Shell structure of optical module and optical module

Abstract

The utility model relates to a housing structure of an optical module and the optical module, and is characterized in that the housing structure comprises a housing and a heat radiation part, the heat radiation part comprises a heat radiation bottom plate and a plurality of heat radiation fins arranged on the heat radiation bottom plate, the housing is provided with two oppositely arranged air guide ports, the heat radiation part is assembled on the inner side of the housing, and the heat radiation fins are arranged on the heat radiation bottom plate. The heat dissipation fins are located between the two air guide openings, heat dissipation channels are formed between the adjacent heat dissipation fins, flow guide channels are further arranged between the heat dissipation channels and the air guide openings, and the heat dissipation channels are communicated with the corresponding air guide openings through the flow guide channels. According to the shell structure, a better heat dissipation effect can be realized, and solder paste is difficult to overflow to the outside of the shell through the air guide port in the actual use process, so that the outside of the shell is not polluted, the problem of cleaning the solder paste on the outer surface of the optical module shell does not exist, and the service life of the optical module shell is prolonged. The measurement precision of the temperature sensor and real-time monitoring are not affected, the use is more convenient, and the beauty of the whole shell and the optical module can be maintained.

Description

Technical Field

[0001] The utility model relates to the field of communications, and in particular to a housing structure of an optical module and an optical module. Background Art

[0002] Optical modules are very important components in optical communication technology, which can realize the mutual conversion between optical and electrical signals. From the functional point of view, optical modules usually include optical ports, optical devices, PCBA boards, bases (one shell) and top covers (another shell). The optical ports are usually constructed on the bases and are mainly used to connect optical fiber jumpers. The optical devices are usually installed on the bases and correspond to the optical ports. The top covers are usually installed on the bases, and the optical devices and PCBA boards are enclosed in the cavity between the top covers and the bases.

[0003] To improve thermal conductivity and EMI, more and more customers want to use closed top packaging, such as the attached Figure 1 As shown in FIG. 1 , in the conventional technology, there are two main ways to realize the closed top packaging form. One way is to form a heat sink fin module separately by welding, wherein the heat sink fin module has a plurality of fins, and then the heat sink fin module is bonded or soldered as a whole to the outer side of the optical module housing, as shown in FIG. Figure 1 As shown; the second method is to form the heat sink fin module separately by aluminum extrusion, and then bond or solder the heat sink fin module as a whole to the outside of the optical module housing. Both implementation methods require bonding the heat sink fin module to the housing, but the thermal conductivity of existing adhesive materials (such as the commonly used Sn42Bi58 adhesive, the thermal conductivity is less than 30w / mk) will be lower than that of the heat sink fin module and the housing material (usually zinc alloy), which will increase its thermal resistance and lead to poor heat dissipation effect. In addition, the adhesive coating will also lead to uneven coating due to process reasons, affecting the heat dissipation effect and causing problems such as bonding falling off. In order to solve this technical problem, the prior art discloses a high-speed pluggable connector assembly with heat dissipation (Chinese patent CN 219226717 U), the connector assembly includes an upper shell, a lower shell and a heat dissipation assembly, the upper shell and the lower shell are butt-jointed and installed up and down by snaps, and an internal heat dissipation cavity is formed, the heat dissipation assembly includes a heat dissipation base plate and fins arranged on the heat dissipation base plate, the upper shell is constructed with two openings arranged oppositely, the heat dissipation assembly is arranged in the heat dissipation cavity, and the top of the fin corresponds to the inner surface of the upper shell, and the end of the fin is just located at the opening (for details, see the attached patent). Figure 3), so that the heat dissipation channel formed between adjacent fins can be connected to the outside world at the opening. During actual assembly, a filler with a heat-conducting function is usually required between the top of the fin and the inner surface of the upper shell. The commonly used filler is solder paste. The solder paste can not only play a role in heat conduction, but also play a role in fixing. Moreover, during actual use, some temperature sensors are usually required to be set on the outer surface of the shell in the optical module to monitor the temperature of the optical module in real time. However, during actual operation, due to the reasons, the solder paste between the fin and the upper shell usually overflows to a certain extent, and the overflowing solder paste is very easy to overflow to the outer surface of the shell, which will not only cause pollution to the outer surface of the optical module shell, but also be difficult to clean in terms of process, affecting the aesthetics of the optical module, and will affect the measurement accuracy of the temperature sensor, and even cause the temperature monitoring to fail, which needs to be solved urgently. Summary of the invention

[0004] The first aspect of the utility model is to solve the above technical problems and provide a housing structure of an optical module, which can effectively prevent solder paste from overflowing to the outer surface of the housing while ensuring the heat dissipation effect, thereby effectively solving the problems existing in the prior art. The main concept is:

[0005] A housing structure of an optical module comprises a housing and a heat dissipation component, wherein the heat dissipation component comprises a heat dissipation base plate and a plurality of heat dissipation fins arranged on the heat dissipation base plate, the housing is constructed with two oppositely arranged air guide ports, the heat dissipation component is assembled on the inner side of the housing, the heat dissipation fins are located between the two air guide ports, and a heat dissipation channel is formed between adjacent heat dissipation fins.

