) is snap-connected with the main shell (1) and is screwed through the face shell fixing hole (19) of the main shell (1); an infrared sensor window is provided at the center of the face shell (3), and a lens window sheet (20) is provided.

2. The personnel density and ambient temperature detection sensor according to claim 1, characterized in that: The MCU module has SigMesh Bluetooth communication function.

3. The sensor for detecting human density and ambient temperature according to claim 2, characterized in that: The MCU module includes: a wired communication interface unit, which is used for wired communication.

4. The sensor for detecting human density and ambient temperature according to claim 3, characterized in that: The MCU module further includes: a DIP switch unit, which is communicatively connected to the MCU module and is used for switching the modes of wired communication and SigMesh communication; and is used for address setting of the infrared array sensor.

5. The sensor for detecting human density and ambient temperature according to claim 4, characterized in that: The MCU module also includes: Key unit, used for parameter setting; Indicator light unit, used for status display.

6. The sensor for detecting human density and ambient temperature according to claim 4, characterized in that: The MCU module further includes: a dry contact output unit, which is used for the MCU module to perform data communication with external equipment.

7. The sensor for detecting human density and ambient temperature according to claim 1, characterized in that: The power module also includes a rectifier unit for converting external power input into direct current.

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