[0006] There is also a guide channel between the heat dissipation channel and the air guide port, and the heat dissipation channel is connected to the corresponding air guide port through the guide channel. In this scheme, by configuring the guide channel between the heat dissipation channel and the air guide port, the heat dissipation channel is connected to the air guide port through the guide channel. On the one hand, the guide channel can play the role of guiding and draining, which is more conducive to guiding wind into the heat dissipation channel so as to take away the heat in the heat dissipation channel, which is conducive to achieving a better heat dissipation effect; on the other hand, the guide channel is separated between the heat dissipation channel and the air guide port, which not only makes the end of the heat dissipation fin and the air guide port have a larger spacing, but also the heat dissipation fin and the air guide port are separated by the guide channel. In actual use, even if part of the solder paste between the heat dissipation fin and the shell overflows, the overflowed solder paste can only exist inside the shell, and it is difficult for the solder paste to flow to the outside of the shell through the air guide port, so as not to cause pollution to the outside of the shell, and there is no problem of cleaning the solder paste on the outer surface of the optical module shell, and it will not affect the measurement accuracy of the temperature sensor and real-time monitoring, which is conducive to more convenient use. In addition, due to the barrier effect of the guide channel, it is difficult to see the overflowing solder paste from the outside, so that the overflowing solder paste will not affect the aesthetics of the entire housing and the optical module.

[0007] Furthermore, a plurality of guide plates are arranged in the guide channel, and the guide plates are arranged on the housing and divide the guide channel into at least two sub-channels. The guide plates are arranged in the guide channel, which can not only guide and divide the wind, so that the wind enters each heat dissipation channel more evenly, but also further increase the heat dissipation area, thereby further improving the heat dissipation effect.

[0008] In order to solve the problem of improving the heat dissipation effect, further, each guide plate corresponds to each heat dissipation fin, and the end of the heat dissipation fin abuts against the corresponding guide plate. Not only can each heat dissipation channel be connected to each sub-channel, so that the air volume of each heat dissipation channel is more uniform, it is more conducive to the wind entering the heat dissipation channel through the sub-channel on one side and being discharged through the sub-channel on the other side, which is conducive to achieving a better heat dissipation effect; it is also conducive to achieving more efficient heat conduction between the guide plate and the heat dissipation fin, so that the guide plate can not only play a role in guiding, but also play a role in enhancing the heat dissipation effect, which is more conducive to heat dissipation.

[0009] Furthermore, the inner end surface of the guide plate is configured as a first inclined surface facing the inner side of the shell, and the end surface of the heat dissipation fin is configured as a second inclined surface adapted to the first inclined surface. When the heat dissipation component is assembled to the shell, the second inclined surface abuts against the corresponding first inclined surface. In this solution, by configuring the inner end surface of the guide plate as a first inclined surface facing the inner side of the shell, and configuring the end surface of the heat dissipation fin as a second inclined surface adapted to the first inclined surface, on the one hand, during assembly, the first inclined surface can play a role in positioning and guiding the heat dissipation component, so that the heat dissipation component can be quickly and conveniently assembled to the shell from the inner side of the shell. On the other hand, the heat dissipation fin abuts against the first inclined surface of the guide plate through the second inclined surface. The structure of the inclined surface makes the contact area larger, which is more conducive to heat transfer and thus more conducive to heat dissipation.

[0010] The second aspect of the utility model is to solve the problem of further improving the heat dissipation effect of the optical module. Furthermore, the air guide port is constructed as an inclined port. In this solution, by constructing the air guide port as an inclined port, on the one hand, the opening size of the air guide port can be effectively increased without increasing the cross-sectional area of ​​the guide channel, which is conducive to guiding more wind into the guide channel to carry more heat. On the other hand, the direction of the air guide port can be effectively changed so that the air guide port faces the outside of the shell, which is more conducive to guiding the external wind into the guide channel, thereby further improving the heat dissipation effect of the optical module.

[0011] Furthermore, the outer end surface of the guide plate is configured to be adapted to the third inclined surface of the air guide port, so that the third inclined surface cooperates with the inclined air guide port to achieve a better air guide effect and a better heat dissipation effect.

[0012] In order to solve the problem of improving the heat dissipation effect, the thickness of the heat dissipation fins is gradually reduced in the direction away from the heat dissipation base plate. This can not only further increase the surface area of ​​the heat dissipation fins under the condition of a certain height of the heat dissipation fins, thereby being more conducive to achieving a better heat dissipation effect, but also further increase the cross-sectional area of ​​the heat dissipation channel, effectively increasing the flow rate of the heat dissipation channel, which is also conducive to achieving a better heat dissipation effect.

[0013] In order to solve the problem of facilitating the formation of the air guide port, preferably, the shell includes two side walls arranged opposite to each other, a heat dissipation wall connected between the two side walls, and a top wall located at both ends of the heat dissipation wall, the two sides of the top wall are respectively connected to the two side walls, and at the two ends of the heat dissipation wall, the heat dissipation wall, the top wall and the two side walls jointly form the air guide port.

[0014] The guide plate is at least connected to the heat dissipation wall,

[0015] The top of each heat dissipation fin corresponds to the heat dissipation wall, which is not only convenient for forming an air guide port, but also the formed air guide port is easier to guide air, thereby facilitating a better heat dissipation effect.

[0016] In some solutions, the top of the heat dissipation fin is against the inner surface of the heat dissipation wall, so that the heat on the heat dissipation fin can be transferred to the outer surface of the heat dissipation wall via the inner surface of the heat dissipation wall, so as to achieve a larger heat dissipation area and be more conducive to heat dissipation.

[0017] In some solutions, a filler with heat conduction function is arranged between the top of the heat dissipation fin and the inner surface of the heat dissipation wall, which can effectively eliminate the gap between the heat dissipation fin and the heat dissipation wall and ensure that the heat on the heat dissipation fin can be more efficiently transferred to the heat dissipation wall through the filler, thereby achieving a better heat dissipation effect.

[0018] Preferably, the guide plate is vertically connected to the heat dissipation wall and the top wall.

[0019] In order to solve the problem of facilitating the formation of the guide channel, in some solutions, the guide channel is constructed on the shell.

[0020] The third aspect of the utility model is to solve the problem of further improving the heat dissipation effect of the optical module. In some schemes, the top wall and the heat dissipation wall are staggered, the outer ends of each guide plate are respectively connected to the ends of the top wall, the upper ends of each guide plate are respectively connected to the inner surface of the heat dissipation wall, and the lower ends of each guide plate are flush. When the heat dissipation component is assembled on the shell, the lower ends of each guide plate are respectively against the heat dissipation base plate of the heat dissipation component, and the heat dissipation wall, the heat dissipation base plate and the two side walls together form the guide channel. In this scheme, the guide channel is formed by the cooperation of the heat dissipation component and the shell, which can not only effectively reduce the difficulty of forming the guide channel, but also facilitate the forming of the guide channel; and through the contact between the guide plate and the heat dissipation base plate, the heat on the heat dissipation base plate can be transferred to the guide plate, so that the guide plate can play the role of a heat dissipation fin, thereby effectively increasing the heat dissipation effect.

[0021] The fourth aspect of the utility model is to solve the problem of improving the heat transfer efficiency. Furthermore, the heat dissipation base plate is also constructed with grooves adapted to the guide vanes, each groove corresponds to each heat dissipation fin, and when the heat dissipation component is assembled to the housing, the lower end of each guide vane is inserted into each groove. By configuring the grooves, not only can the heat dissipation component be positioned during the assembly process, but also accurate assembly can be achieved quickly, and the contact area between the heat dissipation base plate and the guide vane can be effectively increased, which is more conducive to heat transfer and heat dissipation.

[0022] Furthermore, the heat dissipation component further includes two outer walls constructed on both sides of the heat dissipation bottom plate, the two outer walls are respectively adapted to the two side walls in the housing, and when the heat dissipation component is assembled in the housing, the two outer walls are respectively connected to the two side walls, so that the side walls and the outer walls can together constitute the side walls of the housing in the existing optical module.

[0023] Furthermore, the outer walls are respectively constructed with lock groove structures adapted to the unlocking mechanism.

[0024] In order to solve the problem of accurate assembly, further, the heat dissipation bottom plate is configured with a plurality of first positioning parts, and the side wall and / or the top wall of the shell are configured with a second positioning part adapted to the first positioning part. During assembly, the heat dissipation component is positioned by the cooperation of the first positioning part and the second positioning part, so that the heat dissipation component can be quickly and accurately assembled to the shell.

[0025] Preferably, the heat dissipation fins are parallel to each other, which is convenient for processing and forming, and is beneficial for increasing the heat dissipation area and improving the heat dissipation effect.

[0026] To facilitate production and assembly, further, the shell is constructed with a plurality of first assembly parts, the heat dissipation component is constructed with a first matching part adapted to the first assembly part, and the heat dissipation component is detachably mounted on the shell by matching the first matching part and the fastener of the first matching part.

[0027] Preferably, the first assembly portion is a threaded hole, the first matching portion is a through hole adapted to the threaded hole, and the fastener is a bolt or a screw adapted to the threaded hole.

[0028] To facilitate production and assembly, the housing and / or heat dissipation component is further configured with a second assembly portion to connect the housing component of the adapting housing, so that the housing structure and the housing component can jointly form an internal cavity for accommodating components such as circuit boards.

[0029] Preferably, the second assembly portion is a threaded hole or a through hole.

[0030] Furthermore, the shell also includes a light opening portion, one end of the two side walls and one of the top walls are respectively connected to the light opening portion, and the light opening portion is configured with a light opening.

[0031] An optical module includes the housing structure, a cover component and a PCBA board, wherein the cover component is detachably mounted on the housing structure and encloses an internal cavity, the PCBA board is disposed in the internal cavity, and the PCBA board corresponds to a heat dissipation base plate, so that the heat generated by the heat source on the PCBA board can be transferred to the heat dissipation fins through the heat dissipation base plate and dissipated through the heat dissipation fins, thereby achieving the purpose of heat dissipation.

[0032] Compared with the prior art, the shell structure and the optical module of the optical module provided by the utility model are not only conducive to achieving a better heat dissipation effect, but also in actual use, even if part of the solder paste between the heat dissipation fins and the shell overflows, the overflowed solder paste is difficult to flow to the outside of the shell through the air guide port, thereby not causing pollution to the outside of the shell, and there is no problem of cleaning the solder paste on the outer surface of the optical module shell, nor will it affect the measurement accuracy of the temperature sensor and real-time monitoring, which is conducive to more convenient use and conducive to maintaining the aesthetics of the entire shell and the optical module. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the utility model and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other relevant drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 The figure is a schematic diagram of the local structure of an existing optical module.

[0035] Figure 2 This is a front view of a shell structure provided in Example 1 of the utility model.

[0036] Figure 3for Figure 2 Top view of the .

[0037] Figure 4 for Figure 3 Cross-sectional view at AA in the middle.

[0038] Figure 5 for Figure 4 Cross-sectional view at the middle BB.

[0039] Figure 6 One of the partial structural schematic diagrams of a shell in a shell structure provided in Example 1 of the utility model.

[0040] Figure 7 The present invention is a second schematic diagram of a partial structure of a shell structure provided in Example 1 of the present invention.

[0041] Figure 8 A front view of a heat dissipation component in a shell structure provided in Example 1 of the utility model.

[0042] Fig. 9 for Figure 8 Top view of the .

[0043] Fig.10 One of the structural schematic diagrams of a heat dissipation component in a shell structure provided in Example 1 of the utility model.

[0044] Fig.11 A schematic diagram of the local structure of a shell structure provided in Example 1 of the utility model after the heat dissipation component is assembled on the shell.

[0045] Fig.12 A schematic diagram of a partial structure of a shell in a shell structure provided in Example 2 of the utility model.

[0046] Fig.13 A front view of a heat dissipation component in a shell structure provided in Example 2 of the utility model.

[0047] Fig.14 A top view of a shell structure provided in Example 1 of the utility model.

[0048] Fig.15 for Fig.14 Cross-sectional view at CC.

[0049] Fig.16 A schematic diagram of a partial structure of a shell in a shell structure provided in Example 4 of the utility model.

[0050] Fig.17 for Fig.16 Partial bottom view of .

[0051] Fig.18 This is a schematic diagram of the local structure of a guide channel at one end of a shell provided in Example 4 of the utility model.

[0052] Fig.19 A schematic diagram of the local structure of a guide channel at the other end of a shell provided in Example 4 of the utility model.

[0053] Fig. 20 A schematic diagram of the three-dimensional structure of a heat dissipation component in a shell structure provided in Example 4 of the utility model.

[0054] Fig.21 A longitudinal sectional view of a shell structure provided in Example 4 of the utility model, the section position and Fig.14 The position of CC is consistent.

[0055] Fig. 22 A transverse cross-sectional view of a shell structure provided in Example 4 of the utility model, the cutting position and Figure 4 The position of the middle BB is consistent.

[0056] Description of symbols in the figure

[0057] Heat sink fin module 1, fin 11

[0058] Shell 2, side wall 21, heat dissipation wall 22, inner surface 221, top wall 23, air guide port 24, flow guide channel 25, sub-channel 251, first assembly portion 26, second assembly portion 27, optical port portion 28, optical port 281

[0059] Heat dissipation component 3, heat dissipation base plate 31, groove 311, heat dissipation fin 32, second inclined surface 321, heat dissipation channel 33, first matching portion 34, outer wall 35, locking groove structure 351, end wall 36

[0060] The first positioning portion 41 and the second positioning portion 42

[0061] Guide plate 5, first inclined surface 51, third inclined surface 52

[0062] Cover part 6

[0063] Internal cavity 7

[0064] PCBA board 8, heat source 81

[0065] Fastener 9. DETAILED DESCRIPTION

[0066] The technical scheme in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, rather than all the embodiments. The components of the embodiment of the utility model generally described and shown in the drawings here can be arranged and designed in various different configurations. Therefore, the following detailed description of the embodiment of the utility model provided in the drawings is not intended to limit the scope of the utility model claimed for protection, but merely represents the selected embodiment of the utility model. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without making creative work belong to the scope of protection of the utility model.

[0067] Example 1

[0068] This embodiment provides a housing structure of an optical module, including a housing 2 and a heat dissipation component 3. Figure 1-Figure 4 As shown,

[0069] The heat dissipation component 3 includes a heat dissipation base plate 31 and a plurality of heat dissipation fins 32 arranged on the heat dissipation base plate 31. Figure 8 and Fig. 9 As shown, in implementation, each heat dissipation fin 32 can be parallel to each other, and each heat dissipation fin 32 is preferably perpendicular to the heat dissipation base plate 31, which is convenient for processing and forming, and is conducive to increasing the heat dissipation area and improving the heat dissipation effect. The thickness, height and spacing of the heat dissipation fins 32 can be determined according to actual heat dissipation requirements.

[0070] like Figure 3 , Figure 4 and Figure 6 As shown, the housing 2 is configured with two oppositely arranged air guide ports 24 so as to utilize the two air guide ports 24 for heat dissipation. For ease of description, in one embodiment, the housing 2 includes two oppositely arranged side walls 21, a heat dissipation wall 22 connected between the two side walls 21, and a top wall 23 located at both ends of the heat dissipation wall 22. Figure 3-Figure 7 As shown, the top wall 23 and the heat dissipation wall 22 are not coplanar, for example, Figure 4 As shown, the heat dissipation wall 22 is arranged at a position further away from the inner side of the housing 2 (for the convenience of description, in this embodiment, the outer side of the outer surface of the heat dissipation wall 22 is the outer side of the housing 2, and the inner side of the inner surface 221 of the heat dissipation wall 22 is the inner side of the housing 2), the top wall 23 and the heat dissipation wall 22 can be parallel to each other, and the two sides of the top wall 23 are respectively connected to the two side walls 21, as shown in FIG. Figure 3 , Figure 4 and Figure 7 As shown, at both ends of the heat dissipation wall 22, the heat dissipation wall 22, the top wall 23 and the two side walls 21 together form an air guide 24. The two top walls 23 at both ends of the heat dissipation wall 22 are arranged at intervals, such as Figure 3 and Figure 4 As shown, a gap for inserting the heat dissipation fins 32 of the heat dissipation component 3 can be formed between the two top walls 23 .

[0071] In this embodiment, the heat dissipation component 3 is assembled on the inner side of the housing 2. Figure 4 , Figure 5 and Fig.11 As shown, the heat dissipation fin 32 is located exactly between the two air guide ports 24, and the heat dissipation fin 32 can cooperate with the heat dissipation wall 22 of the housing 2, so that a heat dissipation channel 33 can be formed between two adjacent heat dissipation fins 32, as shown in FIG. Figure 5 In this embodiment, the end of the heat dissipation fin 32 does not extend to the air guide port 24 . In fact, in this embodiment, there is a guide channel 25 between the heat dissipation channel 33 and the air guide port 24 , and the heat dissipation channel 33 is connected to the corresponding air guide port 24 through the guide channel 25 .

[0072] In implementation, the outer surface of the heat dissipation fin 32 may have a certain slope, so that the thickness of the heat dissipation fin 32 gradually decreases in the direction away from the heat dissipation base plate 31. Figure 5 As shown, this can not only further increase the surface area of ​​the heat dissipation fins 32 when the height of the heat dissipation fins 32 is constant, thereby being more conducive to achieving a better heat dissipation effect, but also further increase the cross-sectional area of ​​the heat dissipation channel 33, effectively increasing the flow rate of the heat dissipation channel 33, which is also conducive to achieving a better heat dissipation effect.

[0073] In implementation, the guide channel 25 has various implementations. For example, the guide channel 25 can be directly constructed on the housing 2. For example, the top wall 23 of the housing 2 can extend to the inner side of the heat dissipation arm, so that the top wall 23, the heat dissipation wall 22 and the two side walls 21 can jointly enclose the guide channel 25. Figure 3 , Figure 4 , Figure 6 and Figure 7 During assembly, the heat dissipation fins 32 of the heat dissipation component 3 are inserted between the guide channels 25 on both sides, so that the heat dissipation channel 33 is connected to the corresponding air guide port 24 through the guide channel 25. During assembly, the end of the heat dissipation channel 33 can be against the end of the guide channel 25 for better heat dissipation.

[0074] In order to facilitate production and assembly, during implementation, the housing 2 is constructed with a plurality of first assembly portions 26, such as Figure 7 and Fig.11As shown, the heat dissipation component 3 is configured with a first matching portion 34 adapted to the first assembly portion 26, so that the heat dissipation component 3 can be detachably mounted on the housing 2 by a fastener 9 adapted to the first matching portion 34 and the first assembly portion 26. In implementation, the first assembly portion 26 and the first matching portion 34 have multiple matching implementations. For example, the first assembly portion 26 can be a threaded hole, and the first matching portion 34 can be a through hole adapted to the threaded hole. In this case, the fastener 9 can be a bolt or a screw adapted to the threaded hole, so that the heat dissipation component 3 is threadedly connected to the housing 2 using the fastener 9. For another example, the first assembly portion 26 can be a through hole, and the first matching portion 34 can be a threaded hole adapted to the through hole. In this case, the fastener 9 can be a bolt or a screw adapted to the threaded hole, so that the heat dissipation component 3 is threadedly connected to the housing 2 using the fastener 9. For another example, the first assembly portion 26 and the first matching portion 34 can also be mutually matched snap-fit ​​structures, which can also achieve detachable connection, which will not be repeated here. In implementation, the first matching portion 34 can be preferentially arranged on the heat dissipation base plate 31.

[0075] After the assembly is completed, the top of each heat dissipation fin 32 corresponds to the inner surface 221 of the heat dissipation wall 22. Figure 4 and Figure 5 As shown. During implementation, the top of the heat dissipation fin 32 can be against the inner surface 221 of the heat dissipation wall 22, so that the heat on the heat dissipation fin 32 can be transferred to the outer surface of the heat dissipation wall 22 via the inner surface 221 of the heat dissipation wall 22, so as to achieve a larger heat dissipation area, which is more conducive to heat dissipation. In a preferred embodiment, a filler is provided between the top of the heat dissipation fin 32 and the inner surface 221 of the heat dissipation wall 22, and the filler has at least a heat conduction function. During implementation, the filler can preferably use solder paste, which not only has a good heat conduction function, but also has a fixing function. By setting the filling, the filler can be used to effectively eliminate the gap between the heat dissipation fin 32 and the heat dissipation wall 22, and the use of solder paste can play a role of fixing and heat conduction, ensuring that the heat on the heat dissipation fin 32 can be more efficiently transferred to the heat dissipation wall 22, thereby achieving a better heat dissipation effect.

[0076] In a more perfect solution, the heat dissipation component 3 further includes two outer walls 35 constructed on both sides of the heat dissipation bottom plate 31, such as Figure 8-Figure 10 As shown, the two outer walls 35 are arranged opposite to each other, and the two outer walls 35 are respectively adapted to the two side walls 21 in the housing 2. When the heat dissipation component 3 is assembled in the housing 2, the two outer walls 35 are respectively connected to the two side walls 21, as shown in FIG. Fig.10 and Fig.11 As shown, the side wall 21 and the outer wall 35 can together constitute the side wall 21 of the housing 2 in the existing optical module. In a more perfect solution, the outer wall 35 is also configured with a lock groove structure 351 adapted to the unlocking mechanism in the optical module, as shown in FIG. Figure 8 and Fig.10 As shown, the locking groove structure 351 can be realized by using the existing technology, which will not be described here, but the locking groove structure 351 is constructed on the heat dissipation component 3, which is more convenient for processing and assembly. In order to facilitate the cooperation with the cover component 6 and enclose the closed internal cavity 7, in a more perfect embodiment, the heat dissipation component 3 also includes end walls 36 respectively connected to one end of the two outer walls 35, such as Fig.10 As shown, so as to cooperate with the cover part 6 in the optical module. Figure 8 and Fig.10 As shown, the lower edge of the outer wall 35 can be configured as a tooth-like structure so as to better cooperate with the cover component 6 in the light module.

[0077] In order to facilitate accurate assembly of the heat dissipation component 3, in a further embodiment, the heat dissipation bottom plate 31 is configured with a plurality of first positioning portions 41, and correspondingly, the side wall 21 and / or the top arm of the housing 2 are configured with a second positioning portion 42 adapted to the first positioning portion 41. During assembly, the heat dissipation component 3 can be quickly positioned through the cooperation of the first positioning portion 41 and the second positioning portion 42, so that the heat dissipation component 3 can be quickly and accurately assembled to the housing 2. In implementation, the first positioning portion 41 can be a positioning protrusion, and the second positioning portion 42 can be a positioning groove 311 adapted to the positioning protrusion. The first positioning portion 41 can be a positioning groove 311, such as Figure 8 and Fig. 9 As shown, the second positioning portion 42 may be a positioning protrusion adapted to the positioning groove 311, such as Figure 7 and Fig.11 shown.

[0078] In a more perfect solution, the housing 2 and / or the heat dissipation component 3 is further configured with a second assembly portion 27 for connecting the cover component 6, such as Fig.10 and Fig.11 As shown, the housing 2 structure can be enclosed together with the cover member 6 to form an internal cavity 7 for accommodating components such as a circuit board, as shown in FIG. Fig. 22 As shown. In implementation, the second assembly portion 27 may preferably adopt a threaded hole or a through hole or a male buckle in a snap-fit ​​mechanism or a female buckle in a snap-fit ​​structure. As an example, in this embodiment, the second assembly portion 27 adopts a threaded hole, and the housing 2 and the heat dissipation component 3 are respectively configured with a plurality of the threaded holes so as to detachably connect the cover component 6.

[0079] In a more perfect solution, the housing 2 further includes a light opening 28, one end of the two side walls 21 and one of the top arms are respectively connected to the light opening 28, such as Figure 2 and Figure 3 As shown, the optical port portion 28 is configured with an optical port 281 for connecting an optical fiber jumper. Accordingly, the optical device required by the optical module can usually be installed at a position in the optical port portion 28 corresponding to the optical port 281 .

[0080] During implementation, the housing 2 may be preferably made of zinc alloy, and correspondingly, the heat dissipation component 3 may also be preferably made of zinc alloy.

[0081] Example 2

[0082] In order to solve the problem of improving the heat dissipation effect, the main difference between the present embodiment 2 and the above-mentioned embodiment 1 is that in the shell 2 structure provided in the present embodiment, a plurality of guide plates 5 are further arranged in the guide channel 25, and the guide channel is divided into at least two sub-channels 251, such as Fig.12 By disposing the guide plate 5 in the guide channel 25, the guide plate 5 can not only play the role of guiding and dividing the flow, so that the wind enters each heat dissipation channel 33 more evenly, but also further increase the heat dissipation area, thereby further improving the heat dissipation effect.

[0083] In implementation, the guide plate 5 is arranged on the housing 2, such as Fig.12 As shown, for example, the guide plate 5 can be connected to the heat dissipation wall 22, and in a preferred embodiment, the guide plate 5 can be connected to the heat dissipation wall 22 and the top wall 23 at the same time, and each guide plate 5 can be preferentially connected to the heat dissipation wall 22 and the top wall 23 vertically, as shown in FIG. Fig.12 and Fig.14 shown.

[0084] In implementation, the number of sub-channels 251 may be greater than the number of heat dissipation channels 33, or may be equal to the number of heat dissipation channels 33, or may be greater than the number of heat dissipation channels 33. To improve the heat dissipation effect, in the preferred implementation provided in this embodiment, each guide plate 5 corresponds to each heat dissipation fin 32, that is, the number of guide plates 5 may be equal to the number of heat dissipation fins 32, and the end of the heat dissipation fin 32 may abut against the corresponding guide plate 5, such as Fig.15 As shown, this not only allows each heat dissipation channel 33 to be connected to each sub-channel 251 respectively, making the air volume of each heat dissipation channel 33 more uniform, but also facilitates the wind to enter the heat dissipation channel 33 through the sub-channel 251 on one side and be discharged through the sub-channel 251 on the other side, which is conducive to achieving a better heat dissipation effect; it is also conducive to achieving more efficient heat conduction between the guide plate 5 and the heat dissipation fins 32, so that the guide plate 5 can not only play a role in guiding, but also play a role in enhancing the heat dissipation effect, which is equivalent to the heat dissipation fins 32, and is more conducive to heat dissipation.

[0085] Since the end of the heat dissipation fin 32 abuts against the guide plate 5, in a further embodiment, the inner end surface of the guide plate 5 (i.e., the end of the guide plate 5 facing the other side) can be configured as a first inclined surface 51 facing the inner side of the housing 2, such as Fig.15As shown, accordingly, the end surface of the heat dissipation fin 32 can be configured to be a second inclined surface 321 adapted to the first inclined surface 51, as shown in FIG. Fig.13 and Fig.15 As shown, when the heat dissipation component 3 is assembled to the housing 2, the second inclined surface 321 abuts against the corresponding first inclined surface 51. In this way, on the one hand, during assembly, the first inclined surface 51 can play a role in positioning and guiding the heat dissipation component 3, so that the heat dissipation component 3 can be quickly and conveniently assembled to the housing 2 from the inner side of the housing 2. On the other hand, the heat dissipation fins 32 abut against the first inclined surface 51 of the guide plate 5 through the second inclined surface 321. The structure of the inclined surface makes the contact area larger, which is more conducive to the transfer of heat and thus more conducive to heat dissipation. In implementation, the inclination angle of the first inclined surface 51 can be determined according to actual needs, and the inclination angle of the second inclined surface 321 can be adapted to the first inclined surface 51.

[0086] Example 3

[0087] To further improve the heat dissipation effect, the main difference between the present embodiment 3 and the above-mentioned embodiment 1 or embodiment 2 is that in the shell 2 structure provided in the present embodiment, the air guide port 24 is configured as an inclined port, as shown in the figure, that is, the angle between the central axis of the air guide port 24 and the top wall 23 is an acute angle, such as Fig.12 , Fig.14 and Fig.15 As shown, by constructing the air guide port 24 as an inclined port, on the one hand, the opening size of the air guide port 24 can be effectively increased without increasing the cross-sectional area of ​​the guide channel 25, which is beneficial to guiding more wind into the guide channel 25 so as to carry more heat. On the other hand, the direction of the air guide port 24 can be effectively changed so that the air guide port 24 faces the outside of the shell 2, which is more conducive to guiding the external wind into the guide channel 25, thereby further improving the heat dissipation effect of the optical module.

[0088] In practice, the outer end surface of the guide plate 5 can be configured to be perpendicular to the top wall 23. However, in a preferred embodiment, the outer end surface of the guide plate 5 can be configured to fit the third inclined surface 52 of the air guide port 24, such as Fig.12 and Fig.14 As shown, the outer end surface of the guide plate 5 can also be constructed as an inclined surface, and the inclination angle can be consistent with the inclination angle of the air guide port 24, such as Fig.12 and Fig.15 As shown, the third inclined surface 52 cooperates with the inclined air guide port 24 to achieve a better air guide effect and a better heat dissipation effect.

[0089] Example 4

[0090] In order to facilitate the formation of the guide channel 25 and achieve a better heat dissipation effect, the main difference between the present embodiment 4 and the above-mentioned embodiment 1 or embodiment 2 or embodiment 3 is that in the shell 2 structure provided in the present embodiment, the guide channel 25 is formed in a different manner. Specifically, in the present embodiment, the top wall 23 and the heat dissipation wall 22 can be arranged in a staggered manner, that is, along the direction perpendicular to the projection of the top wall 23, the projections of the top wall 23 and the heat dissipation wall 22 may not overlap. At this time, the outer ends of each guide plate 5 can be respectively connected to the ends of the top wall 23, such as Fig.16 and Fig.17 As shown, at the same time, the upper end of each guide plate 5 can be connected to the inner surface 221 of the heat dissipation arm, and the lower end of each guide plate 5 is flush, as shown in FIG. Fig.18 and Fig.19 As shown, the heat dissipation bottom plate 31 of the heat dissipation component 3 is reserved with abutment area adapted to the guide plate 5, and no heat dissipation fins 32 are arranged in the abutment area. Fig. 20 As shown, when the heat dissipation component 3 is assembled on the housing 2, the lower ends of the guide plates 5 are respectively against the heat dissipation bottom plate 31 of the heat dissipation component 3, and the heat dissipation wall 22, the heat dissipation bottom plate 31 and the two side walls 21 together form the guide channel 25. Fig.21 As shown. In this embodiment, the heat dissipation component 3 and the housing 2 cooperate to form the guide channel 25, which can not only effectively reduce the difficulty of forming the guide channel 25, but also facilitate the formation of the guide channel 25; and through the direct contact between the guide plate 5 and the heat dissipation base plate 31, the heat on the heat dissipation base plate 31 can be transferred to the guide plate 5, so that the guide plate 5 can play the role of the heat dissipation fin 32, which is equivalent to the heat dissipation fin 32. Based on the inventive concept in this embodiment, it is equivalent to forming a multi-section spliced ​​fin (heat dissipation fin 32 and guide plate 5) between the two air guide ports 24, and each fin contacts the heat dissipation base plate 31, thereby effectively increasing the heat dissipation effect.

[0091] In a further embodiment, the heat dissipation base plate 31 is further configured with a groove 311 adapted to fit the guide plate 5. Fig. 20 As shown, each groove 311 corresponds to each heat dissipation fin 32, so that when the heat dissipation component 3 is assembled to the housing 2, the lower end of each guide plate 5 can be inserted into each groove 311. The configuration of the groove 311 can not only position the heat dissipation component 3 during the assembly process, and can quickly achieve accurate assembly, but also can effectively increase the contact area between the heat dissipation base plate 31 and the guide plate 5, which is more conducive to heat transfer and heat dissipation.

[0092] Example 5

[0093] The present embodiment provides an optical module, including the housing 2 structure described in any one of Embodiments 1 to 4, and also including a cover component 6 and a PCBA board 8 adapted to the housing 2 structure, wherein the cover component 6 can be detachably mounted on the housing 2 structure by a fastener 9 or a snap-on structure, and encloses an internal cavity 7. As an example, in a preferred embodiment, the housing 2, the heat dissipation component 3 and the cover component 6 together enclose the internal cavity 7, such as Fig. 22 The PCBA board 8 can be disposed in the internal cavity 7, and the PCBA board 8 can correspond to the heat dissipation base plate 31, as shown. Fig. 22 As shown, the heat source 81 in the optical module, including the heat source 81 on the PCBA board 8, can correspond to or contact the heat dissipation base plate 31, so that the heat generated by the heat source 81 can be transferred to the heat dissipation fins 32 through the heat dissipation base plate 31 and dissipated through the heat dissipation fins 32, thereby achieving the purpose of heat dissipation.

[0094] Of course, during implementation, a thermally conductive material may be provided between the heat source 81 and the heat dissipation base plate 31. The thermally conductive material may be solder paste, heat dissipation silicone, heat dissipation mud, etc., so that heat can be transferred to the heat dissipation base plate 31 more smoothly and efficiently. Examples will not be given one by one here.

[0095] The above description is only a specific implementation of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention.

Claims

1. A housing structure of an optical module, characterized in that: The invention comprises a shell and a heat dissipation component, wherein the heat dissipation component comprises a heat dissipation base plate and a plurality of heat dissipation fins arranged on the heat dissipation base plate, the shell is structured with two oppositely arranged air guide ports, the heat dissipation component is assembled on the inner side of the shell, the heat dissipation fins are located between the two air guide ports, and a heat dissipation channel is formed between adjacent heat dissipation fins. A guide channel is also provided between the heat dissipation channel and the air guide port, and the heat dissipation channel is connected with the corresponding air guide port through the guide channel.

2. The housing structure of the optical module according to claim 1, characterized in that: A plurality of guide plates are arranged in the guide channel, and the guide plates are arranged on the shell body and divide the guide channel into at least two sub-channels.

3. The housing structure of the optical module according to claim 2, characterized in that: Each guide plate corresponds to each heat dissipation fin, and the end of the heat dissipation fin abuts against the corresponding guide plate.

4. The housing structure of the optical module according to claim 3, characterized in that: The inner end surface of the guide plate is configured as a first inclined surface facing the inner side of the shell, and the end surface of the heat dissipation fin is configured as a second inclined surface adapted to the first inclined surface. When the heat dissipation component is assembled to the shell, the second inclined surface abuts against the corresponding first inclined surface.

5. The housing structure of the optical module according to claim 2, characterized in that: The air guide port is configured as an inclined port.

6. The housing structure of the optical module according to claim 2, characterized in that: The outer end surface of the guide plate is configured to be a third inclined surface adapted to the air guide port.

7. The housing structure of the optical module according to claim 1, characterized in that: The thickness of the heat dissipation fins gradually decreases in a direction away from the heat dissipation base plate.

8. The housing structure of the optical module according to any one of claims 2 to 7, characterized in that: The housing includes two side walls arranged opposite to each other, a heat dissipation wall connected between the two side walls, and a top wall located at both ends of the heat dissipation wall. The two sides of the top wall are respectively connected to the two side walls. At the two ends of the heat dissipation wall, the heat dissipation wall, the top wall and the two side walls jointly form the air guide port. The guide plate is at least connected to the heat dissipation wall, The top of each heat dissipation fin corresponds to the heat dissipation wall respectively.

9. The housing structure of the optical module according to claim 8, characterized in that: The top of the heat dissipation fin abuts against the inner surface of the heat dissipation wall; Alternatively, a filler with a heat-conducting function is arranged between the top of the heat dissipation fin and the inner surface of the heat dissipation wall.

10. The housing structure of the optical module according to claim 8, characterized in that: The guide plate is vertically connected to the heat dissipation wall and the top wall; And / or, the housing further comprises a light opening portion, one end of the two side walls and one of the top walls are respectively connected to the light opening portion, and the light opening portion is configured with a light opening.

11. The housing structure of the optical module according to claim 8, characterized in that: The flow guiding channel is configured on the shell.

12. The housing structure of the optical module according to claim 8, characterized in that: The top wall and the heat dissipation wall are staggered, the outer end of each guide plate is respectively connected to the end of the top wall, and the upper end of each guide plate is respectively connected to the inner surface of the heat dissipation wall. When the heat dissipation component is assembled on the shell, the lower end of each guide plate is respectively against the heat dissipation base plate of the heat dissipation component, and the heat dissipation wall, the heat dissipation base plate and the two side walls together form the guide channel.

13. The housing structure of the optical module according to claim 12, characterized in that: The heat dissipation bottom plate is also structured with grooves adapted for guide vanes, each groove corresponding to each heat dissipation fin. When the heat dissipation component is assembled on the housing, the lower end of each guide vane is inserted into each groove.

14. The housing structure of the optical module according to claim 8, characterized in that: The heat dissipation component also includes two outer walls constructed on both sides of the heat dissipation bottom plate, and the two outer walls are respectively adapted to the two side walls in the shell. When the heat dissipation component is assembled in the shell, the two outer walls are respectively connected to the two side walls.

15. The housing structure of the optical module according to claim 14, characterized in that: The outer walls are respectively configured with lock slot structures adapted to unlocking mechanisms; And / or, the heat dissipation base plate is configured with a plurality of first positioning portions, and the side walls and / or top wall of the housing are configured with second positioning portions adapted to the first positioning portions.

16. The housing structure of the optical module according to claim 8, characterized in that: The housing is configured with a plurality of first assembly parts, the heat dissipation component is configured with a first matching part adapted to the first assembly parts, and the heat dissipation component is detachably mounted on the housing by means of a fastener adapted to the first matching part and the first matching part.

17. The housing structure of the optical module according to claim 16, characterized in that: The housing and / or the heat dissipation component is also configured with a second mounting portion.

18. The housing structure of the optical module according to claim 17, characterized in that: The first assembly portion is a threaded hole, the first matching portion is a through hole adapted to the threaded hole, and the fastener is a bolt or a screw adapted to the threaded hole; The second assembly portion is a threaded hole or a through hole.

19. An optical module, comprising a cover component and a PCBA board, characterized in that: It also includes the shell structure described in any one of claims 1-18, the cover component is detachably mounted on the shell structure and surrounds an internal cavity, the PCBA board is arranged in the internal cavity, and the PCBA board corresponds to the heat dissipation base plate.

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